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WO2010128811A3 - Appareil de dépôt de films minces et système de dépôt de films minces le comprenant - Google Patents

Appareil de dépôt de films minces et système de dépôt de films minces le comprenant Download PDF

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Publication number
WO2010128811A3
WO2010128811A3 PCT/KR2010/002887 KR2010002887W WO2010128811A3 WO 2010128811 A3 WO2010128811 A3 WO 2010128811A3 KR 2010002887 W KR2010002887 W KR 2010002887W WO 2010128811 A3 WO2010128811 A3 WO 2010128811A3
Authority
WO
WIPO (PCT)
Prior art keywords
thin film
film deposition
substrate holder
present
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/002887
Other languages
English (en)
Korean (ko)
Other versions
WO2010128811A2 (fr
Inventor
배경빈
윤형석
강창호
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SNU Precision Co Ltd
Original Assignee
SNU Precision Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SNU Precision Co Ltd filed Critical SNU Precision Co Ltd
Priority to JP2012509732A priority Critical patent/JP5506917B2/ja
Priority to CN201080020337.9A priority patent/CN102421933B/zh
Publication of WO2010128811A2 publication Critical patent/WO2010128811A2/fr
Publication of WO2010128811A3 publication Critical patent/WO2010128811A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

La présente invention porte sur un appareil de dépôt de film mince comprenant : une chambre de transfert pour transférer des substrats ; et une première chambre de traitement et une seconde chambre de traitement couplées respectivement aux deux côtés de la chambre de transfert, chacune de la première chambre de traitement et de la seconde chambre de traitement comprenant : un premier support de substrat et un second support de substrat espacés l'un de l'autre ; et une unité de pulvérisation interposée entre le premier support de substrat et le second support de substrat pour fournir de façon consécutive des matières de dépôt dans la direction des premier et second supports de substrat. La présente invention porte également sur un système de dépôt de films minces comprenant l'appareil. L'appareil ainsi configuré de la présente invention a de multiples chambres de traitement qui réalisent le même traitement et qui sont reliées respectivement aux deux côtés de la chambre de traitement, permettant ainsi d'effectuer un traitement de films minces simultanément sur de multiples substrats et d'améliorer la vitesse de traitement.
PCT/KR2010/002887 2009-05-07 2010-05-06 Appareil de dépôt de films minces et système de dépôt de films minces le comprenant Ceased WO2010128811A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012509732A JP5506917B2 (ja) 2009-05-07 2010-05-06 薄膜蒸着装置およびこれを備える薄膜蒸着システム
CN201080020337.9A CN102421933B (zh) 2009-05-07 2010-05-06 薄膜沉积装置及其系统

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0039826 2009-05-07
KR1020090039826A KR101119853B1 (ko) 2009-05-07 2009-05-07 박막 증착 장치 및 이를 구비하는 박막 증착 시스템

Publications (2)

Publication Number Publication Date
WO2010128811A2 WO2010128811A2 (fr) 2010-11-11
WO2010128811A3 true WO2010128811A3 (fr) 2011-03-17

Family

ID=43050634

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/002887 Ceased WO2010128811A2 (fr) 2009-05-07 2010-05-06 Appareil de dépôt de films minces et système de dépôt de films minces le comprenant

Country Status (5)

Country Link
JP (1) JP5506917B2 (fr)
KR (1) KR101119853B1 (fr)
CN (1) CN102421933B (fr)
TW (1) TWI386500B (fr)
WO (1) WO2010128811A2 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101151234B1 (ko) * 2010-03-30 2012-06-14 주식회사 케이씨텍 직립방식 증착장치 및 기판 이송 방법
KR101700608B1 (ko) * 2011-04-15 2017-02-01 이찬용 기판처리장치
JP5846780B2 (ja) * 2011-06-30 2016-01-20 株式会社アルバック 真空処理装置及び真空処理方法、リチウムイオン二次電池の製造方法
KR101467195B1 (ko) * 2013-05-14 2014-12-01 주식회사 아바코 가스 분사기 및 이를 포함하는 박막 증착 장치
KR102426712B1 (ko) * 2015-02-16 2022-07-29 삼성디스플레이 주식회사 표시 장치 제조 장치 및 표시 장치 제조 방법
CN108966676B (zh) * 2017-03-17 2023-08-04 应用材料公司 在真空系统处理掩模装置的方法、掩模处理组件和用于在基板上沉积材料的真空系统
US11133430B2 (en) * 2017-08-09 2021-09-28 Kaneka Corporation Photoelectric conversion element production method
JP2019528370A (ja) * 2017-08-17 2019-10-10 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ いくつかのマスクを取り扱うための方法、基板を処理するための方法、及び基板をコーティングするための装置
KR101921648B1 (ko) * 2017-12-28 2018-11-26 주식회사 올레드온 수직형 면증발원을 이용한 고해상도 ａｍｏｌｅｄ 소자의 클러스터형 양산장비
KR20210081597A (ko) * 2019-12-24 2021-07-02 캐논 톡키 가부시키가이샤 성막 시스템　및 전자 디바이스 제조방법
KR102407505B1 (ko) * 2020-04-29 2022-06-13 주식회사 선익시스템 증착 장치 및 인라인 증착 시스템
CN111663104A (zh) * 2020-06-24 2020-09-15 武汉华星光电半导体显示技术有限公司 蒸镀系统及蒸镀方法
KR102879506B1 (ko) 2021-03-03 2025-11-03 삼성디스플레이 주식회사 진공 처리 장치 및 이를 이용한 진공 처리 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH051378A (ja) * 1991-03-25 1993-01-08 Shin Meiwa Ind Co Ltd インライン成膜装置における基板ホルダの搬送装置
KR20040088238A (ko) * 2003-04-09 2004-10-16 (주)네스디스플레이 진공증착 시스템과 방법
JP2007077493A (ja) * 2005-09-15 2007-03-29 Applied Materials Gmbh & Co Kg コーティング機及びコーティング機の動作方法
JP2007239071A (ja) * 2006-03-10 2007-09-20 Fujifilm Corp 真空蒸着装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0299959U (fr) * 1989-01-24 1990-08-09
JPH0941142A (ja) * 1995-07-26 1997-02-10 Balzers & Leybold Deutsche Holding Ag 真空中で被覆したい基板を交互に位置決めする装置
JP2000277585A (ja) * 1999-03-23 2000-10-06 Hitachi Ltd 基板搬送装置および真空処理装置
AU2003263609A1 (en) * 2002-09-20 2004-04-08 Semiconductor Energy Laboratory Co., Ltd. Fabrication system and manufacturing method of light emitting device
JP2004146369A (ja) * 2002-09-20 2004-05-20 Semiconductor Energy Lab Co Ltd 製造装置および発光装置の作製方法
JP4397655B2 (ja) * 2003-08-28 2010-01-13 キヤノンアネルバ株式会社 スパッタリング装置、電子部品製造装置及び電子部品製造方法
JP2008019477A (ja) * 2006-07-13 2008-01-31 Canon Inc 真空蒸着装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH051378A (ja) * 1991-03-25 1993-01-08 Shin Meiwa Ind Co Ltd インライン成膜装置における基板ホルダの搬送装置
KR20040088238A (ko) * 2003-04-09 2004-10-16 (주)네스디스플레이 진공증착 시스템과 방법
JP2007077493A (ja) * 2005-09-15 2007-03-29 Applied Materials Gmbh & Co Kg コーティング機及びコーティング機の動作方法
JP2007239071A (ja) * 2006-03-10 2007-09-20 Fujifilm Corp 真空蒸着装置

Also Published As

Publication number Publication date
TW201107507A (en) 2011-03-01
KR101119853B1 (ko) 2012-02-28
CN102421933A (zh) 2012-04-18
JP2012526199A (ja) 2012-10-25
WO2010128811A2 (fr) 2010-11-11
JP5506917B2 (ja) 2014-05-28
KR20100120941A (ko) 2010-11-17
CN102421933B (zh) 2014-07-23
TWI386500B (zh) 2013-02-21

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