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WO2010117765A1 - Eléments de découpe en diamant polycristallin thermiquement stable à double frittage - Google Patents

Eléments de découpe en diamant polycristallin thermiquement stable à double frittage Download PDF

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Publication number
WO2010117765A1
WO2010117765A1 PCT/US2010/029164 US2010029164W WO2010117765A1 WO 2010117765 A1 WO2010117765 A1 WO 2010117765A1 US 2010029164 W US2010029164 W US 2010029164W WO 2010117765 A1 WO2010117765 A1 WO 2010117765A1
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WO
WIPO (PCT)
Prior art keywords
pcd
compact
segments
polycrystalline diamond
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2010/029164
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English (en)
Inventor
David R. Hall
Ronald B. Crockett
Joseph R. Fox
Ashok Tamang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schlumberger Canada Ltd
Services Petroliers Schlumberger SA
Schlumberger Technology BV
Schlumberger Holdings Ltd
Prad Research and Development Ltd
Original Assignee
Schlumberger Canada Ltd
Services Petroliers Schlumberger SA
Schlumberger Technology BV
Schlumberger Holdings Ltd
Prad Research and Development Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Canada Ltd, Services Petroliers Schlumberger SA, Schlumberger Technology BV, Schlumberger Holdings Ltd, Prad Research and Development Ltd filed Critical Schlumberger Canada Ltd
Publication of WO2010117765A1 publication Critical patent/WO2010117765A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D99/00—Subject matter not provided for in other groups of this subclass
    • B24D99/005—Segments of abrasive wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B10/00—Drill bits
    • E21B10/46—Drill bits characterised by wear resisting parts, e.g. diamond inserts
    • E21B10/56—Button-type inserts
    • E21B10/567—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts
    • E21B10/5676—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts having a cutting face with different segments, e.g. mosaic-type inserts
    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B10/00—Drill bits
    • E21B10/46—Drill bits characterised by wear resisting parts, e.g. diamond inserts
    • E21B10/56—Button-type inserts
    • E21B10/567—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts
    • E21B10/573—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts characterised by support details, e.g. the substrate construction or the interface between the substrate and the cutting element
    • E21B10/5735—Interface between the substrate and the cutting element

Definitions

  • Embodiments of the present invention relate generally to the field of earth boring tools and in particular relates to polycrystalline diamond cutting elements used on drill bits for earth boring.
  • Specialized drill bits are used to drill well-bores, boreholes, or wells in the earth for a variety of purposes, including water wells; oil and gas wells; injection wells; geo thermal wells; monitoring wells, mining; and, other similar operations. These drill bits come in two common types, roller cone drill bits and fixed cutter drill bits.
  • drill bit is attached directly to a shaft that is turned by a motor, engine, drive, or other means of providing torque to rotate the drill bit.
  • the drill bit is connected to the surface of the earth by what is referred to as a drill string and a motor or drive that rotates the drill bit.
  • the drill string typically comprises several elements that may include a special down-hole motor configured to provide additional or, if a surfaces motor or drive is not provided, the only means of turning the drill bit.
  • drill pipe connects these elements, the drill bit, down-hole motor, logging tools, and drill collars, to the surface where a motor or drive mechanism turns the entire drill string and, consequently, the drill bit, to engage the drill bit with the geological formation to drill the well-bore deeper.
  • drilling mud As a well is drilled, fluid, typically a water or oil based fluid referred to as drilling mud is pumped down the drill string through the drill pipe and any other elements present and through the drill bit.
  • Other types of drilling fluids are sometimes used, including air, nitrogen, foams, mists, and other combinations of gases, but for purposes of this application drilling fluid and/or drilling mud refers to any type of drilling fluid, including gases.
  • drill bits typically have a fluid channel within the drill bit to allow the drilling mud to pass through the bit and out one or more jets, ports, or nozzles.
  • the purpose of the drilling fluid is to cool and lubricate the drill bit, stabilize the well-bore from collapsing or allowing fluids present in the geological formation from entering the well-bore, and to carry fragments or cuttings removed by the drill bit up the annulus and out of the well-bore.
  • drilling fluid typically is pumped through the inner annulus of the drill string and out of the drill bit
  • drilling fluid can be reverse-circulated. That is, the drilling fluid can be pumped down the annulus (the space between the exterior of the drill pipe and the wall of the well- bore) of the well-bore, across the face of the drill bit, and into the inner fluid channels of the drill bit through the jets or nozzles and up into the drill string.
  • Roller cone drill bits were the most common type of bit used historically and featured two or more rotating cones with cutting elements, or teeth, on each cone. Roller cone drill bits typically have a relatively short period of use as the cutting elements and support bearings for the roller cones typically wear out and fail after only 50 hours of drilling use.
  • PCD polycrystalline diamond
  • tungsten carbide cutters tungsten carbide cutters
  • natural or synthetic diamond other hard materials, or combinations thereof.
  • the differences in material properties can cause thermal stresses that lead the PCD cutting element to crack, delaminate, or otherwise become weakened and/or damaged at the interface between the cutting slug and the PCD cutting element.
  • Embodiments of the invention include a first layer comprising at least one polycrystalline diamond segment positioned upon a second layer or transition layer.
  • a first PCD segment is positioned proximate a second PCD segment and separated therefrom by an interfacial boundary.
  • the interfacial boundary optionally is non-planar relative to the first and/or the second PCD segment.
  • the interfacial boundary includes an abrasive material.
  • the interfacial boundary is contiguous with and formed of the same material as the second layer.
  • the first layer remains thermally stable at a higher temperature than the temperature below which the second table remains thermally stable.
  • the second layer is coupled to a substrate or cutting slug.
  • Embodiments of the PCD segments include those that have been processed to provide a granular structure comprising interstices with a reduced number of metallic catalysts.
  • Other embodiments of the PCD segments include those that have been processed to provide a granular structure that include interstices infiltrated with a material that remains thermally stable at a higher temperature than the temperature below which the metallic catalysts remain thermally stable.
  • Other embodiments of the granular structure of the PCD segments comprise interstices that include one or more non-metallic catalysts.
  • Yet other embodiments of the granular structure of the PCD segments comprise substantially fully dense diamond, i.e., a granular structure being substantially free of voids and/or interstices with or without other materials within any remaining interstices.
  • inventions include a body of abrasive material coupled to a substrate.
  • the body includes a substantially pointed or conical shaped cutting surface.
  • the body optionally includes one or more PCD segments coupled to and exposed in the conical cutting surface.
  • a method of forming a PCD cutting elements coupled to a cutting slug includes providing a canister or other container configured to receive a plurality of thermally stable pre-sintered polycrystalline diamond segments.
  • the canister is filled with grains of polycrystalline diamond and, optionally, a catalytic material.
  • the polycrystalline diamond segments are positioned upon the grains of polycrystalline diamond such that an interfacial boundary is formed from the grains of polycrystalline diamond to separate each of the plurality of polycrystalline diamond segments.
  • a press than applies a temperature and a pressure to the container to sinter the grains of polycrystalline diamond and bond the polycrystalline diamond segments to the sintered grains of polycrystalline diamond.
  • each of the expressions “at least one of A, B and C,” “at least one of A, B, or C,” “one or more of A, B, and C,” “one or more of A, B, or C” and “A, B, and/or C” means A alone, B alone, C alone, A and B together, A and C together, B and C together, or A, B and C together.
  • FIG. 1 is an isometric view of an embodiment of a PCD compact cutting element
  • FIG. 2 is a microscopic level view of an embodiment of a granular structure of a PCD segment;
  • FIG. 3 is a microscopic level view of another embodiment of a granular structure of a
  • FIG. 4 is an isometric view of an embodiment of a metallic carbide disc for use in embodiments of methods of making a PCD segment;
  • FIG. 5 is an isometric view of another embodiment of a metallic carbide disc for use in embodiments of methods of making a PCD segment;
  • FIG. 6A is a cross-sectional view of an embodiment of a canister for use in embodiments of methods of making a PCD segment;
  • FIG. 6B is a cross-sectional view of an embodiment of a canister for use in embodiments of methods of making a PCD compact
  • FIG. 7 is an orthogonal view of an embodiment of a PCD cutting element
  • FIG. 8 is an orthogonal diagram of another embodiment of a PCD cutting element
  • FIG. 9 is an orthogonal diagram of another embodiment of a PCD cutting element
  • FIG. 10 is an orthogonal diagram of another embodiment of a PCD cutting element
  • FIG. 11 is an orthogonal diagram of another embodiment of a PCD cutting element
  • FIG. 12 is an orthogonal diagram of another embodiment of a PCD cutting element
  • FIG. 13 is an orthogonal diagram of another embodiment of a PCD cutting element
  • FIG. 14 is an orthogonal diagram of another embodiment of a PCD cutting element
  • FIG. 15 is a cross-sectional view of an embodiment of a PCD cutting element
  • FIG. 16 is a cross-sectional view of another embodiment of a PCD cutting element
  • FIG. 17 is a cross-sectional view of another embodiment of a PCD cutting element
  • FIG. 18 is a cross-sectional view of another embodiment of a PCD cutting element
  • FIG. 19 is a cross-sectional view of another embodiment of a PCD cutting element
  • FIG. 20 is a cross-sectional view of another embodiment of a PCD cutting element
  • FIG. 21 is an isometric view of an embodiment of a rotary drag bit that includes an embodiment of a PCD compact cutting element in a close-up view;
  • FIG. 22 is an isometric view of an embodiment of a PCD compact cutting element that includes a transition layer with a conical surface;
  • FIG. 23 is an isometric view of another embodiment of a rotary drag bit that includes an embodiment of a PCD compact cutting element that includes a conical surface in a close- up view;
  • FIG. 24 is an orthogonal view of another embodiment of a PCD cutting element;
  • FIG. 25 is an orthogonal view of another embodiment of a PCD cutting element; and,
  • FIG. 26 is an orthogonal view of another embodiment of a PCD cutting element; [0049]
  • the drawings are not necessarily to scale.
  • FIG. 1 shows an isometric view of an embodiment of a poly crystalline diamond (PCD) compact 101.
  • the PCD compact 101 includes a first table or layer 105 formed of a plurality of PCD segments 110 that, optionally, are sintered and/or preformed, as will be described in further detail below.
  • the PCD segments 110 optionally are leached diamond, natural diamond, synthetic diamond, highly pressurized diamond, calcium carbonate sintered diamond, combinations thereof, and similar materials and for purposes of the claims a PCD segment and/or polycrystalline diamond encompasses all these materials and those that fall within the scope of this disclosure.
  • the PCD segments 110 optionally are thermally stable as will be described in further detail below.
  • the first layer 105 has a diameter of 130.
  • the first layer 105 can optionally have different dimensions and different shapes, including ovoid, half-circle, square, and other such shapes, and that all of these embodiments fall within the scope of the disclosure.
  • the plurality of PCD segments 110 are separated by an interfacial boundary 150 between each of the plurality of PCD segments 110.
  • the interfacial boundaries 150 comprises an abrasive material selected from a group that includes, but is not limited to, tungsten carbide, cubic boron nitride, thermally stable polycrystalline diamond, polycrystalline diamond, and the like.
  • the interfacial boundaries 150 optionally are non- linear and/or non-planar relative to adjacent PCD segments 110.
  • the non-linear and/or non-planar quality of the interfacial boundary 150 creates an interlocking feature - best seen as interlocking feature 760 in FIG. 7 and interlocking feature 960 in FIG. 9 - between the diamond segments 110, thereby reducing the likelihood that adjacent PCD segments 110 will move relative to each other and, therefore, reducing the likelihood of a PCD segment 110 being torn and/or damaged and/or removed undesirably from the PCD compact 101 during use.
  • the PCD compact 101 also includes a second table or layer 115, also referred to as a transition layer 115.
  • the PCD segments 110 are positioned upon and bonded to the second layer 115.
  • the second layer 115 optionally comprises an abrasive material selected from a group that includes, but is not limited to, tungsten carbide, cubic boron nitride, thermally stable polycrystalline diamond, polycrystalline diamond, and the like.
  • the embodiment of the PCD compact 101 illustrates a second layer 115 that includes sintered PCD grains 120 that is optionally interspersed with a metallic catalyst.
  • the second layer 115 is contiguous with and comprises the same material as the interfacial boundary 150.
  • the second layer 115 has a diameter of 135 that is the same, within manufacturing tolerances, as the diameter 130 of the first layer 105.
  • the second layer 115 can optionally have different dimensions and different shapes, including ovoid, half-circle, square, and other such shapes, including dimensions and shapes different from the first layer 105, and that all of these embodiments fall within the scope of the disclosure.
  • the second table 115 is bonded to a substrate 125 made from, for example, a metallic material.
  • the substrate 125 can be made from a metallic material selected from the group that includes, but is not limited to, tungsten carbide, titanium carbide, tungsten molybdenum carbide, tantalum carbide, combinations thereof, and other similar materials.
  • the substrate 125 has a diameter of 140 that is the same, within manufacturing tolerances, as the diameter 130 of the first layer 105 and the diameter 135 of the second layer 115.
  • the substrate 125 can optionally have different dimensions and different shapes, including ovoid, half-circle, square, and other such shapes, including dimensions and shapes different from the first layer 105 and/or the second layer 115, and that all of these embodiments fall within the scope of the disclosure.
  • the PCD segments 110 typically are formed by sintering powdered diamond, and, optionally, various catalysts, typically metallic powders mixed with the diamond powder.
  • the catalysts typically metallic materials, such as cobalt and other similar metallic materials, act as a catalyst to reduce the temperature and/or the pressure at which the sintering process occurs and/or speeds the reaction by which the diamond grains and any other materials crystallize and form a granular structure.
  • the diamond powder and any catalysts and/or other materials are placed in a canister or form that is compressed under a pressure and a temperature sufficient to sinter and crystallize the diamond powder and any other materials into a solid PCD segment.
  • a sintered PCD granular structure 300 comprises polycrystalline diamond grains or crystals 301 and a catalyzing material 310 dispersed between the polycrystalline diamond grains or crystals 301.
  • the catalyzing material 310 is selected from a group of metallic materials, including, but not limited to, cobalt, nickel, iron, ruthenium, rhodium, palladium, platinum, chromium, manganese, tantalum, osmium, iridium, and combinations thereof.
  • the catalysts are removed via leaching and/or acid etching with acids that react with the catalysts and/or other known methods, leaving a PCD segment that is said to be thermally stable, typically referred to as thermally stable polycrystalline (TSP).
  • TSP thermally stable polycrystalline
  • FIG. 2 is an idealized microscopic level view of a sintered PCD granular structure 200 that has been processed to remove the catalyst (e.g., catalyst 220 in FIG. 3), thereby leaving voids 220 and PCD grains 201, as discussed above. That is, the thermally stable PCD segments 110 of FIG. 1 optionally have been processed in such a way to improve the thermal stability of the PCD segments 110 relative to PCD segments that have not undergone such processing. Improved thermal stability means that the diamond segments remain stable, e.g., do not exhibit increased tendencies to fail, crack, chip, delaminate, or otherwise wear more quickly during use at higher temperatures than these failure modes would otherwise manifest themselves.
  • the PCD grains 201 typically are submicron in size, providing dimensional context for the FIGS. 2 and 3, typically from about 1 micron to about 50 microns and, more preferably, from about 5 microns to about 35 microns and, more preferably still, from about 7 microns to about 25 microns.
  • the PCD granular structure is processed to provide PCD grains 201 large enough such that the PCD grains 201 do not easily oxidize and burn up when subjected to the heat caused by friction during use.
  • the PCD granular structure 200 is then subjected to additional processing, such as another sintering process (i.e., double sintering) to cause the PCD grains 201 to grow and expand into the interstices or voids 220, leaving PCD granular structure that is substantially diamond dense. That is, the PCD granular structure 200 comprises at least 90% PCD grains 201.
  • additional processing such as another sintering process (i.e., double sintering) to cause the PCD grains 201 to grow and expand into the interstices or voids 220, leaving PCD granular structure that is substantially diamond dense. That is, the PCD granular structure 200 comprises at least 90% PCD grains 201.
  • the PCD granular structure 200 is sintered while in contact with non-catalytic materials, i.e., those materials that typically do not catalyze or cause the PCD granular structure to change crystal structure (e.g., from diamond to graphite) and/or lower the temperature at which the PCD granular structure 200 and PCD grains 201 begin to become thermally unstable.
  • non-catalytic materials i.e., those materials that typically do not catalyze or cause the PCD granular structure to change crystal structure (e.g., from diamond to graphite) and/or lower the temperature at which the PCD granular structure 200 and PCD grains 201 begin to become thermally unstable.
  • a non-metallic catalyst 210 that is thermally stable e.g., one having a coefficient of thermal expansion similar to that of the PCD grains 201 can be placed in contact with the PCD granular structure 201 during the sintering process, thereby causing the non-metallic catalyst 210 to infiltrate and/or grow within one or more of the interstices or voids 220.
  • the non-metallic catalyst 210 can be selected from a group that includes, but is not limited to, silicon, silicon carbide, boron, carbonates, hydroxide, hydride, hydrate, phosphorus-oxide, phosphoric acid, carbonate, lanthanide, actinide, phosphate hydrate, hydrogen phosphate, phosphorus carbonate, combinations thereof, and other similar materials.
  • the PCD granular structure 200 is sintered with one or more thermally stable materials 215, including, but not limited to, cobalt suicide, titanium, niobium, molybdenum, tungsten, tantalum, combinations thereof, and other similar materials.
  • thermally stable materials 215 are those thermally stable materials 215 that they tend to act to make the PCD granular structure 200 less brittle under impact loads.
  • Prior art PCD compacts typically had a PCD segment bonded directly to a substrate. This arrangement caused difficulties during manufacturing and use because, among other problems, the coefficient of thermal expansion differed, sometimes greatly, between the substrate and the PCD segment. During manufacturing, in which the PCD segment was to be bonded to the substrate, the different rates of thermal expansion often resulted in PCD segments that cracked due to the thermal stresses created at the interface of the substrate and the PCD segment as the substrate and PCD segment expanded and contracted at different rates while heating and cooling. Similar results occurred during use in which the PCD segment would be subjected to direct heating caused by friction, whereas the substrate is heated primarily through heat transferred by conduction through the PCD segment and to the substrate.
  • a benefit of the second layer or transition layer 115 is that it solves the previously unresolved problem of bonding a PCD segment to a substrate that has a different coefficient of thermal expansion. That is, embodiments of PCD compacts of the invention have improved thermal stability, improved bonding of the PCD segments to a substrate, improved reliability, and other benefits as described herein and one having skill in the art will understand by reading the disclosure.
  • PCD segments 110 are formed by sintering diamond powder or other similar material and, optionally, a catalyst. Illustrated in FIGS. 4 and 5 are discs 405, 410, that are provided.
  • the discs 405, 410 optionally formed of a metallic carbide, such as those materials discussed above.
  • the discs 405 and 410 are used to shape the PCD segments 110.
  • the discs 405, 410 include one or more areas 415 in which the PCD segments 110 are formed, the areas 415 being separated by one or more ribs 420 on a front surface 409 of the discs 405, 410.
  • the ribs 420 may be straight, non-liner, curvilinear, non-planar, combinations thereof, and the like. (It should be noted that shape and location of the ribs 420 is a mirror of the shape and location of the interfacial boundary 150 of the PCD compact 101 discussed above. Thus, the ribs 420 can optionally be of any shape and any dimension contemplated for the interfacial boundaries.) In addition, the ribs 420 separate the PCD segments 110 from coming into contact with each other during the manufacturing process.
  • Embodiments of the method making PCD include providing a canister or can 601 as seen in FIG. 6A. At least one disc or a first disc 405 is placed within the canister 601 and each area 415 of the disc 405 is filled with, for example, diamond powder 650 (and any catalysts and other materials, which are considered present in the discussion of the diamond powder 650), as discussed above, that will be sintered to form the PCD segment 110, as discussed above.
  • diamond powder 650 and any catalysts and other materials, which are considered present in the discussion of the diamond powder 650
  • another disc 630 separates each disc 405 from the diamond powder 650 proximate to a back surface 407 of each disc 405.
  • the disc 630 optionally is made of niobium and/or similar such materials, which prevents, at least to some degree, the flow of diamond powder 650 and the growth of crystallized diamond grains into the back surface 407 of the disc 405 during sintering.
  • the number of discs 405 positioned in the canister 601 and, consequently, the number of PCD segments 110 produced, is a function, in part, of the thickness 655 of the layer of diamond powder 650 and the thickness 408 of the discs 405.
  • the thickness 655 of the diamond powder 650 and the thickness 408 of the disc 405 optionally can be varied in the same canister 601, thus producing PCD segments of different dimensions in one manufacturing batch.
  • the quantity of PCD segments 110 produced is a function, in part, on the configuration and number of ribs 420 on each disc 405. Further, different discs 405 with different configurations of ribs 420 can be used in a given canister 601, thus further affecting the yield of PCD segments 110.
  • the diamond powder 650 Prior to placing the lid 660 on the canister 601 and sealing the canister 601, the diamond powder 650 may be tamped down or compacted with an applied pressure low enough to avoid breakage of any of the discs 405 and 630.
  • the canister 650 is heated to reduce or eliminate some or all of any impurities present in the diamond powder 650 and elsewhere in the canister 601 before sealing the canister 601.
  • the lid 660 is sealed to the canister 601 through welding, such as laser welding and other known methods.
  • the canister is sealed using a process described in U.S. Patent 7,575,425 to Hall et al, which is herein incorporated by reference for all that it contains.
  • the canister 601 After the canister 601 is sealed, it is placed within a salt form (not shown). One or more salt forms are then stacked and placed on an anvil of a high-temperature, high-pressure press (not shown). The press applies a pressure and a temperature sufficiently high to cause the diamond powder 650 (and any catalysts and other materials) to sinter. During the sintering process, the diamond powder 650 typically reduces in volume as it becomes solid. [0069] Once the sintering process is complete and the canister 601 is removed from both the press and the salt form, the diamond powder 650 will have become the sintered PCD segments 110.
  • Embodiments of the method further include forming PCD compacts, such as those illustrated in FIG. 1, to combine PCD segments 110 with an unsintered abrasive powder or material that will form the second or transition layer 115 and a substrate 125.
  • One or more PCD segments 2610 are placed in a canister 2601, similar to the canister 601, as illustrated in FIG. 6B.
  • Unsintered abrasive material 2620 such as diamond powder, by way of example, is placed in the canister in between - at the interfacial boundary 2650 - and on top of the PCD segments 2610 that typically have been processed to improve the thermal stability of the PCD segments 2610, as discussed above.
  • the unsintered abrasive material optionally includes metallic catalysts and/or non-metallic catalysts and/or other thermally stable materials as discussed above.
  • the substrate 2625 is placed on top of the unsintered abrasive material 2620.
  • the unsintered abrasive material 2620 Prior to placing the lid 2660 on the canister 2601 and sealing the canister 2601, the unsintered abrasive material 2620 may be tamped down or compacted with an applied pressure low enough to avoid breakage of any of the PCD segments 2610.
  • the canister 2601 is heated to reduce or eliminate some or all of any impurities present in the unsintered abrasive material 2620 and elsewhere in the canister 2601 before sealing the canister 2601.
  • the lid 2660 is sealed to the canister 2601 through welding, such as laser welding and other known methods.
  • the canister is sealed using a process described in U.S.
  • Patent 7,575,425 to Hall et al After the canister 2601 is sealed, it is placed within a salt form (not shown). One or more salt forms are then stacked and placed on an anvil of a high-temperature, high-pressure press (not shown). The press applies a pressure and a temperature sufficiently high to cause the unsintered abrasive material 2620 (and any catalysts and other materials) to sinter. During the sintering process, the abrasive material 2620 typically reduces in volume as it becomes solid. In addition, the PCD segments 2610 undergo a second, or double, sintering process, by which the PCD grains grow and/or other non-metallic catalysts and/or other thermally stable materials are incorporated and sintered into the PCD segments as discussed above.
  • the abrasive material 2620 forms both a mechanical and a chemical bond or attachment with the PCD segments 2610 at the interfacial boundary 2650 and at a lower surface 2611.
  • the PCD segments 2610 would exhibit, in part, growth of PCD grains 201 (FIG. 2) into the interstices and voids 220 (FIG. 2) across and into a transition zone 2621 of the now sintered abrasive material 2620.
  • a solid, rigid diamond layer at the transition zone 2621 forms a mechanical bond between the sintered layer of abrasive material 2620 and the PCD segments 2610, reducing any residual stress concentrations that may otherwise occur.
  • the abrasive material 2620 may reduce in volume as it sinters, provided further space into which PCD grains may grow during the sintering process, further improving the mechanical bond. It should be noted that while the grain size of the PCD grains and the sintered abrasive material can vary substantially, a grain size that is similar between the PCD grains and the sintered abrasive material can improve and provide a more uniform bond between the two materials as compared to the bond that occurs when the grain sizes are dissimilar.
  • the layer of sintered abrasive material 2620 acts as a transition layer, and is typically selected and prepared to have a coefficient of thermal expansion somewhere between that of the PCD segments 2610 and the substrate 2625.
  • the gradient of thermal stresses is changed gradually throughout the PCD compact rather than having a sharp transition at each interface. That is, a first layer of PCD segments 2610 is configured to remain thermally stable at a first temperature and a second layer or transition layer 2620 is configured to remain thermally stable at a second temperature lower than the first temperature.
  • FIGS. 7 - 14 Disclosed in FIGS. 7 - 14 are various, non-limiting embodiments of PCD compacts comprising PCD segments of various shapes and the interfacial boundaries between each PCD segment.
  • the PCD compact 710 includes two PCD segments 710 and a single interfacial boundary 750 that is non-linear and non-planar and includes interlocking features 760, such as the illustrated dimples.
  • the PCD segments 710, 810, 910, 1010, 1110, 1210,. 1310, and 1410 can be a variety of shapes, including, but not limited to, circular, square, hexagonal or a polygonal working surface.
  • the PCD segments 1310, and 1410 can be arranged symmetrically or asymmetrically around the PCD compacts 701, 801, 901, 1001, 1101, 1201, 1301, and 1401. Further, the PCD segments can be oriented relative to the direction of work so that the PCD segments perform the majority of the work as compared to the abrasive material.
  • interfacial boundaries 750, 950, and others can include comprise interlocking features.
  • the interfacial boundaries 950 includes a series of steps 960.
  • the interlocking features 750, 850, 950, 1050, 1150, 1250, 1350, and 1450 optionally include also comprise complementary projections and recesses.
  • PCD compact 1201 in FIG. 12 includes a PCD segment 1210 that has a interfacial boundary 1250 that is a plurality of oval openings.
  • FIGS. 15 - 20 Disclosed in FIGS. 15 - 20 are cross-sections of various, non-limiting embodiments of PCD compacts 1501, 1601, 1701, 1801, 1901, and 2001.
  • Each of the PCD compacts 1501, 1601, 1701, 1801, 1901, and 2001 include a plurality of PCD segments 1510, 1610, 1710, 1810, 1910, and 2010, respectively, with an interfacial boundary 1550, 1650, 1750, 1850,. 1950, and 2050 separating them, respectively.
  • the transition layers 1515, 1615, 1715, 1815, 1925, and 2015 are bonded at lower surface 1511, 1611, 1711, 1811, 1911, and 2011 to the PCD segments 1510, 1610, 1710, 1810, 1910, and 2010.
  • the transition layers 1515, 1615, 1715, 1815, 1925, and 2015 are bonded at upper surfaces 1524, 1624, 1724,
  • Fig. 21 shows an embodiment of a drag bit 2800 that includes a plurality of PCD compacts or shear cutters 2801 as described above.
  • the shear cutters 2801 are attached to blades 2880 that each extend from a head 2890 of the drag bit 2800 for cutting against the subterranean formation being drilled.
  • Fig. 22 discloses an embodiment of a PCD compact or pointed cutting element 3101 that includes PCD segments 3110 arranged about the PCD compact or cutting element 3101.
  • the PCD segments 3110 can be arranged symmetrically or asymmetrically about the PCD compact 3101 as required for a particular application.
  • a sintered abrasive material 3120 having a conical surface 3123 supports the PCD segments 3110 that, in turn, is supported by a substrate 3125.
  • Fig. 23 shows an embodiment of another drag bit 3100 that includes a plurality of pointed PCD compacts or cutting elements 3101.
  • the PCD compacts 3101 may be pressed or machined into the desired shape or configuration.
  • the PCD compact 3101 may be used in road milling, pavement resurfacing, mining, and trenching applications.
  • Disclosed in FIGS. 24 - 26 are various, non-limiting embodiments of arrangements of the PCD segments 2410, 2510, and 2710 around conical or pointed PCD compacts 2401,
  • the PCD segments 2410, 2510, and 2710 can be of various shapes and sizes, non-limiting examples of which include, but are not limited to, rectangular, trapezoidal, square, hexagonal or triangular shape and disposed within or exposed in the conical surface, such as conical surface 3123 in FIG. 22, as noted.
  • the interfacial boundaries 2450, 2550, and 2750 can be formed of a sintered abrasive material.
  • the present invention includes providing devices and processes in the absence of items not depicted and/or described herein or in various embodiments hereof, including in the absence of such items as may have been used in previous devices or processes, e.g., for improving performance, achieving ease and/or reducing cost of implementation.

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  • Life Sciences & Earth Sciences (AREA)
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Abstract

Les modes de réalisation de l'invention concernent une pastille de diamant polycristallin comprenant une pluralité de segments de diamant polycristallin à double frittage. Les segments de diamant polycristallin sont configurés pour rester thermiquement stables à une première température. Les segments de diamant polycristallin sont positionnés sur une couche de transition de diamant polycristallin à simple frittage qui est configurée pour rester thermiquement stable à une seconde température inférieure à la première température et sont collés à ladite couche de transition. La couche de transition est positionnée sur un substrat et collée à celui-ci. Les modes de réalisation de l'invention ont amélioré la stabilité thermique, et de ce fait les défauts de fabrication sont moins nombreux et la longévité d'utilisation s'en trouve améliorée.
PCT/US2010/029164 2009-03-30 2010-03-30 Eléments de découpe en diamant polycristallin thermiquement stable à double frittage Ceased WO2010117765A1 (fr)

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