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WO2010106232A3 - A method and device for transferring heat - Google Patents

A method and device for transferring heat Download PDF

Info

Publication number
WO2010106232A3
WO2010106232A3 PCT/FI2010/050207 FI2010050207W WO2010106232A3 WO 2010106232 A3 WO2010106232 A3 WO 2010106232A3 FI 2010050207 W FI2010050207 W FI 2010050207W WO 2010106232 A3 WO2010106232 A3 WO 2010106232A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
electromagnetic radiation
transferring heat
heat
absorbing element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/FI2010/050207
Other languages
French (fr)
Other versions
WO2010106232A2 (en
Inventor
Jani Oksanen
Jaakko Tulkki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of WO2010106232A2 publication Critical patent/WO2010106232A2/en
Publication of WO2010106232A3 publication Critical patent/WO2010106232A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/003—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect using selective radiation effect
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S10/00—PV power plants; Combinations of PV energy systems with other systems for the generation of electric power
    • H02S10/30—Thermophotovoltaic systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/18—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices and the electric light source share a common body having dual-functionality of light emission and light detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Sorption Type Refrigeration Machines (AREA)
  • Led Device Packages (AREA)

Abstract

A method and device for transferring heat in a thermophotonic heat pump where heat energy is transferred by using light or other electromagnetic radiation from an emitting element to an absorbing element in direction opposite to the direction defined by the second law of thermodynamics. Heat energy is transferred by using the light or other electromagnetic radiation generated in the structure by electroluminescence from the emitting element to the absorbing element. In the absorbing element light or other electromagnetic radiation is absorbed without exploiting the energy of the light or other electromagnetic radiation in a form other than as heat energy.
PCT/FI2010/050207 2009-03-19 2010-03-18 A method and device for transferring heat Ceased WO2010106232A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20095285A FI20095285L (en) 2009-03-19 2009-03-19 Method and device for heat transfer
FI20095285 2009-03-19

Publications (2)

Publication Number Publication Date
WO2010106232A2 WO2010106232A2 (en) 2010-09-23
WO2010106232A3 true WO2010106232A3 (en) 2011-08-18

Family

ID=40510282

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI2010/050207 Ceased WO2010106232A2 (en) 2009-03-19 2010-03-18 A method and device for transferring heat

Country Status (2)

Country Link
FI (1) FI20095285L (en)
WO (1) WO2010106232A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9557215B2 (en) 2012-08-17 2017-01-31 Massachusetts Institute Of Technology Phonon-recyling light-emitting diodes
WO2015023819A1 (en) 2013-08-16 2015-02-19 Massachusetts Institute Of Technology Thermo-electrically pumped light-emitting diodes

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628695A (en) * 1984-09-28 1986-12-16 The United States Of America As Represented By The United States Department Of Energy Solid state radiative heat pump
US6378321B1 (en) * 2001-03-02 2002-04-30 The Regents Of The University Of California Semiconductor-based optical refrigerator
US20040231717A1 (en) * 2003-05-22 2004-11-25 Paul Greiff Micron gap thermal photovoltaic device and method of making the same
US20090188549A1 (en) * 2008-01-29 2009-07-30 Mtvp Corporation Method of and apparatus for improved thermophotonic generation of electricity

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628695A (en) * 1984-09-28 1986-12-16 The United States Of America As Represented By The United States Department Of Energy Solid state radiative heat pump
US6378321B1 (en) * 2001-03-02 2002-04-30 The Regents Of The University Of California Semiconductor-based optical refrigerator
US20040231717A1 (en) * 2003-05-22 2004-11-25 Paul Greiff Micron gap thermal photovoltaic device and method of making the same
US20090188549A1 (en) * 2008-01-29 2009-07-30 Mtvp Corporation Method of and apparatus for improved thermophotonic generation of electricity

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
CATCHPOLE K R ET AL: "Thin semiconducting layers as active and passive emitters for thermophotonics and thermophotovoltaics", SOLAR ENERGY, PERGAMON PRESS. OXFORD, GB, vol. 76, no. 1-3, 1 January 2004 (2004-01-01), pages 251 - 254, XP004481464, ISSN: 0038-092X, DOI: DOI:10.1016/J.SOLENER.2003.09.008 *
JANI OKSANEN, JUKKA TULKKI: "Thermophotonic heat pump - towards the first demonstration of electroluminescent cooling", SPIE, PO BOX 10 BELLINGHAM WA 98227-0010 USA, vol. 7614, 8 February 2010 (2010-02-08), XP040518699 *

Also Published As

Publication number Publication date
WO2010106232A2 (en) 2010-09-23
FI20095285A7 (en) 2010-09-20
FI20095285A0 (en) 2009-03-19
FI20095285L (en) 2010-09-20

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