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WO2010104276A3 - Boîtier del pour grille de connexion, grille de connexion utilisant le boîtier del, et procédé de fabrication du boîtier del - Google Patents

Boîtier del pour grille de connexion, grille de connexion utilisant le boîtier del, et procédé de fabrication du boîtier del Download PDF

Info

Publication number
WO2010104276A3
WO2010104276A3 PCT/KR2010/001134 KR2010001134W WO2010104276A3 WO 2010104276 A3 WO2010104276 A3 WO 2010104276A3 KR 2010001134 W KR2010001134 W KR 2010001134W WO 2010104276 A3 WO2010104276 A3 WO 2010104276A3
Authority
WO
WIPO (PCT)
Prior art keywords
led
package
manufacturing
led package
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/001134
Other languages
English (en)
Other versions
WO2010104276A2 (fr
Inventor
The Tran Nguyen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nepes Led Corp
Original Assignee
Nepes Led Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/381,408 external-priority patent/US8058667B2/en
Priority claimed from US12/381,409 external-priority patent/US8039862B2/en
Priority to CN2010800077963A priority Critical patent/CN102318091A/zh
Priority to EP10750967.1A priority patent/EP2406835A4/fr
Priority to RU2011134604/28A priority patent/RU2488195C2/ru
Priority to AU2010221920A priority patent/AU2010221920A1/en
Application filed by Nepes Led Corp filed Critical Nepes Led Corp
Priority to KR1020107005556A priority patent/KR101111256B1/ko
Priority to SG2011055852A priority patent/SG173518A1/en
Priority to JP2011553937A priority patent/JP2012520565A/ja
Publication of WO2010104276A2 publication Critical patent/WO2010104276A2/fr
Publication of WO2010104276A3 publication Critical patent/WO2010104276A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape

Landscapes

  • Led Device Packages (AREA)

Abstract

Boîtier DEL pour grille de connexion, grille de connexion utilisant le boîtier DEL, et procédé de fabrication du boîtier DEL. Pour la fabrication du boîtier DEL, une matière résineuse liquide transparente est disposée sur au moins deux protubérances annulaires présentant un bord supérieur vif et des parois latérales inclinées, et au moins une rainure annulaire est formée entre deux desdites protubérances annulaires, ce qui permet de réaliser facilement, en une passe, une couche de scellage à curbure convexe en utilisant la tension de surface.
PCT/KR2010/001134 2009-03-10 2010-02-24 Boîtier del pour grille de connexion, grille de connexion utilisant le boîtier del, et procédé de fabrication du boîtier del Ceased WO2010104276A2 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2011553937A JP2012520565A (ja) 2009-03-10 2010-02-24 Ｌｅｄリードフレームパッケージ、これを利用したｌｅｄパッケージ及び前記ｌｅｄパッケージの製造方法
SG2011055852A SG173518A1 (en) 2009-03-10 2010-02-24 Led leadframe package, led package using the same, and method of manufacturing the led package
EP10750967.1A EP2406835A4 (fr) 2009-03-10 2010-02-24 Boîtier del pour grille de connexion, grille de connexion utilisant le boîtier del, et procédé de fabrication du boîtier del
RU2011134604/28A RU2488195C2 (ru) 2009-03-10 2010-02-24 Комплект светодиодной выводной рамки, светодиодная группа, использующая данную рамку, и способ изготовления светодиодной группы
AU2010221920A AU2010221920A1 (en) 2009-03-10 2010-02-24 LED leadframe package, LED package using the same, and method of manufacturing the LED package
CN2010800077963A CN102318091A (zh) 2009-03-10 2010-02-24 Led引线框封装、使用led引线框封装的led封装及制造led封装的方法
KR1020107005556A KR101111256B1 (ko) 2009-03-10 2010-02-24 Ｌｅｄ 리드 프레임 패키지, 이를 이용한 ｌｅｄ 패키지 및 상기 ｌｅｄ 패키지의 제조 방법

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US12/381,408 2009-03-10
US12/381,408 US8058667B2 (en) 2009-03-10 2009-03-10 Leadframe package for light emitting diode device
US12/381,409 2009-03-10
US12/381,409 US8039862B2 (en) 2009-03-10 2009-03-10 White light emitting diode package having enhanced white lighting efficiency and method of making the same

Publications (2)

Publication Number Publication Date
WO2010104276A2 WO2010104276A2 (fr) 2010-09-16
WO2010104276A3 true WO2010104276A3 (fr) 2010-11-25

Family

ID=42728911

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/001134 Ceased WO2010104276A2 (fr) 2009-03-10 2010-02-24 Boîtier del pour grille de connexion, grille de connexion utilisant le boîtier del, et procédé de fabrication du boîtier del

Country Status (9)

Country Link
EP (1) EP2406835A4 (fr)
JP (1) JP2012520565A (fr)
KR (1) KR101111256B1 (fr)
CN (1) CN102318091A (fr)
AU (1) AU2010221920A1 (fr)
RU (1) RU2488195C2 (fr)
SG (1) SG173518A1 (fr)
TW (1) TW201044646A (fr)
WO (1) WO2010104276A2 (fr)

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CN102130236A (zh) * 2010-12-31 2011-07-20 北京大学深圳研究生院 一种led芯片的封装方法及封装器件
TW201238086A (en) * 2011-03-03 2012-09-16 Lextar Electronics Corp Chip package structure
CN102185042A (zh) * 2011-03-28 2011-09-14 北京大学深圳研究生院 Led封装方法、封装器件、光调节方法及系统
US9159886B2 (en) 2011-04-19 2015-10-13 Intellectual Discovery Co., Ltd. Lighting apparatus with a carrier layer
US8721097B2 (en) * 2011-05-19 2014-05-13 Taiwan Semiconductor Manufacturing Company, Ltd. LED lamp with improved light output
TWI418742B (zh) * 2011-06-30 2013-12-11 隆達電子股份有限公司 發光元件的封裝結構
KR101148780B1 (ko) * 2011-11-16 2012-05-24 김종율 엘이디 패키지 및 이의 제조방법
KR101287484B1 (ko) * 2012-03-07 2013-07-19 삼성전자주식회사 발광 소자 패키지
KR20130103080A (ko) * 2012-03-09 2013-09-23 서울반도체 주식회사 Ｌｅｄ 조명장치
KR20130110997A (ko) * 2012-03-30 2013-10-10 서울반도체 주식회사 Ｌｅｄ용 렌즈 및 그 제조방법
TWI489657B (zh) * 2012-04-12 2015-06-21 隆達電子股份有限公司 發光二極體封裝件
TWI474517B (zh) * 2012-05-28 2015-02-21 Lextar Electronics Corp 發光裝置及其製造方法
KR101321101B1 (ko) * 2012-06-01 2013-10-23 주식회사 코스텍시스 기판 및 이를 이용한 소자 패키지
CN103515517B (zh) * 2012-06-20 2016-03-23 展晶科技(深圳)有限公司 发光二极管模组
CN103515502A (zh) * 2012-06-29 2014-01-15 展晶科技(深圳)有限公司 发光二极管装置
US9608177B2 (en) 2013-08-27 2017-03-28 Lumens Co., Ltd. Light emitting device package and backlight unit having the same
KR101504309B1 (ko) * 2013-08-27 2015-03-20 주식회사 루멘스 발광 소자 패키지 및 이를 갖는 백라이트 유닛
KR102188500B1 (ko) 2014-07-28 2020-12-09 삼성전자주식회사 발광다이오드 패키지 및 이를 이용한 조명장치
JP6730017B2 (ja) * 2014-11-10 2020-07-29 エルジー イノテック カンパニー リミテッド 発光素子パッケージ、及びこれを含む照明システム
KR20160149363A (ko) 2015-06-17 2016-12-28 삼성전자주식회사 반도체 발광소자
CN106784260A (zh) * 2016-11-30 2017-05-31 深圳市聚飞光电股份有限公司 一种直下式led背光源的制作方法
KR102261288B1 (ko) * 2017-03-14 2021-06-04 현대자동차 주식회사 자동차 외장용 발광다이오드 패키지
CN109585632B (zh) * 2019-02-14 2019-07-30 旭宇光电（深圳）股份有限公司 大功率远程荧光粉型白光led散热封装
JP7445120B2 (ja) * 2020-02-21 2024-03-07 日亜化学工業株式会社 発光装置
CN112467010B (zh) * 2020-11-13 2022-03-22 中山市聚明星电子有限公司 二极管封装工艺及封装二极管
KR102338707B1 (ko) * 2021-06-14 2021-12-13 주식회사 소룩스 광원 및 조명장치
KR102634521B1 (ko) 2023-10-31 2024-02-07 장연식 통증 완화 약물 주입시스템

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Also Published As

Publication number Publication date
SG173518A1 (en) 2011-09-29
RU2488195C2 (ru) 2013-07-20
EP2406835A2 (fr) 2012-01-18
AU2010221920A1 (en) 2011-09-29
KR20100106297A (ko) 2010-10-01
JP2012520565A (ja) 2012-09-06
EP2406835A4 (fr) 2013-09-18
CN102318091A (zh) 2012-01-11
RU2011134604A (ru) 2013-04-20
TW201044646A (en) 2010-12-16
WO2010104276A2 (fr) 2010-09-16
KR101111256B1 (ko) 2012-02-22

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