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WO2010103943A1 - Matrice de module de caméra et son procédé de fabrication - Google Patents

Matrice de module de caméra et son procédé de fabrication Download PDF

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Publication number
WO2010103943A1
WO2010103943A1 PCT/JP2010/053196 JP2010053196W WO2010103943A1 WO 2010103943 A1 WO2010103943 A1 WO 2010103943A1 JP 2010053196 W JP2010053196 W JP 2010053196W WO 2010103943 A1 WO2010103943 A1 WO 2010103943A1
Authority
WO
WIPO (PCT)
Prior art keywords
lens
layer
lens group
camera module
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2010/053196
Other languages
English (en)
Japanese (ja)
Inventor
明 小坂
康隆 谷村
隆 松尾
夏樹 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Inc
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Priority to JP2011503768A priority Critical patent/JP5440600B2/ja
Publication of WO2010103943A1 publication Critical patent/WO2010103943A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/08—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present invention relates to a camera module array and a manufacturing method thereof.
  • MCU micro camera unit
  • a lens barrel and a lens holder that support a lens, a holder that supports an infrared (IR) cut filter, a substrate, an image sensor, and a casing that holds a laminate including optical elements, such a stack A resin or the like for sealing the body is required. For this reason, it has been difficult to produce a camera module by miniaturizing the above-mentioned many parts and combining each part with high accuracy.
  • IR infrared
  • a laminated member is formed by attaching a substrate, a semiconductor sheet on which a large number of imaging elements are formed, and a lens array sheet on which a large number of imaging lenses are formed through a resin layer, A technique for dicing the laminated member to complete each camera module has been proposed (for example, Patent Document 1).
  • a camera module is formed by laminating a layer including an image sensor, a layer including a lens, and the like in a wafer state (at the wafer level). For this reason, it is difficult to form a drive mechanism for moving a lens for realizing a function such as autofocus or zoom in the camera module.
  • the layer including the lens is formed at the wafer level, there is a problem that the manufacturing method and material are limited, and the degree of freedom in design is narrowed.
  • the present invention provides a camera module array in which the lens can be displaced and the posture of the lens can be stabilized while suppressing an increase in the size of the apparatus, and the degree of freedom in design can be widened. Objective.
  • a first aspect of the camera module array is a camera module array in which a plurality of camera modules are connected, and the camera module array includes an image sensor in which a plurality of image sensors are connected.
  • An elastic member array in which a plurality of elastic members each having a lower elastic member that urges and an upper elastic member that urges the lens unit from the other main surface side opposite to the one main surface of the lens unit. The elastic member array is stacked when the lens unit moves in the predetermined direction. A force in a direction opposite to the predetermined direction is applied to the lens unit, and the lens unit is held by the upper elastic member and the lower elastic member while being accommodated in the camera module. .
  • the elastic member array includes a lower elastic member array in which a plurality of the lower elastic members are connected, and an upper elastic member array in which the upper elastic members are connected in series.
  • the lens unit is sandwiched and held between the lower elastic member and the upper elastic member of each of the lower elastic member array and the upper elastic member array.
  • the lens unit includes one or more lenses.
  • the camera module array has a frame layer array in which a plurality of frame layers surrounding the lens unit provided separately from the lens unit are connected.
  • the frame layer array has a light shielding property.
  • the frame layer array is made of a conductor or an organic material containing a conductor.
  • a first aspect of a method for manufacturing a camera module array according to the present invention is the method for manufacturing a camera module array according to claim 1, wherein the lens unit is prepared (a), the imaging element array, (B) forming a laminate by laminating an actuator array and the elastic member array, and step (b) includes a step of incorporating the lens unit in the middle of the lamination of the laminate.
  • Array manufacturing method is the method for manufacturing a camera module array according to claim 1, wherein the lens unit is prepared (a), the imaging element array, (B) forming a laminate by laminating an actuator array and the elastic member array, and step (b) includes a step of incorporating the lens unit in the middle of the lamination of the laminate.
  • the step (a) is a step of preparing a wafer level lens having a lens portion formed by integrally raising a transparent resin on a transparent substrate. And dividing the wafer level lens into individual pieces to form the lens unit.
  • the step (a) forms the lens unit by integrally molding a lens and a holder for holding the lens by injection molding. And a step of performing.
  • an increase in the thickness of the device for moving the lens unit against the elastic force of the elastic member is suppressed, and the posture of the lens unit is stabilized. Therefore, it is possible to provide a camera module array in which the lens can be displaced, the posture of the lens can be stabilized, and the degree of freedom of design can be widened while suppressing an increase in size of the apparatus. Can do.
  • the posture of the lens unit can be further stabilized.
  • the lens unit only needs to include one or more lenses.
  • this corresponds to a configuration in which the lens and the holder that holds the lens are integrally formed. be able to.
  • the frame layer array includes a plurality of frame layers surrounding the lens unit provided separately from the lens unit, the manufacturing method and material of the lens unit are not easily limited. Design flexibility is widened.
  • the frame layer array is configured to have a light shielding property, it is possible to prevent unnecessary light from entering the lens unit.
  • the frame layer array is made of a conductor or an organic material containing a conductor, it can be used as an electromagnetic shield.
  • a manufacturing method suitable for the camera module array according to claim 1 can be provided.
  • a lens unit is obtained by dividing a wafer level lens having a lens portion formed by integrally raising a transparent resin on a transparent substrate into individual pieces.
  • the lens unit can also be obtained at the wafer level.
  • the lens unit is formed by integrally molding the lens and the holder for holding the lens by injection molding.
  • the lens unit is formed by integrally molding the lens and the holder for holding the lens by injection molding.
  • FIG. 1 is a schematic diagram showing a schematic configuration of a mobile phone 100 equipped with a camera module 500 according to the first embodiment of the present invention.
  • FIG. 1 and the drawings after FIG. 1 three axes XYZ orthogonal to each other are appropriately attached in order to clarify the orientation relationship.
  • the mobile phone 100 is configured as a foldable mobile phone, and includes a first housing 200, a second housing 300, and a hinge part 400.
  • the first casing 200 and the second casing 300 are each a plate-shaped rectangular parallelepiped and have a role as a casing for storing various electronic members.
  • the first casing 200 includes a camera module 500 and a display (not shown)
  • the second casing 300 includes a control unit that electrically controls the mobile phone 100, buttons, and the like. And an operating member (not shown).
  • the hinge part 400 connects the first casing 200 and the second casing 300 so as to be rotatable. For this reason, the mobile phone 100 can be folded.
  • FIG. 2 is a schematic cross-sectional view focusing on the first casing 200 of the mobile phone 100.
  • the camera module 500 is a small-sized imaging device having a XY cross-section of about 5 mm square and a thickness (depth in the Z direction) of about 3 mm, a so-called micro camera unit. (MCU).
  • MCU micro camera unit.
  • FIG. 3 is a schematic cross-sectional view of the camera module 500, and the direction indicated by the arrow AR1 corresponds to the + Z direction.
  • an arrow AR ⁇ b> 1 indicating a direction corresponding to the + Z direction is attached in order to clarify the orientation relationship.
  • the camera module 500 includes an optical unit KB in which a lens group 20 (lens unit) as a photographing optical system is movably provided, and an imaging unit PB that acquires a captured image related to a subject image. have.
  • the imaging unit PB has a configuration in which an imaging element layer 18 having an imaging element 181 such as a COMS sensor or a CCD sensor and a cover glass layer 17 are laminated in this order in the + Z direction.
  • the cover glass layer 17 may include a filter layer that cuts infrared rays (IR).
  • the optical unit KB includes a lid layer 10, a first frame layer 11, a first parallel spring (upper parallel spring) 12, a second frame layer 13, a second parallel spring (lower parallel spring) 14, an actuator layer 15, and lens position adjustment.
  • the layer 16 and the lens group 20 are provided.
  • the lid layer 10, the first frame layer 11, the first parallel spring 12, the second frame layer 13, the second parallel spring 14, the actuator layer 15, the lens position adjustment layer 16, and the lens group 20 are all in a wafer state (wafer Level). These manufacturing processes will be described later.
  • the lens position adjusting layer 16, the actuator layer 15, the second parallel spring 14, the second frame layer 13, the first parallel spring 12, the first frame layer 11, and the lid layer 10 are arranged in this order in the + Z direction.
  • the lens group 20 is held between the second parallel spring 14 and the first parallel spring 12 which are stacked.
  • the first parallel spring 12, the second parallel spring 14, and the actuator layer 15 cooperate with each other to move the lens group 20 in the direction along the Z axis.
  • the lid layer 10, the first and second frame layers 11 and 13, the lens position adjustment layer 16, the cover glass layer 17, and the imaging element layer 18 serve as a fixing portion for the lens group 20.
  • the lens group 20 is supported by first and second parallel springs 12 and 14 coupled to the fixed portion.
  • the second parallel spring 14 is interposed between the actuator layer 15 on the ⁇ Z side of the lens group 20 and the lens group 20.
  • a first parallel spring 12 is interposed between the first frame layer 11 on the + Z side of the lens group 20 and the lens group 20. That is, the lens group 20 is sandwiched between the first parallel spring 12 and the second parallel spring 14.
  • the posture of the lens group 20 is maintained regardless of the movement of the lens group 20, and the optical axis of the lens group 20 is substantially constant. Retained.
  • first and second parallel springs 12 and 14 apply a force in a direction opposite to the moving direction of the lens group 20 (that is, the + Z direction) when the lens group 20 as the moving object moves in the + Z direction.
  • the lens group 20 is given.
  • the direction of the force applied to the lens group 20 by the first and second parallel springs 12 and 14 is the moving direction of the lens group 20 (ie, ⁇ Z Direction).
  • the lens group 20 is moved by the elastic force of the first and second parallel springs 12 and 14 from the lens position adjusting layer 16.
  • the lens group 20 is supported by the lens position adjusting layer 16 by being pressed against the upper end surface of the protrusion 162.
  • the lens group 20 is placed at a predetermined position on the most ⁇ Z side of a range (displaceable range) that can be displaced along the Z axis and is stationary.
  • the predetermined position is set to a position at which the focal point of the optical unit KB is disposed on the + Z side surface (hereinafter also referred to as “imaging surface”) on which a large number of pixel circuits are arranged in the image sensor 181.
  • the focal point of the optical unit KB here refers to a point where light beams emitted from the optical unit KB gather at one point when parallel light beams enter the optical unit KB from the + Z side.
  • the optical unit KB corresponds to the “optical system” of the present invention.
  • the lens group 20 is pressed against the lens position adjusting layer 16 by the elastic force of the first and second parallel springs 12 and 14, so that a strong impact is applied to the camera module 500. Even in such a case, the posture of the lens group 20 is maintained.
  • the actuator layer 15 has a displacement generating part that generates a drive displacement in the + Z direction, and is disposed on the ⁇ Z side of the lens group 20.
  • the displacement generating unit comes into contact with the first protrusion 201 protruding to the ⁇ Z side of the lens group 20, and the drive displacement generated by the displacement generating unit is transmitted to the lens group 20 through the first protruding part 201. That is, the actuator layer 15 moves the lens group 20 that is a moving object in a predetermined direction (here, the + Z direction).
  • the lens group 20 In a scene where the drive displacement in the + Z direction in the displacement generating portion is reduced, the lens group 20 is in a direction opposite to the predetermined direction ( ⁇ Z direction) by the elastic force of the first and second parallel springs 12 and 14. Move to.
  • the lens group 20 that is a moving object is coupled to the first and second parallel springs 12 and 14 disposed at positions facing each other via the lens group 20,
  • the first and second parallel springs 12 and 14 are elastically deformed in a direction perpendicular to the lens group 20 (+ Z direction), and hold the posture of the lens group 20.
  • the lens group 20 receives a driving force from the displacement generating portion of the actuator layer 15 and displaces the position along the Z axis.
  • the optical unit KB provided in the camera module 500 can displace the lens group 20 in the optical axis direction (+ Z direction) of the lens group 20, and drive the camera module 500 to displace the lens group 20.
  • the optical unit KB provided in the camera module 500 can displace the lens group 20 in the optical axis direction (+ Z direction) of the lens group 20, and drive the camera module 500 to displace the lens group 20.
  • the lens group 20 is manufactured at a wafer level using a glass substrate as a base material, and is formed by, for example, superposing two or more lenses. In the present embodiment, a case where the lens group 20 is configured by overlapping two optical lenses is illustrated. In the present embodiment, the lens group 20 functions as an imaging lens that guides light from the subject to the imaging element 181.
  • FIG. 4 and 5 are schematic cross-sectional views of the lens group 20, and the direction indicated by the arrow AR2 corresponds to the + Z direction.
  • FIG. 6 is a bottom view of the lens group 20, and
  • FIG. 7 is a top view of the lens group 20.
  • the lens group 20 includes a first lens constituent layer LY1 having a first lens G1, a second lens constituent layer LY2 having a second lens G2, and a spacer layer RB. .
  • the first lens constituent layer LY1 and the second lens constituent layer LY2 are coupled via the spacer layer RB.
  • the outer edges of the non-lens portions of the first and second lens constituent layers LY1, LY2 have a substantially square shape.
  • the first and second lens constituent layers LY1 and LY2 correspond to the “lens layer” of the present invention.
  • the first lens surface does not function as a lens.
  • a protrusion 201 is provided on one main surface (here, the ⁇ Z side) of the first lens constituent layer LY1 having the first lens G1, the first lens surface does not function as a lens.
  • the one main surface (here, + Z side) of the second lens constituent layer LY2 having the second lens G2 is provided with a non-lens portion that does not function as a lens.
  • a second protrusion 202 is provided.
  • FIG. 8 is a view of the spacer layer RB as viewed from the ⁇ Z side, focusing on the shape of the spacer layer RB.
  • the spacer layer RB is provided along the outer edge of the non-lens portion of the first and second lens constituting layers LY1, LY2, and the outer edge and the inner edge of the ZY cross section are rectangular in shape. It has a configuration.
  • the optical axis of the lens group 20 is set in a direction along the Z axis.
  • each functional layer ⁇ About each functional layer> Below, the detail of each functional layer which comprises the camera module 500 is demonstrated.
  • the ⁇ Z side surface is referred to as one main surface
  • the + Z side surface is referred to as the other main surface.
  • Image sensor layer 18 As shown in FIG. 3, the image sensor layer 18 receives light from the subject that has passed through the optical unit KB, and generates an image signal related to the image of the subject, its peripheral circuit, and the image sensor 181. It is a member provided with the outer peripheral part which surrounds.
  • the image sensor 181 is configured by arranging a large number of pixel circuits.
  • a solder ball HB for performing soldering by a reflow method is provided on one main surface (the surface on the ⁇ Z side) of the imaging element layer 18.
  • various types of wiring for applying a signal to the image sensor 181 and reading a signal from the image sensor 181 are connected to one main surface of the image sensor layer 18. Terminals are provided.
  • the cover glass layer 17 has a substantially flat plate shape and an XY cross section having a substantially square shape, and is made of transparent glass or the like.
  • the cover glass layer 17 is bonded to the other main surface (+ Z side surface) of the image sensor layer 18 and has a function of protecting the image sensor 181.
  • the image sensor substrate 178 is configured with the cover glass layer 17 bonded to the image sensor layer 18.
  • the lens position adjustment layer 16 is configured by using a resin material, is disposed between the image sensor 181 and the lens group 20, and is a member that adjusts the distance between the image sensor 181 and the lens group 20. Specifically, the lens position adjustment layer 16 defines the position (initial position) of the lens group 20 in the non-driven state.
  • the lens position adjustment layer 16 is generated using, for example, a method of etching a resin.
  • FIG. 9 is a top view of the lens position adjusting layer 16.
  • FIG. 10 is a side view of the lens position adjustment layer 16.
  • the lens position adjustment layer 16 includes a frame body 161 and a protrusion 162.
  • the frame body 161 is a substantially rectangular annular portion constituting the outer peripheral portion of the lens position adjusting layer 16, and has a plate-like shape substantially parallel to the XY plane.
  • the frame body 161 forms a hole (through hole) 16H penetrating in the direction along the Z-axis.
  • the + Y side plate-like member and the ⁇ Y side plate-like member constituting the frame body 161 are: Each has a protruding portion 161T that protrudes toward the through hole 16H.
  • one main surface of the frame body 161 is bonded to the adjacent cover glass layer 17, and the other main surface of the frame body 161 is adjacent to the adjacent actuator layer 15 (specifically, the frame body 152 ( To be described later)).
  • the projecting portion 162 is configured to stand in the + Z direction in the vicinity of the inner edge of the convex portion 161T constituting the frame body 161.
  • the projection 162 is a plate-like portion having a substantially rectangular board surface substantially parallel to the XZ plane, and the longitudinal direction of the projection 162 is a direction substantially parallel to the X axis, and the short direction of the projection 162 Is a direction substantially parallel to the Z-axis.
  • the end surface on the + Z side of the protrusion 162 has a function of placing the lens group 20 at the initial position when the lens group 20 comes into contact therewith.
  • the protrusion 162 provided between the image sensor 181 and the lens group 20 as the moving object corresponds to the “contact portion” of the present invention.
  • a region where a plurality of pixel circuits constituting the image sensor 181 are arranged (hereinafter also referred to as “pixel array region”), that is, an outer edge of the front surface (image pickup surface) of the image sensor 181 is indicated by a broken line. Yes.
  • the protrusion 162 is disposed at a position where the optical path from the subject through the lens group 20 to the pixel array area of the image sensor 181 is sandwiched in the direction in which the width of the pixel array area is the narrowest. That is, the protrusion 162 is installed so as not to adversely affect the photographing and increase the size of the apparatus.
  • the actuator layer 15 is a thin plate-like member in which a displacement element (also referred to as “actuator element”) that generates a driving force is provided on a metal or silicon (Si) substrate.
  • FIG. 11 is a top view of the actuator layer 15.
  • FIG. 12 is a side view of the actuator layer 15.
  • the actuator layer 15 includes two frames that protrude from the frame body 152 with respect to the frame body 152 that forms the outer peripheral portion and the hollow portion inside the frame body 152.
  • the plate-like movable part 151 is provided.
  • a thin-film actuator element 153 is provided on the other main surface side of the movable portion 151.
  • the actuator element 153 for example, a thin film of shape memory alloy (SMA) is used.
  • SMA shape memory alloy
  • the movable portion 151 is set in a mold having a shape to be memorized, and a predetermined temperature (for example, , 600 ° C.) heating (shape memory processing) is performed.
  • SMA has a characteristic of restoring to a predetermined contracted shape (memory shape) stored in advance when the temperature exceeds a predetermined phase transformation temperature by heating and reaches a predetermined temperature. For this reason, when the SMA is heated by energization of the heater layer, the SMA contracts and deforms to have a memory shape, and the free end FT of the movable portion 151 moves in the + Z direction (see FIG. 12). That is, the free end FT side of the movable part 151 functions as a displacement generating part.
  • a predetermined contracted shape memory shape
  • the heater layer is energized from an electrode provided on the imaging element layer 18, and the conduction from the electrode to the heater layer is, for example, the actuator layer 15, the lens position adjusting layer 16, and the cover glass layer 17. What is necessary is just to carry out through the thin electroconductive member (not shown) affixed on the side surface.
  • the frame body 152 functions as a portion (movable reference portion) serving as a reference for displacement of the movable portion 151, and the actuator layer 15 functions as a drive layer.
  • the frame 152 of the actuator layer 15 is joined to the fixed frame 141 (see FIG. 13) of the second parallel spring 14.
  • the free end FT side of each movable portion 151 comes into contact with the corresponding first protrusion 201.
  • the displacement generated at the free end FT of each movable portion 151 is transmitted to the lens group 20 via each first protrusion 201. That is, each movable portion 151 applies a force to the lens group 20 in the + Z direction, thereby displacing the lens group 20 in the + Z direction.
  • the amount of displacement generated on the free end FT side of the movable portion 151 differs depending on the heating temperature of the SMA, and the amount of displacement is adjusted by controlling the amount of current supplied to the heater layer.
  • the heater layer is deformed as the SMA is deformed, and the electric resistance of the heater layer is changed according to the deformation of the heater layer. For this reason, the amount of displacement may be controlled by monitoring the current resistance value of the heater layer.
  • FIG. 13 is an external view of the lower surface of the second parallel spring 14.
  • FIG. 14 is a view showing the second parallel spring 14 joined to the lens group 20.
  • the second parallel spring 14 is an elastic member having a fixed frame 141 and an elastic portion 142, and is a layer (elastic layer) forming a spring mechanism.
  • the second parallel spring 14 constitutes the “plate-like elastic member layer” of the present invention.
  • the fixed frame 141 constitutes the outer peripheral portion of the second parallel spring 14 and is joined to the frame 152 of the adjacent actuator layer 15.
  • the elastic part 142 has a connection part PG1 with the fixed frame 141 and a joint part PG2 with the lens group 20, and the connection part PG1 and the joint part PG2 are connected by a plate-like member EB.
  • the second parallel spring 14 is joined to the adjacent actuator layer 15 in the fixed frame 141. Further, as shown in FIG. 14, the second parallel spring 14 is joined to the lens group 20 at a joint portion PG ⁇ b> 2 provided in the elastic portion 142.
  • the first projecting portion 201 contacts the vicinity of the free end FT of the actuator layer 15 through the gap between the fixed frame body 141 of the second parallel spring 14 and the plate-like member EB. That is, the second parallel spring 14 has a shape that does not contact the first protrusion 201 of the lens group 20.
  • the second parallel spring 14 can be elastically deformed in the optical axis direction ( ⁇ Z direction) of the lens group 20 by elastic deformation of the plate-like member EB, and functions as a spring mechanism.
  • the second parallel spring 14 is manufactured using a SUS metal material or phosphor bronze.
  • the shape of the parallel spring is patterned on the metal material by photolithography, and wet etching is performed by dipping in an iron chloride-based etchant. A pattern of parallel springs is formed.
  • Second frame layer 13 As shown in FIG. 3, the second frame layer 13 is a ring-shaped member in which the outer edge and the inner edge of the XY cross section are each substantially rectangular, and forms a hollow portion that penetrates along the Z-axis. The second frame layer 13 surrounds the lens group 20 from the side by arranging the lens group 20 in the hollow portion.
  • resin, glass, etc. are mentioned as a raw material which comprises the 2nd frame layer 13,
  • the 2nd frame layer 13 is manufactured by what is called a press method using a metal metal mold
  • the lower end surface (one main surface) located on the ⁇ Z side of the second frame layer 13 is joined to the fixed frame body 141 of the adjacent second parallel spring 14. Further, the upper end surface (other main surface) located on the + Z side of the second frame layer is joined to the adjacent first parallel spring 12 (specifically, a fixed frame body 121 (described later) of the first parallel spring 12).
  • First parallel spring 12 As shown in FIG. 13, the first parallel spring 12 is an elastic member having the same configuration and function as the second parallel spring 14, and includes a fixed frame body 121 and an elastic portion 122. In the present embodiment, the first parallel spring 12 constitutes the “plate-like elastic member layer” of the present invention.
  • One main surface of the fixed frame 121 is joined to the other main surface of the adjacent second frame layer 13, and the other main surface of the fixed frame 121 is connected to the adjacent first frame layer 11 (in detail, the first frame It is joined to the lower end surface (described later) of the layer 11 on the ⁇ Z side.
  • FIG. 15 is a view showing the first parallel spring 12 joined to the lens group 20.
  • the joint part PG ⁇ b> 2 provided in the elastic part 122 is joined to the upper end surface on the + Z side of the projection part 202 of the lens group 20.
  • First frame layer 11 As shown in FIG. 3, the first frame layer 11 is a ring-shaped member in which the outer edge and the inner edge of the XY cross section are each substantially rectangular like the second frame layer 13 and penetrates along the Z axis. Forming a hollow portion.
  • the hollow portion of the first frame layer 11 serves as a space in which the plate-like member EB and the protrusion 202 that are elastically deformed when the lens group 20 is moved in the + Z direction can move.
  • the first frame layer 11 is formed by the same material and manufacturing method as the second frame layer 13.
  • the lower end surface (one main surface) located on the ⁇ Z side of the first frame layer 11 is joined to the fixed frame body 121 of the adjacent first parallel spring 12. Moreover, the upper end surface (other end surface) located on the + Z side of the first frame layer is joined to the adjacent lid layer 10 (specifically, near the outer peripheral portion of the lid layer).
  • the outer edge of the XY cross section has a substantially square shape
  • the lid layer 10 has a hole (through hole) 10 ⁇ / b> H penetrating in a direction parallel to the Z axis at a substantially center, and is substantially in the XY plane. It is a plate-like member having a parallel board surface.
  • the through hole 10H is a hole for guiding light from the subject to the image sensor 181 through the lens group 20, and the lid layer 10 is formed by pressing a flat resin material or patterning the resin material.
  • the through hole 10H is formed and manufactured by a method of etching later.
  • FIG. 16 is a flowchart showing the manufacturing process of the camera module 500.
  • process A generation of the lens group 20 (step SP1),
  • process B sheet preparation (step SP2),
  • process C assembly jig preparation (step SP3),
  • process D First bonding of the sheet (step SP4),
  • Process E Mounting of the lens group 20 (Step SP5),
  • Process F Second bonding of the sheet (Step SP6),
  • Process G Image sensor substrate 178 (Step SP7) and
  • process H dicing
  • step SP1 the lens group 20 is generated.
  • a wafer in which a large number of lens groups 20 are arranged in a matrix (hereinafter also referred to as a “lens group wafer”) is manufactured, and a large number of lens groups 20 are separated into pieces by dicing. Produced.
  • the lens group wafer includes a wafer in which a large number of first lens constituent layers LY1 are arranged (first lens constituent layer wafer), a wafer in which a large number of spacer layers RB are arranged (spacer layer wafer), and a large number of second lenses.
  • a wafer (second lens constituent layer wafer) on which the constituent layers LY2 are arranged is stacked and bonded to each other.
  • FIG. 17 is a plan view schematically showing the first and second lens constituent layer wafers U20a and U20c.
  • FIG. 18 is a plan view schematically showing the spacer layer wafer U20b.
  • the first lens component layer wafer U20a is integrally configured by arranging a large number of first lens component layers LY1 in a matrix at first predetermined intervals.
  • the second lens component layer wafer U20c is configured integrally by arranging a large number of second lens component layers LY2 in a matrix at first predetermined intervals.
  • the spacer layer wafer U20b is configured integrally by arranging a number of spacer layers RB in a matrix at first predetermined intervals.
  • the spacer layer wafer U20b has a lattice structure in which a large number of through-holes having a substantially square outer edge are arranged in a matrix at first predetermined intervals.
  • the first lens component layer wafer U20a, the spacer layer wafer U20b, and the second lens component layer wafer U20c are stacked in this order and bonded to each other, and then the broken lines shown in FIGS. Each lens group 20 is separated into individual pieces by dicing along the line.
  • each first lens constituent layer LY1 in the first lens constituent layer wafer U20a is the same, and the manufacturing method of each second lens constituent layer LY2 in the second lens constituent layer wafer U20c is also the same. For this reason, here, description will be given focusing on the production of the first and second lens constituent layers LY1, LY2.
  • the first and second lens constituent layers LY1, LY2 are both produced by the same method using a glass substrate as a base material.
  • FIG. 19 is a diagram showing a state of manufacturing the first lens constituent layer LY1 having the first lens G1
  • FIG. 20 is a diagram showing a state of manufacturing the second lens constituent layer LY2 having the second lens G2. is there.
  • a wafer-like transparent substrate 20BS is prepared.
  • the material of the substrate 20BS include transparent materials such as glass such as so-called Tempax (registered trademark) and resins such as so-called PPMA.
  • a highly transparent acrylic or epoxy ultraviolet (UV) curable resin is applied to both surfaces of the substrate 20BS.
  • a transparent lens molding die 20CA having one curved surface shape of the first lens G1 is pressed from the upper surface of the substrate 20BS with a predetermined pressure, and the other curved surface of the first lens G1 is pressed from the lower surface of the substrate 20BS.
  • the transparent lens molding die 20CB having the shape and the shape of the first protrusion 201 is pressed with a predetermined pressure.
  • the ultraviolet rays UV1 are irradiated to form the polymer lenses GP1 and GP2 and the first protrusion 201 on each surface of the substrate 16BS.
  • the first lens constituent layer wafer U20a is manufactured.
  • the tip of the first protrusion 201 is a surface that contacts the actuator layer 15.
  • highly transparent acrylic or epoxy ultraviolet (UV) curable resin is applied to both surfaces of the substrate 20BS.
  • a transparent lens molding die 20CC having the shape of one curved surface of the second lens G2 and the shape of the second protrusion 202 is pressed from the upper surface of the substrate 20BS with a predetermined pressure, and the second lens G2 is pressed from the lower surface of the substrate 20BS.
  • a transparent lens molding die 20CD having the shape of the other curved surface of the two lenses G2 is pressed with a predetermined pressure.
  • ultraviolet rays UV1 are irradiated to form polymer lenses GP3 and GP4 and second protrusions 202 on each surface of the substrate 16BS.
  • the second lens constituent layer wafer U20c is manufactured.
  • the tip of the second protrusion 202 is a surface joined to the first parallel spring 12.
  • the spacer layer wafer U20b is manufactured, for example, by processing a wafer-like glass substrate by etching or the like.
  • Alignment marks for alignment are formed at two or more predetermined locations on the first and second lens component layer wafers U20a and U20c and the spacer layer wafer U20b manufactured in this way.
  • the first lens component layer wafer U20a, the spacer layer wafer U20b, and the second lens component layer wafer U20c are aligned and bonded while confirming the respective alignment marks using a mask aligner or the like.
  • the first and second lens constituent layers LY1, LY2 and the spacer layer RB constitute the lens group 20.
  • UV curing layers are provided on the upper and lower surfaces of the spacer layer RB to be bonded to the first and second lens constituent layers LY1 and LY2, and bonded by irradiating ultraviolet rays.
  • a method of irradiating plasma of an inert gas on the upper and lower surfaces of the spacer layer RB and bonding the surfaces of the spacer layer RB while being activated surface activated bonding method.
  • a method of forming a diaphragm layer with a resin material or the like colored separately in black is used.
  • a wafer (lens group wafer) in which a large number of lens groups 20 are arranged in a matrix is manufactured, and a large number of individual lens groups 20 are manufactured by dicing.
  • FIG. 21 is a plan view illustrating a configuration example of a sheet to be prepared. Here, it is assumed that a wafer-level disk-shaped sheet is prepared.
  • a large number of chips corresponding to members related to the functional layer are formed in a matrix in a predetermined arrangement.
  • a large number of chips corresponding to the first frame layer 11 are formed in a predetermined arrangement on the sheet (first frame layer sheet) U11 of the first frame layer 11.
  • predetermined array is used to include a state in which a large number of chips are arrayed at a predetermined interval in a predetermined direction (a state in which a plurality of chips are connected to form an array).
  • the first frame layer sheet U11 has a lattice shape in which side surfaces of chips corresponding to the first frame layer 11 are connected to each other.
  • the first frame layer sheet U11 is made of a resin material, glass, or the like.
  • the first frame layer sheet U11 is made of a resin material
  • the first frame layer sheet U11 is manufactured by a method such as press molding or injection molding using a metal mold.
  • the first frame layer sheet U11 is manufactured by, for example, so-called blasting using a metal or ceramic shadow mask.
  • the lens position adjustment layer 16 sheet (lens position adjustment layer sheet) U16 a large number of chips corresponding to the lens position adjustment layer 16 are formed in a predetermined arrangement.
  • the lens position adjustment layer sheet U16 has a shape in which side surfaces of chips corresponding to the lens position adjustment layer 16 are connected to each other.
  • the lens position adjustment layer sheet U16 is made of a resin material or the like.
  • the lens position adjusting layer sheet U16 is manufactured by manufacturing a mold having the shape of the lens position adjusting layer sheet U16, pouring resin into the mold, heating the resin together with the mold, and then cooling.
  • the lens position adjustment layer sheet U16 may be manufactured using injection molding or the like.
  • step SP2 as with the first frame layer sheet U11 and the lens position adjustment layer 16, the lid layer 10, the first parallel spring 12, the second frame layer 13, the second parallel spring 14, and the actuator layer 15 are used.
  • a sheet (imaging element substrate sheet) U178 (imaging element array) is prepared. That is, eight sheets U10 to 16 and U178 are prepared.
  • step SP3 the assembly jig 300 is prepared.
  • FIG. 22 is a diagram focusing on the part of the assembly jig 300 used for manufacturing each camera module 500.
  • the assembly jig 300 is configured by providing a large number of protrusions 301 having substantially the same shape on a flat base, in a predetermined arrangement.
  • alignment marks for alignment are formed at two or more predetermined locations. Further, the upper surface of the protrusion 301 is configured to be substantially parallel to the main surface of the flat base.
  • step SP4 Three sheets U11 to U13 among the eight prepared sheets U10 to U16 and U178 are joined.
  • FIG. 23 shows a state in which three sheets U11 to U13 are stacked and joined in step S4, a lens group 20 is attached in step S5, and four sheets U10 and U14 to U16 are stacked in step S6. It is a figure which shows typically a mode that it joins, and a mode that the image pick-up element board
  • step SP4 as shown in FIG. 23, with respect to the first frame layer sheet U11, the first parallel spring sheet U12 (upper elastic member array), and the second frame layer sheet U13 (frame layer array), the sheets U11 ⁇
  • the alignment is performed while maintaining the sheet shape so that the chips included in U13 are stacked on each other. Then, the sheets U11 to U13 are joined using an adhesive or the like.
  • FIGS. 24 to 26 are views showing how the sheets U11 to U13 are stacked and joined by paying attention to each chip constituting one camera module 500.
  • FIG. 24 to 26 the camera module 500 shown in FIG. 3 is shown upside down for convenience of the process.
  • the first frame layer sheet U11 is placed on the assembly jig 300 so that each first frame layer 11 is placed at a predetermined position on the base of the assembly jig 300. Placed.
  • the moving direction of the first frame layer sheet U11 when the first frame layer sheet U11 is carried on the assembly jig 300 is indicated by an arrow YJ1.
  • the first frame layer sheet is formed by joining the fixed frame body 121 constituting the outer peripheral portion of the first parallel spring 12 on one main surface of the first frame layer 11.
  • the first parallel spring seat U12 is joined to U11.
  • the fixed frame 121 is pressed against the one main surface of the first frame layer 11 in the direction indicated by the arrow YJ2, and the other main surface of the fixed frame 121 and the first frame layer 11 The main surface is joined.
  • the joint portion PG2 of the first parallel spring 12 is brought into contact with the upper surface of the protrusion 301 of the assembly jig 300, whereby the substantially parallel plate shape of the first parallel spring 12 is maintained.
  • the first main surface of the second frame layer 13 is joined to the first main surface of the fixed frame 121 constituting the outer peripheral portion of the first parallel spring 12.
  • the second frame layer sheet U13 is joined to the parallel spring sheet U12.
  • the second frame layer 13 is pressed against the main surface of the fixed frame 121 of the first parallel spring 12 in the direction indicated by the arrow YJ3, and the main surface of the fixed frame 121 The other main surface of the two-frame layer 13 is joined.
  • FIG. 27 is a diagram illustrating a state in which the lens group 20 is attached.
  • step SP5 the lens group 20 generated in step SP1 is attached to a hollow portion of each second frame layer 13 of the unit manufactured in step SP4 by a predetermined mounter. That is, the lens group 20 is inserted into each gap of the second frame layer sheet U13 having a lattice shape.
  • the end surfaces of the two second protrusions 202 of the lens group 20 are joined to the joint PG2 of the first parallel spring 12, respectively.
  • the end surface of the second protrusion 202 is joined to the one main surface side of the joint portion PG2.
  • an adhesive (ultraviolet curable adhesive) that is cured by irradiation of ultraviolet rays is applied in advance to the end surface of the second protrusion 202 of the lens group 20, and the second protrusion 202 of the lens group 20 is applied.
  • abutted with respect to the junction part PG2 of the 1st parallel spring 12 is mentioned.
  • step SP6 Sheet second joining (process F): In step SP6, as shown in FIG. 23, four sheets U10, U14 to U16 of the eight sheets U10 to U16 and U178 prepared in step SP2 are joined.
  • step SP6 the second parallel spring sheet U14 (lower elastic member array) and the actuator layer sheet U15 (actuator array) are arranged on one main surface side of the units generated up to step SP5.
  • the alignment is performed in the sheet shape so that the included chips are stacked on the respective chips included in the second frame layer sheet U13. And each sheet
  • the sheet is so formed that each chip included in the lid layer sheet U10 is stacked with respect to each chip included in the first frame layer sheet U11 with respect to the other main surface side of the first frame layer sheet U11. Alignment (alignment) is performed in the shape. In this state, the lid layer sheet U10 is bonded to the other main surface side of the first frame layer sheet U11 using an adhesive or the like.
  • the sheet-like shape is formed so that each chip included in the lens position adjustment layer sheet U16 is stacked on each chip included in the actuator layer sheet U15 with respect to one main surface side of the actuator layer sheet U15.
  • the alignment is performed as it is.
  • the lens position adjustment layer sheet U16 is bonded to the other main surface side of the actuator layer sheet U15 using an adhesive or the like.
  • FIG. 28 to FIG. 31 are views showing how the sheets U10 and U14 to U16 are laminated and joined, focusing on each chip constituting one camera module 500.
  • FIGS. 30 and 31 the upper and lower sides of the camera module 500 shown in FIG. 3 are shown in the same state.
  • the spring seat U14 is joined.
  • the joint part PG2 of the second parallel spring 14 is joined to the non-lens part of the first lens constituent layer LY1 of the lens group 20 by an adhesive or the like.
  • the actuator layer sheet U15 is bonded onto one main surface of the second parallel spring sheet U14 so that the actuator layer 15 is bonded to one main surface of the second parallel spring 14.
  • each movable portion 151 of the actuator layer 15 comes into contact with the corresponding first protrusion 201 and the free end FT of each movable portion 151 is pushed up in the direction corresponding to the ⁇ Z side. It becomes a state.
  • the unit formed by joining the actuator layer sheet U15 on the second parallel spring sheet U14 is removed from the assembly jig 300, and the lid layer sheet is attached to the unit. U10 is joined.
  • the lens group 20 is held by the first and second parallel springs 12, 14, so that the lens group 20 floats in the air. It becomes.
  • the unit joined up to the actuator layer sheet U15 is turned upside down, and the outer peripheral portion of the lid layer 10 is pressed against the other main surface of the first frame layer 11 in the direction indicated by the arrow YJ7. Meanwhile, the other main surface of the first frame layer 11 and one main surface of the outer peripheral portion of the lid layer 10 are joined by an adhesive or the like.
  • the lens with respect to one main surface of the actuator layer sheet U15 is so joined that one main surface of the frame body 152 of the actuator layer 15 is bonded to the frame body 161 of the lens position adjusting layer 16.
  • the position adjustment layer sheet U16 is joined.
  • the unit formed by joining up to the lid layer sheet U10 is placed on the other main surface of the lens position adjustment layer sheet U16, and the unit is pushed down in the direction indicated by the arrow YJ8.
  • the other main surface of the lens position adjustment layer sheet U16 and one main surface of the actuator layer sheet U15 are bonded together with an adhesive or the like.
  • the upper end surface of the protrusion 162 of the lens position adjustment layer 16 contacts a part of the non-lens portion of the first lens constituent layer LY1 of the lens group 20, and the lens group 20 is pushed up to the lid layer 10 side.
  • the force by which the movable portion 151 of the actuator layer 15 is pushed down by the first projection 201 is reduced, and the free end FT of the movable portion 151 of the actuator layer 15 that has been pushed down by the first projection 201 rises in the + Z direction. To do.
  • the movable part 151 hardly generates an elastic force, that is, the shape of the movable part 151 is substantially flat.
  • the extending distance along the Z axis of the first protrusion 201 and the protrusion 162 is set so that the state where the first protrusion 201 and the free end FT are in contact with each other is maintained.
  • the free end FT does not come into contact with the first protrusion 201 and is swung in an inefficient manner. Is prevented.
  • both the first and second parallel springs 12 and 14 have a large displacement in the position of the joint portion PG2 in the + Z direction with respect to the connection portion PG1, that is, bending deformation (flexure deformation) of the plate-like member EB. That is, each plate member EB is elastically deformed and stress (elastic force) is charged so that each joint portion PG2 is displaced toward the lid layer 10 side.
  • the lens group 20 is pressed against the upper end surface of the protrusion 162 of the lens position adjusting layer 16 by the elastic force generated in each plate member EB.
  • the pressing force of the lens group 20 against the protrusion 162 suppresses the occurrence of deviations in the posture and position of the lens group 20 such as the tilt amount regardless of the holding posture of the camera module 500 by the user.
  • step SP7 the lens position adjusting layer sheet is bonded so that the outer peripheral portion of the image sensor substrate 178 is bonded to the frame 161 of the lens position adjusting layer 16 of the unit formed by bonding the lens position adjusting layer 16.
  • the other main surface of the imaging element substrate sheet U178 is bonded to one main surface of U16.
  • step SP8 a large number of lens groups 20 are respectively inserted, and a laminated member formed by laminating eight sheets U10 to U16 and U178 is protected by a dicing tape or the like and then separated into chips by a dicing device. . At this time, a large number of camera modules 500 are completed.
  • the actuator element 153 of the actuator layer 15 contracts and deforms due to heating by energization of the heater layer provided in the actuator layer 15. I do. Then, the free end FT of the movable portion 151 is displaced in the + Z direction. Note that the amount of displacement generated on the free end FT side of the movable portion 151 differs depending on the heating temperature of the SMA, and the amount of displacement is adjusted by controlling the amount of current supplied to the heater layer.
  • SMA shape memory alloy
  • the electric resistance of the heater layer also changes in accordance with the deformation of the heater layer accompanying the deformation of the SMA, the current resistance value of the heater layer is monitored, and the displacement amount of the free end FT, that is, the lens group 20 It is possible to control the amount of displacement.
  • the thickness along the Z axis of the first frame layer 11 ensures a space in which the lens group 20 moves, that is, a movable range (stroke) along the Z axis of the lens group 20.
  • the extension distance along the Z axis of the second protrusion 202 is such that the lens group 20 is pushed up in the + Z direction when the lens position adjusting layer 16 is bonded to the actuator layer 15 and the lens group 20. Is greater than or equal to the distance obtained by adding the distance movable in the + Z direction (movable distance).
  • the camera module 500 has the first and second parallel springs 12 and 14 that restrict the movement of the lens group 20, and performs AF control (focusing) by the movement of the lens group 20. Control) is realized.
  • the lens group 20 In the non-driven state, when the lens group 20 is pressed against the lens position adjusting layer 16 by the first and second parallel springs 12 and 14, and the movable portion 151 of the actuator layer 15 is deformed, The lens group 20 is configured to move against the elastic force of the second parallel springs 12 and 14.
  • the Z-axis of the camera module 500 is aligned. It is not necessary to increase the thickness in the direction (optical axis direction). In particular, even when the posture of the camera module 500 is variously changed in the non-driven state, the inclination of the lens group 20 and the like are suppressed, so that the posture of the lens group 20 is stabilized. Therefore, it is possible to displace the lens while suppressing an increase in the size of the apparatus, and it is possible to stabilize the posture of the lens.
  • the camera module 500 is configured by laminating a plurality of layers, a small and thin camera module 500 is realized. Therefore, the displacement of the lens and the stabilization of the posture of the lens can be achieved while suppressing an increase in the size of the apparatus.
  • a lens position adjusting layer 16 having a protrusion 162 with which the lens group 20 abuts is separately provided between the image sensor 181 and the lens group 20. For this reason, in order to set the lens group 20 to the initial position, it is possible to easily manufacture a portion (contact portion) with which the lens group 20 is brought into contact.
  • the lens group 20 when the lens group 20 is in contact with the lens position adjusting layer 16 in the non-driven state, the lens group 20 is focused on a subject located at infinity with the camera module 500 as a reference. It is arranged at a predetermined position.
  • the lens group 20 can be easily and accurately arranged at a predetermined position generally adopted as an initial state of focus control.
  • the lens group 20 is disposed at a predetermined position so that a subject located at infinity with the camera module 500 as a reference can be focused by simply joining the layers without performing any special adjustment operation thereafter. can do.
  • the protrusion 162 is disposed at a position that sandwiches the optical path from the subject through the lens group 20 to the pixel array region of the image sensor 181 in the direction in which the width of the pixel array region is the narrowest. For this reason, the protrusion 162 corresponding to the contact portion can be installed without adversely affecting the photographing and without enlarging the apparatus.
  • the lens position adjustment layer 16 is provided in which the lens group 20 is brought into contact with the lens group 20 in the non-driven state and the lens group 20 is disposed at the initial position.
  • the lens group 20 itself may be provided with a structure for disposing the lens group 20 at the initial position without providing the lens position adjusting layer 16.
  • a specific example will be described.
  • FIG. 32 is a schematic cross-sectional view of a camera module 500A according to a modification of the present invention.
  • the lens position adjustment layer 16 is removed from the camera module 500 according to the above-described embodiment, and the lens group 20 is changed to a lens group 20A (lens unit) having a different configuration. It has been changed.
  • the optical unit KB is changed to the optical unit KBA with the lens group 20 being changed to the lens group 20A.
  • the mobile phone 100A according to the modification includes a first housing 200A provided with a camera module 500A.
  • the same reference numerals are assigned and description thereof is omitted, and different parts will be described below.
  • FIG. 33 is a bottom view of the lens group 20A.
  • the lens group 20A includes two first protrusions 201 on one main surface of the non-lens part of the first lens constituent layer LY1 of the lens group 20 according to the embodiment.
  • it has a configuration in which four third protrusions 203 are added. That is, the third protrusion 203 is formed integrally with the first lens G1.
  • the third protrusion 203 is made of, for example, resin, and the extension distance of the third protrusion 203 along the Z axis is longer than the extension distance of the first protrusion 201 along the Z axis. Yes.
  • the third protrusion 203 for example, when the first lens constituent layer LY1 is manufactured, the same technique as the first protrusion 201 together with the first protrusion 201 on the one main surface side of the substrate 16BS is used. It may be formed by.
  • FIG. 34 is a diagram showing the second parallel spring 14 joined to the lens group 20A. As shown in FIG. 34, the third protrusion 203 is provided so as not to contact the plate-like member EB of the second parallel spring 14.
  • the tip end portion of the third protrusion 203 abuts against the other main surface of the cover glass layer 17 in the non-driven state.
  • the cover glass layer 17 is bonded to the actuator layer 15, the other main surface of the cover glass layer 17 abuts on the tip of the third protrusion 203, and the third protrusion 203 is Pushed up to the + Z side.
  • the lens group 20A is pushed up to the + Z side, the plate-like members EB of the first and second parallel springs 12 and 14 are deformed to the lid layer 10 side.
  • the lens group 20A is pushed down by the elastic force of the first and second parallel springs 12 and 14, and the third protrusion 203 is formed on the cover glass layer.
  • the lens group 20 ⁇ / b> A is arranged at a predetermined position by being pressed against the other main surface 17.
  • the other main surface of the cover glass layer 17 corresponds to a portion where the lens group 20A abuts and places the lens group 20A in the initial position, that is, a “contact portion” of the present invention.
  • a space for moving the lens group 20A corresponding to the moving object against the elastic force of the first and second parallel springs 12 and 14 is provided as in the above embodiment.
  • the tilt of the lens group 20A is suppressed, so that the posture of the lens group 20 is stabilized. Therefore, the lens can be displaced and the posture of the lens can be stabilized while suppressing an increase in the size of the apparatus.
  • the third protrusion 203 of the lens group 20A has a configuration that comes into contact with the other main surface of the cover glass layer 17 corresponding to the contact portion. For this reason, the enlargement of the apparatus accompanying the increase in the number of layers which comprise the camera module 500A is suppressed. It is also possible to reduce the manufacturing cost of the camera module 500A.
  • the third projection 203 that contacts the other main surface of the cover glass layer 17 and the first lens G1 are integrally configured. For this reason, the 3rd projection part 203 can be manufactured comparatively easily and with sufficient precision.
  • the stress design concerning the 2nd parallel spring 14 it is also possible to form the 3rd projection part 203 suitably so that it may not contact the 2nd parallel spring 14.
  • the image pickup device substrate sheet U178 on which the image pickup device substrate sheet 178 is arranged is shipped to the customer in a state before the image pickup device substrate sheet U178 is attached, and the steps after the attachment of the image pickup device substrate sheet U178 are performed by the customer.
  • the lens group 20 ⁇ / b> A is transported in an unstable state that is not held by the cover glass layer 17.
  • the lens position adjustment layer sheet U16 in which a large number of lens position adjustment layers 16 are arranged is bonded as in the above embodiment. It is preferable to ship the lens group 20 to the customer in the state of the unit because the lens group 20 is held by the lens position adjusting layer 16 and transported in a stable state. Specifically, for example, the occurrence of problems such as plastic deformation due to stress concentration of the first and second parallel springs 12 and 14 is suppressed, which is preferable.
  • the aspect ratio related to the shape that can be produced by molding there is a limit of the aspect ratio related to the shape that can be produced by molding.
  • the extending distance along the Z axis is long, that is, rather than manufacturing the lens group 20A having the third protrusion 203 having a large aspect ratio.
  • the lens group 20 in the non-driven state, the lens group 20 abuts against the lens position adjustment layer 16 so that a subject located at infinity with the camera module 500 as a reference is focused.
  • the lens group 20 is installed at a predetermined position, but the present invention is not limited to this.
  • the predetermined position where the lens group 20 is in contact with the lens position adjustment layer 16 is closer to the image sensor 181 than the position of the lens group 20 where the focal point of the lens group 20 is on the imaging surface of the image sensor 181. It may be a position.
  • FIG. 35 is a diagram schematically illustrating the positional relationship between the focal point of the lens group 20 and the image sensor 181 according to the above embodiment
  • FIG. 36 illustrates the focal point of the lens group 20 and the image sensor 181 according to this modification. It is a figure which shows typically the positional relationship of these.
  • the focus FP of the lens group 20 is imaged. It is disposed on the imaging surface of the element 181.
  • FIG. 36 when the lens group 20 is in contact with the lens position adjusting layer 16 and is disposed at a predetermined position, The focal point FP is disposed at a position opposite to the lens group 20 with respect to the imaging surface of the imaging element 181.
  • the lens group 20 can be arranged.
  • the initial position of the lens group 20 may be the position of the lens group 20 that focuses on a subject that is located very close to the camera module 500.
  • the lens group 20 includes the first and second lenses G1 and G2.
  • the present invention is not limited to this.
  • the lens group 20 may be an optical system having one lens. That is, the optical system that is the moving object may include one or more optical lenses.
  • the focus control is performed by moving the lens group 20, but the present invention is not limited to this.
  • a so-called zoom operation may be realized by moving the lens group 20.
  • SMA is used as the actuator element 153.
  • the actuator element 153 is not limited to this.
  • a so-called bi-metal strip may be used.
  • a film made of a material having a coefficient of thermal expansion different from that of the substrate may be formed instead of SMA. That is, the movable part may be configured to include a substrate and a thin film formed on the substrate and having a different coefficient of thermal expansion from the substrate.
  • a layer (metal layer) of a metal material such as aluminum or nickel is formed on one main surface side of a substrate of a movable part made of Si.
  • the movable portion is deformed due to the difference in thermal expansion coefficient, and the free end of the movable portion is displaced in the + Z direction.
  • the free end of the movable part tends to be displaced unintentionally in proportion to changes in the environmental temperature.
  • the movable portion 151 has a force with which the lens group 20 is pressed in the ⁇ Z direction against the lens position adjusting layer 16 by the first and second parallel springs at the upper limit of the assumed operating environment temperature. If the force is larger than the force exerted on the lens group 20, the posture of the lens group 20 is not broken.
  • the actuator element for example, a thin film (piezoelectric thin film) of a piezoelectric element such as an inorganic piezoelectric body (PZT) or an organic piezoelectric body (PVDF) may be used. That is, the movable part may be configured to include a substrate and a thin film of a piezoelectric element formed on the substrate.
  • a piezoelectric thin film is used as the actuator element, an electrode, a piezoelectric thin film, and an electrode are formed on the Si substrate in this order using a sputtering method or the like, and poling with a high electric field is performed.
  • the lens group 20 that is the moving object is configured to include the first and second lens constituent layers LY1 and LY2, but is not limited thereto.
  • the moving object may be configured by one or more layers including one or more lens layers.
  • the plate-like first and second parallel springs 12 and 14 are employed as members for restricting the movement of the lens group 20, but the present invention is not limited to this.
  • various elastic members including a helical spring may be employed.
  • the camera module 500 has a so-called wafer level camera configuration obtained by laminating a plurality of functional layers at the wafer level, but the technical idea of the present invention is that each functional layer Is applicable to general imaging devices including imaging devices that are not layered.
  • the configuration in which the lens group 20 is formed at the wafer level has been described.
  • the group 20B (lens unit) is held by the first parallel spring 12 and the second parallel spring 14, and the first parallel spring 12, the second parallel spring 14, and the actuator layer 15 cooperate with each other, so that the lens group You may take the structure which moves 20B to the direction along a Z-axis.
  • FIG. 37 the same components as those of the camera module 500 shown in FIG. 3 are denoted by the same reference numerals, and redundant description is omitted.
  • the camera module 500B includes an optical unit KBB in which a lens group 20B as a photographing optical system is movably provided, and an imaging unit PB that acquires a photographed image related to the subject image.
  • the lid layer 10, the first and second frame layers 11, 13, the lens position adjusting layer 16, the cover glass layer 17, and the image sensor layer 18 serve as a fixing portion for the lens group 20B.
  • the lens group 20B is supported by the first and second parallel springs 12 and 14 coupled to the fixed portion.
  • the second parallel spring 14 is interposed between the lens group 20 and the actuator layer 15 on the ⁇ Z side of the lens group 20B.
  • a first parallel spring 12 is interposed between the first frame layer 11 on the + Z side of the lens group 20B and the lens group 20B. That is, the lens group 20 ⁇ / b> B is sandwiched between the first parallel spring 12 and the second parallel spring 14.
  • the posture of the lens group 20 is maintained regardless of the movement of the lens group 20B, and the optical axis of the lens group 20 is substantially constant. Retained.
  • first and second parallel springs 12 and 14 apply a force in a direction opposite to the moving direction of the lens group 20B (that is, the + Z direction) when the lens group 20B as the moving object moves in the + Z direction. This is applied to the lens group 20B.
  • the direction of the force applied to the lens group 20B by the first and second parallel springs 12 and 14 is the moving direction of the lens group 20 (ie, ⁇ Z Direction).
  • the lens group 20B is moved by the elastic force of the first and second parallel springs 12 and 14 from the lens position adjusting layer 16.
  • the lens group 20 ⁇ / b> B is pressed against the upper end surface of the protrusion 162, and the lens position adjustment layer 16 also supports the lens group 20 ⁇ / b> B.
  • the lens group 20B is disposed at a predetermined position on the most ⁇ Z side of the range (displaceable range) that can be displaced along the Z axis, and is stationary.
  • the lens group 20B is pressed against the lens position adjusting layer 16 by the elastic force of the first and second parallel springs 12 and 14, so that a strong impact is applied to the camera module 500B. Even in such a case, the posture of the lens group 20B is maintained.
  • the actuator layer 15 has a displacement generating portion that generates a driving displacement in the + Z direction, and is disposed on the ⁇ Z side of the lens group 20B.
  • the displacement generating unit comes into contact with the first protrusion protruding to the ⁇ Z side of the lens group 20B, and the drive displacement generated in the displacement generating unit is transmitted to the lens group 20 via the first protruding part 201. That is, the actuator layer 15 moves the lens group 20B, which is a moving object, in a predetermined direction (here, the + Z direction).
  • the lens group 20B In a scene where the drive displacement in the + Z direction at the displacement generating portion is reduced, the lens group 20B is in a direction opposite to the predetermined direction ( ⁇ Z direction) by the elastic force of the first and second parallel springs 12 and 14. Move to.
  • the lens group 20B includes a first lens G1 and a second lens G2, and a lens holder HL that accommodates them. From the two openings of the hollow cylindrical holder HL, the first lens G1 and the second lens G2, respectively.
  • the lens group 20 ⁇ / b> B functions as an imaging lens that guides light from the subject to the imaging device 181.
  • the first lens G1, the second lens G2, and the holder HL can be formed by injection molding a resin such as polycarbonate, and are formed separately after the first lens G1 and the second lens G2 are molded.
  • the lens group 20B can be formed by being incorporated in the holder HL.
  • the first lens G1 and the second lens G2 can also be formed of a glass material. In this case, the first lens G1 and the second lens G2 are molded and polished, and then incorporated into the holder HL. .
  • the first lens G1, the second lens G2, and the holder HL are all integrally formed by injection molding. That is, by polishing the inner surface of a mold corresponding to a lens portion called a lens core with an accuracy corresponding to the polishing roughness of the lens main surface, all can be integrally formed by injection molding. .
  • the lens core is configured to be separable from the mold corresponding to the holder HL, and only the polishing accuracy of the lens core can be dramatically increased.
  • the manufacturing process can be simplified as compared with the case where the first lens G1, the second lens G2, and the holder HL are separately injection-molded.
  • the configuration includes the first lens G1 and the second lens G2.
  • the lens group 20B is also referred to as a lens group 20B.
  • the lens group 20B has four ribs RB that protrude from the side surface of the cylindrical holder HL at equal intervals.
  • the two ribs RB having a common center line are on the opposite side ( ⁇ Z direction) from the direction indicated by the arrow AR1 at the end opposite to the side surface of the cylindrical holder HL. It has the 1st protrusion part 201 which protrudes, and in another 2 rib RB, it protrudes in the direction (+ Z direction) which arrow AR1 shows in the edge part on the opposite side to the side surface of the cylindrical holder HL.
  • a second protrusion 202 is provided.
  • the first protrusion 201 contacts the displacement generation part of the actuator layer 15, and the second protrusion 202 is joined to the first parallel spring 12 as shown in FIG.
  • the upper end surface on the + Z side of the second protrusion 202 is joined to the joint PG2 provided on the elastic part 122 of the first parallel spring 12.
  • the process of incorporating the lens group 20B having such a configuration into the camera module 500B is the same as the process of incorporating the lens group 20 described with reference to FIGS.
  • the chips included in the sheets U11 to U13 are stacked on each other.
  • alignment is performed with the sheet shape.
  • the sheets U11 to U13 are joined using an adhesive or the like.
  • the individual lens groups 20B are inserted into the respective gaps of the second frame layer sheet U13 having a lattice shape.
  • the end surfaces of the two second protrusions 202 of the lens group 20B are joined to the joint PG2 of the first parallel spring 12, respectively.
  • an adhesive (ultraviolet curing adhesive) that is cured by irradiation of ultraviolet rays is applied in advance to the end face of the second protrusion 202 of the lens group 20B, and the second protrusion 202 of the lens group 20B is applied.
  • abutted with respect to the junction part PG2 of the 1st parallel spring 12 is mentioned.
  • the individual lens group 20B (or lens group 20) is inserted into the laminate of the sheets U11 to U13, the second parallel spring sheet U14 (lower elastic member array), and the actuator layer sheet U15 (actuator array). Alignment (alignment) is performed with the sheet shape so that each chip included in each is stacked with respect to each chip included in the second frame layer sheet U13, and the sheets U14 and U15 are used with an adhesive or the like Further, the state immediately before dicing, in which the lens position adjustment layer sheet U16 and the imaging element substrate sheet U178 (imaging element array) are joined, is called a camera module array, and is shipped as a product in this state. There is also.
  • the first frame layer sheet U11 and the second frame layer sheet U13 are made of a resin material, glass, or the like.
  • the first frame layer sheet U11 and the second frame layer sheet U13 are made of an organic material such as a resin
  • the first frame layer sheet U11 and the second frame layer sheet U13 have conductivity, for example.
  • a resin material kneaded with carbon black unnecessary light from the outside can be shielded, and the first frame layer 11 and the second frame layer 13 can be used as electromagnetic shields.
  • the lens group 20B formed by a conventional method is used instead of the lens group 20 formed at the wafer level, so that the camera module 500B is limited to a wafer-like material. Therefore, the degree of freedom in designing the optical system can be increased, and both the low cost when the camera module is manufactured at the wafer level and the versatility of the design when using the individual lens can be achieved.
  • a function as an electromagnetic shield can be provided, so that unnecessary light from the outside can be prevented from entering the lens group 20 and malfunction of the actuator layer 15 can be prevented.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)

Abstract

La présente invention concerne une matrice de module de caméra capable de déplacer la lentille, de stabiliser l'attitude de la lentille et d'augmenter le degré de liberté de conception tout en évitant l'agrandissement d'un dispositif. Un groupe de lentilles à l'état de pièces séparées est donc inséré dans chacune des cavités d'une deuxième feuille de couche de structure présentant une forme de grille après que la feuille de chacune des couches a été liée. Dans ce cas, chacune des surfaces d'extrémité de deux deuxièmes parties en saillie du groupe de lentilles est assemblée à la jonction d'un premier ressort parallèle.
PCT/JP2010/053196 2009-03-11 2010-03-01 Matrice de module de caméra et son procédé de fabrication Ceased WO2010103943A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011503768A JP5440600B2 (ja) 2009-03-11 2010-03-01 カメラモジュールアレイおよびその製造方法

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JP2009057659 2009-03-11
JP2009-057659 2009-03-11

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WO2010103943A1 true WO2010103943A1 (fr) 2010-09-16

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JP (1) JP5440600B2 (fr)
WO (1) WO2010103943A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015019716A1 (fr) * 2013-08-08 2015-02-12 コニカミノルタ株式会社 Dispositif de commande d'objectif et dispositif d'imagerie

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000284157A (ja) * 1999-03-31 2000-10-13 Brother Ind Ltd レンズユニット及びレンズユニットを備えた光走査装置
JP2003238820A (ja) * 2002-02-20 2003-08-27 Nidec Copal Corp 光学機器用帯電防止樹脂材料
JP2005539276A (ja) * 2002-09-17 2005-12-22 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法
JP2008191332A (ja) * 2007-02-02 2008-08-21 Mitsumi Electric Co Ltd カメラモジュール

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000284157A (ja) * 1999-03-31 2000-10-13 Brother Ind Ltd レンズユニット及びレンズユニットを備えた光走査装置
JP2003238820A (ja) * 2002-02-20 2003-08-27 Nidec Copal Corp 光学機器用帯電防止樹脂材料
JP2005539276A (ja) * 2002-09-17 2005-12-22 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法
JP2008191332A (ja) * 2007-02-02 2008-08-21 Mitsumi Electric Co Ltd カメラモジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015019716A1 (fr) * 2013-08-08 2015-02-12 コニカミノルタ株式会社 Dispositif de commande d'objectif et dispositif d'imagerie

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