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WO2010039932A1 - Construction d'un appareil photographique ayant un nombre réduit de composants - Google Patents

Construction d'un appareil photographique ayant un nombre réduit de composants Download PDF

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Publication number
WO2010039932A1
WO2010039932A1 PCT/US2009/059193 US2009059193W WO2010039932A1 WO 2010039932 A1 WO2010039932 A1 WO 2010039932A1 US 2009059193 W US2009059193 W US 2009059193W WO 2010039932 A1 WO2010039932 A1 WO 2010039932A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead frame
image sensor
focus
camera assembly
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2009/059193
Other languages
English (en)
Inventor
John David Newton
Simon James Bridger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEXT HOLDINGS Inc
Original Assignee
NEXT HOLDINGS Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEXT HOLDINGS Inc filed Critical NEXT HOLDINGS Inc
Publication of WO2010039932A1 publication Critical patent/WO2010039932A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings

Definitions

  • CMOS complementary metal oxide semiconductor
  • CCD charge coupled device
  • CID charge injection device
  • Connecting wires 18 may connect the image sensor 12 directly or indirectly to a processor, e.g., a digital signal processor or the processor of a general or specialized computing device.
  • the connecting wires 18 may be connected to a circuit board, a communication bus, an interface adapter or other suitable connector.
  • Window 20 covers and protects the image sensor 12.
  • the window 20 is separately formed (e.g., cast, i molded, extruded, etc.) or is selected from a set of windows having various sizes in order to fit the specific dimensions of the image sensor 12.
  • each one of the above-described components serves a single function, and no components have multiple functions.
  • Methods used to construct these cameras are relatively labor intensive and expensive because there are so many separate components. Accordingly, there is a need for a camera having a reduced number of components as compared to known cameras, and furthermore, for methods of manufacturing cameras having a reduced number of components.
  • the total number of components in a camera assembly may be reduced by providing components that serve multiple functions.
  • the lead frame may not only be used as a mount for the image sensor, but also as the housing for the image sensor.
  • a sheet of material including but not limited to metal may be cut or stamped to form the lead frame.
  • the lead frame has sections that may be folded to form a housing for the camera.
  • the lead frame may provide a mechanism for mounting and focus the lens of the camera assembly.
  • at least one focus section may be cut or stamped into the sheet of material that comprises the lead frame. The focus section can translate with respect to the rest of the lead frame.
  • a lens When the lead frame is folded into the housing, a lens may be mounted on the focus section.
  • the lens may be focused by moving the lens (which is mounted to the focus section) closer to or further away from the image sensor.
  • embodiments described herein reduce components of camera assemblies by providing a multi- function lead frame that not only serves as a mount for the image sensor, but also as a housing for the camera assembly and a focus mechanism.
  • Other embodiments such as a clear coating to cover and protect the image sensor — may also reduce the number of components and reduce manufacturing costs.
  • FIG. 1 is a cross-sectional diagram illustrating the parts of a known camera assembly.
  • FIG. 2 is a cross-sectional diagram illustrating the image sensor of the camera assembly shown in FIG. 1.
  • FIGS. 3A-C are diagrams illustrating exemplary lead frames that may be used to construct cameras according to certain exemplary embodiments of the present invention.
  • FIG. 4A is a cross-sectional side view diagram of a camera assembly assembled from the lead frame shown in FIG. 3A according to certain exemplary embodiments of the present invention.
  • FIG. 4B is a perspective view diagram of the assembled camera assembly shown in FIG. 4A.
  • FIG. 5 is a block diagram illustrating a method of constructing a camera assembly according to certain exemplary embodiments of the present invention.
  • FIG. 6 is a block diagram illustrating camera assembly connected to a computing device according to certain exemplary embodiments of the present invention.
  • FIG. 4 shows an exemplary camera assembly 30 as assembled with the lead frame 32 shown in FIG. 3A.
  • the camera assembly 30 includes only three separate components — a lead frame 32, an image sensor 50, and a lens 64.
  • the lead frame 32 itself serves several functions, and thus replaces the separate focus mechanism 6 and separate housing 8 of known systems (such as shown in FIGS. 1 and 2). Embodiments of the invention thus reduce components and costs associated with manufacturing camera assemblies.
  • the lead frame 32 is unassembled and flat, and as described below, it includes sections and apertures that serve various functions and thus reduce the number components needed to construct a camera assembly.
  • the lead frame 32 may be composed of metals, including but not limited to aluminum, copper, tin, steel, or any other suitable metal or alloy.
  • the lead frame may be composed of a plastic or thermoplastic material (e.g., acrylic, Plexiglass, polycarbonate, etc.) or of any other suitable rigid or semi-rigid materials, as will be apparent to those skilled in the art.
  • Various manufacturing processes may be used to form the shape of the lead frame 32 (and the sections and apertures contained therein), including but not limited to extruding, molding, die cutting, stamping, and/or cutting with a laser, knives, or scissors.
  • a die may be used to cut or stamp the shape of the lead frame 32 (and the sections and apertures contained therein) out of the blank of material.
  • the blank of material can include metals, plastics, or polymers as described above. The thickness of the blank of material is dependent upon the intended application or environment for the camera assembly 30.
  • the lead frame 32 is beneficial because it serves multiple functions.
  • the lead frame 32 may form a housing for the camera assembly 30.
  • the embodiments of lead frame 32 in FIGS. 3A-C each have at least four discrete sections 34, 36, 38, and 40.
  • the at least four sections 34, 36, 38, and 40 of the unassembled lead frame 32 form four walls of the housing when the lead frame 32 is fully assembled.
  • This disclosure may refer to "sections" of the lead frame 32 and "walls" of the housing interchangeably.
  • FIG. 4A and 4B show camera assembly 30 that is made from the lead frame 32 in FIG. 3A. (The embodiments of the lead frames 32 shown in FIGS.
  • the exemplary lead frame 32 in FIG. 3A has four sections 34, 36, 38, and 40, that are designed to be folded into the exemplary four- walled housing shown in FIG. 4A and 4B.
  • fifth and sixth walls may be formed by plastic overmoldings that may be used to secure the wires 52 of the optical sensor 50 in place.
  • Such overmouldings may be formed in a plane perpendicular to the plane of the lead frame 32, such that a portion of each overmolding forms the fifth and sixth walls when the lead frame 32 is folded into its assembled configuration.
  • the overmoldings may be formed in a plane substantially parallel to the plane of the lead frame 32, with a portion of each overmolding being bent or folded into position to form the fifth and sixth walls.
  • the fifth and sixth walls may be formed using aluminum tape, adhesive, soldering, bonding, mechanical fasteners or the like.
  • the optional fifth and sixth walls may be constructed from either the same or a different type of material as the rest of the lead frame 32.
  • the assembled housing for the camera assembly 30 may be mounted on a mounting mechanism (or on other components) so that the open ends of the housing are covered by the mounting mechanism itself.
  • the lead frame 32 may have fewer than four sections.
  • the lead frame may only have three sections so that when assembled, the lead frame forms a triangular-shaped housing for the camera assembly.
  • the lead frame may have more than four sections.
  • a lead frame with eight sections might form an octagon-shaped housing for the camera.
  • FIGS. 3A and 3C show embodiments having a tag 42, which is optional and not required. The tag 42 may be used to secure or hold the lead frame 32 in place while it is being manufactured.
  • the tag 42 may be removed from the rest of the lead frame 32 by breaking the tag 42 off along the holes 62.
  • the tag 42 may be cut from the same blank of material as the rest of the lead frame 42, or the tag 42 may be attached to the lead frame 32 by overmolding or other known techniques.
  • lead frame 32 With as few holes as possible in order to limit the amount of light that is introduced into the camera assembly 30 as assembled (such as in FIG. 4).
  • the folding may be done either manually or mechanically, such as by way of a press or other suitable machine. The folding technique is dependent upon the material of the blank, the intended application, or the environment for the camera assembly 30.
  • the walls of the housing may be secured in place with any known method, including but not limited to adhesive, soldering, bonding, or mechanical fasteners.
  • the housing is made waterproof by joining the folded edges of the lead frame 32 with appropriate adhesives and sealants.
  • the lead frame 32 may provide a mount for the image sensor 50.
  • the image sensor 50 may be mounted to any section of the lead frame 32. In FIG. 3 A, the image sensor 50 is mounted to section 36, in FIG. 3B it is mounted to section 34, and in FIG. 3C it is mounted to section 38.
  • the image sensor 50 may be mounted to the lead frame 32 (whatever section is selected as the location for the lead frame 32) with any known technique, including but not limited to adhesive, soldering, bonding, or mechanical fasteners (such as tacks, pins, snaps, nails, or buttons).
  • the image sensor 50 can be based on complementary metal oxide semiconductor (CMOS), charge coupled device (CCD), or charge injection device (CID) technologies, or any other sensor technology capable of detecting changes in electromagnetic radiation.
  • CMOS complementary metal oxide semiconductor
  • CCD charge coupled device
  • CID charge injection device
  • the image sensor 50 may also include a one dimensional or two dimensional array of pixels.
  • the size and shape of the image sensor 50 and the size and shape of the housing of camera assembly 30 may be dependent upon one another. For example, if a small camera assembly 30 is desired, then it may be necessary to use smaller image sensors 50. If a larger camera assembly 30 is desired, then it may be possible to use larger image sensors 50.
  • a clear coating 54 may be applied over the image sensor 50 to cover and protect the image sensor 50.
  • the coating 54 is initially liquid and may be applied or brushed onto the image sensor 50 with an applicator.
  • the coating is a protective encapsulate that is transparent at the wavelengths at which the image sensor 50 operates.
  • the term "clear" is used to describe any coating that is transparent at the wavelengths at which the image sensor 50 operates, and is not limited to coatings that appear to be clear to the naked eye.
  • One non-limiting example of clear coating 54 is the ULTRA LIGHT-WELD 3069 series offered by the company Dymax Corporation, located in Torrington, Connecticut.
  • the clear coating 54 is beneficial because there is no casting or separate components required, as opposed to other systems (such as shown in FIG. 2) that require casting a separate window 20 to mount over the image sensor.
  • the clear coating 54 provides more efficiencies than known components such as windows.
  • FIGS. 3A-C also show a plurality of wires 52 to connect the image sensor 50 directly or indirectly to a processor, e.g., a digital signal processor or the processor of a general or specialized computing device.
  • the connecting wires 18 may be connected to a circuit board, a communication bus, an interface adapter or other suitable connector.
  • the figures do not show the precise electrical connections that may be desired to connect the image sensor 50 to computing device 90 (as shown in FIG. 6) or other electrical components, such electrical connections would be obvious to one of skill in the art.
  • camera assembly 30 may include one or more optical emitters 68.
  • Embodiments having optical emitters 68 may be useful if the camera assembly 30 is used with a touch screen.
  • Touch screens have several applications, among them in computer displays, video monitors, or white boards, etc. Touch screens rely on the detection of light (or other forms of energy) emitted across the touch screen.
  • the camera assembly 30 may be positioned along one or more edges of the touch screen, with the field of view of the camera assembly 30 pointed towards the center of the touch screen.
  • the optical emitter 68 emits some type of light or energy across the a touch screen.
  • optical emitter 68 may be a light emitting diode (LED) that generates infrared
  • the optical emitter 68 may generate energy in other portions of the EM spectrum.
  • the optical emitters 68 may generate other types of energy as applicable with appropriate image sensor 50.
  • Embodiments of touch screens may have reflective or retroreflective materials mounted or affixed to the edges of the touch screen. Retroreflective materials are designed to reflect the emitted light in substantially the same direction from which it originated, and reflective materials are designed to reflect the emitted light in general across the touch screen. Thus, light or energy may be emitted by optical emitter 68, reflected by the reflective (or retroreflective) materials, and received through the aperture 48 of the camera assembly 30. If an object is interrupting light in the touch screen (for example, if a finger, pen, stylus, or other object is touching the touch screen), the object will cast a shadow on the reflective material, which may be registered by the image sensor 50 of the camera assembly 30. The system may then use triangulation or other calculation techniques to determine the location of the touch object based on the location of the shadow that is registered by the image sensor 50.
  • the optical emitter 68 is mounted on the outer surface of the housing when the camera assembly 30 is fully assembled. (Thus, in FIG. 3A- C the optical emitter 68 is in shadow lines because the optical emitter 68 is mounted on the opposite side of the lead frame 32.) Although the figures show the optical emitter 68 as mounted on the same section as the aperture 48, it should be understood that the optical emitter 68 may be mounted on other sections as well. Additionally, the figures show two optical emitters 68, but there may be fewer than or more than two optical emitters 68 in other embodiments. [0031]
  • the lead frame 32 also provides an aperture 48 for the camera assembly 30.
  • the exact placement of the aperture 48 relative to the image sensor 50 is not essential.
  • the image sensor 50 is mounted on section 36, and the aperture 48 is defined in section 40.
  • the image sensor 50 is mounted on section 34 and the aperture 48 is defined in section 38.
  • the image sensor 50 is mounted on section 38 and the aperture 48 is defined in section 40.
  • the lead frame 32 such that the image sensor 50 is on a wall opposite the aperture 48 when the camera assembly 30 is assembled, such as in FIG. 4.
  • the image sensor 50 and the aperture 48 are mounted on alternating sections.
  • the aperture 48 and image sensor 50 are on adjacent sections 38, 40 such that when assembled, the aperture 48 and image sensor 50 will be on adjacent walls of the housing.
  • the particular placement and order of the sections (and aperture 48 and image sensor 50) are not essential and should not be limited to the embodiments shown in the figures.
  • FIGS. 3A and 3B provide two focus sections 44, 46 whereas FIG. 3C only shows one focus section 44.
  • the focus sections 44, 46 have a square or rectangular shaped body defined by a cut-out in the lead frame 32, but that shape is not limiting. Rather, the focus sections 44, 46 can be any shape suitable for mounting the lens 64, such as circular, triangular, hexagon, or any other shape.
  • Two bars 66 connect the focus section 44, 46 to the rest of the lead frame 32.
  • the particular design of the bars 66 is not essential, and in some embodiments, there may be only one bar.
  • the bars 66 enable the focus sections 44, 46 to be moved in position with respect to the rest of the lead frame 32 (and in particular, moved with respect to the image sensor 50 when the camera assembly 30 is fully assembled as in FIGS. 4A and 4B). Specifically, when a force is applied to the focus sections 44, 46, the bars 66 deform slightly in the direction of the force. Thus the focus sections 44, 46 are "bent" into the desired position.
  • the focus sections 44, 46 may be bent into position in the direction of the arrows shown in FIGS. 3A-C within the space that surrounds the body of the focus sections 44, 46. It may also be desirable in some embodiments to bend the focus sections 44, 46 either into or out of the plane of the lead frame 32.
  • the focus sections 44, 46 serve as a mount for the lens 64.
  • the lens 64 may be a single element aspherical lens, with an f-theta characteristic, which can be constructed from transparent plastic material or glass.
  • the single element lens results in reduced internal reflections without resorting to anti reflection coatings and improved accuracy and mechanical stability compared to known multi-element glass lens solutions.
  • the f-theta lens characteristic is desirable in optical position sensing, as it results in a basically linear correspondence between pixel number and angle of refraction.
  • the lens 64 need not be a single element aspherical lens, however, but may be include any lens known to those of skill in the art.
  • Mounting of the lens 64 to the focus sections 44, 46 may be accomplished with any one of known techniques, including but not limited to adhesive, soldering, bonding, or mechanical fasteners.
  • the lens 64 may be focused by positioning the focus sections 44, 46 (together with the lens 64) either closer to or further away from the image sensor 50. Adjusting the position of the lens 64 changes the convergence point of the light refracted through the lens 64 onto the image sensor 50, thus changing the relative focus of lens 64.
  • the lens 64 may be fixed in the desired position. Fixing the lens 64 in the desired position may be accomplished with any one of known techniques, including but not limited to the use of adhesive, soldering, bonding, or mechanical fasteners.
  • FIG. 3 A there are two focus sections 44, 46 that are on either side of section
  • focus section 44 will be on a wall that is adjacent to the image sensor 50, and there are no other focus sections.
  • the respective positioning of the focus sections 44, 46 and image sensor 50 are not limiting.
  • focus section 44 may be located on section 34 such that when assembled, focus section 44 would be opposite to the image sensor 50.
  • assembly tags, mounting pins, or features to locate and secure the image sensor 50 may be overmolded onto the lead frame 32.
  • the optional tag 42 which may be used to hold the lead frame 32 in place while it is being manufactured, is another example of a component that may be over molded.
  • FIG. 5 shows a method for constructing a camera assembly 30 according to certain embodiments.
  • Step 72 comprises preparing the lead frame 32, which includes providing a blank of material (such as metal, polymer, or a plastic) and then forming the blank of material into the desired shape of the lead frame 32.
  • the lead frame 32 may be formed by a die, stamp, laser, knives, scissors, or can be molded or extruded.
  • Step 72 also includes forming the aperture 48, focus sections 44, 46, and any sections, holes, or fold lines in the lead frame 32.
  • Step 74 comprises mounting the image sensor 50 to the lead frame 32.
  • the image sensor 50 may be mounted to any section of the lead frame 32, as described above with respect to FIGS. 3A-C, and may be mounted with any known technique, including but not limited to the use of adhesive, soldering, bonding, or mechanical fasteners (such as tacks, pins, snaps, nails, or buttons).
  • Step 74 also includes the optional step of applying a clear coating 54 over the image sensor 50 to cover and protect the image sensor 50, and affixing any necessary connecting wires 52.
  • step 76 comprises folding the sections of the lead frame 32 to make the housing of the camera assembly 30.
  • Step 76 may also include the step of securing the lead frame 32 in the folded position, such as by using adhesive, soldering, bonding, or mechanical fasteners.
  • Step 78 comprises mounting the lens 64 to the focus sections 44, 46 of the lead frame 32.
  • the lens 64 may be mounted to the focus sections 44, 46 using any one of known techniques, including but not limited to the use of adhesive, soldering, bonding, or mechanical fasteners.
  • step 80 comprises focus the lens 64 by moving the lens 64 either closer to or further away from the image sensor 50 by translating the focus sections 44, 46.
  • the lens 64 may be fixed in the desired position using any one of known techniques, including but not limited to the use of adhesive, soldering, bonding, or mechanical fasteners.
  • side walls may be added to completely enclose the housing for the camera assembly 30.
  • side walls may be constructed from the same type of material as the rest of the lead frame 32, and may be mounted to the housing using any known technique.
  • FIG. 6 is a block diagram illustrating a camera assembly 30 interfaced with a computing device 90 in accordance with exemplary embodiments of the invention.
  • Computing device 90 may be coupled to the camera assembly 30 by hardwire (e.g., the connecting wires 52) and/or wireless connections.
  • Computing device 90 may be any suitable computing device, including, but not limited to a processor-driven device such as a personal computer, a laptop computer, a handheld computer, a personal digital assistant (PDA), a digital and/or cellular telephone, a pager, a video game device, etc.
  • PDA personal digital assistant
  • processors can refer to any type of programmable logic device, including a microprocessor or any other type of similar device.
  • Computing device 90 may include, for example, a processor 92, a system memory 94, and various system interface components 96 that may all be functionally connected via a system bus 100.
  • the system interface components 96 may enable the processor 92 to communicate with peripheral devices.
  • a storage device interface 102 can provide an interface between the processor 92 and a storage device 108 (removable and/or non-removable), such as a disk drive.
  • a network interface 104 may also be provided as an interface between the processor 92 and a network communications device (not shown), so that the computing device 90 can be connected to a network.
  • An input/output (I/O) interface 106 can provide an interface between the processor 92 and the camera assembly 30.
  • the image sensor 50 may provide input signals (such as those representing images taken by the image sensor 50) to the processor 92 via interface 106. Similarly, the image sensor 50 may receive output signals from the processor 92 via the interface 106.
  • a number of program modules may be stored in the system memory 94. (Program modules may also be stored in any other computer-readable media associated with the storage device 108 (e.g., a hard disk drive), and/or any other data source accessible by computing device 90.)
  • the program modules may include an operating system 110 that may control the processor 92. Also, program modules may include those for controlling a touch screen.
  • One or more camera assemblies 30 can be mounted to a display (such as LDC, plasma, CRT, or static image) that is also interfaced with the computing device 90 to produce a touch screen system.
  • a computing device can include any suitable arrangement of components that provide a result conditioned on one or more inputs.
  • Suitable computing devices include multipurpose microprocessor-based computer systems accessing stored software, but also application-specific integrated circuits and other programmable logic, and combinations thereof. Any suitable programming, scripting, or other type of language or combinations of languages may be used to implement the teachings contained herein in software.
  • the methods of manufacturing disclosed herein may be embodies as software methods for controlling manufacturing equipment.
  • the software methods may access one or more computer-readable media that embody computer-readable instructions which, when executed by at least one computer, cause the at least one computer to implement instructions to control manufacturing equipment.
  • the software may comprise one or more components, processes, and/or applications.
  • the manufacturing equipment may be any equipment described herein, such as robotic die cutters, stampers, solder tools, or folders.
  • Any suitable computer-readable medium or media may be used to implement or practice the presently-disclosed subject matter, including, but not limited to, diskettes, drives, magnetic-based storage media, optical storage media, including disks (including CD-ROMS, DVD-ROMS, and variants thereof), flash, RAM, ROM, and other memory devices, and the like.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Studio Devices (AREA)

Abstract

L'invention porte sur des appareils photographiques (30) ayant un nombre réduit de composants par comparaison avec des appareils photographiques connus, et sur des procédés de fabrication de tels appareils photographiques. Conformément à un ou plusieurs modes de réalisation de l'invention, le nombre total de composants dans un appareil photographique (30) peut être réduit par la fourniture de composants qui remplissent de multiples fonctions. Par exemple, la grille de connexion (32) peut être utilisée à la fois comme boîtier pour l'appareil photographique et comme monture pour le détecteur d'image (50). De plus, la grille de connexion (32) peut comprendre un mécanisme de focalisation simple qui peut faire translater la lentille (64) par rapport au reste de la grille de connexion (32). Ainsi, les modes de réalisation de l'invention réduisent les composants d'appareils photographiques en fournissant au moins une grille de connexion multifonction (32) qui sert de boîtier pour l'appareil photographique (30), de monture pour le détecteur d'image (50) et de mécanisme de focalisation (44, 46). D'autres modes de réalisation, tels qu'un revêtement transparent pour recouvrir et protéger le détecteur d'image (50), réduisent également le nombre de composants et réduisent les coûts de fabrication.
PCT/US2009/059193 2008-10-02 2009-10-01 Construction d'un appareil photographique ayant un nombre réduit de composants Ceased WO2010039932A1 (fr)

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Application Number Priority Date Filing Date Title
NZ57168208 2008-10-02
NZ571682 2008-10-02

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WO2010039932A1 true WO2010039932A1 (fr) 2010-04-08

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8115753B2 (en) 2007-04-11 2012-02-14 Next Holdings Limited Touch screen system with hover and click input methods
US8149221B2 (en) 2004-05-07 2012-04-03 Next Holdings Limited Touch panel display system with illumination and detection provided from a single edge
US8289299B2 (en) 2003-02-14 2012-10-16 Next Holdings Limited Touch screen signal processing
US8384693B2 (en) 2007-08-30 2013-02-26 Next Holdings Limited Low profile touch panel systems
US8405636B2 (en) 2008-01-07 2013-03-26 Next Holdings Limited Optical position sensing system and optical position sensor assembly
US8432377B2 (en) 2007-08-30 2013-04-30 Next Holdings Limited Optical touchscreen with improved illumination
US8456447B2 (en) 2003-02-14 2013-06-04 Next Holdings Limited Touch screen signal processing
US8508508B2 (en) 2003-02-14 2013-08-13 Next Holdings Limited Touch screen signal processing with single-point calibration

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US844152A (en) * 1906-02-21 1907-02-12 William Jay Little Camera.
US4329037A (en) * 1981-06-08 1982-05-11 Container Corporation Of America Camera structure
US5043751A (en) * 1990-06-08 1991-08-27 Richard Rice Self-bracing credit-card-size camera for single-shot emergency use, and method for manufacture and distribution
US5103249A (en) * 1990-10-24 1992-04-07 Lauren Keene Folding disposable camera apparatus in combination with instant film
EP0843202A1 (fr) * 1996-11-13 1998-05-20 Eastman Kodak Company Un appareil photographique

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US844152A (en) * 1906-02-21 1907-02-12 William Jay Little Camera.
US4329037A (en) * 1981-06-08 1982-05-11 Container Corporation Of America Camera structure
US5043751A (en) * 1990-06-08 1991-08-27 Richard Rice Self-bracing credit-card-size camera for single-shot emergency use, and method for manufacture and distribution
US5103249A (en) * 1990-10-24 1992-04-07 Lauren Keene Folding disposable camera apparatus in combination with instant film
EP0843202A1 (fr) * 1996-11-13 1998-05-20 Eastman Kodak Company Un appareil photographique

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8289299B2 (en) 2003-02-14 2012-10-16 Next Holdings Limited Touch screen signal processing
US8456447B2 (en) 2003-02-14 2013-06-04 Next Holdings Limited Touch screen signal processing
US8466885B2 (en) 2003-02-14 2013-06-18 Next Holdings Limited Touch screen signal processing
US8508508B2 (en) 2003-02-14 2013-08-13 Next Holdings Limited Touch screen signal processing with single-point calibration
US8149221B2 (en) 2004-05-07 2012-04-03 Next Holdings Limited Touch panel display system with illumination and detection provided from a single edge
US8115753B2 (en) 2007-04-11 2012-02-14 Next Holdings Limited Touch screen system with hover and click input methods
US8384693B2 (en) 2007-08-30 2013-02-26 Next Holdings Limited Low profile touch panel systems
US8432377B2 (en) 2007-08-30 2013-04-30 Next Holdings Limited Optical touchscreen with improved illumination
US8405636B2 (en) 2008-01-07 2013-03-26 Next Holdings Limited Optical position sensing system and optical position sensor assembly
US8405637B2 (en) 2008-01-07 2013-03-26 Next Holdings Limited Optical position sensing system and optical position sensor assembly with convex imaging window

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