WO2010023992A1 - Light-emitting device and method for manufacturing same - Google Patents

Abstract

In a light-emitting device (400), a semiconductor light-emitting element (403) is mounted on a substrate (401), the light-emitting element (403) is covered with a resinous frame-shaped structure (405) containing phosphor, and a space between the light-emitting element (403) and the frame-shaped structure (405) is filled with a light transmissive resinous material (406). The frame-shaped structure (405) that is previously molded is preferably incorporated. The light-emitting device (400) is obtained by mounting the semiconductor light-emitting element (403) on the substrate (401), covering the light-emitting element (403) with the resinous frame-shaped structure (405) containing phosphor, and filling the space between the light-emitting element and the frame-shaped structure with the light transmissive resinous material (406). Thus, a method for manufacturing the light-emitting element with a highly uniform phosphor layer and the light-emitting element with high mass productivity is provided.

Description

Light emitting device and manufacturing method thereof

The present invention relates to a light emitting device in which a semiconductor light emitting element is covered with a resinous frame-like structure containing a phosphor, and a method for manufacturing the same.

Many conventional light emitting devices have a structure in which a light emitting element is arranged on a substrate and the periphery of the light emitting element is covered with a sealing resin containing a phosphor. A technique is adopted in which a phosphor is excited by light emitted from a light emitting element to generate light having a different wavelength by generating light having a different wavelength.

In many cases, the phosphor is mixed with a translucent resin, and is hardened after filling, coating, or coating around the light emitting element. Various manufacturing methods such as the potting method of Patent Document 1, the dipping method of Patent Document 2, the screen printing method of Patent Document 3, the method of Patent Document 4, and the mold forming method of Patent Document 5 have been proposed.

FIG. 4A is a schematic cross-sectional view showing a conventional resin-sealed formation method disclosed in Patent Document 1 below. In the light emitting device 100, a light emitting element 102 is mounted on an electrode 109 on a substrate 101, and is further covered with a covering material including a phosphor 103. As an example of a method for mounting the light emitting element, the covering material 104 including the phosphor 103 is discharged through the thin tube 107 of the dropping device 108 and dropped into the cavity 106, and then the covering material 104 is cured. It is covered with the covering material 104 containing.

However, according to the resin-sealed formation method, the method of dropping the potting material in which the phosphor 103 is mixed in advance with the coating material 104 is shaped by the surface tension and viscosity of the coating material when the coating material is solidified. Due to the deformation, not only the dimensional accuracy is not good, but also the shape instability on the wall surface or the liquid level as shown in FIG. 4B, or the manufacturing process may be inclined as shown in FIG. 4C. In either case, the thickness of the covering material 104 covering the light emitting element changes, which leads directly to a product defect.

At the same time when the potting process is started, the phosphors in the coating material have different specific gravities. Therefore, the phosphors are precipitated at the beginning in the syringe, resulting in an imbalance in the phosphor concentration in the potting material composition. Taking FIG. 4A as an example, the phosphor 103 contained in the coating material 104 in the syringe 108 settles with time and is present in the vicinity of the narrow tube 107. On the other hand, it becomes lean above the syringe. Thus, even if the phosphor concentration in the coating material is as set at the beginning of the discharge operation, it gradually changes as the production time elapses, and on the contrary, it becomes further dilute after a certain stage. Sedimentation of the phosphor also occurs in the cavity 106 after dripping and before curing. Therefore, not only the phosphor is not uniformly coated around the light emitter, but also the light emission variation of each final product becomes very large. The light-emitting device thus produced is particularly problematic when the light distribution chromaticity is not uniform due to the unevenness of the phosphor amount.

A screen printing method as shown in FIGS. 5A and 5B is known as means for suppressing variations in coating thickness of a coating material containing a phosphor (Patent Document 3). The periphery of the light emitting element 201 mounted on the light emitting device 200 is covered with a coating layer 207 containing a phosphor 202. The covering material 203 containing the phosphor 202 is supplied to the upper surface of the screen metal mask 204 having the cavity 206 opened in a predetermined shape, and is further filled in the cavity 206 while being extended by the squeegee 205. The covering material thus filled is cured, and the covering layer 207 can be formed around the light emitting element 201 with a predetermined thickness.

However, in the screen printing method, it is inevitable that an imbalance of the phosphor concentration occurs in the coating material containing the phosphor during processing. In addition, it is difficult to place the screen metal mask accurately with respect to the position of the light-emitting element, which causes an increase in thickness accuracy but a decrease in position accuracy. In addition, there is a problem that it is difficult to apply a large number of light emitting elements at once.

The mold molding method can increase the accuracy of thickness, position, dimensions, concentration, etc., compared to other means. 6A to 6C are schematic views showing a coating method by transfer molding (Patent Document 5). The transfer molding die 300 has a three-sheet structure. The lower mold 301 is provided with a cavity 302 into which a substrate is inserted. A cavity 304 for molding a coating layer is provided below the middle mold 303. In addition, a pot 306 for charging material is provided on the upper side of the middle mold, and the upper mold 305 has a structure in which the material charged in the pot 306 is injected under pressure. The substrate 311 on which the light emitting element 310 is mounted is stored in the cavity 302 of the lower mold 301. A space formed by the light emitting element 310, the substrate 311, the electrode 307, and the cavity 304 below the middle mold 303 becomes the shape of the phosphor layer. The covering material 313 including the phosphor 312 is charged in an appropriate amount in the pot 306 on the upper side of the middle mold 303. By applying pressure with the upper mold 305, the coating material 313 is injected from the injection port 314 through the runner 315 and into the cavity 304 through the gate 316. The pressure is maintained at an appropriate time and temperature to cure the coating material and then remove from the mold.

However, this method generates a lot of scrap material in parts other than the product such as the inlet, runner, and pot. Since the phosphor is extremely expensive, there is a big problem from an economical point of view. Further, this method has a problem that there is a limit to molding a large amount in a short time.

JP 2004-119838 A JP-A-5-291629 JP 2005-123238 A JP 2006-49524 A JP-A-8-78450

In order to solve the above-described conventional problems, the present invention provides a light-emitting device with high uniformity of a phosphor layer and high productivity, and a method for manufacturing the same.

The light-emitting device of the present invention is a light-emitting device in which a semiconductor light-emitting element is mounted on a substrate, and the light-emitting element is covered with a resin frame-like structure containing a phosphor, and the light-emitting element and the frame-like structure The space with the body is filled with a translucent resin material.

A method for manufacturing a light emitting device according to the present invention is a method for manufacturing a light emitting device in which a semiconductor light emitting element is mounted on a substrate, and after the light emitting element is mounted on a substrate, a resin frame-like structure containing a phosphor The light emitting element is covered, and a space between the light emitting element and the frame structure is filled with a translucent resin material.

In the present invention, a phosphor containing a phosphor formed in a predetermined size and concentration in advance is disposed on a semiconductor light emitting device on a substrate, so that a phosphor layer with high uniformity and a mass-productive device can be obtained. A high light-emitting element can be obtained. Further, according to the present invention, since the phosphor composition is a frame-like structure that is already molded into a predetermined shape, the light emission that realizes the desired light emission characteristics without changing the size and concentration during processing. An element can be provided. Furthermore, since the light distribution chromaticity for each product becomes uniform, there is no need for selection and selection in the final product as in the conventional method, so that the reduction in man-hours and the yield can be satisfactorily suppressed. In addition, since the translucent resin in which the phosphor is blended is formed in the structure in advance, it is possible to obtain much improved dimensional accuracy compared to other manufacturing methods formed on the substrate. As a result, not only the quality of the product but also the function is improved, so that an optical design with a high degree of difficulty can be achieved. In addition, since the space filled with the translucent resin is formed by a structure, the manufacturing cost can be suppressed and the design can be easily changed as compared with the conventional method.

FIG. 1A is a cross-sectional view schematically showing the light emitting device in the first embodiment of the present invention, and FIG. 1B is a plan view thereof. 2A to 2C are cross-sectional views illustrating steps for manufacturing the light emitting device according to the first embodiment of the present invention. 3A to 3I are cross-sectional views showing steps of manufacturing a light emitting device according to the second embodiment of the present invention. 4A to 4C are cross-sectional views illustrating a conventional method of coating a light emitting element by potting. 5A and 5B are cross-sectional views illustrating a conventional method for coating a light emitting element by screen printing. 6A to 6C are cross-sectional views showing a conventional method of coating a light emitting element by mold molding.

The light-emitting device of the present invention includes a semiconductor light-emitting element mounted on a substrate, covered with a resin-made frame-like structure containing a phosphor on the outside thereof, and light-transmitting in the space between the light-emitting element and the frame-like structure. Filled with resin material.

The resin-like frame-like structure containing the phosphor preferably contains an organic and / or inorganic phosphor and a light scattering agent.

Moreover, it is preferable that the resin and / or the translucent resin material constituting the frame-like structure is silicone rubber or gel. Silicone rubber or gel has the advantage of high heat resistance. Furthermore, the strain at the time of curing of the translucent resin material is absorbed by the frame structure of silicone rubber or gel, so that a uniform filling layer can be formed.

It is preferable that a lens is further arranged outside the frame-like structure. Thereby, the directivity of light can be controlled.

Since this lens also has high heat resistance, silicone rubber or resin is preferable.

It is preferable that the frame-like structure is formed in advance so as to cover the light emitting element.

In a preferred example of the present invention, a frame-like structure that contains a phosphor in a predetermined concentration and is molded into a predetermined shape is disposed in the vicinity of the light-emitting element on the substrate. And filling the space formed by the structure with a translucent resin and then curing it.

Alternatively, the phosphor may be blended with a translucent resin that fills the space of the frame-like structure containing the phosphor.

(Embodiment 1)
A first embodiment of the present invention will be described with reference to FIGS. 1A-B to 2A-C.

1A is a sectional view schematically showing a semiconductor light emitting device according to the present embodiment, FIG. 1B is a plan view thereof, and FIGS. 2A to 2C are sectional views showing manufacturing steps of the embodiment. A lead electrode 402 having a predetermined conductive circuit is formed on the substrate 401 of the light emitting device 400. A light emitting element 403 is disposed on the substrate 401 or the lead electrode 402, and the surface of the light emitting element 403 and the lead electrode 402 are electrically connected by a thin metal wire 404. A frame-shaped structure 405 containing a phosphor 408 is disposed around the light-emitting element 403, and a space formed by the frame-shaped structure 405, the light-emitting element 403, and the substrate 401 is filled with a light-transmitting resin 406. A lens-shaped structure 407 is attached to the exterior.

The light emitting element 403 is mounted on the substrate 401 using, for example, a die bonder machine, and the lead electrode 402 on the substrate is connected by wire bonding with a fine metal wire 404.

The material of the substrate 401 is not limited, but a printed substrate such as glass epoxy, polyimide, epoxy resin-impregnated aramid nonwoven fabric, or ceramic can be used favorably. Since recent light emitting devices generate more heat and require more effective heat dissipation, ceramic substrates using ceramic substrates, metal substrates typified by aluminum substrates, substrates using metal oxides such as alumina, etc. It is desirable to use it, but it is not limited to this.

The type of the light emitting element 403 is not particularly limited. For example, a semiconductor layer made of a group III nitride compound, that is, a GaN-based, AlGaN-based, InGaN-based, InAlGa-based, or the like is stacked on an element substrate formed of sapphire. In addition, SiC, GaP, or the like can be used for the element substrate, but the element substrate is not limited thereto.

The wavelength emitted by the light emitting element 403 varies from the ultraviolet region to the visible region, but is arbitrarily selected according to the purpose. For example, a desired emission color such as blue, red, or green is selected. A plurality of similar light emitting elements can be used. In addition, various light emission colors can be obtained by combining light-emitting elements having different light emission colors.

The dimensions of the substrate and the light emitting element are not particularly limited. Further, the dimensions of the frame-like structure are also set by the dimensions and quantity of the light emitting elements mounted on the substrate. However, the space formed by the periphery of the inner surface of the frame-like structure and the inner surface of the top plate (the portion of the filler 406 in FIG. 1) is less than the light emitting element to the extent that it does not interfere with the thin metal wires 404 coupled to the light emitting element. It needs to be bigger. Preferably, it is about 0.2 to 1.0 mm larger than the outer periphery of the light emitting element. It is desirable that the distance between the periphery of the light emitting element and the inner surface around the frame structure and the distance between the upper surface of the light emitting element and the inner surface of the top plate of the frame structure are equal. The thickness of the frame-like structure is preferably 0.2 to 2.0 mm as adjusted by the blending amount of phosphor and the emission color. When the thickness is less than 0.2 mm, it is difficult to maintain the shape, and when the thickness exceeds 2.0 mm, the light emission efficiency tends to deteriorate. The height is preferably 0.5 to 3 mm.

The shape of the frame-shaped structure is preferably a bowl to uniformly cover the periphery of a single light emitting element, but when simultaneously covering a plurality of light emitting elements, an appropriate shape is selected depending on the arrangement of the light emitting elements, A circle, a polygon, an ellipse, etc. may be sufficient. Further, depending on the optical design, a hemispherical or aspherical lens shape may be used.

The shape of the lenticular structure is adjusted by the directivity of light emitted from the desired light emitting device. Depending on the purpose of light collection, diffusion, etc., any shape such as concave, convex, Fresnel, spherical, aspherical surface is used. In addition, a plurality of lenses having a diameter substantially equal to that of the light emitting elements may be provided for each individual light emitting element, or the plurality of light emitting elements may be simultaneously covered with a single lens.

As shown in FIG. 2A, an electrode 402 for mounting and connecting a light emitting element 403 and a thin metal wire 404 for connecting a light emitting device are formed on a substrate 401. As the electrode, a good electrical conductor such as copper, phosphor bronze, iron or nickel is used, and the surface can be plated with a noble metal such as gold, silver, platinum or palladium.

The light emitting element 403 needs to be covered with a phosphor. As shown in FIG. 2B, a frame-like structure 405 in which a covering material 410 containing a phosphor 408 is molded in advance is disposed in the vicinity of the light emitting element 403. Next, a filler 406 is filled into the space 411 formed by the frame-shaped structure 405, the light emitting element 403, and the substrate 401 from the injection port 409.

The phosphor 408 is selected according to the emission color emitted from the light emitting element 403 and the desired emission color of the light emitting device. For example, white light can be obtained by mixing light emitted from a phosphor that emits light having a peak wavelength of about 0.57 μm and a blue light-emitting element having a peak wavelength of about 0.45 μm.

The kind and amount of the phosphor 408 are not particularly limited, and a particulate phosphor can be used regardless of whether it is organic or inorganic. There are mainly YAG (yttrium, aluminum, garnet) phosphors, BOS (barium, orthosilicate) phosphors, and TAG (terbium, aluminum, garnet) phosphors. , Red, blue, yellow, and green light are selected from a combination of one or more. The amount of the phosphor blended in the coating material is adjusted according to the desired emission color. As an example, the phosphor is added in the range of 5 to 20% by mass with respect to 100% by mass of the coating material.

In addition to the phosphor, an appropriate amount of light scattering material can be blended with the frame structure 405 for the purpose of adjusting directivity. Examples of the light scattering material include titanium oxide, aluminum oxide, and silicon oxide.

The covering material 410 constituting the frame-like structure 405, the filler 406 filled in the space 411 formed by the frame-like structure 405 and the light emitting element 403, and the substrate 401, and a resinous composition having translucency are selected. . Here, the translucent resin material refers to a resin having a transmittance of 90% or more when light having a wavelength of 580 nm is transmitted through a sheet or plate having a thickness of 2 mm.

This resinous composition can be selected from thermoplastic and thermosetting, and acrylic, polycarbonate, urethane, methacrylic acid, methacrylic acid ester, silicone and the like can be used. Moreover, not only resin but rubber | gum shape and a gel-like thing may be sufficient. A silicone type is desirable because of its excellent light transmittance and heat resistance as well as resistance to ultraviolet rays. Moreover, from the point of relieving stress due to temperature change, it is desirable that the property after curing is rubber or gel. Further, the covering material 410 constituting the frame-like structure 405 and the filler 406 filling the space 411 formed by the frame-like structure 405, the light emitting element 403, and the substrate 401 are not necessarily the same.

The frame structure 405 is formed by compression molding. Compression molding produces less molding scrap than transfer molding and injection molding, and many molded products can be obtained at one time. In addition, it may be a method obtained by rolling into a sheet and punching or cutting, or a method obtained by slicing an extruded product. Moreover, you may shape | mold by these composites, and may combine the several components obtained by the same or different method.

The frame-like structure 405 is preferably fixed to the substrate 401 with a silicone pressure adhesive. Of course, it may be affixed with another adhesive or the like, or the tackiness of the original frame structure material may be used. Alternatively, it may be integrally molded directly on the substrate.

The filling material 406 is filled by a syringe as an example, but a known conventional technique such as potting, screen printing, knife coating, etc. may be used depending on the shape of the frame structure.

As shown in FIG. 2C, a lens-like structure 407 can be installed in order to further control the directivity. The lenticular structure 407 is preferably molded from silicone rubber or silicone resin. The lenticular structure 407 can be directly molded on the substrate 401. In addition, a lens-like structure obtained in advance by conventional mold molding such as compression, transfer, and injection may be pasted on the substrate with an adhesive, adhesive, etc., or a mechanical fitting structure, etc. It may be fixed with.

The property of the lens-like structure 407 may be glass, resin, or rubber, but it is desirable that the lens-like structure 407 be made of a silicone material in view of excellent light transmittance, heat resistance, and resistance to ultraviolet rays.

(Embodiment 2)
A second embodiment will be described with reference to FIGS. 3A-I. The frame-like structure is obtained by extruding the covering material 602 containing the phosphor 601 by the extrusion molding machine 600. The covering material 602 is filled in a cylinder of the extrusion molding machine 600, and is further pressurized by rotating a screw. The pressurized covering material 602 is extruded from the base 603 (FIG. 3A), and then heated and cured to obtain a tubular molded product 607 (FIG. 3B). Extrusion molding can not only be completed in a short time, but also the coating material 602 is constantly stirred by the rotation of the screw, so that a tube-shaped molded product 607 containing a phosphor is uniformly obtained continuously.

Also, by changing the base 603, it can be made into an arbitrary shape such as a ring shape, a polygonal shape, an elliptical shape. The tubular molded product 607 is continuously cut by the slicing blade 604 at equal intervals from the end face (FIG. 3C-E). Thus, a frame-like structure 501 having an arbitrary shape can be obtained (FIG. 3F). In this example, the top plate is not formed.

When the frame-like structure 501 thus obtained is placed on a light-emitting device including the substrate 504 and the electrode 510, a space 502 can be formed by the frame-like structure 501, the light-emitting element 503, and the substrate 504 (FIG. 3G). The filler 505 is filled while being extended by a squeegee 507 through a screen plate 506 having a predetermined shape. The filler contains a phosphor 508 for adjusting the function and characteristics of the light emitting device (FIG. 3H). In this way, the light emitting device 509 of this embodiment is obtained (FIG. 3I).

Hereinafter, the present invention will be described more specifically with reference to examples.
Example 1
A product name “YR450” (yellow phosphor) manufactured by Intermatix was uniformly mixed with 10% by mass of silicone rubber “FSG3161K2C” manufactured by Fuji Polymer Industries Co., Ltd. This blend was compression-molded at 150 ° C. for 5 minutes using a compression mold to obtain a rectangular parallelepiped frame-like structure having one surface (bottom surface) opened. The inner dimensions were 4 mm in length, 4 mm in width, 1 mm in height, and the outer dimensions were 4.75 mm in length, 4.75 mm in width, and 1.75 mm in height. The thickness (coating thickness) of the frame-shaped structure was 0.75 mm. Further, a through hole having a diameter of 0.3 mm was provided on one of the four sides of the outer periphery. Outline of a substrate on which a total of four light-emitting elements having a length of 1.2 mm, a width of 1.2 mm, and a height of 0.3 mm (light emission color is blue at around 450 nm) at a pitch of 1.5 mm, a total of four. The frame-like structure is arranged in the center. Next, thermosetting silicone, OE-6351 (product name, manufactured by Toray Dow Corning Co., Ltd.) was filled from a 0.3 mm through-hole using a syringe and heated at 150 ° C. for 120 minutes to be cured. Thereafter, a hemispherical lens-like structure having a sphere radius of R8 mm was directly molded on the substrate using a transfer mold. The material was thermosetting silicone, FSG3161K2C (manufactured by Fuji Polymer Industries Co., Ltd.), and the molding condition was 150 ° C. for 5 minutes. The obtained light-emitting device was as shown in FIG. 1, and a light-emitting element with high uniformity of the phosphor layer and a light-emitting element with high mass productivity could be obtained. Further, the light emitting element that achieves desired light emission characteristics can be obtained without the size and concentration being changed during processing.

Current was passed through the obtained light emitting device, and the color temperature was measured with CA-2000 manufactured by Konica Minolta. When a current of 100 mA was passed, white light having a color temperature of 4100K and color coordinates of X0.4 and Y0.45 was obtained. Further, the transmittance when light having a wavelength of 580 nm was transmitted through a 2 mm thick sheet or plate of the silicone rubber “FSG3161K2C” was 93%.

(Example 2)
A light emitting device was produced in the same manner as in Example 1 except that the phosphor concentration and the coating thickness of the frame-like structure were changed to Table 1 below. The obtained light emitting device was caused to emit light in the same manner as in Example 1, and the color temperature was measured. These conditions and results are shown in Table 1.

When the phosphor concentration is low, it is necessary to increase the thickness of the phosphor-containing layer. As a result, a large amount of material was consumed, and the luminous efficiency tended to deteriorate. Further, it was found that when the phosphor concentration is high, the color temperature is lowered, the thickness of the phosphor-containing layer can be reduced, and the material can be reduced. However, it has been found that if the thickness is too low, the strength decreases and the efficiency of the phosphor decreases as the concentration increases. From the above, it was found that the phosphor concentration of the frame-like structure is preferably 5 to 20% by mass.

(Comparative Example 1)
As a comparative example, a rectangular parallelepiped frame-like structure not blended with a phosphor was molded as in the prior art, and a filler blended with a phosphor was injected and cured after an arbitrary time after blending. . The obtained light emitting device was caused to emit light in the same manner as in Example 1, and the color temperature was measured. These conditions and results are shown in Table 2 together with the results of Example 1.

As apparent from Table 2, the light emitting device of Example 1 had a substantially uniform color temperature regardless of the elapsed time, but the color temperature of the light emitting device of Comparative Example 1 fluctuated with the elapsed time. This is because the phosphor blended in the filler settles and the concentration of the phosphor contained in the filler to be injected increases.

The method for manufacturing a light emitting device and the light emitting device of the present invention can be used for a light source such as an illumination, a display and a backlight.

100, 200, 400, 509 Light emitting device 101, 311, 401, 504 Substrate 102, 201, 310, 403, 503 Light emitting element 103, 202, 312, 408, 508, 601 Phosphor 104, 203, 313, 410, 602 Coating material 106, 206 Cavity 107 Thin tube 108 Syringe 204 Metal mask 205, 507 Squeegee 207 Coating layer 300 Molding die 301 Lower mold 302 Cavity 303 for inserting the substrate Middle mold 304 Cavity 305 for molding the coating layer Upper mold 306 Pot 314 Inlet 315 Runner 316 Gate 109, 307, 402, 510 Electrode 404 Metal thin wire 405, 501 Frame structure 406, 505 Filler (translucent resin material)
407 Lenticular structure 409 Inlet 411, 502 Space for filling filler 506 Screen plate 600 Extrusion machine 603 Base 604 Slice blade

Claims (16)

A light emitting device having a semiconductor light emitting element mounted on a substrate,
The light emitting element is covered with a resin frame-like structure containing a phosphor,
A light-emitting device, wherein a space between the light-emitting element and the frame-shaped structure is filled with a translucent resin material. The light-emitting device according to claim 1, wherein the resin frame-like structure containing the phosphor includes an organic phosphor and / or an inorganic phosphor, and a light scattering agent. 2. The light emitting device according to claim 1, wherein the resin and / or the translucent resin material constituting the frame-like structure is a silicone rubber or a gel. The light-emitting device according to any one of claims 1 to 3, wherein a lens is further arranged outside the frame-like structure. The light emitting device according to claim 4, wherein the lens is a silicone rubber or a resin. The light emitting device according to any one of claims 1 to 4, wherein the frame-like structure contains 5 to 20% by mass of a phosphor. The method for manufacturing a light-emitting device according to claim 1, wherein a phosphor is also mixed in the light-transmitting resin. 7. The light emitting device according to claim 1, wherein a space formed by the inner surface of the frame-like structure and the inner surface of the top plate is 0.2 to 1.0 mm larger than the outer periphery of the light emitting element. 9. The light emission according to claim 1, wherein a distance between the periphery of the light emitting element and the inner surface of the frame-shaped structure and a distance between the upper surface of the light-emitting element and the inner surface of the top surface of the frame-shaped structure are equal. apparatus. The light-emitting device according to any one of claims 1 to 4, 6, 8, and 9, wherein the frame-like structure has a thickness of 0.2 to 2.0 mm and a height of 0.5 to 3 mm. A method of manufacturing a light emitting device in which a semiconductor light emitting element is mounted on a substrate,
After mounting the light emitting element on a substrate,
Covering the phosphor element with a resin frame structure containing a phosphor,
A method for manufacturing a light-emitting device, wherein a space between the light-emitting element and the frame-shaped structure is filled with a translucent resin material. The method for manufacturing a light-emitting device according to claim 11, wherein the frame-shaped structure is previously formed into a shape that covers the light-emitting element. The frame-like structure includes a phosphor-like structure containing a phosphor at a predetermined concentration and molded into a predetermined shape in the vicinity of the light-emitting element on the substrate. The manufacturing method of the light-emitting device according to claim 11, wherein the space formed by the structure is filled with a translucent resin and then cured. The method for manufacturing a light-emitting device according to claim 11, wherein a phosphor is also blended in the translucent resin. The method for manufacturing a light emitting device according to claim 11, wherein the frame-like structure is formed by compression molding. The method for manufacturing a light-emitting device according to any one of claims 11 to 15, wherein a lens further containing silicone rubber or resin is directly molded on the outside of the frame-like structure.

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