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WO2010019264A3 - Chemical mechanical polisher having movable slurry dispensers and method - Google Patents

Chemical mechanical polisher having movable slurry dispensers and method Download PDF

Info

Publication number
WO2010019264A3
WO2010019264A3 PCT/US2009/004667 US2009004667W WO2010019264A3 WO 2010019264 A3 WO2010019264 A3 WO 2010019264A3 US 2009004667 W US2009004667 W US 2009004667W WO 2010019264 A3 WO2010019264 A3 WO 2010019264A3
Authority
WO
WIPO (PCT)
Prior art keywords
slurry
distal end
movable
chemical mechanical
dispensing nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2009/004667
Other languages
French (fr)
Other versions
WO2010019264A2 (en
Inventor
Yulin Wang
Alpay Yilmaz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/196,860 external-priority patent/US8414357B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to CN200980131752.9A priority Critical patent/CN102124545B/en
Priority to JP2011523002A priority patent/JP5542818B2/en
Publication of WO2010019264A2 publication Critical patent/WO2010019264A2/en
Publication of WO2010019264A3 publication Critical patent/WO2010019264A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

A chemical mechanical polisher comprises a polishing platen capable of supporting a polishing pad, first and second substrate carriers that are each capable of holding a substrate against the polishing pad and first and second movable slurry dispansers. The movable slurry dispenser comprises (i) an arm comprising a pivoting end and a distal end, (ii) at least one slurry dispensing nozzle on the distal end, and (iii) a dispenser drive capable of rotating the arm about the pivoting end to swing the slurry dispensing nozzle at the distal end to dispense slurry across the polishing platen. In another version, the movable slurry dispenser comprises a hinged arm having a plurality of sections that are joined at one or more hinge joints, a pivoting end and a distal end, and at least one slurry dispensing nozzle located at or near the distal end.
PCT/US2009/004667 2008-08-14 2009-08-14 Chemical mechanical polisher having movable slurry dispensers and method Ceased WO2010019264A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200980131752.9A CN102124545B (en) 2008-08-14 2009-08-14 Chemical mechanical polisher having movable slurry dispensers and method
JP2011523002A JP5542818B2 (en) 2008-08-14 2009-08-14 Chemical mechanical polishing machine and method with movable slurry dispenser

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US8899308P 2008-08-14 2008-08-14
US61/088,993 2008-08-14
US12/196,860 US8414357B2 (en) 2008-08-22 2008-08-22 Chemical mechanical polisher having movable slurry dispensers and method
US12/196,860 2008-08-22

Publications (2)

Publication Number Publication Date
WO2010019264A2 WO2010019264A2 (en) 2010-02-18
WO2010019264A3 true WO2010019264A3 (en) 2010-05-20

Family

ID=41669537

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/004667 Ceased WO2010019264A2 (en) 2008-08-14 2009-08-14 Chemical mechanical polisher having movable slurry dispensers and method

Country Status (4)

Country Link
JP (1) JP5542818B2 (en)
KR (1) KR20110065464A (en)
CN (1) CN102124545B (en)
WO (1) WO2010019264A2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103223638B (en) * 2013-04-28 2016-04-13 上海华力微电子有限公司 Chemical-mechanical grinding device
CN103286693A (en) * 2013-05-31 2013-09-11 上海集成电路研发中心有限公司 Grinding fluid distribution arm
CN104425323B (en) 2013-08-30 2018-01-19 细美事有限公司 The method for handling the device of substrate and cleaning the device
CN104625941B (en) * 2013-11-14 2018-09-04 盛美半导体设备（上海）有限公司 Wafer processing apparatus
CN104637836B (en) * 2013-11-14 2019-06-25 盛美半导体设备（上海）有限公司 Wafer processing apparatus
KR101637537B1 (en) * 2014-07-01 2016-07-08 주식회사 케이씨텍 Chemical mechanical polishing apparatus and method
CN104308744A (en) * 2014-08-26 2015-01-28 上海华力微电子有限公司 Chemical mechanical grinding liquid supply device
CN105479324B (en) * 2014-10-03 2020-11-06 株式会社荏原制作所 Polishing apparatus and processing method
WO2016093963A1 (en) * 2014-12-12 2016-06-16 Applied Materials, Inc. System and process for in situ byproduct removal and platen cooling during cmp
KR101587894B1 (en) * 2015-02-17 2016-01-25 주식회사 티에스시 Slurry Supply Device
KR101707450B1 (en) * 2015-12-04 2017-02-16 주식회사 포스코 Sample processing apparatus
KR101681679B1 (en) * 2016-03-31 2016-12-01 에이프로테크주식회사 Apparatus for supplying slurry of wafer polishing apparatus
JP6717691B2 (en) 2016-07-06 2020-07-01 株式会社荏原製作所 Substrate processing equipment
EP3616237A4 (en) * 2017-04-26 2020-12-16 Axus Technology, LLC CMP MACHINE WITH INCREASED THROUGHPUT AND IMPROVED PROCESS FLEXIBILITY
KR101966952B1 (en) * 2017-07-06 2019-04-18 주식회사 케이씨텍 Slurry supply unit and apparatus for polishing substrate having the slurry supply device
US11251047B2 (en) * 2017-11-13 2022-02-15 Applied Materials, Inc. Clog detection in a multi-port fluid delivery system
KR102037750B1 (en) * 2018-02-09 2019-10-29 에스케이실트론 주식회사 Slurry supplying unit and apparatur for polishing wafer including the same
CN108857904B (en) * 2018-06-25 2020-04-10 深圳市冠华珠宝有限公司 Grinding machine with auxiliary agent spray holes
JP7152279B2 (en) 2018-11-30 2022-10-12 株式会社荏原製作所 Polishing equipment
CN110977622B (en) * 2019-12-13 2021-04-02 大连理工大学 A kind of control method of polishing liquid multi-point variable position automatic dripping
KR102754098B1 (en) * 2019-12-24 2025-01-14 에스케이하이닉스 주식회사 Apparatus of chemical mechanical polishing And Method of driving the same
JP7493966B2 (en) * 2020-03-06 2024-06-03 株式会社荏原製作所 Polishing Equipment and Processing Systems
KR102835295B1 (en) 2020-03-06 2025-07-18 가부시키가이샤 에바라 세이사꾸쇼 Polishing apparatus, treatment system, and polishing method
CN111633498B (en) * 2020-06-09 2022-03-29 南京鲲途机电科技有限公司 Automatic ceramic grinding machine tool
US11724355B2 (en) * 2020-09-30 2023-08-15 Applied Materials, Inc. Substrate polish edge uniformity control with secondary fluid dispense
CN113245986B (en) * 2021-06-01 2021-10-01 湖南工业职业技术学院 Disc surface grinding device of continuous concrete mixer
WO2022259833A1 (en) * 2021-06-11 2022-12-15 株式会社荏原製作所 Polishing device
JP7732785B2 (en) * 2021-06-30 2025-09-02 株式会社荏原製作所 Liquid supply device and polishing device
US20230130235A1 (en) * 2021-10-21 2023-04-27 Applied Materials, Inc. Polishing slurry dispense nozzle
JP2024054715A (en) * 2022-10-05 2024-04-17 株式会社荏原製作所 Polishing Equipment
KR102842617B1 (en) * 2023-01-11 2025-08-07 에스케이하이닉스 주식회사 Multi-nozzle for CMP slurry supply

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6482290B1 (en) * 2001-08-10 2002-11-19 Taiwan Semiconductor Manufacturing Co., Ltd Sweeping slurry dispenser for chemical mechanical polishing
US20060003671A1 (en) * 2004-07-02 2006-01-05 Stumpf John F CMP apparatus and method
US7052374B1 (en) * 2005-03-01 2006-05-30 Taiwan Semiconductor Manufacturing Co., Ltd. Multipurpose slurry delivery arm for chemical mechanical polishing

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000006010A (en) * 1998-06-26 2000-01-11 Ebara Corp Cmp device and its grinding liquid feeding method
AU4044400A (en) * 1999-04-01 2000-10-23 Koninklijke Philips Electronics N.V. Dual cmp pad conditioner
US6390902B1 (en) * 2001-06-06 2002-05-21 United Microelectronics Corp. Multi-conditioner arrangement of a CMP system
US6722943B2 (en) * 2001-08-24 2004-04-20 Micron Technology, Inc. Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
JP2006147773A (en) * 2004-11-18 2006-06-08 Ebara Corp Polishing apparatus and polishing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6482290B1 (en) * 2001-08-10 2002-11-19 Taiwan Semiconductor Manufacturing Co., Ltd Sweeping slurry dispenser for chemical mechanical polishing
US20060003671A1 (en) * 2004-07-02 2006-01-05 Stumpf John F CMP apparatus and method
US7052374B1 (en) * 2005-03-01 2006-05-30 Taiwan Semiconductor Manufacturing Co., Ltd. Multipurpose slurry delivery arm for chemical mechanical polishing

Also Published As

Publication number Publication date
JP5542818B2 (en) 2014-07-09
JP2011530422A (en) 2011-12-22
KR20110065464A (en) 2011-06-15
CN102124545B (en) 2013-11-06
CN102124545A (en) 2011-07-13
WO2010019264A2 (en) 2010-02-18

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