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WO2010014243A3 - Outil de fond à refroidissement thermoélectrique à film mince - Google Patents

Outil de fond à refroidissement thermoélectrique à film mince Download PDF

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Publication number
WO2010014243A3
WO2010014243A3 PCT/US2009/004411 US2009004411W WO2010014243A3 WO 2010014243 A3 WO2010014243 A3 WO 2010014243A3 US 2009004411 W US2009004411 W US 2009004411W WO 2010014243 A3 WO2010014243 A3 WO 2010014243A3
Authority
WO
WIPO (PCT)
Prior art keywords
thin film
thermoelectric cooling
film thermoelectric
cooling layer
coupled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2009/004411
Other languages
English (en)
Other versions
WO2010014243A2 (fr
Inventor
Rocco Difoggio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Baker Hughes Holdings LLC
Original Assignee
Baker Hughes Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Baker Hughes Inc filed Critical Baker Hughes Inc
Priority to BRPI0917426A priority Critical patent/BRPI0917426A2/pt
Priority to GB1101610.2A priority patent/GB2476178B/en
Publication of WO2010014243A2 publication Critical patent/WO2010014243A2/fr
Publication of WO2010014243A3 publication Critical patent/WO2010014243A3/fr
Anticipated expiration legal-status Critical
Priority to NO20110208A priority patent/NO20110208A1/no
Ceased legal-status Critical Current

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B47/00—Survey of boreholes or wells
    • E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
    • E21B47/017—Protecting measuring instruments
    • E21B47/0175—Cooling arrangements
    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B47/00—Survey of boreholes or wells
    • E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
    • E21B47/017—Protecting measuring instruments
    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B36/00—Heating, cooling or insulating arrangements for boreholes or wells, e.g. for use in permafrost zones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Geology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Fluid Mechanics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Geophysics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)

Abstract

L'invention concerne un appareil et un procédé permettant de refroidir une matrice en fond de puits. L'appareil inclut une matrice à semi-conducteurs. Une couche de refroidissement thermoélectrique à film mince est couplée à la matrice à semi-conducteurs, et un dissipateur thermique est couplé à la  couche de refroidissement thermoélectrique à film mince. Un procédé inclut le transport d'une matrice à semi-conducteurs sur un support vers un emplacement de fond de puits et l'activation d'une couche de refroidissement thermoélectrique à film mince couplée à la matrice à semi-conducteurs. Le procédé inclut en outre le pompage de la chaleur de la couche de refroidissement thermoélectrique à film mince en utilisant un dissipateur thermique couplé à la couche de refroidissement thermoélectrique à film mince.
PCT/US2009/004411 2008-08-01 2009-07-30 Outil de fond à refroidissement thermoélectrique à film mince Ceased WO2010014243A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
BRPI0917426A BRPI0917426A2 (pt) 2008-08-01 2009-07-30 ferramenta de subsuperfície com resfriamento termoelétrico de película fina
GB1101610.2A GB2476178B (en) 2008-08-01 2009-07-30 Downhole tool with thin film thermoelectric cooling
NO20110208A NO20110208A1 (no) 2008-08-01 2011-02-07 Nedihulls verktoy med tynnfilm termoelektrisk kjoling

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/184,684 US20100024436A1 (en) 2008-08-01 2008-08-01 Downhole tool with thin film thermoelectric cooling
US12/184,684 2008-08-01

Publications (2)

Publication Number Publication Date
WO2010014243A2 WO2010014243A2 (fr) 2010-02-04
WO2010014243A3 true WO2010014243A3 (fr) 2010-04-15

Family

ID=41606905

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/004411 Ceased WO2010014243A2 (fr) 2008-08-01 2009-07-30 Outil de fond à refroidissement thermoélectrique à film mince

Country Status (5)

Country Link
US (1) US20100024436A1 (fr)
BR (1) BRPI0917426A2 (fr)
GB (1) GB2476178B (fr)
NO (1) NO20110208A1 (fr)
WO (1) WO2010014243A2 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9995131B2 (en) 2008-11-13 2018-06-12 Halliburton Energy Services, Inc. Downhole thermal component temperature management system and method
US8826984B2 (en) * 2009-07-17 2014-09-09 Baker Hughes Incorporated Method and apparatus of heat dissipaters for electronic components in downhole tools
US8695729B2 (en) * 2010-04-28 2014-04-15 Baker Hughes Incorporated PDC sensing element fabrication process and tool
US8746367B2 (en) * 2010-04-28 2014-06-10 Baker Hughes Incorporated Apparatus and methods for detecting performance data in an earth-boring drilling tool
EP2487327B1 (fr) * 2011-02-09 2015-10-14 Siemens Aktiengesellschaft Système électronique sous-marin
US20140252531A1 (en) * 2013-03-07 2014-09-11 Qualcomm Incorporated Systems and methods for harvesting dissipated heat from integrated circuits (ics) in electronic devices into electrical energy for providing power for the electronic devices
CN107178929B (zh) * 2017-05-18 2020-11-27 西安交通大学 一种井下半导体制冷热泵装置
CN107178930B (zh) * 2017-05-24 2019-10-29 彭波涛 一种主动式井下仪表热管理系统及方法
US10907446B2 (en) * 2019-03-21 2021-02-02 Dmytro KHACHATUROV Telemetry system and method for cooling downhole electronics
US20230221188A1 (en) * 2022-01-07 2023-07-13 Baker Hughes Oilfield Operations Llc High temperature sensor and system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5547028A (en) * 1994-09-12 1996-08-20 Pes, Inc. Downhole system for extending the life span of electronic components
US20030236628A1 (en) * 2002-06-25 2003-12-25 Martorana Richard T. Environmentally mitigated navigation system
US20060213660A1 (en) * 2005-03-23 2006-09-28 Baker Hughes Incorporated Downhole cooling based on thermo-tunneling of electrons

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4375157A (en) * 1981-12-23 1983-03-01 Borg-Warner Corporation Downhole thermoelectric refrigerator
US5817188A (en) * 1995-10-03 1998-10-06 Melcor Corporation Fabrication of thermoelectric modules and solder for such fabrication
US5931000A (en) * 1998-04-23 1999-08-03 Turner; William Evans Cooled electrical system for use downhole
US6134892A (en) * 1998-04-23 2000-10-24 Aps Technology, Inc. Cooled electrical system for use downhole
US6253556B1 (en) * 2000-04-06 2001-07-03 Texas Components Corporation Electrical system with cooling or heating
US6548894B2 (en) * 2000-11-30 2003-04-15 International Business Machines Corporation Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication
US7549987B2 (en) * 2000-12-09 2009-06-23 Tsunami Medtech, Llc Thermotherapy device
US7342169B2 (en) * 2001-10-05 2008-03-11 Nextreme Thermal Solutions Phonon-blocking, electron-transmitting low-dimensional structures
US6841413B2 (en) * 2002-01-07 2005-01-11 Intel Corporation Thinned die integrated circuit package
US8455751B2 (en) * 2003-12-02 2013-06-04 Battelle Memorial Institute Thermoelectric devices and applications for the same
US7308795B2 (en) * 2004-12-08 2007-12-18 Hall David R Method and system for cooling electrical components downhole
US7527101B2 (en) * 2005-01-27 2009-05-05 Schlumberger Technology Corporation Cooling apparatus and method
US20080178920A1 (en) * 2006-12-28 2008-07-31 Schlumberger Technology Corporation Devices for cooling and power

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5547028A (en) * 1994-09-12 1996-08-20 Pes, Inc. Downhole system for extending the life span of electronic components
US20030236628A1 (en) * 2002-06-25 2003-12-25 Martorana Richard T. Environmentally mitigated navigation system
US20060213660A1 (en) * 2005-03-23 2006-09-28 Baker Hughes Incorporated Downhole cooling based on thermo-tunneling of electrons

Also Published As

Publication number Publication date
US20100024436A1 (en) 2010-02-04
BRPI0917426A2 (pt) 2015-12-01
NO20110208A1 (no) 2011-02-22
GB2476178A (en) 2011-06-15
GB201101610D0 (en) 2011-03-16
WO2010014243A2 (fr) 2010-02-04
GB2476178B (en) 2013-02-20

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