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WO2010096355A3 - Système de refroidissement utilisant de multiples plaques froides - Google Patents

Système de refroidissement utilisant de multiples plaques froides Download PDF

Info

Publication number
WO2010096355A3
WO2010096355A3 PCT/US2010/024219 US2010024219W WO2010096355A3 WO 2010096355 A3 WO2010096355 A3 WO 2010096355A3 US 2010024219 W US2010024219 W US 2010024219W WO 2010096355 A3 WO2010096355 A3 WO 2010096355A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooling system
multiple cold
system utilizing
utilizing multiple
cold plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2010/024219
Other languages
English (en)
Other versions
WO2010096355A2 (fr
Inventor
Tim Louvar
Scott Gill
Dale Thompson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Parker Hannifin Corp
Original Assignee
Parker Hannifin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Parker Hannifin Corp filed Critical Parker Hannifin Corp
Publication of WO2010096355A2 publication Critical patent/WO2010096355A2/fr
Publication of WO2010096355A3 publication Critical patent/WO2010096355A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F25B39/022—Evaporators with plate-like or laminated elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2500/00—Problems to be solved
    • F25B2500/01—Geometry problems, e.g. for reducing size

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention porte sur un sous-ensemble de plaques froides pour un système de refroidissement à fluide frigorigène liquide, le sous-ensemble de plaques froides comprenant de multiples plaques froides/évaporateurs en contact thermique avec le composant électrique ou électronique devant être refroidi, et les multiples plaques froides/évaporateurs étant en contact thermoconducteur les unes avec les autres.
PCT/US2010/024219 2009-02-17 2010-02-15 Système de refroidissement utilisant de multiples plaques froides Ceased WO2010096355A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15311409P 2009-02-17 2009-02-17
US61/153,114 2009-02-17

Publications (2)

Publication Number Publication Date
WO2010096355A2 WO2010096355A2 (fr) 2010-08-26
WO2010096355A3 true WO2010096355A3 (fr) 2011-01-06

Family

ID=42634404

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/024219 Ceased WO2010096355A2 (fr) 2009-02-17 2010-02-15 Système de refroidissement utilisant de multiples plaques froides

Country Status (1)

Country Link
WO (1) WO2010096355A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104567498A (zh) * 2013-10-29 2015-04-29 杨泰和 贴设式单侧导热均温器

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010039676B4 (de) * 2010-08-24 2016-06-09 Mahle International Gmbh Kühlsystem zum Kühlen von Elektronikkomponenten
US8368208B2 (en) 2010-10-01 2013-02-05 Raytheon Company Semiconductor cooling apparatus
US9472487B2 (en) 2012-04-02 2016-10-18 Raytheon Company Flexible electronic package integrated heat exchanger with cold plate and risers
US9553038B2 (en) 2012-04-02 2017-01-24 Raytheon Company Semiconductor cooling apparatus
DE102012014813B9 (de) 2012-07-26 2016-06-16 Wieland-Werke Ag Strukturierte Kühlkörper in Modulbauweise
JP6767837B2 (ja) * 2016-10-11 2020-10-14 昭和電工株式会社 冷却装置
US20240006684A1 (en) 2022-06-29 2024-01-04 Dana Automotive Systems Group, Llc Battery cooling system
US20240244792A1 (en) * 2023-01-13 2024-07-18 Vertiv Corporation Systems and methods for two-phase cold plate cooling

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3481393A (en) * 1968-01-15 1969-12-02 Ibm Modular cooling system
JPH09121557A (ja) * 1995-10-23 1997-05-06 Hitachi Ltd 回転機器の電子部品冷却構造及びその製作方法
JP2002181487A (ja) * 2000-12-12 2002-06-26 Daikin Ind Ltd 空気調和機用熱交換器
US20020185262A1 (en) * 2001-06-12 2002-12-12 Baer Daniel B. Single or dual buss thermal transfer system
US20040257840A1 (en) * 2003-06-17 2004-12-23 Utc Power, Llc Power converter cooling
EP1519646A2 (fr) * 2003-09-26 2005-03-30 Thermal Form & Function LLC Emploi de matériaux en mousse graphitée dans un liquide pompé, refroidissiment biphasé, radiateur
EP1717537A1 (fr) * 2005-04-13 2006-11-02 Tubes Radiatori S.R.L. Elément chauffant pour chauffage
DE102007023058A1 (de) * 2007-05-16 2008-10-30 Siemens Ag Kühlplattensystem

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3481393A (en) * 1968-01-15 1969-12-02 Ibm Modular cooling system
JPH09121557A (ja) * 1995-10-23 1997-05-06 Hitachi Ltd 回転機器の電子部品冷却構造及びその製作方法
JP2002181487A (ja) * 2000-12-12 2002-06-26 Daikin Ind Ltd 空気調和機用熱交換器
US20020185262A1 (en) * 2001-06-12 2002-12-12 Baer Daniel B. Single or dual buss thermal transfer system
US20040257840A1 (en) * 2003-06-17 2004-12-23 Utc Power, Llc Power converter cooling
EP1519646A2 (fr) * 2003-09-26 2005-03-30 Thermal Form & Function LLC Emploi de matériaux en mousse graphitée dans un liquide pompé, refroidissiment biphasé, radiateur
EP1717537A1 (fr) * 2005-04-13 2006-11-02 Tubes Radiatori S.R.L. Elément chauffant pour chauffage
DE102007023058A1 (de) * 2007-05-16 2008-10-30 Siemens Ag Kühlplattensystem

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104567498A (zh) * 2013-10-29 2015-04-29 杨泰和 贴设式单侧导热均温器

Also Published As

Publication number Publication date
WO2010096355A2 (fr) 2010-08-26

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