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WO2010077529A3 - Fabrication of conductive nanostructures on a flexible substrate - Google Patents

Fabrication of conductive nanostructures on a flexible substrate Download PDF

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Publication number
WO2010077529A3
WO2010077529A3 PCT/US2009/066302 US2009066302W WO2010077529A3 WO 2010077529 A3 WO2010077529 A3 WO 2010077529A3 US 2009066302 W US2009066302 W US 2009066302W WO 2010077529 A3 WO2010077529 A3 WO 2010077529A3
Authority
WO
WIPO (PCT)
Prior art keywords
drum
fabrication
flexible substrate
conductive nanostructures
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2009/066302
Other languages
French (fr)
Other versions
WO2010077529A2 (en
Inventor
Ding Wang
Jerome C. Porque
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to CN200980155613XA priority Critical patent/CN102300802A/en
Priority to EP09836644.6A priority patent/EP2370348A4/en
Priority to US13/130,064 priority patent/US20110240476A1/en
Publication of WO2010077529A2 publication Critical patent/WO2010077529A2/en
Publication of WO2010077529A3 publication Critical patent/WO2010077529A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/006—Nanostructures, e.g. using aluminium anodic oxidation templates [AAO]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/028—Electroplating of selected surface areas one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B2207/00—Coding scheme for general features or characteristics of optical elements and systems of subclass G02B, but not including elements and systems which would be classified in G02B6/00 and subgroups
    • G02B2207/101—Nanooptics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G02B5/3025—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Provided is a method of fabricating a continuous nanostructured material having an electrodeposited surface layer. A conductive master drum having a relief pattern on its surface that exposes only a portion of the master drum surface is immersed into a plating bath. An electrodepositable material is coated onto the exposed surface of the drum. A support material is coated over the deposited layer and the relief structure. Removal from the drum yields the nanostructured material.
PCT/US2009/066302 2008-12-17 2009-12-02 Fabrication of conductive nanostructures on a flexible substrate Ceased WO2010077529A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200980155613XA CN102300802A (en) 2008-12-17 2009-12-02 Fabrication Of Conductive Nanostructures On A Flexible Substrate
EP09836644.6A EP2370348A4 (en) 2008-12-17 2009-12-02 Fabrication of conductive nanostructures on a flexible substrate
US13/130,064 US20110240476A1 (en) 2008-12-17 2009-12-02 Fabrication of conductive nanostructures on a flexible substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13827208P 2008-12-17 2008-12-17
US61/138,272 2008-12-17

Publications (2)

Publication Number Publication Date
WO2010077529A2 WO2010077529A2 (en) 2010-07-08
WO2010077529A3 true WO2010077529A3 (en) 2010-08-26

Family

ID=42310474

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/066302 Ceased WO2010077529A2 (en) 2008-12-17 2009-12-02 Fabrication of conductive nanostructures on a flexible substrate

Country Status (5)

Country Link
US (1) US20110240476A1 (en)
EP (1) EP2370348A4 (en)
KR (1) KR20110099039A (en)
CN (1) CN102300802A (en)
WO (1) WO2010077529A2 (en)

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Publication number Priority date Publication date Assignee Title
EP2446259B1 (en) 2009-06-25 2020-08-05 The University of North Carolina At Chapel Hill Method and system for using actuated surface-attached posts for assessing biofluid rheology
JP5735785B2 (en) * 2010-11-30 2015-06-17 豊田鉄工株式会社 Electronic component cooling device and method of manufacturing the same
US9610754B2 (en) * 2011-12-23 2017-04-04 Hong Kong Baptist University Fabrication of highly flexible near-infrared metamaterials
JP5850574B2 (en) * 2012-09-20 2016-02-03 株式会社シンク・ラボラトリー Continuous pattern plating transfer system and method of manufacturing continuous pattern plating transfer
US9952149B2 (en) 2012-11-30 2018-04-24 The University Of North Carolina At Chapel Hill Methods, systems, and computer readable media for determining physical properties of a specimen in a portable point of care diagnostic device
US10040018B2 (en) 2013-01-09 2018-08-07 Imagine Tf, Llc Fluid filters and methods of use
EP2754524B1 (en) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Method of and apparatus for laser based processing of flat substrates being wafer or glass element using a laser beam line
EP2781296B1 (en) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Device and method for cutting out contours from flat substrates using a laser
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10442719B2 (en) * 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9861920B1 (en) 2015-05-01 2018-01-09 Imagine Tf, Llc Three dimensional nanometer filters and methods of use
US10730047B2 (en) 2014-06-24 2020-08-04 Imagine Tf, Llc Micro-channel fluid filters and methods of use
JP2017521259A (en) 2014-07-08 2017-08-03 コーニング インコーポレイテッド Method and apparatus for laser machining materials
TWI659793B (en) 2014-07-14 2019-05-21 美商康寧公司 System and method for processing transparent materials using adjustable laser beam focal lines
US10124275B2 (en) 2014-09-05 2018-11-13 Imagine Tf, Llc Microstructure separation filters
TWI561462B (en) * 2014-10-07 2016-12-11 Iner Aec Executive Yuan A method for forming dendritic silver with periodic structure as light-trapping layer
WO2016133929A1 (en) 2015-02-18 2016-08-25 Imagine Tf, Llc Three dimensional filter devices and apparatuses
HUE055461T2 (en) 2015-03-24 2021-11-29 Corning Inc Laser cutting and processing of display glass compositions
US10118842B2 (en) 2015-07-09 2018-11-06 Imagine Tf, Llc Deionizing fluid filter devices and methods of use
JP7082042B2 (en) 2015-07-10 2022-06-07 コーニング インコーポレイテッド A method for continuously forming holes in a flexible substrate sheet and related products.
US10479046B2 (en) 2015-08-19 2019-11-19 Imagine Tf, Llc Absorbent microstructure arrays and methods of use
US10900135B2 (en) * 2016-02-09 2021-01-26 Weinberg Medical Physics, Inc. Method and apparatus for manufacturing particles
WO2018052895A2 (en) * 2016-09-16 2018-03-22 3M Innovative Properties Company Method of making a nanostructured cylindrical roll
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
LT3529214T (en) 2016-10-24 2021-02-25 Corning Incorporated SUBSTRATE PROCESSING STATION FOR LASER MACHINERY OF SHEET SHAPE GLASS SUBSTRATES
CN111936311A (en) 2018-04-17 2020-11-13 3M创新有限公司 Conductive film
CN119080402B (en) * 2024-08-27 2025-08-01 成都赋仁生物科技有限公司 Single-molecule array chip of composite resin substrate and preparation method thereof

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Publication number Priority date Publication date Assignee Title
US6375870B1 (en) * 1998-11-17 2002-04-23 Corning Incorporated Replicating a nanoscale pattern
US6929733B2 (en) * 2001-01-17 2005-08-16 Sandia Corporation Sacrificial plastic mold with electroplatable base
US7276445B2 (en) * 2004-04-30 2007-10-02 Lg.Philips Co., Ltd. Method for forming pattern using printing method
US7361285B2 (en) * 2004-04-30 2008-04-22 Lg.Philips Lcd Co., Ltd. Method for fabricating cliche and method for forming pattern using the same

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DE10229166B4 (en) * 2002-06-28 2006-03-09 Infineon Technologies Ag Process for producing a structured metal layer
JP2004193497A (en) * 2002-12-13 2004-07-08 Nec Electronics Corp Chip size package and manufacturing method thereof
US9040090B2 (en) * 2003-12-19 2015-05-26 The University Of North Carolina At Chapel Hill Isolated and fixed micro and nano structures and methods thereof
US8673428B2 (en) * 2006-12-27 2014-03-18 Hitachi Chemical Company, Ltd. Engraved plate and substrate with conductor layer pattern using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6375870B1 (en) * 1998-11-17 2002-04-23 Corning Incorporated Replicating a nanoscale pattern
US6929733B2 (en) * 2001-01-17 2005-08-16 Sandia Corporation Sacrificial plastic mold with electroplatable base
US7276445B2 (en) * 2004-04-30 2007-10-02 Lg.Philips Co., Ltd. Method for forming pattern using printing method
US7361285B2 (en) * 2004-04-30 2008-04-22 Lg.Philips Lcd Co., Ltd. Method for fabricating cliche and method for forming pattern using the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2370348A4 *

Also Published As

Publication number Publication date
US20110240476A1 (en) 2011-10-06
CN102300802A (en) 2011-12-28
EP2370348A2 (en) 2011-10-05
EP2370348A4 (en) 2016-12-21
KR20110099039A (en) 2011-09-05
WO2010077529A2 (en) 2010-07-08

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