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WO2010074840A3 - Acrylic thermal conductive sheet and method for producing the same - Google Patents

Acrylic thermal conductive sheet and method for producing the same Download PDF

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Publication number
WO2010074840A3
WO2010074840A3 PCT/US2009/064680 US2009064680W WO2010074840A3 WO 2010074840 A3 WO2010074840 A3 WO 2010074840A3 US 2009064680 W US2009064680 W US 2009064680W WO 2010074840 A3 WO2010074840 A3 WO 2010074840A3
Authority
WO
WIPO (PCT)
Prior art keywords
component
mass
average particle
particle diameter
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2009/064680
Other languages
French (fr)
Other versions
WO2010074840A2 (en
Inventor
Masaki Yoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to US13/132,419 priority Critical patent/US20110245373A1/en
Priority to CN200980156198XA priority patent/CN102307939A/en
Priority to EP09835444A priority patent/EP2370510A2/en
Priority to SG2011040896A priority patent/SG171965A1/en
Publication of WO2010074840A2 publication Critical patent/WO2010074840A2/en
Publication of WO2010074840A3 publication Critical patent/WO2010074840A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Graft Or Block Polymers (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

To provide a thermal conductive sheet having improved thermal conductivity while maintaining flexibility and flame retardancy, and a method for producing the same. The above sheet can be obtained from hardened material comprising: a binder component (A) containing at least one alkyl (meth)acrylate monomer having an alkyl group of 12 to 18 carbon atoms and/or a partial polymer thereof; aluminum hydroxide particles (B) having an average particle diameter of 0.3 m or more and less than 4.0 m which are obtained by a crystallization method and are not subjected to a pulverization treatment; aluminum hydroxide particles (C) having an average particle diameter of 4.0 m or more and 15.0 m or less which are obtained by a crystallization method and are not subjected to a pulverization treatment, and also satisfy the relation: average particle diameter of the particles (C)/average particle diameter of the particles (B) = 3 to 15; and a reaction initiator (D); wherein the content of the component (A) is 100 parts by mass, the content of the component (B) is from 50 to 400 parts by mass, the content of the component (C) is from 50 to 1,000 parts by mass, and the content of the component (D) is from 0.01 to 5 parts by mass.
PCT/US2009/064680 2008-12-15 2009-11-17 Acrylic thermal conductive sheet and method for producing the same Ceased WO2010074840A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US13/132,419 US20110245373A1 (en) 2008-12-15 2009-11-17 Acrylic thermal conductive sheet and method for producing the same
CN200980156198XA CN102307939A (en) 2008-12-15 2009-11-17 Acrylic thermally conductive sheet and preparation method thereof
EP09835444A EP2370510A2 (en) 2008-12-15 2009-11-17 Acrylic thermal conductive sheet and method for producing the same
SG2011040896A SG171965A1 (en) 2008-12-15 2009-11-17 Acrylic thermal conductive sheet and method for producing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008318667A JP5646812B2 (en) 2008-12-15 2008-12-15 Acrylic heat conductive sheet and method for producing the same
JP2008-318667 2008-12-15

Publications (2)

Publication Number Publication Date
WO2010074840A2 WO2010074840A2 (en) 2010-07-01
WO2010074840A3 true WO2010074840A3 (en) 2010-08-19

Family

ID=42288350

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/064680 Ceased WO2010074840A2 (en) 2008-12-15 2009-11-17 Acrylic thermal conductive sheet and method for producing the same

Country Status (8)

Country Link
US (1) US20110245373A1 (en)
EP (1) EP2370510A2 (en)
JP (1) JP5646812B2 (en)
KR (1) KR101651708B1 (en)
CN (1) CN102307939A (en)
SG (1) SG171965A1 (en)
TW (1) TW201026802A (en)
WO (1) WO2010074840A2 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5223149B2 (en) * 2010-06-28 2013-06-26 北川工業株式会社 Thermal conductivity material
JP6020942B2 (en) * 2011-01-07 2016-11-02 株式会社Ｇｓユアサ Power storage device
JP5804323B2 (en) 2011-01-07 2015-11-04 株式会社Ｇｓユアサ Power storage element and power storage device
JP5480191B2 (en) * 2011-03-31 2014-04-23 古河電気工業株式会社 Thermally conductive rubber composition and method for producing the same
CN102504707B (en) * 2011-11-01 2014-03-26 特艾弗新材料科技（上海）有限公司 Fast cured thermal conductive adhesive and preparation method thereof
JP2013118313A (en) * 2011-12-05 2013-06-13 Dexerials Corp Electromagnetic wave-absorbing thermally conductive sheet, and manufacturing method of electromagnetic wave-absorbing thermally conductive sheet
TWI484013B (en) * 2012-03-12 2015-05-11 Showa Denko Kk A polymerizable composition, a polymer, an image display device, and a method for manufacturing the same
CN104169316B (en) * 2012-03-28 2016-08-24 昭和电工株式会社 Polymerizable composition, polymerizable composition, polymerizate, stick together plate, the manufacture method of image display device and image display device
DE102012109500A1 (en) * 2012-10-05 2014-04-10 Dr. Neidlinger Holding Gmbh Heat-dissipating polymer and resin compositions for producing the same
JP6029932B2 (en) * 2012-10-30 2016-11-24 日東電工株式会社 Thermally conductive adhesive sheet and method for producing the same
CN106459237B (en) * 2014-05-22 2020-08-07 迪睿合株式会社 Acrylic heat conductive composition and heat conductive sheet
JP6576617B2 (en) * 2014-05-22 2019-09-18 デクセリアルズ株式会社 Acrylic heat conductive composition and heat conductive sheet
JP6564560B2 (en) * 2014-05-22 2019-08-21 デクセリアルズ株式会社 Acrylic heat conductive composition and heat conductive sheet
JP6710828B2 (en) * 2016-04-06 2020-06-17 北川工業株式会社 HEAT CONDUCTIVE SHEET, AND METHOD FOR MANUFACTURING HEAT CONDUCTIVE SHEET
JP6791271B2 (en) * 2017-01-26 2020-11-25 信越化学工業株式会社 Thermal conductivity sheet and its manufacturing method
CN113841234B (en) 2019-05-21 2024-12-17 Ddp特种电子材料美国有限责任公司 Two-part interface material, system including the same, and method thereof
EP3973032B1 (en) 2019-05-21 2023-09-27 DDP Specialty Electronic Materials US, LLC Thermal interface materials
KR102476584B1 (en) * 2019-07-10 2022-12-13 주식회사 엘지화학 Composition for thermally conductive sheet and thermally conductive sheet prepared therefrom
JP2023516361A (en) 2020-03-03 2023-04-19 スリーエム イノベイティブ プロパティズ カンパニー Thermally Conductive Article Comprising Entangled or Aligned Fibers, Method of Making Same, and Battery Module
US20230312796A1 (en) * 2020-09-29 2023-10-05 Lg Chem, Ltd. Curable Composition
CN119955340B (en) * 2025-02-17 2025-11-11 深圳市傲川科技有限公司 Wear-resistant heat-conducting paint and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001226117A (en) * 2000-02-17 2001-08-21 Denki Kagaku Kogyo Kk Spherical alumina powder and resin composition
JP2004315663A (en) * 2003-04-16 2004-11-11 Three M Innovative Properties Co Acrylic heat conductive composition and heat conductive sheet
WO2006016936A1 (en) * 2004-07-09 2006-02-16 3M Innovative Properties Company Thermally conductive sheet
US20060228542A1 (en) * 2005-04-08 2006-10-12 Saint-Gobain Performance Plastics Corporation Thermal interface material having spheroidal particulate filler
WO2007053475A1 (en) * 2005-10-28 2007-05-10 3M Innovative Properties Company Method for producing thermally conductive sheet and thermally conductive sheet produced by the method
WO2008055014A1 (en) * 2006-10-31 2008-05-08 3M Innovative Properties Company Sheet formable monomer composition, heat conductive sheet and production method of the heat conductive sheet

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003313431A (en) * 2002-04-26 2003-11-06 Showa Denko Kk Thermally conductive resin composition, sheet, electronic component using the same, semiconductor device, display device, and plasma display panel
JP2007056067A (en) * 2005-08-22 2007-03-08 Denki Kagaku Kogyo Kk Electrically insulating flame-retardant heat conductive material and heat conductive sheet using the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001226117A (en) * 2000-02-17 2001-08-21 Denki Kagaku Kogyo Kk Spherical alumina powder and resin composition
JP2004315663A (en) * 2003-04-16 2004-11-11 Three M Innovative Properties Co Acrylic heat conductive composition and heat conductive sheet
WO2006016936A1 (en) * 2004-07-09 2006-02-16 3M Innovative Properties Company Thermally conductive sheet
US20060228542A1 (en) * 2005-04-08 2006-10-12 Saint-Gobain Performance Plastics Corporation Thermal interface material having spheroidal particulate filler
WO2007053475A1 (en) * 2005-10-28 2007-05-10 3M Innovative Properties Company Method for producing thermally conductive sheet and thermally conductive sheet produced by the method
WO2008055014A1 (en) * 2006-10-31 2008-05-08 3M Innovative Properties Company Sheet formable monomer composition, heat conductive sheet and production method of the heat conductive sheet

Also Published As

Publication number Publication date
US20110245373A1 (en) 2011-10-06
CN102307939A (en) 2012-01-04
JP2010138357A (en) 2010-06-24
EP2370510A2 (en) 2011-10-05
KR20110104951A (en) 2011-09-23
KR101651708B1 (en) 2016-08-26
JP5646812B2 (en) 2014-12-24
WO2010074840A2 (en) 2010-07-01
SG171965A1 (en) 2011-07-28
TW201026802A (en) 2010-07-16

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