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WO2010071609A3 - System and processing of a substrate - Google Patents

System and processing of a substrate Download PDF

Info

Publication number
WO2010071609A3
WO2010071609A3 PCT/SG2009/000484 SG2009000484W WO2010071609A3 WO 2010071609 A3 WO2010071609 A3 WO 2010071609A3 SG 2009000484 W SG2009000484 W SG 2009000484W WO 2010071609 A3 WO2010071609 A3 WO 2010071609A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
processing
station
surface inspection
top surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/SG2009/000484
Other languages
French (fr)
Other versions
WO2010071609A2 (en
Inventor
Hae Choon Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rokko Ventures Pte Ltd
Original Assignee
Rokko Ventures Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rokko Ventures Pte Ltd filed Critical Rokko Ventures Pte Ltd
Priority to CN2009801503236A priority Critical patent/CN102439707A/en
Publication of WO2010071609A2 publication Critical patent/WO2010071609A2/en
Anticipated expiration legal-status Critical
Publication of WO2010071609A3 publication Critical patent/WO2010071609A3/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sorting Of Articles (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

A system for processing a substrate (100) comprising a loading station for receiving the substrate; a bottom surface inspection station (30) for inspecting the bottom surface of the substrate; a top surface inspection station (35) for inspecting the top surface of the substrate and; a sorting station for sorting the substrate into a predetermined category based upon the bottom surface inspection and top surface inspection.
PCT/SG2009/000484 2008-12-17 2009-12-17 System and processing of a substrate Ceased WO2010071609A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009801503236A CN102439707A (en) 2008-12-17 2009-12-17 System and processing of a substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200809409-6 2008-12-17
SG200809409-6A SG162631A1 (en) 2008-12-17 2008-12-17 System and processing of a substrate

Publications (2)

Publication Number Publication Date
WO2010071609A2 WO2010071609A2 (en) 2010-06-24
WO2010071609A3 true WO2010071609A3 (en) 2013-10-24

Family

ID=42269270

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG2009/000484 Ceased WO2010071609A2 (en) 2008-12-17 2009-12-17 System and processing of a substrate

Country Status (4)

Country Link
CN (1) CN102439707A (en)
SG (1) SG162631A1 (en)
TW (1) TW201033600A (en)
WO (1) WO2010071609A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015505516A (en) * 2012-02-07 2015-02-23 イスメカ セミコンダクター ホールディング エス アーＩｓｍｅｃａ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｈｏｌｄｉｎｇ Ｓａ Parts sorting device
TW201421013A (en) * 2012-11-16 2014-06-01 Prov Technology Corp Electronic component inspection and classification equipment
TW201500733A (en) * 2013-06-25 2015-01-01 Chiuan Yan Technology Co Ltd Conductive glass inspection system
US9341580B2 (en) * 2014-06-27 2016-05-17 Applied Materials, Inc. Linear inspection system
CN110108716A (en) * 2019-05-06 2019-08-09 华侨大学 A kind of automation substrate wafer defect and thickness detecting system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050134256A1 (en) * 2003-12-19 2005-06-23 Asm Assembly Automation Ltd. System for processing electronic devices
WO2008097012A1 (en) * 2007-02-06 2008-08-14 Hanmi Semiconductor Co., Ltd. Vision system of sawing and placement equipment
WO2008126955A1 (en) * 2007-04-13 2008-10-23 Jt Corporation Apparatus for inspecting semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050134256A1 (en) * 2003-12-19 2005-06-23 Asm Assembly Automation Ltd. System for processing electronic devices
WO2008097012A1 (en) * 2007-02-06 2008-08-14 Hanmi Semiconductor Co., Ltd. Vision system of sawing and placement equipment
WO2008126955A1 (en) * 2007-04-13 2008-10-23 Jt Corporation Apparatus for inspecting semiconductor device

Also Published As

Publication number Publication date
WO2010071609A2 (en) 2010-06-24
TW201033600A (en) 2010-09-16
SG162631A1 (en) 2010-07-29
CN102439707A (en) 2012-05-02

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