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WO2010071574A1 - Eléments électroniques à haute fréquence étirables - Google Patents

Eléments électroniques à haute fréquence étirables Download PDF

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Publication number
WO2010071574A1
WO2010071574A1 PCT/SE2009/051425 SE2009051425W WO2010071574A1 WO 2010071574 A1 WO2010071574 A1 WO 2010071574A1 SE 2009051425 W SE2009051425 W SE 2009051425W WO 2010071574 A1 WO2010071574 A1 WO 2010071574A1
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frequency
weight
metal alloy
alloy
electronics device
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Shi CHENG
Zhigang Wu
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0825—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a flexible sheet or membrane, e.g. for varying the focus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/273—Adaptation for carrying or wearing by persons or animals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/40—Element having extended radiating surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B17/00—Systems with reflecting surfaces, with or without refracting elements
    • G02B17/002—Arrays of reflective systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder

Definitions

  • the present invention relates in general to high-frequency devices and in particular to high-frequency devices being stretchable in one, two or three dimensions and/or twistable in three dimensions.
  • the present invention also relates to manufacturing of such devices.
  • BACKGROUND Electronics in lightweight, stretchable, foldable, and twistable formats have recently attracted increasing interest from industry and academia. Stretchability is desired especially in devices that need to be in contact with the skin of a user or has to be conformal to curved surfaces. Devices that e.g. participate in monitoring of different conditions of human or animal organs or that are used for continuous or intermittent treatment of an animal or human body do often have at least parts of the equipment attached to the skin. Conventional electronics are usually made from rigid materials and are certainly not made to stretch, fold or twist. Stiff devices and part components are typically uncomfortable while being used as body-worn large area electronics, but until recently no stretchable electronics have existed on the market.
  • stretchable electronics in particular for large area applications, for use in healthcare, wellness and functional clothes, has been carried on during the last few years. Also, applications where electronics is intended to be attached to curved surfaces, stretchable electronics is a possible approach to achieve such arrangements.
  • a typical example is e.g. the application of large area antennas on aircraft surfaces.
  • Stretchable, foldable and/or twistable electronic systems may significantly enhance the comfort of the user or simplify the integration on curved surfaces.
  • a wide range of applications can be foreseen in many areas such as wearable computing, body area networks, implanted medical devices, interactive gaming, radio frequency identification (RFID) systems, aeronautic sensing, and military radars.
  • RFID radio frequency identification
  • Various approaches to implement stretchable electronics have been introduced, mainly focusing on providing stretchable interconnects between smaller, rigid components. Such approaches have been based on pre-stretched elastic substrates, wavy silicon substrates, meandered metal strips embedded in elastic material or liquid alloy filled elastomeric channels.
  • stretchable interconnect can be found in the article "A multiaxial stretchable interconnect using liquid-alloy-filled elastomeric microchanneis", by H.-J. Kim et al in Applied Physics Letter, vol. 92, No. 1, Jan, 2008, pp. 011904-1-3. Interconnects stretchable in their interconnecting direction up to 60% were disclosed. However, a relative complex manufacturing with e.g. gold pre- deposition was used. In many applications using high-frequency devices, flexible interconnects are only solving a part of the stretchability problem. This is due to the fact that many high-frequency devices, such as antennas or micro-wave devices themselves occupy a relatively large area or volume, mainly due to their operation frequency.
  • An object of the present invention is to provide high-frequency devices presenting a high stretchability in one or two dimensions.
  • a further object of the present invention is to provide a manufacturing method for such devices that is suitable for large-scale production.
  • a high-frequency device comprises a substrate sheet of an elastic material and a metal alloy provided within and/or on the substrate sheet.
  • the metal alloy is liquid at the temperatures of operation, i.e. below 10O 0 C.
  • the metal alloy is provided in an at least two-dimensional pattern.
  • the metal alloy is wettable in contact with a surface of the elastic material.
  • a manufacturing method comprises providing of a substrate sheet and distributing a metal alloy in an at least two-dimensional pattern within and/or on the substrate sheet.
  • the metal alloy is liquid at the temperatures of operation, i.e. below 100 0 C.
  • the metal alloy is wetting a surface of the material of the substrate sheet.
  • the method also comprises covering of free surfaces of the metal alloy.
  • a method of using a stretchable high-frequency device comprises deforming of the stretchable high-frequency device, wherein electrical or electromagnetic properties of the stretchable high- frequency device are adapted.
  • an electronic device comprises a substrate sheet of synthetic silicone rubber and a metal alloy providejl_withJn_and/or-onJhe-substrate-sheet ⁇ -The-metal-alloy-is-liquid-at-room-temperature' and has a composition of 68.5 weight-% Ga, 21.5 weight-% In and 10 weight-% Sn.
  • One advantage with the present invention is that 1D or 2D stretchable large-area high-frequency devices are provided, furthermore by manufacturing processes suitable for large-scale production.
  • the high-frequency devices or other products made by the manufacturing methods according to the present invention also exhibit 3D foldability and twistability. This is very advantageous, since deformable high frequency devices will be more versatile than solely stretchable devices for the conceived and possible future applications.
  • Other advantages are discussed further in connection with the exemplary embodiments of the detailed description further below.
  • FIG. 1 is a schematic illustration of an embodiment of a high-frequency device according to the present invention
  • FIG. 2 is a flow diagram of steps of an embodiment of a manufacturing method according to the present invention
  • FIGS. 3A-D are schematic drawings of an embodiment of a manufacturing method according to the present invention.
  • FIG. 4 is a flow diagram of steps of the embodiment of a manufacturing method according to Figs. 3A-D;
  • FIGS. 5A-E are schematic drawings of another embodiment of a manufacturing method according to the present invention.
  • FIG.6 is a flow diagram of steps of the embodiment of a manufacturing method according to Figs. 5A-D;
  • FIG.7 is an illustration of an embodiment of an antenna according to the present invention.
  • FIGS. 8A-B are diagrams of reflection coefficients
  • FIGS. 9A-D are diagrams of radiation patterns
  • FIG. 10 is an illustration of another embodiment of an antenna according to the present invention.
  • FIG. 11 is a diagram of radiation efficiency;
  • FIGS. 12A-D illustrate an embodiment of a deformable frequency-selective surface;
  • FIG. 13 is a flow diagram of an embodiment of a method of using a stretchable high-frequency device according to the present invention.
  • FIGS. 14A-D illustrate an embodiment of a metamaterial
  • FIGS. 16A-C illustrate an embodiment of a deformable reflective mirror array.
  • a typical high-frequency device e.g. a radio-frequency (RF) antenna
  • RF radio-frequency
  • the components of the pattern are typically in the same order of magnitude as a wavelength or at least a non-negligible part of a wavelength for the radiation with the intended frequency.
  • a general stretchability can be provided by a suitable elastic material.
  • Most suitable such materials are non-conductors, typically different types of rubber. Due to this non-conductive properties, the actual conducting material pattern has to be provided in a different manner. Metals or alloys are suitable choices. Furthermore, also the conducting material has to provide a certain elasticity. Alloys with low melting temperatures are generally relatively soft and easily deformable. Furthermore, in order to form a two- dimensional pattern, it would be preferable to use the alloys in melted conditions.
  • a high-frequency device 1 comprises a substrate sheet 10 of an elastic material 11 and a metal alloy 12 provided within and/or on the substrate sheet 10. This is schematically illustrated in Fig. 1. Two-dimensional stretchability and three-dimensional foldability and twistability are achieved when using a metal alloy incorporated into or deposited onto an elastic substrate material, or a combination thereof.
  • the metal alloy 12 is provided in a two-dimensional pattern 13 distributed over the substrate sheet 10.
  • the metal alloy 12 has to be liquid at a temperature below a disintegration temperature of the elastic material 11.
  • the metal alloy 12 is liquid at a temperature below 100 0 C, more preferably the metal alloy 12 is liquid at a temperature below 70 0 C and most preferably the metal alloy 12 is liquid at room temperature.
  • the high-frequency device 1 can be manufactured at a temperature at which the substrate sheet 10 is intact and the metal alloy 12 is liquid, which means that the metal alloy easily is distributed into the requested two-dimensional pattern 13.
  • the metal alloy 12 is liquid at room temperature, i.e. at most operation temperatures. This ensures an undisrupted conductivity through the whole two-dimensional pattern 13 during operation.
  • a room temperature liquid metal alloy may be incorporated into channels 14, macro or micro channels, or a combination thereof, in the elastic material 11.
  • One aspect that influences both the manufacturing and the operation is that the metal alloy 12 is wettable in contact with a surface of the elastic material 11. In other words, a droplet of liquid metal alloy in contact with the elastic material will spread out over a relatively large area.
  • the choice of materials is of importance.
  • the metal alloy should as mentioned above be liquid at moderate temperatures and at least at temperatures below any disintegration temperature for the elastic material. Different groups of useful metal alloys are found; alloys of Ga, In and Sn, alloys of Na and K, alloys of Bi, In and Sn, alloys of Bi, Pb and Sn, alloys of Bi, Pb, Sn and Cd, alloys of Ga and In, and alloys of In, Cu and Bi.
  • Galinstan ® is a useful choice.
  • the eutectic alloy comprises 68.5 weight-% Ga, 21.5 weight-% In and 10 weight-% Sn.
  • the melting temperature is -19°C, which makes it liquid at most normal operation temperatures.
  • alloy compositions somewhat off the eutectic composition have sufficiently low melting temperatures and may also advantageously be used.
  • the alloys of Ga and In are an alternative choice. For instance, an alloy of 75.5 weight-% Ga and 24.5 weight-% In has a melting temperature of approximately 16°C.
  • Sodium-potassium alloys are highly reactive with air and must be handled with care.
  • a eutectic composition of 78 weight-% K and 22 weight-% Na is liquid from -12 0 C.
  • NaK alloys having a K content of 40 - 90 weight-% are all liquid at room temperature. Due to the hazardous properties, NaK is presently not considered as a preferred choice.
  • liquid metals have somewhat higher melting temperature are of interest, since a form alteration can be performed at temperature somewhat higher than room temperature. The actual operation temperature may then be lower than the melting temperature, but if the shape then is maintained, there is no risk for altering any connection conditions. Alloys having a melting temperature below about 100 0 C, and preferably below about 70°C, are considered as possible to use.
  • Field's metal is one example, being a eutectic alloy of 32.5 weight-% Bi, 51 weight-% In and 16.5 weight-% Sn.
  • Rose's metal is another example, being an alloy of 50 weight-% Bi, 25-28 weight-% Pb and 22-25 weight-% Sn.
  • Wood's metal comprising in a eutectic composition 50 weight-% Bi, 26.7 weight-% Pb, 13.3 weight-% Sn and 10 weight-% Cd.
  • the alloy is also known as Lipowitz's alloy or by the commercial names of cerrobend ® , bendalloy or pewtalloy.
  • Liquid MetalPad an alloy of In, Cu and Bi, is feasible.
  • the elastic material is preferably selected from synthetic rubber, natural rubber, latex and elastomer.
  • the synthetic rubber may e.g. be silicone rubber or polyurethane.
  • silicone rubber is considered as a useful choice. It has good elastic properties, allowing large stretchability and it is at the same time easy to handle and work.
  • the high-frequency devices comprise a room temperature liquid alloy with a composition of 68.5 weight-% Ga, 21.5 weight-% In and 10 weight-% Sn and an elastic material in the form of silicone rubber. This configuration is very useful also as a general purpose electronic device.
  • Fig. 2 illustrates a flow diagram of steps of an embodiment of a method for manufacturing of a high- frequency device according to the present invention.
  • the process starts in step 200.
  • a substrate sheet is provided.
  • a metal alloy is distributed in a two-dimensional pattern within and/or on the substrate sheet in step 220.
  • the metal alloy is liquid at the temperatures of operation, i.e. below 100 0 C.
  • the metal alloy 12 is liquid at a temperature below 70 0 C and preferably the metal alloy 12 is liquid at room temperature.
  • the metal alloy is wetting a surface of the material of the substrate sheet.
  • free surfaces of the metal alloy are covered.
  • the process ends in step 249.
  • Figs. 3A-D show an example of a possible manufacturing method for producing deformable high frequency devices, e.g. RF or optical devices, according to the present invention.
  • a design pattern was first transferred to master and then replicated to elastic materials by molding.
  • the channels in the elastic material may in other embodiments be fabricated using a number of manufacturing methods such as casting, e.g. soft-lithography, ablation, etching, embossing, and/or imprinting.
  • the channels may have any shapes.
  • a pattern of channels 14 was created in a first substrate part sheet 18, i.e.
  • a base portion a base portion, and a pattern of inlets 16 was created in a second substrate part sheet 15, i.e. a lid or a cover.
  • the patterned channels 14 are covered with the lid and the lid is bonded to the base portion to form the substrate sheet 10.
  • liquid metal alloy 12 was injected into the patterned channels 14 through the inlets 16.
  • the injection inlets 16 were sealed by a seal 17.
  • the providing step 210 comprises the creation 211 of a substrate sheet having internal channels.
  • This step in turn comprises in a particular embodiment four part steps.
  • step 212 channels are formed in a surface of a first substrate part sheet.
  • step 2 ⁇ a cover is provided, constituted by a second substrate part sheet. Inlets are created through the second substrate part sheet in step 214. It would also in an alternative embodiment be feasible to have at least some of the inlets made through the first substrate part sheet.
  • the cover is bonded on top of the channels in the first substrate part sheet.
  • the distributing step 220 comprises in this embodiment injecting 221 of the metal alloy through the inlets into the internal channels.
  • the covering step 230 comprises in this embodiment sealing 231 of said inlets.
  • FIGs 5A-E show an example of another possible manufacturing method for producing deformable high frequency devices according to the present invention.
  • a mask 20 is provided by a pattern, as seen in Fig. 5A. This can be performed by any prior art mask production method.
  • the mask 20 comprises openings 21, which may have any shape.
  • the mask 20 is provided on top of a first substrate part sheet 18.
  • a liquid metal alloy 12 is deposited over the mask 20, filling up the openings 21. The mask is removed, and in Fig. 5D, a pattern 22 of liquid metal alloy 12 is presented on top of the first substrate part sheet 18.
  • the liquid metal alloy pattern 22 on top of such a substrate can be encapsulated with uncured elastic material which then is cured to form a second substrate part sheet 15, which bonded together with the first substrate part sheet 18 realizes the substrate sheet 10 of the stretchable electronics.
  • metallization patterns can be printed on a low cost substrate, e.g. paper or transparency, or elastic substrate.
  • a low cost substrate e.g. paper or transparency, or elastic substrate.
  • This technique can thereby be applied for low cost and highly efficient electronics or elastic electronics.
  • the distributing step 220 comprises three part steps.
  • a mask is provided on top of a first substrate part sheet.
  • the mask can be made by different techniques, e.g. by casting, soft lithography, ablation, etching, embossing and/or imprinting. Openings in the mask are filled by the metal alloy in step 223.
  • the covering step 230 also comprises two part steps.
  • the first substrate part sheet is covered with an uncured elastic material.
  • the uncured elastic material is cured.
  • the distributing step can e.g. comprise a printing ot the metal alloy into the two-dimensional pattern onto the surface of the first substrate part sheet. If a temperature is selected, at which the liquid metal alloy has viscosity properties similar to printer inks, an ordinary printer could even be used. Such distribution is then preferably followed by a covering step 230 as shown in Fig. 6.
  • the high-frequency devices are implemented as radio frequency (RF) devices, in particular deformable RF devices.
  • the RF device takes the form of an antenna.
  • a highly 2D stretchable unbalanced loop antenna capable of working at the 2.4 GHz industry-scientific-medical (ISM) band. Apart from the 2D stretchability, this antenna can also be folded or twisted in three dimensions without mechanical or electrical damage.
  • ISM industry-scientific-medical
  • Such antenna features a number of merits such as enhancing the comfort for the user and ease of integration on curved/movable surfaces, e.g. integrated on a human body for interactive gaming or body area networks, or in a human body, e.g. implanted medical devices.
  • the elastic channels for the stretchable antenna according to this embodiment were fabricated using a standard soft-lithography technique.
  • the antenna design was patterned to SU-8 on a silicon wafer using
  • Fig. 7 shows the geometry of the 2D stretchable unbalanced loop antenna 2 in a top view and a side view.
  • the resonance frequency f of this antenna is determined by the overall length of the upper tube 30, and calculated by where c is the light velocity in free-space, ⁇ ⁇ ft is the effective dielectric constant that is approximately equal to ⁇ 1 ⁇ ueioihB ⁇ negligible ⁇ flkrti5fih ⁇ th1 ⁇ llcor ⁇ e ⁇ ubber membranes.
  • the lower semi-cylindrical cavity 32 acted as a ground plane 33 for the antenna 2.
  • a large number of spacers 34 were aligned in this cavity 32 to separate the top and bottom silicone rubber membranes. These spacers 34 have negligible effect on the antenna electrical characteristics.
  • the lower semi-cylindrical cavity 32 can also be used for active device integration. Complex routing can be implemented in this area without affecting the electrical performance of the antenna.
  • a thin RF coaxial cable was attached to the antenna via two openings 35 in the top membrane. These circular membranes were 95 mm in diameter, which had nearly no influence on the antenna electrical characteristics and can be made smaller in a final product applications. Large membranes were chosen for convenience in the measurements.
  • Figs. 9A-D present the simulated and measured xz- and yz-plane radiation patterns at 2.4 GHz. Similar to conventional unbalanced loop antennas, the non-stretched antenna featured broad beam coverage. The maximum antenna gain was found to be around 2.7 dBi. Slight variations on the measured radiation patterns could be seen when this antenna was stretched, cf. Fig. 9C-D. Since no significant gain reduction was observed, this antenna still achieved good performance even if it was stretched to 40%.
  • Table 1 Measured radiation efficiency at 2.4 GHz and resonance frequencies of the stretchable unbalanced loop antenna without and with stretching.
  • a planar inverted cone antenna (PICA) for ultrawideband (UWB) applications has been implemented and characterized, using the above-mentioned manufacturing method.
  • the demonstrated prototype exhibited a 2-D stretchabilitv of UP to 40% in two perpendicular directions as well as 3-D foldability and twistability.
  • the demonstrated UWB antenna exhibited high 2D stretchability and 3D foldability and twistability. Measured results on its electrical performance show that this antenna features broad impedance bandwidth and radiation characteristics even if it is stretched to 40%.
  • the antenna fulfils the requirements of UWB stretchable electronic systems.
  • RF devices according to the present invention can also be applied in other applications as well.
  • the technique according to the present invention may also be used for producing other deformable RF devices, e.g. resonators, frequency-selective surface, metamaterials, and reflective surfaces that reflect RF waves or microwaves.
  • an RF device is provided as a resonator.
  • Deformable resonators like closed or open metallic cavities, e.g. in cubic, spherical or cylindrical shapes, can be realized using the similar method as presented above, where the liquid alloy boundaries are embedded in elastic materials.
  • the resonance frequencies of the resonator can thereby be tuned by means of varying the geometry, e.g. by stretching, pressing or bending, of the closed cavity.
  • Such mechanical deforming actions then gives rise to dimension changes of the resonating conductive parts, which consequently gives rise to changes in resonating properties.
  • Such deformable resonators can also be an antenna.
  • an antenna As seen above, by stretching the antenna, changes in the antenna properties are achieved, e.g. in resonance frequency or intensity. By quantifying such changes in antenna properties, the amount of e.g. stretching can be estimated.
  • the stretchable antenna can be used as a sensor, e.g. monitoring strain or motion. Such antenna can thus be employed both for wirelessly transmitting/receiving data and as a self-contained sensor.
  • deformable frequency-selective surfaces, metamaterials, and reflective surfacesxarrbB-mBdeirrthBiorrn ⁇ fthre ⁇ hirrlayeTST ⁇ t ⁇ p ⁇ lastic ⁇ thin membrane, a mm nqui ⁇ metal alloy layer and a bottom elastic thin membrane are provided in a sandwich configuration.
  • Tunability or reconfigurability in terms of resonance frequency, directivity, radiation patterns or focus can be realized by means of varying the geometries of these devices.
  • the RF device is provided as a frequency-selective surface.
  • the non-stretched frequency-selective surface 5 is illustrated in a top view in Fig. 12A and in a side view in Fig. 12B.
  • the liquid alloy 12 has been configured as a periodic structure 40 comprising a number of rectangular apertures 41 like unit cells incorporated in an elastic material. In alternative embodiments other types of geometrical unit cells, e.g. circular, elliptical, ring, or cross shaped can be used.
  • the resonance frequency or other RF characteristics of the surface can be tuned by means of varying the geometries of the substrate sheet 10.
  • the substrate sheet 10 is stretched in two dimensions, thereby increasing the size of the rectangular apertures 41.
  • the substrate sheet 10 is deformed, giving a different apparent aperture distance in one direction.
  • Substrate sheets with thick liquid alloy layers 12 act as impedance transformers rather than a frequency-selective surface.
  • step 250 steps of an embodiment of a method of using a stretchable high-frequency device according to the present invention are illustrated in a flow diagram.
  • the process starts in step 250.
  • step 260 a stretchable high-frequency device is deformed, giving rise to an adaptation of electrical or electromagnetic properties of the stretchable high-frequency device.
  • step 270 the adaptations of the electrical or electromagnetic properties of the stretchable high-frequency device are detected, typically by use of a sensor for electrical or electromagnetic properties.
  • step 280 the detected adaptations are interpreted, either manually or by processing in a processor, in terms of strain or deformation of the stretchable high- frequency device.
  • the procedure ends in step 299.
  • a RF device is provided as a RF reflector.
  • a RF device is provided as a microwave reflector.
  • a RF device is provided as a metamaterial.
  • a metamaterial is characterized in that it presents electrical, magnetic or electromagnetic properties, which are affected by the internal unit cells of the metamaterial, to assume values that are not associated with the materials as such. Examples are metamaterials exhibiting an effective permittivity ⁇ and/or permeability ⁇ lower than 0.
  • a specific embodiment of the metamaterial that can be used for extensive applications is described in connection with Figs. 14A-D.
  • the liquid alloy 12 has been configured as a periodic structure 44 comprising a number of split ring like unit cells 45 incorporated in the elastic material 11 in a layer 49.
  • other types of geometrical unit cells e.g. H-shaped, circular, or rectangular can be utilized,.
  • the wave propagation via said metamaterial 6 can be tuned by means of varying the geometries of said metamaterial 6, in analogy with the modification of the resonance properties, described further above.
  • Three-dimensional metamaterial can be formed by stacking a number of metamaterial layers in a space.
  • a second periodic structure 46 comprising a number of conductive lines 47 is provided in an additional layer 48.
  • the non-stretched metameterial 6 is illustrated in a top view in Fig. 14A and in a side view in Fig. 14B.
  • the substrate sheet 10 is stretched in two dimensions, thereby increasing the size and spacing of the ring like unit cells 45.
  • Fig. 14D 1 the substrate sheet 10 is deformed, giving a different apparent distance in one direction.
  • the changes in size and spacing in turn give rise to changes e.g. in effective permittivity and/or permeability.
  • a tunable metamaterial is thus 5 achieved.
  • the high-frequency device is a deformable optics device.
  • the deformable optics device takes the form of a reflective mirror for infrared, visible or UV light.
  • a reflective mirror for infrared, visible or UV light.
  • the liquid alloy 12 is here been configured as a mirror-like structure 50 within an elastic substrate sheet 10.
  • the liquid alloy 12 forms a continuous two-dimensional surface.
  • the mirror-like structure 50 has a certain curvature, and radiation 51 impinging onto the mirror-like structure 50 is reflected and is in this particular case focused in a particular focusing point 52.
  • Properties of the reflected waves, e.g. their focusing point 52, can be tuned by varying the geometries of the surface.
  • Fig. 15B This is illustrated in Fig. 15B, where the substrate sheet 10 is deformed by a force f.
  • Deformable reflective surfaces for radio frequencies and microwaves may be implemented in the same way as the deformable optics, e.g. reflective mirrors for infrared, visible light or UV. By means of varying the geometries of the mirrors, the reflected waves can be tuned.
  • a mirror array 53 comprising liquid metal alloy 12 in or on one or more substrates.
  • Figs. 16A-C describes a specific embodiment of such deformable reflective mirrors or mirror array.
  • Liquid metal alloy 12 has been configured as a reflective surface 54 in a mirror array 53 as seen in the elevational view of Fig. 16A.
  • the substrate sheet 10 comprises control devices 56
  • each control device 56 can be instructed.
  • the control device 56 controls in this embodiment the volume of a cavity 57 below a respective reflective surface 54.
  • the volume is increased, as is illustrated in Fig. 16C, the shape of the part of the substrate sheet in which the reflective surface 54 is incorporated is altered, and so are the optical properties of the reflective surface
  • the behavJojLolreflected-wavesxan-be-tunedJn- this way it is possible to obtain synchronized or independently tuned or controlled unit cells.
  • the liquid metal alloy preferably room temperature liquid metal alloy
  • the liquid metal alloy may also be used in achieving 2D or 3D patterns or metallization.
  • the liquid metal alloy may be used as conductive ink.
  • Metallization patterns can be printed on a low cost substrate, e.g. paper or transparent substrate. For instance, via controlling the wetability between the surfaces of the substrate and liquid metal alloy, patterns on the substrate can be formed.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Aerials With Secondary Devices (AREA)

Abstract

La présente invention concerne un dispositif à haute fréquence (1) qui comprend une feuille de substrat (10) d'un matériau élastique (11) et un alliage métallique (12) prévu à l'intérieur de et/ou sur la feuille de substrat (10). L'alliage métallique (12) est liquide à des températures inférieures à 1000 °C. L'alliage métallique (12) est prévu dans une configuration au moins bidimensionnelle (13). L'alliage métallique (12) peut être mouillé en contact avec une surface du matériau élastique (11).
PCT/SE2009/051425 2008-12-16 2009-12-15 Eléments électroniques à haute fréquence étirables Ceased WO2010071574A1 (fr)

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CN103367880A (zh) * 2013-07-05 2013-10-23 华中科技大学 一种频率可调控的可拉伸液态金属天线及其制备方法
CN104577307A (zh) * 2013-10-21 2015-04-29 中兴通讯股份有限公司 一种天线、天线控制方法及移动终端
JP2015095562A (ja) * 2013-11-12 2015-05-18 日本メクトロン株式会社 導電ペーストの充填方法、および多層プリント配線板の製造方法
WO2016053951A1 (fr) * 2014-10-01 2016-04-07 Ohio State Innovation Foundation Dispositifs d'identification par radiofréquence (rfid) à large bande passante d'impédance étirables
WO2017157690A1 (fr) * 2016-03-14 2017-09-21 Technische Universität Darmstadt Applicateur de micro-ondes et système pour le traitement invasif minimum de tissu biologique
KR101791016B1 (ko) 2016-03-29 2017-10-27 한국기계연구원 신축성 나노금속패턴 제조방법
CN107658551A (zh) * 2017-10-30 2018-02-02 南京信息工程大学 一种基于镓铟锡液态金属的频率可重构天线
CN107833656A (zh) * 2017-09-30 2018-03-23 华南理工大学 一种可拉伸柔性功能导体
CN108601124A (zh) * 2018-05-04 2018-09-28 北京梦之墨科技有限公司 一种电热线及电热装置
CN108649362A (zh) * 2018-04-12 2018-10-12 北京梦之墨科技有限公司 导电连接件及其制造方法
CN110416736A (zh) * 2019-07-23 2019-11-05 电子科技大学 一种基于温敏液态金属的可编码电磁超材料
CN111198052A (zh) * 2020-01-14 2020-05-26 清华大学 一种可变形液态传感器
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US11387013B1 (en) 2017-05-24 2022-07-12 United States Of America As Represented By The Secretary Of The Air Force Residue free electrically conductive material
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CN103367880B (zh) * 2013-07-05 2016-01-20 华中科技大学 一种频率可调控的可拉伸液态金属天线及其制备方法
CN103367880A (zh) * 2013-07-05 2013-10-23 华中科技大学 一种频率可调控的可拉伸液态金属天线及其制备方法
CN104577307A (zh) * 2013-10-21 2015-04-29 中兴通讯股份有限公司 一种天线、天线控制方法及移动终端
CN104577307B (zh) * 2013-10-21 2019-07-05 中兴通讯股份有限公司 一种天线、天线控制方法及移动终端
JP2015095562A (ja) * 2013-11-12 2015-05-18 日本メクトロン株式会社 導電ペーストの充填方法、および多層プリント配線板の製造方法
US10268940B2 (en) 2014-10-01 2019-04-23 Ohio State Innovation Foundation Stretchable broad impedance bandwidth RFID devices
WO2016053951A1 (fr) * 2014-10-01 2016-04-07 Ohio State Innovation Foundation Dispositifs d'identification par radiofréquence (rfid) à large bande passante d'impédance étirables
WO2017157690A1 (fr) * 2016-03-14 2017-09-21 Technische Universität Darmstadt Applicateur de micro-ondes et système pour le traitement invasif minimum de tissu biologique
KR101791016B1 (ko) 2016-03-29 2017-10-27 한국기계연구원 신축성 나노금속패턴 제조방법
US11395608B2 (en) * 2017-04-04 2022-07-26 Roche Diabetes Care, Inc. Medical sensor system, in particular continuous glucose monitoring system
US10784011B1 (en) 2017-05-24 2020-09-22 United States Of America As Represented By The Secretary Of The Air Force Residue free electrically conductive material
US11380457B1 (en) 2017-05-24 2022-07-05 United States Of America As Represented By The Secretary Of The Air Force Residue free electrically conductive material
US11387013B1 (en) 2017-05-24 2022-07-12 United States Of America As Represented By The Secretary Of The Air Force Residue free electrically conductive material
US11600402B1 (en) 2017-05-24 2023-03-07 United States Of America As Represented By The Secretary Of The Air Force Residue free electrically conductive material
US11769604B1 (en) 2017-05-24 2023-09-26 United States Of America As Represented By The Secretary Of The Air Force Residue free electrically conductive material
CN107833656A (zh) * 2017-09-30 2018-03-23 华南理工大学 一种可拉伸柔性功能导体
CN107658551A (zh) * 2017-10-30 2018-02-02 南京信息工程大学 一种基于镓铟锡液态金属的频率可重构天线
CN108649362A (zh) * 2018-04-12 2018-10-12 北京梦之墨科技有限公司 导电连接件及其制造方法
CN108649362B (zh) * 2018-04-12 2024-02-23 北京梦之墨科技有限公司 导电连接件及其制造方法
CN108601124A (zh) * 2018-05-04 2018-09-28 北京梦之墨科技有限公司 一种电热线及电热装置
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