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WO2010064506A1 - Dispositif d’imagerie et endoscope - Google Patents

Dispositif d’imagerie et endoscope Download PDF

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Publication number
WO2010064506A1
WO2010064506A1 PCT/JP2009/068420 JP2009068420W WO2010064506A1 WO 2010064506 A1 WO2010064506 A1 WO 2010064506A1 JP 2009068420 W JP2009068420 W JP 2009068420W WO 2010064506 A1 WO2010064506 A1 WO 2010064506A1
Authority
WO
WIPO (PCT)
Prior art keywords
solid
imaging device
heat radiating
substrates
radiating member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/068420
Other languages
English (en)
Japanese (ja)
Inventor
寛 雲財
裕之 永水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Medical Systems Corp
Original Assignee
Olympus Medical Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Medical Systems Corp filed Critical Olympus Medical Systems Corp
Priority to JP2010541274A priority Critical patent/JPWO2010064506A1/ja
Publication of WO2010064506A1 publication Critical patent/WO2010064506A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
    • A61B1/051—Details of CCD assembly
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/12—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor with cooling or rinsing arrangements
    • A61B1/128—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor with cooling or rinsing arrangements provided with means for regulating temperature
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2407—Optical details
    • G02B23/2423—Optical details of the distal end
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2476—Non-optical details, e.g. housings, mountings, supports
    • G02B23/2484—Arrangements in relation to a camera or imaging device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/555—Constructional details for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes

Definitions

  • an image pickup apparatus having a multi-plate structure that achieves high image quality by using a plurality of solid-state image sensors.
  • an imaging apparatus having a two-plate solid-state imaging element structure using two solid-state imaging elements in order to make the diameter of the tip portion equal to that when a single-plate imaging apparatus is used. (Hereinafter referred to as “two-plate imaging device”) is suitable.
  • a prism with a coating reflecting green and transmitting red and blue is installed, and red and blue colors are placed on one solid-state image pickup device arranged in a direction in which red and blue are transmitted.
  • a filter is provided.
  • black and white and green color filters are provided on the other solid-state imaging device arranged in the direction in which green is reflected.
  • Japanese Patent Application Laid-Open No. 2004-258497 and Japanese Patent Application Laid-Open No. 2007-135951 disclose disposing a two-plate imaging device in the distal end portion of the endoscope.
  • the two-plate imaging device 101 includes a prism unit 102 and two solid-state imaging elements 106 and 107.
  • the tip of the prism unit 102 on the incident light side is fitted and fixed to the holding holder 112.
  • a metal frame member 113 is provided on the outer peripheral surface of the base end of the holding holder 112 so as to enclose the two FPCs 108 and 109.
  • a heat shrinkable tube 114 is provided on the proximal end side of the holding holder 112. The heat-shrinkable tube 114 covers up to the outer peripheral portions of the two communication cables 118 and 119.
  • the heat shrinkable tube 114 is filled with a filler 115 that protects the imaging device 101.
  • the two-plate imaging device 101 has a configuration in which the electronic components 110 and 111 on the two FPCs 108 and 109 necessary to drive the two solid-state imaging devices 106 and 107 face each other. Therefore, it is excellent in terms of downsizing and assembly.
  • the second solid-state imaging device 107 and the electronic components 110 and 111 which are heat generating components, are densely packed, the heat generated is transferred to the solid-state imaging devices 106 and 107 via the filler 115, and the S / N is deteriorated. There was a risk.
  • an imaging apparatus disposed in an endoscope that is a medical device that is inserted into a body cavity and observes a living tissue for example, a rigid electronic endoscope provided with a rigid insertion portion will be described as an example.
  • a rigid electronic endoscope 1 (hereinafter simply referred to as “endoscope”) 1 shown in FIG. 2 has an imaging device 51 described later.
  • the endoscope 1 includes an insertion portion 2 having a distal end portion 11, an operation portion 3 connected to the proximal end of the insertion portion 2, a universal cord 4 extending from the operation portion 3, and a proximal end of the universal cord 4
  • the scope connector 5 is disposed on the side of the scope connector 5, and the electrical connector 6 is provided at the end of the cable extending from the side of the scope connector 5.
  • an observation lens 21 of the objective lens unit 20 and an illumination lens 22 that is an illumination optical component are disposed at the distal end of the distal end portion 11.
  • tip part 11 has the hard pipe
  • the hard tube 27 is fitted with the tip cover 25.
  • the observation lens 21 is held by a lens holding frame 24 together with an objective lens group 23 including a plurality of objective lenses. That is, the objective lens unit 20 includes an observation lens 21, an objective lens group 23, and a lens holding frame 24.
  • the objective lens unit 20 is fitted and fixed to a tip frame 26 that is a metallic tip hard member.
  • the illumination lens 22 is held by the tip cover 25.
  • the tip surface of the light guide bundle 29 is disposed so as to face.
  • the light guide bundle 29 is inserted into the insertion portion 2, the operation portion 3, and the universal cord 4 of the endoscope 1, is disposed up to the scope connector 5, and transmits illumination light from a light source device (not shown).
  • a holding holder 28 that is inserted into the distal end frame 26 and is fitted and fixed to the lens holding frame 24 is disposed on the outer peripheral portion of the base end of the lens holding frame 24 of the objective lens unit 20.
  • the distal end portion of the prism unit 30 of the imaging device 51 (the distal end portion where the incident light from the objective lens unit 20 is incident) is fitted and fixed to the proximal end portion of the holding holder 28.
  • the imaging device 51 includes a prism unit 30 having a prism portion 31 constituting an optical unit, two solid-state imaging devices 35 and 37, two FPCs 38 and 39, and two This is a two-plate type imaging device 51 having cables 43 and 45 and a heat radiating member 60.
  • the prism unit 30 is configured by joining a plurality of optical members, and divides the incident light that has passed through the objective lens unit 20 into two optical paths and emits them. That is, the prism unit 30 includes a prism portion 31 configured by bonding the first prism 32 and the second prism 33, a first cover glass 34 bonded to the emission surface side of the prism 32, and a prism And a second cover glass 36 joined to the light emitting surface 33 side.
  • the prism unit 31 has a green reflective coating layer (also referred to as a dichroic coating layer) 30 ⁇ / b> A on a joint boundary surface where the first prism 32 and the second prism 33 are overlapped.
  • the green reflective coating layer 30A is formed on the joining boundary surface where the first prism 32 and the second prism 33 are overlapped by applying a reflective film to the slope of the first prism 32, and the incident light green ( G) reflects light and transmits red (R) and blue (B) light.
  • a cover glass 34 and a first solid-state imaging device 35 for luminance signal or color signal (G signal) are provided on the exit surface side of the first prism 32 that is reflected substantially at right angles by the green reflective coating layer 30A. Arranged and fixed in order.
  • a cover glass 36 and two color signals (R, B) are provided behind the green prism coat layer 30A of the first prism 32 and the side that is transmitted through and emitted from the second prism 33 (outgoing surface side).
  • Signal) second solid-state imaging device 37 is arranged and fixed in that order.
  • the first solid-state imaging device 35, the second solid-state imaging device 37, the first prism 32, and the second prism 33 have the same optical path length.
  • the first solid-state imaging device 35 receives light emitted from the first prism 32 that is reflected by the green reflective coating layer 30 ⁇ / b> A and constitutes the prism portion 31.
  • the second solid-state imaging device 37 receives light emitted from the second prism 33 through the first prism 32 and the second prism 33.
  • the second solid-state imaging device 37 has red (R) and blue (B) color filters (not shown) arranged in stripes on the light receiving surface.
  • the solid-state imaging devices 35 and 37 are CCDs or CMOSs, and the configuration other than the color filter is substantially the same. That is, the two solid-state imaging devices 35 and 37 receive and photoelectrically convert the light in the two optical paths emitted from the prism unit 31 of the prism unit 30.
  • a first FPC (flexible printed circuit board) 38 on which electronic components 40 such as a capacitor and an IC are mounted is connected to the first solid-state imaging device 35.
  • a second FPC 39 on which an electronic component 41 such as a capacitor and an IC is mounted is connected to the second solid-state imaging element 37. That is, the imaging device 51 is provided in each of the solid-state imaging devices 35 and 37, and has FPCs 38 and 39 on which electronic components 40 and 41 necessary for driving the respective solid-state imaging devices are mounted.
  • the electronic components 40 and 41 are large-sized electronic components that generate the largest amount of heat among the plurality of electronic components mounted on the FPCs 38 and 39. Further, the FPCs 38 and 39 may have small electronic components mounted on the surface opposite to the surface on which the electronic components 40 and 41 are mounted.
  • the plurality of signal lines 42 of the first communication cable 43 are electrically connected to the first FPC 38.
  • a plurality of signal lines 44 of the second communication cable 45 are electrically connected to the second FPC 39.
  • the communication cables 43 and 45 are cables for supplying power to the electronic components 40 and 41 and transmitting and receiving signals to and from the solid-state imaging devices 35 and 37 via the FPCs 38 and 39. That is, the imaging device 51 is electrically connected to the FPCs 38 and 39, and the communication cables 43 and 45 that supply power to the electronic components 40 and 41 and transmit and receive signals to and from the solid-state imaging devices 35 and 37 through the FPCs 38 and 39. Have.
  • the FPCs 38 and 39 are arranged so that the arranged electronic components 40 and 41 face each other across the extension line Oa of the optical axis O of the objective lens unit 20, that is, toward the optical axis extension direction. It is arrange
  • the front end of the prism unit 30 (the front end where the incident light from the objective lens unit 20 enters) is fitted and fixed to the prism unit joint 28A of the holding holder 28.
  • a metal frame member 46 that includes two solid-state imaging devices 35 and 37 and two FPCs 35 and 38 is provided on the outer peripheral surface of the prism unit joint portion 28 ⁇ / b> A of the holding holder 28.
  • the heat shrinkable tube 47 is covered on the outer peripheral surface of the proximal end side of the holding holder 28.
  • the heat-shrinkable tube 47 encloses the imaging device 51 including the metal frame member 46 and covers up to the outer peripheral portions of the two communication cables 43 and 45.
  • the heat shrinkable tube 47 is filled with a filler 48 for protecting the imaging device 51 and for releasing heat.
  • a heat dissipating member 60 for dissipating heat generated by the electronic components 40 and 41 is provided.
  • the heat dissipation member 60 is arranged in the gap formed by disposing the substrate surface on which the electronic components 40 and 41 of the FPCs 38 and 39 are disposed facing the optical axis extending direction of the objective lens unit 20, the heat dissipation member 60 is arranged.
  • the heat radiating member 60 is a heat sink, and is made of a metal material such as copper or aluminum having high thermal conductivity, for example.
  • the heat radiating member 60 may be made of a material other than a metal material as long as it has a high thermal conductivity and a low heat storage property.
  • the shape of the heat radiating member 60 is matched to the shape of the gap (space) between the two FPCs 38 and 39 formed by disposing the electronic components 40 and 41 so as to face each other.
  • the heat radiating member 60 has a cross section perpendicular to the optical axis O of the incident light of the objective lens unit 20, strictly the extension line Oa of the optical axis O, in the extending direction of the FPCs 38 and 39. It is a trapezoidal shape that tapers towards.
  • the shape of the heat radiating member 60 may be, for example, an arc (cone) shape in which a cross section perpendicular to the optical axis of incident light of the objective lens unit 20 tapers in the extending direction of the FPCs 38 and 39. .
  • thermo conductivity filler 48 made of a resin containing silicon particles or the like which are high thermal conductivity particles.
  • a filler 48 is also filled between the periphery of the heat dissipating member 60 and the metal frame member 46 in the direction of the left and right side surfaces of the heat dissipating member 60.
  • the operation of the imaging device 51 will be described with reference to FIG.
  • the electronic components 40 and 41 and the solid-state imaging elements 35 and 37 generate heat.
  • the solid-state imaging devices 35 and 37 and the electronic components 40 and 41 are arranged in a region between the first FPC 38 and the second FPC 39 formed by arranging the electronic components 40 and 41 so as to face each other.
  • a heat dissipating member 60 is provided for dissipating the heat generated in step.
  • the heat generated by the electronic components 40 and 41 and the solid-state imaging devices 35 and 37 is transferred to the heat radiating member 60 through the filler 48 and radiated.
  • the electronic components 40 and 41 and the second solid-state imaging element 37 are densely arranged by the structure in which the electronic components 40 and 41 face each other, but heat can be efficiently radiated by the heat radiating member 60. For this reason, the first solid-state imaging element 35 and the second solid-state imaging element 37 of the imaging device 51 are not easily affected by heat, and the operation is stable because the deterioration of S / N is prevented.
  • the imaging device 51 of the first embodiment is a small two-plate imaging device 51 having a structure in which the electronic components 40 and 41 face each other, the heat generated can be efficiently radiated. Therefore, the solid-state imaging elements 35 and 37 are not affected by heat. Note that in the imaging device 51, due to the heat dissipation effect of the heat dissipation member 60, the electronic components 40 and 41 other than the solid-state imaging elements 35 and 37 are not easily affected by heat. Further, the endoscope 1 having the imaging device 51 has the effect of the imaging device 51 and realizes the diameter reduction of the distal end portion 11 of the insertion portion 2 and the entire insertion portion.
  • the imaging device 51A and the endoscope 1A according to the second embodiment will be described with reference to FIGS. Since the imaging device 51A is similar to the imaging device 51, the same components are denoted by the same reference numerals and description thereof is omitted.
  • a part of the heat radiating member 60 includes a first solid-state image pickup device 35, a second solid-state image pickup device 37, a first FPC 38, and a second FPC 39. It is in contact with the member 46.
  • the metal frame member 46 is a thin metal tubular member.
  • the side surface portion of the heat radiating member 60 is in surface contact with the metal frame member 46 having high thermal conductivity, so that the heat of the heat radiating member 60 is transferred to the metal frame member 46, and the metal Heat is radiated from the frame member 46. Therefore, the imaging device 51A has a higher heat dissipation effect than the imaging device 51.
  • the heat radiating member 60 Even if a part of the heat radiating member 60 is disposed close to the metal frame member 46 or a part of the side surface portion of the metal frame member 46 is disposed so as to contact the metal frame member 46, the heat radiating member 60. If the heat is transferred to the metal frame member 46, a heat radiation effect higher than that of the imaging device 51 can be obtained.
  • a filler 48 is interposed between the heat radiating member 60 and the metal frame member 46.
  • the metal frame member 46 is increased in thickness so that the diameter of the imaging device 51A does not increase, thereby improving the heat dissipation effect.
  • the imaging apparatus 51A includes a metal frame in which at least a part of the heat dissipation member 60 includes the first solid-state imaging element 35, the second solid-state imaging element 37, the first FPC 38, and the second FPC 39. It is close to or in contact with the member 46. For this reason, in addition to the effect which imaging device 51 and endoscope 1 have, imaging device 51A and endoscope 1A have the heat dissipation effect improved more.
  • an imaging device 51B and an endoscope 1B according to the third embodiment will be described with reference to FIG. Since the imaging device 51B is similar to the imaging device 51 and the like, the same components are denoted by the same reference numerals and description thereof is omitted.
  • the signal line 44 a that is a part of the signal lines 42, 44, 44 a included in the first and second communication cables 43, 45 ⁇ / b> A is connected and fixed to the heat radiating member 60.
  • the signal line is made of a conductive material such as copper, and the conductive material is a high thermal conductivity material.
  • the signal line 44a of the second communication cable 45A is connected to a part of the heat radiating member 60, the heat in the heat radiating member 60 is transferred to the signal line 44a, so that the heat radiating effect is effective. It is more improved.
  • the second communication cable 45A is configured in the same manner as the first communication cable 43, but has a heat radiating signal line 44a other than the signal line 44 necessary for power feeding and signal transmission / reception. Yes.
  • the signal line 44 a may be an excess signal line in the cable, or may be provided in the cable particularly for connecting the heat radiating member 60.
  • first communication cable 43 may be configured in the same manner as the second communication cable 45A, and the heat radiation signal line may be connected to the heat radiation member 60 together with the signal line 44a, or a plurality of heat radiation signal lines.
  • the first and second communication cables 43 and 45 ⁇ / b> A having 44 a may be prepared, and a plurality of heat radiating signal lines 44 a may be connected to the heat radiating member 60.
  • the two communication cables 43 and 45A may be coaxial cables, and an external conductor having a ground potential wound around the central conductor of at least one coaxial cable may be connected to the heat radiating member 60 as a heat radiating signal line.
  • connection location of the signal line 44a to the heat radiating member 60 is not limited to the tapered lower portion of the heat radiating member 60 as shown in FIG. 7, and may be connected to other locations.
  • the signal line 44a connected to the heat radiating member 60 has been described with respect to the configuration using the signal line 44a of the second communication cable 45A.
  • a heat dissipation cable having a dedicated signal line for heat dissipation may be provided.
  • the heat radiating cable has a diameter that does not increase the diameter of the imaging device 51A and has a signal line with high thermal conductivity.
  • the imaging device 51B of the present embodiment has a configuration in which part of the signal lines 42, 44, and 44a included in the first and second communication cables 43 and 45A are attached to the heat dissipation member 60. is there. For this reason, in addition to the effect which the imaging device 51 and the endoscope 1 have, the imaging device 51B and the endoscope 1B have a more improved heat dissipation effect.
  • an imaging device 51C and an endoscope 1C according to the fourth embodiment will be described with reference to FIG. Since the imaging device 51C is similar to the imaging device 51 and the like, the same components are denoted by the same reference numerals and description thereof is omitted.
  • the heat dissipating member 60A of the image pickup apparatus 51C has cutouts 61 that are opened in the extending direction side and on both side surfaces of the two FPCs 38 and 39. For this reason, the surface area of 60 A of heat radiating members is larger than the surface area of the heat radiating member 60 of 1st Embodiment. Since the cutout 61 of the heat dissipation member 60A shown in FIG. 8 is provided so that the extending direction side and both side portions on the base end side of the FPCs 38 and 39 are opened, the heat dissipation member 60A does not have the cutout 61. The surface area is larger than that of the heat dissipation member 60.
  • the heat radiating member 60A may have two notches so that, for example, a part of both sides of the upper surface and the lower surface in the direction perpendicular to the optical axis O of the objective lens unit 20 is opened.
  • the shape or the like of the notch 61 is not limited to the shape shown in FIG. 8, and for example, the width and length of the opening may be appropriately changed.
  • the imaging device 51C of the present embodiment has a notch 61 in the heat radiating member 60A, and the surface area of the heat radiating member 60A is larger than that of the heat radiating member 60 of the imaging device 51 of the first embodiment. For this reason, in addition to the effect which the imaging device 51 and the endoscope 1 have, the imaging device 51C and the endoscope 1C have a further improved heat dissipation effect.
  • an imaging device 51D and an endoscope 1D according to the fifth embodiment will be described with reference to FIG. Since the imaging device 51D is similar to the imaging device 51 and the like, the same components are denoted by the same reference numerals and description thereof is omitted.
  • the heat radiating member 60B of the imaging device 51D of the present embodiment includes a first heat radiating member 62 divided into two in the vertical direction on a surface perpendicular to the optical axis 0 of the objective lens unit 20. And a second heat radiating member 63.
  • the vertical direction is the vertical direction in FIG. 9, that is, the direction in which the FPC 38 and the FPC 39 are arranged to face each other.
  • the heat radiating member 60B is divided into two in the vertical direction on the surface perpendicular to the optical axis O of the objective lens unit 20, and thus has a large surface area.
  • the two divided heat dissipating members 62 and 63 are arranged at a predetermined interval.
  • the entire surface area of the heat radiating member 60B is the same as that of the fourth embodiment. It is larger than the heat dissipation member 60A of the imaging device 51C. Therefore, the heat dissipation effect of the heat dissipation member 60B is further improved.
  • the shapes of the heat dissipation members 62 and 63 of the heat dissipation member 60B may be the same size and shape, or may be different sizes and shapes.
  • the heat dissipating member 60B is only required to be divided into at least two in the vertical direction. For example, the heat dissipating member is formed so that part of both sides of the upper surface and the lower surface in the direction perpendicular to the optical axis O of the objective lens unit 20 are opened. 60B may be divided into four.
  • the imaging device 51D and the endoscope 1D have a further improved heat dissipation effect.
  • an imaging device 51E and an endoscope 1E according to the sixth embodiment will be described with reference to FIG. Since the imaging device 51E is similar to the imaging device 51 and the like, the same components are denoted by the same reference numerals and description thereof is omitted.
  • the imaging device 51 ⁇ / b> E includes a heat dissipation member 60 on at least a part of a portion of the electronic components 40 and 41 that are mounted on the first and second FPCs 38 and 39, respectively, in contact with the heat dissipation member 60.
  • Insulating member 64 is provided to prevent contact with and insulate.
  • the insulating member 64 is an insulating tape formed of, for example, an insulating material, and is attached to the entire region or a partial region of each of the electronic components 40 and 41 facing the heat radiating member 60.
  • the insulating member 64 is preferably formed of a material having high thermal conductivity.
  • the insulating member 64 is not limited to the insulating tape, and may be an insulating layer formed by applying an insulating material to the entire area of the electronic components 40 and 41 or a part of the area.
  • the imaging device 51E does not cause contact between the electronic components 40 and 41 and the heat dissipation member 60, that is, a short circuit, the operations of the electronic components 40 and 41 and the solid-state imaging elements 35 and 37 are stable.
  • the insulating member 64 may be provided in a region where the electronic components 40 and 41 and the heat radiating member 60 are in contact with each other, or even if the electronic components 40 and 41 and the heat radiating member 60 are not in contact with each other, You may provide in all the area
  • the insulating member 64 may be provided on one of the electronic components 40 and 41. That is, the heat radiating member 60 of the imaging device may be provided with the insulating member 64, or may be configured with at least a part of the insulating member 64, or at least part of the electronic components 40 and 41. An insulating member 64 may be provided to prevent contact with the heat radiating member 60 for insulation.
  • the imaging device 51E and the endoscope 1E have stable operations in addition to the effects of the imaging device 51 and the endoscope 1.
  • the heat dissipating members 60, 60A, 60B may themselves be constituted by insulating members, or may be constituted by conductive members, and the outer peripheral surface.
  • the insulating member may be attached or applied to all or at least a part.
  • the region between the metal frame member 46 and the heat dissipation member 60, the metal frame member 46 and the first and second FPCs 38 and 39 It is preferable to provide the fillers 48 in the regions between the layers in a substantially uniform thickness. Then, the heat dissipation effect of the heat radiating member 60 itself can be improved, and the heat radiating member 60 can be disposed near the center of the imaging device 51, so that the imaging device 51 is reduced in diameter.
  • the imaging apparatus 51 of the embodiment according to the present invention has been described by taking a two-plate imaging apparatus having two solid-state imaging elements 35 and 37 as an example, the imaging apparatus 51 is not limited to this, and for example, a three-plate imaging Needless to say, the present invention can also be applied to a configuration in which an apparatus is provided and the photographing light is divided into three optical paths and emitted by the prism unit.
  • the endoscope of the present invention is an endoscope having an imaging device at the distal end portion of the insertion portion, and the imaging device has an objective lens unit and an incident light that has passed through the objective lens unit.
  • An optical unit that divides light into two optical paths and emits the light; a first solid-state image sensor and a second solid-state image sensor that receive light in the two optical paths emitted from the optical unit;
  • the heat dissipating member having a notch disposed between and the first substrate or the second substrate are electrically connected to each other, and the first substrate or the second substrate passes through the first substrate or the second substrate.
  • Power supply to electronic components and Two cables having a signal line for transmitting and receiving signals to and from the first solid-state imaging device or the second solid-state imaging device, and a signal line connected to the heat dissipation member, and the first solid state
  • An image sensor, the second solid-state image sensor, the first substrate and the second substrate are included, a metal frame member having a contact surface with a part of the heat dissipation member, and at least a part of the electronic component
  • the insulating tape which prevents the contact with the said heat radiating member provided, and the filler with which the said metal frame member is filled are comprised.

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  • Endoscopes (AREA)

Abstract

La présente invention concerne un dispositif d’imagerie de type à double carte (51) comportant deux éléments d’imagerie à semi-conducteur (35, 37). Le dispositif d’imagerie comporte : des substrats (38, 39) sur lesquels des composants électroniques (40, 41) nécessaires pour piloter les éléments d’imagerie à semi-conducteur (35, 37) sont fixés, respectivement; deux câbles (43, 45) électriquement connectés aux substrats (38, 39), respectivement; et un élément dissipateur de chaleur (60) agencé entre les deux substrats (38, 39).
PCT/JP2009/068420 2008-12-04 2009-10-27 Dispositif d’imagerie et endoscope Ceased WO2010064506A1 (fr)

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JP2019180712A (ja) * 2018-04-09 2019-10-24 株式会社島津製作所 治療支援装置
US10499794B2 (en) 2013-05-09 2019-12-10 Endochoice, Inc. Operational interface in a multi-viewing element endoscope
CN112438682A (zh) * 2019-08-30 2021-03-05 深圳迈瑞生物医疗电子股份有限公司 内窥镜摄像头及内窥镜摄像系统
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US9872609B2 (en) 2009-06-18 2018-01-23 Endochoice Innovation Center Ltd. Multi-camera endoscope
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US9554692B2 (en) 2009-06-18 2017-01-31 EndoChoice Innovation Ctr. Ltd. Multi-camera endoscope
US11278190B2 (en) 2009-06-18 2022-03-22 Endochoice, Inc. Multi-viewing element endoscope
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US9706903B2 (en) 2009-06-18 2017-07-18 Endochoice, Inc. Multiple viewing elements endoscope system with modular imaging units
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US12220105B2 (en) 2010-06-16 2025-02-11 Endochoice, Inc. Circuit board assembly of a multiple viewing elements endoscope
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US9986892B2 (en) 2010-09-20 2018-06-05 Endochoice, Inc. Operational interface in a multi-viewing element endoscope
US10080486B2 (en) 2010-09-20 2018-09-25 Endochoice Innovation Center Ltd. Multi-camera endoscope having fluid channels
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US12204087B2 (en) 2010-10-28 2025-01-21 Endochoice, Inc. Optical systems for multi-sensor endoscopes
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JP2017521119A (ja) * 2014-05-26 2017-08-03 オリンパス ビンテル ウント イーベーエー ゲーエムベーハーＯｌｙｍｐｕｓ Ｗｉｎｔｅｒ ＆ Ｉｂｅ Ｇｅｓｅｌｌｓｃｈａｆｔ Ｍｉｔ Ｂｅｓｃｈｒａｎｋｔｅｒ Ｈａｆｔｕｎｇ ビデオ内視鏡
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