WO2010061759A1 - 湿気硬化型ホットメルト接着剤 - Google Patents
湿気硬化型ホットメルト接着剤 Download PDFInfo
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- WO2010061759A1 WO2010061759A1 PCT/JP2009/069534 JP2009069534W WO2010061759A1 WO 2010061759 A1 WO2010061759 A1 WO 2010061759A1 JP 2009069534 W JP2009069534 W JP 2009069534W WO 2010061759 A1 WO2010061759 A1 WO 2010061759A1
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- moisture
- hot melt
- melt adhesive
- isocyanate compound
- curable hot
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6603—Compounds of groups C08G18/42, C08G18/48, or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
- C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3203—Polyhydroxy compounds
- C08G18/3212—Polyhydroxy compounds containing cycloaliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/38—Low-molecular-weight compounds having heteroatoms other than oxygen
- C08G18/3819—Low-molecular-weight compounds having heteroatoms other than oxygen having nitrogen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/20—Compositions for hot melt adhesives
Definitions
- the present invention relates to a moisture curable hot melt adhesive having excellent heat resistance, short tack-free time and excellent initial adhesive strength, and a method for producing the same.
- Moisture curable hot melt adhesives are used in various fields such as the building interior materials field (or building materials field) and the electronic materials field.
- a moisture-curing hot melt adhesive is an adhesive containing a urethane prepolymer having an isocyanate group at the end, and is generally applied to adherends (or a substrate and an adherend) in a heated and melted state and cooled. It is an adhesive whose adhesive strength, heat resistance, and the like are improved by moisture curing in which an isocyanate group is crosslinked with moisture in the atmosphere after solidification by solidification and the urethane prepolymer has a high molecular weight.
- initial bond strength One of the properties required for moisture-curing hot melt adhesives is initial bond strength.
- a moisture-curing hot melt adhesive is mixed with a tackifying resin to increase the initial wettability to the substrate, or a thermoplastic resin is added to improve the initial cohesive strength. Is done.
- the tackifier resin and the thermoplastic resin are not necessarily sufficiently compatible with the urethane prepolymer that is the main component of the moisture-curable hot melt adhesive.
- Patent Documents 1 and 2 disclose blending a tackifier resin having a hydroxyl group (hereinafter also referred to as “hydroxyl group-containing tackifier resin”) in order to improve the compatibility of the adhesive component.
- Patent Document 1 discloses that a moisture-curable hot melt adhesive composed of a urethane prepolymer is produced by reacting a rosin derivative having a hydroxyl group, a polyol, and an isocyanate compound at a time.
- Patent Document 2 discloses a urethane hot melt adhesive in which a reactive tackifying resin having a hydroxyl number is blended, and a thermoplastic polymer such as a reactive tackifying resin, a polyol, an isocyanate compound, and an ethylene vinyl compound is added at once. The reaction is disclosed.
- the hydroxyl group-containing tackifying resin disclosed in Patent Documents 1 and 2 can improve the compatibility with the adhesive component, the characteristics of the moisture-curable hot-melt adhesive, for example, initial adhesive strength and after moisture curing May also reduce the heat resistance. Therefore, in order to improve the heat resistance of the moisture-curable hot melt adhesive after moisture curing, it may be possible to add an excess of an isocyanate compound, but a large amount of volatile isocyanate compound remains in the adhesive. It is environmentally undesirable.
- the tack-free time of the moisture-curing hot melt adhesive becomes longer, and the solidification performance may be lowered. That is, when a laminate is manufactured by bonding an adherend to a base material such as wood or plastic using a moisture-curable hot melt adhesive having a longer tack-free time, it takes time to cure the laminate. Therefore, when cutting the obtained laminated product, if the time until the obtained laminated body is cut after the base material and the adherend are bonded together, burrs are generated on the cross section of the laminated body at the time of cutting. It may occur or the adherend may peel off from the substrate.
- the time until the laminated body is cut after the base material and the adherend are bonded to each other is increased to some extent, such a problem is solved, but the production efficiency of the laminated product is lowered. Therefore, in order to increase the production efficiency of the laminated product, the tack-free time of the moisture-curable hot melt adhesive is shortened, the initial adhesive strength is increased, and the base material and the adherend are bonded together before lamination. It was necessary to shorten the time to cut the body.
- the present invention has been made to solve such a problem, and the problem is that it is excellent in environmental aspects, compatibility of components, initial adhesive strength and heat resistance after moisture curing, and a moisture-curable hot having a short tack-free time. It is to provide a melt adhesive and a method for producing such a moisture curable hot melt adhesive.
- the inventor has surprisingly found that when a specific tackifying resin is used, initial adhesive strength is high without excessive addition of an isocyanate compound, and heat resistance after moisture curing is excellent.
- the present inventors have found that a moisture-curable hot melt adhesive can be obtained with a short tack-free time, and have completed the present invention.
- the present invention in one aspect, is a moisture curable hot melt adhesive containing a urethane prepolymer having an isocyanate group at its end, (A) including urethane-modified rosin, the residual ratio of the isocyanate compound is 5.0% by weight or less, Provided is a moisture-curable hot melt adhesive having a heat-resistant softening temperature of 60 ° C. or higher after moisture curing.
- the present invention provides (A) a urethane-modified rosin, a moisture-curable hot melt adhesive obtained by a reaction of an isocyanate compound and a rosin derivative having a hydroxyl group.
- the present invention provides a moisture-curable hot melt adhesive obtained by mixing (A) a urethane-modified rosin, a polyol, and an isocyanate compound.
- the urethane prepolymer provides a moisture-curable hot melt adhesive obtained by a reaction between a polyol and an isocyanate compound.
- the present invention further provides (B) a moisture-curing hot melt adhesive comprising a thermoplastic resin.
- the present invention provides: (I) (A) a step of obtaining a urethane-modified rosin by reaction of an isocyanate compound and a rosin derivative having a hydroxyl group; and (ii) (A) a moisture-curable hot melt having a step of mixing a urethane-modified rosin, a polyol and an isocyanate compound.
- a method for producing an adhesive is provided.
- the present invention provides a method for producing a moisture-curable hot melt adhesive, comprising a step of obtaining a urethane prepolymer by mixing a polyol and an isocyanate compound in the step (ii), The residual ratio of the isocyanate compound is 5.0% by weight or less,
- a method for producing a moisture-curable hot melt adhesive having a heat-resistant softening temperature of 60 ° C. or higher after moisture curing.
- the present invention provides the above-described moisture-curable hot melt adhesive manufactured by the above-described manufacturing method.
- tack-free time refers to the time taken from the application of a molten moisture-curing hot melt adhesive to the sticking of the adhesive surface.
- Initial bond strength refers to the bond strength when a moisture-curing hot melt adhesive is melted and applied to an adherend, and then the temperature of the adhesive decreases and the adhesive solidifies to become a solid.
- the initial adhesive strength is affected by wettability and cohesive strength.
- Weight is the angle ( ⁇ ) formed by the edge where the molten adhesive contacts the substrate when the moisture-curing hot melt adhesive heated and melted is contacted with the substrate (solid). It can be measured by size. The smaller ⁇ , the greater the wettability and the easier it is to adhere.
- the “cohesive force” refers to a force resulting from an interaction between molecules in the adhesive, which occurs in the process of cooling the heat-cured moisture-curing hot melt adhesive using an applicator and then cooling.
- “Final adhesive strength” means the adhesive strength after the molten moisture-curing hot melt adhesive is solidified and then cured by reacting the isocyanate groups in the adhesive with moisture in the atmosphere, that is, after moisture curing.
- (A) urethane-modified rosin refers to a modified rosin obtained by reacting an isocyanate compound with a rosin derivative having a hydroxyl group.
- Rosin derivative having a hydroxyl group refers to a derivative in which rosin is modified to have a hydroxyl group.
- a rosin derivative having a hydroxyl group can be obtained by bonding the carboxyl group of rosin and one hydroxyl group of the diol by an ester bond by the reaction of rosin and diol.
- (A) Urethane-modified rosin is obtained by reacting a hydroxyl group of an rosin derivative with an isocyanate compound, and the hydroxyl group reacts with an isocyanate group to form a urethane bond. Accordingly, (A) the urethane-modified rosin has substantially no hydroxyl group, and as a result, has no substantial reactivity with the isocyanate compound.
- the present inventors produce a moisture curable hot melt adhesive, even if (A) the urethane-modified rosin is added to the mixture of polyol and isocyanate compound forming the prepolymer, the polyol and isocyanate Since the reaction with the compound was not substantially affected, it was considered unnecessary to add an excess of the isocyanate compound.
- the inventors have found that the moisture-curable hot melt adhesive containing “(A) urethane-modified rosin” according to the present invention described above has excellent heat resistance after moisture curing, and has a reduced tack-free time.
- the present invention has been completed by finding that a curable hot melt adhesive can be obtained.
- the moisture curable hot melt adhesive according to the present invention is a moisture curable hot melt adhesive containing a urethane prepolymer having an isocyanate group at the end, (A) including urethane-modified rosin, the residual ratio of the isocyanate compound is 5.0% by weight or less, Since the heat-resistant softening temperature after moisture curing is 60 ° C or higher, Excellent balance of environmental aspect, compatibility, initial adhesive strength, tack free time, heat resistance after moisture curing, etc.
- the moisture-curing hot melt adhesive according to the present invention does not need to be produced by adding an isocyanate compound in excess, and thus is excellent in environmental aspects and in compatibility with each component. Excellent heat resistance after moisture curing, high initial wettability and cohesion, so excellent initial adhesive strength and short tack-free time.
- a base material woody material or plastic
- an adherend film, decorative sheet, plastic
- the urethane-modified rosin is obtained by the reaction of an isocyanate compound and a rosin derivative having a hydroxyl group, so that the isocyanate compound reacts directly with the polyol.
- the urethane-modified rosin and the isocyanate compound do not substantially react, a moisture-curable hot-melt adhesive having excellent heat resistance and a short tack-free time can be obtained without excessively blending the isocyanate compound.
- the urethane prepolymer is obtained by a reaction between a polyol and an isocyanate compound
- (A) the urethane-modified rosin is substantially not involved in the reaction. Therefore, since it is not necessary to use an isocyanate compound excessively in order to improve the heat resistance after moisture curing, the residual ratio of the isocyanate compound is reduced, which is environmentally preferable.
- the moisture-curable hot melt adhesive according to the present invention further comprises (B) a thermoplastic resin, so that the tack-free time is further shortened, and the heat resistance after moisture curing is reduced even if the residual ratio of the isocyanate compound is low. Excellent and more compatible.
- the method for producing a moisture curable hot melt adhesive includes: (I) a step of obtaining a urethane-modified rosin by reaction of an isocyanate compound and a rosin derivative having a hydroxyl group; (Ii) (A) Since it is a production method having a step of mixing urethane-modified rosin, polyol and isocyanate compound, (A) Since the urethane-modified rosin does not participate in the reaction between the polyol and the isocyanate compound, the heat resistance of the moisture-curable hot melt adhesive after moisture curing can be improved without adding an excessive amount of the isocyanate compound.
- the production method of the present application can maintain the residual ratio of the isocyanate compound low, the environmental aspect is also excellent. Furthermore, the obtained moisture-curing hot melt adhesive has a short tack-free time and a high initial cohesive force, and is therefore excellent in initial adhesive force.
- the method for producing the moisture curable hot melt adhesive of the present invention is as follows.
- the method includes a step of obtaining a urethane prepolymer by mixing a polyol and an isocyanate compound, and a method for producing a moisture-curable hot melt adhesive, Since the residual ratio of the isocyanate compound of the moisture curable hot melt adhesive is 5.0% by weight or less, and the heat-resistant softening temperature after moisture curing is 60 ° C. or higher, Since the isocyanate compound does not substantially react with the urethane-modified rosin (A), the moisture-curing type has high heat resistance after moisture curing, although the residual ratio of the isocyanate compound in the moisture-curing hot melt adhesive is lower. Hot melt adhesives can be produced.
- the moisture-curing hot melt adhesive according to the present invention comprises “a urethane prepolymer having an isocyanate group at its end”.
- the “urethane prepolymer having an isocyanate group at the end” according to the present invention is not particularly limited as long as the target moisture-curable hot melt adhesive can be obtained.
- Such a urethane prepolymer can be obtained by reacting a polyol and an isocyanate compound according to a conventionally known method.
- the “urethane prepolymer having an isocyanate group at the end” is also simply referred to as “urethane prepolymer”.
- the “polyol” is not particularly limited as long as the target urethane prepolymer can be obtained.
- a known polyol used for ordinary polyurethane production can be used. it can.
- the polyol those having 1 to 3 functional groups are preferred, and in particular, a bifunctional polyol, so-called diol, is preferred.
- Polyols can be used alone or in combination.
- polyol for example, polyols classified into ether, ester, polycarbonate, polydiene, and the like can be used.
- ether polyol examples include polyoxytetramethylene polyol (PTMG), polyoxypropylene polyol (PPG), and polyoxyethylene polyol (PEG).
- ester polyols include polyethylene adipate (PEA), polybutylene adipate (PBA), polyalkylene terephthalate, polyalkylene isophthalate, polyalkylene phthalate, and polycaprolactone polyol (PCL).
- copolymers for example, a block copolymer of PTMG and caprolactone, a copolymer of polyester polyol and polyether polyol, and the like can also be used.
- copolymers can be synthesized by, for example, ring-opening copolymerization of ⁇ -caprolactone with PTMG, or ring-opening copolymerization of tetrahydrofuran, ethylene oxide, or propylene oxide with polyester polyol.
- Examples thereof also include substituted or unsubstituted polyalkylene ether glycols, polyhydroxy diethers such as polyhydroxy polyalkylene ethers, polyhydroxy polyesters, ethylene oxide adducts of polyols, and mono-substituted esters of glycols.
- the “isocyanate compound” is not particularly limited as long as the desired urethane prepolymer can be obtained.
- the “isocyanate compound” a known isocyanate compound used for ordinary polyurethane production is used. be able to.
- the isocyanate compound those having an average of 1 to 3 isocyanate groups per molecule are preferable, and a bifunctional isocyanate compound, so-called diisocyanate compound is particularly preferable. Isocyanate compounds can be used alone or in combination.
- isocyanate compound examples include ethylene diisocyanate, ethylidene diisocyanate, propylene diisocyanate, butylene diisocyanate, hexamethylene diisocyanate, toluene diisocyanate, cyclopentylene-1,3-diisocyanate, cyclohexylene-1,4-diisocyanate.
- Isocyanate compounds can be used alone or in combination.
- the “urethane prepolymer” When producing the “urethane prepolymer” according to the present invention, monools and monoisocyanates can be used, and trifunctional polyols and trifunctional isocyanates can be used as long as the desired urethane prepolymer can be obtained.
- the “urethane prepolymer” is produced by reacting a difunctional polyol and a difunctional isocyanate, and the heat stability of the resulting moisture-curable hot melt adhesive and the control of the production method (and its production process) are controlled. From the point, it is more preferable.
- urethane-modified rosin is a modified rosin obtained by a reaction between a rosin derivative having a hydroxyl group and an isocyanate compound, and having a urethane bond formed by a reaction between the hydroxyl group and the isocyanate group in the molecule.
- a diol having a weight average molecular weight of 1000 or less may be used.
- the “rosin derivative having a hydroxyl group” is as described above. More specifically, for example, an ester of rosin and a polyhydric alcohol, formalin-modified rosin or modified rosin alcohol, and the like have a residual hydroxyl group. A rosin derivative.
- the hydroxyl value of the rosin derivative having a hydroxyl group is preferably 10 to 180.
- the “rosin derivative having a hydroxyl group” is a compound in which various modifications are made to rosin and as a result, a hydroxyl group remains, and the most common is an ester of rosin and a polyhydric alcohol. It can be illustrated.
- rosin examples include non-denatured rosins such as gum rosin, wood rosin, tall oil rosin, as well as disproportionated rosin based on these rosins, hydrogenated rosin, polymerized rosin, and purified products thereof. be able to. It is also possible to use a reinforced rosin obtained by adding maleic acid, maleic anhydride, fumaric acid, acrylic acid or the like to these rosins, or a modified product thereof.
- polyhydric alcohol examples include, for example, dihydric alcohols such as ethylene glycol, propylene glycol, diethylene glycol, and dipropylene glycol, trihydric alcohols such as glycerin and trimethylolpropane, tetrahydric alcohols such as pentaerythritol and diglycerin, and dipentaerythritol.
- dihydric alcohols such as ethylene glycol, propylene glycol, diethylene glycol, and dipropylene glycol
- trihydric alcohols such as glycerin and trimethylolpropane
- tetrahydric alcohols such as pentaerythritol and diglycerin
- dipentaerythritol dipentaerythritol.
- the hexahydric alcohol can be illustrated.
- Esters of rosin and polyhydric alcohols can be obtained using known methods. For example, it can be obtained by heating rosin and alcohol in an inert atmosphere such as nitrogen gas. The reaction conditions at this time are generally 250 to 280 ° C. and 5 to 20 hours.
- the above production method can be applied to formalin-modified rosin, modified rosin alcohol, and the like, and can also be applied to rosin that has been modified such as phenolization.
- the “isocyanate compound” used as the raw material for the urethane-modified rosin may be the same as or different from the “isocyanate compound” described in the production of the “urethane prepolymer”.
- the “isocyanate compound” used as a raw material for the urethane-modified rosin may be any compound having one or more isocyanate groups in the compound, and may be monoisocyanate or diisocyanate. It may be an isocyanate added to a polyhydric alcohol or the like.
- the “isocyanate compound residual ratio” is 5.0% by weight or less, preferably 3.0% by weight or less, and more preferably 1.0 to 3.0% by weight. When the residual ratio of the isocyanate compound is higher than 5.0% by weight, it is not preferable from the viewpoint of environmental hygiene, and the initial adhesive strength may be lowered.
- the “heat-resistant softening temperature after moisture curing” of the moisture-curable hot melt adhesive is preferably 60 ° C. or higher, particularly 70 ° C. or higher.
- the modified rosin “(A) urethane modified rosin” obtained by reacting an isocyanate compound and a rosin derivative having a hydroxyl group is used.
- the polymer can be controlled separately. Therefore, as will be described later, the residual ratio of the isocyanate compound can be controlled to 5.0% by weight or less, and the heat-resistant softening temperature after moisture curing can be controlled to 60 ° C. or more.
- the “remaining ratio of isocyanate compound” means the weight percent of the unreacted isocyanate compound remaining in the moisture-curable hot melt adhesive. That is, the residual ratio of the isocyanate compound is represented by the following formula (I).
- Formula (I): Residual ratio of isocyanate compound (wt%) Unreacted isocyanate compound amount (g) x 100 / Moisture curable hot melt adhesive amount (g)
- the amount of unreacted isocyanate compound remaining in the moisture curable hot melt adhesive is obtained by mixing methanol with the moisture curable hot melt adhesive and reacting the unreacted isocyanate compound in the adhesive with methanol. It can be calculated by determining the amount of (X). That is, first, a predetermined amount (g) of a moisture-curable hot melt adhesive and excess methanol are mixed to determine the amount of the above-mentioned reactant (X). Next, the weight (g) of the unreacted isocyanate compound is calculated from the value of the amount of the reactant (X). Then, the residual ratio (% by weight) of the isocyanate compound is calculated from the weight (g) of the used moisture-curable hot melt adhesive and the weight (g) of the unreacted isocyanate compound.
- the outline of the calculation method actually performed is as follows. First, the isocyanate compound used for producing the prepolymer according to the moisture curable hot melt adhesive is reacted with methanol, and the resulting reaction product (X) is used as a sample resin for gel permeation chromatography ( A calibration curve is created using GPC. Next, the moisture-curable hot melt adhesive of the present invention and methanol are actually reacted, and the obtained reaction resin is measured by GPC to obtain the peak of the reactant (X). From the peak and the calibration curve described above, the amount (g) of the unreacted isocyanate compound can be calculated. Finally, the residual ratio of the isocyanate compound is calculated from the measured weight (g) of the moisture-curable hot melt adhesive and the calculated amount (g) of the unreacted isocyanate compound.
- Heat-resistant softening temperature after moisture curing refers to a temperature measured by a method defined in JIS K6833. The outline of the measurement method is described below. First, a particle board and a sheet that has been subjected to an easy adhesion treatment are bonded to each other with a moisture-curable hot melt adhesive, and after about 120 minutes, cut into test pieces having a size of 25 mm ⁇ 150 mm using a cutter. After curing for about 120 hours under the conditions of 20 ° C. and humidity 60%, a 500 g weight is suspended from the ear of the test piece, and the temperature is raised in the heating bath. The temperature when the adhesive is softened and the weight is dropped is defined as the heat-resistant softening temperature.
- the heat-resistant softening temperature is a temperature exhibiting heat resistance, and is preferably as high as possible.
- the moisture curable hot melt adhesive according to the present invention may further comprise (B) a thermoplastic resin.
- the “(B) thermoplastic resin” in the present invention may be generally called a thermoplastic resin as long as it does not interfere with the performance of the target moisture-curable hot melt adhesive, and is particularly limited. It will never be done.
- Thermoplastic resins are usually produced by polymerizing monomers. Examples of monomers used as raw materials include methyl (meth) acrylate, ethyl (meth) acrylate, and n-propyl (meth) acrylate.
- ethylene vinyl acetate resin is most preferred in the present invention.
- the vinyl acetate content of the ethylene vinyl acetate resin is preferably 10% by weight or more, particularly preferably 20 to 40% by weight. When the vinyl acetate content is less than 10% by weight, the compatibility may deteriorate.
- the moisture curable hot melt adhesive of the present invention may contain other additives as necessary.
- additives are those usually used in moisture-curable hot melt adhesives, and are particularly limited as long as they can be used in the moisture-curable hot melt adhesives according to the present invention. is not. Examples of such additives include plasticizers, antioxidants, pigments, light stabilizers, flame retardants and catalysts, waxes, and the like.
- Examples of the “plasticizer” include dioctyl phthalate, dibutyl phthalate, dioctyl adipate, mineral spirit and the like.
- Examples of the “antioxidant” include phenolic antioxidants, phosphite antioxidants, thioether antioxidants, amine antioxidants, and the like.
- Examples of the “pigment” include titanium oxide and carbon black.
- Examples of the “light stabilizer” include benzotriazole, hindered amine, benzoate, benzotriazole and the like.
- Examples of the “flame retardant” include halogen flame retardant, phosphorus flame retardant, antimony flame retardant, metal hydroxide flame retardant and the like.
- Catalysts include metal catalysts such as tin catalysts (trimethyltin laurate, trimethyltin hydroxide, dibutyltin dilaurate, dibutyltin maleate, etc.), lead catalysts (lead oleate, lead naphthenate, lead octenoate) ), Other metal catalysts (metal naphthenate such as cobalt naphthenate), and amine catalysts such as triethylenediamine, tetramethylethylenediamine, tetramethylhexylenediamine, diazabicycloalkenes, dialkylaminoalkylamines Examples can be given.
- Examples of the “wax” include waxes such as paraffin wax and microcrystalline wax.
- the method for producing a moisture-curable hot melt adhesive according to the present invention is as follows: (I) a step of obtaining a urethane-modified rosin by reaction of an isocyanate compound and a rosin derivative having a hydroxyl group; (Ii) (A) It has the process of mixing a urethane modified rosin, a polyol, and an isocyanate compound.
- the reaction of the isocyanate compound and the rosin derivative having a hydroxyl group in the step (i) can be carried out using the same method as the reaction method of the isocyanate compound and a general compound having a hydroxyl group. Can be done.
- the method of mixing the (A) urethane-modified rosin, polyol and isocyanate compound in step (ii) can be performed using a known mixing method.
- the “mixing” related to the step (i) and the “mixing” related to the step (ii) can be performed in the same manner.
- the “isocyanate compound residual ratio” of the moisture-curable hot melt adhesive is 5.0% by weight or less, and the “heat-resistant softening temperature after moisture curing” is 60 ° C. or more. Can be controlled.
- a method for producing a moisture-curable hot melt adhesive in which a hydroxyl group-containing tackifying resin and an isocyanate compound are reacted to form (A) a urethane-modified rosin and then a polyol and an isocyanate compound are added. Therefore, it is completely different from the conventional production method in which a hydroxyl group-containing tackifying resin, a polyol, and an isocyanate compound are reacted at once (or collectively).
- the hydroxyl group-containing tackifying resin has a hydroxyl group that can react with an isocyanate compound.
- This hydroxyl group reacts with an isocyanate compound or an isocyanate group at the end of the urethane prepolymer to stop the progress of the chain extension reaction. Due to the termination of the chain length extension reaction, the moisture-curable hot melt adhesive cannot obtain sufficient heat resistance after moisture curing. Therefore, when an excess of an isocyanate compound is added to increase the heat resistance, a large amount of the isocyanate compound remains in the moisture-curable hot melt adhesive, and the residual ratio of the isocyanate compound is more than 5.0% by weight. High value.
- the production method according to the present invention is different from the conventional production method “a production method in which a hydroxyl group-containing tackifying resin, a polyol, and an isocyanate compound are reacted together”, and first, a hydroxyl group-containing tackifying resin and an isocyanate compound are reacted.
- One feature is to eliminate the hydroxyl groups of the hydroxyl group-containing tackifying resin. Since the (A) urethane-modified rosin having substantially no hydroxyl group is blended with the polyol and the isocyanate compound, the reaction between the polyol and the isocyanate compound is not substantially affected by the (A) urethane-modified rosin.
- the production method according to the present invention is characterized in that each component is controlled independently by separately producing the urethane-modified rosin and the prepolymer. Therefore, it is possible to provide a moisture-curable hot melt adhesive that is excellent in heat resistance after moisture curing, has a short tack-free time, and is excellent in initial adhesive strength without using an excess isocyanate compound.
- the present invention provides the moisture-curing hot melt adhesive according to the present invention, which is manufactured by the manufacturing method according to the present invention.
- the moisture curable hot melt adhesive according to the present invention can be used in a field where a moisture curable hot melt adhesive is conventionally used. Furthermore, it can also be used for exterior materials and interior materials for building materials that require a high initial adhesive strength, flooring, application of a decorative sheet to a base material, profile wrapping, and the like.
- the moisture-curing hot melt adhesive is suitable for application to the floor as a decorative material as a building interior member, but is not limited to application to the floor, and is also applicable to other substrates. You can also paste. Therefore, the moisture curable hot melt adhesive of the present invention can be used for woodworking, paper processing, fiber processing, general use and the like.
- the moisture curable hot melt adhesive can be used by using the same method as the conventional moisture curable hot melt adhesive, and is particularly limited as long as the target member or laminate can be obtained. It is not a thing. Further, for example, when the adherend is bonded to the base material, the moisture-curable hot melt adhesive may be applied to the base material side or may be applied to the adherend side.
- “Adherent” may be a commonly used one and is not particularly limited, and specific examples thereof include a film and a decorative sheet.
- the film may be colorless, colored, transparent or opaque, and examples thereof include polyolefin resin, polyester resin, acetate resin, polystyrene resin, and vinyl chloride resin.
- examples of the polyolefin resin include polyethylene and polypropylene, and examples of the polyester resin include polyethylene terephthalate.
- the decorative sheet examples include the following: a plastic material sheet such as hard or semi-rigid vinyl chloride resin, polyolefin resin, and polyester resin; a veneer processed from wood into a sheet; and makeup with various cosmetic printing paper.
- a plastic material sheet such as hard or semi-rigid vinyl chloride resin, polyolefin resin, and polyester resin
- a veneer processed from wood into a sheet and makeup with various cosmetic printing paper.
- base material those commonly used can be used, and are not particularly limited, but examples thereof include the following: plywood such as lauan plywood, medium fiber board (MDF), particle Wood based materials such as board, solid wood, wood fiber board; inorganic materials such as cement board, gypsum board, lightweight cellular concrete (ALC); and plastic materials such as vinyl chloride resin, polyolefin resin, polyester resin.
- plywood such as lauan plywood, medium fiber board (MDF), particle Wood based materials such as board, solid wood, wood fiber board
- inorganic materials such as cement board, gypsum board, lightweight cellular concrete (ALC)
- plastic materials such as vinyl chloride resin, polyolefin resin, polyester resin.
- Laminated products obtained by laminating these adherends and substrates with the moisture-curable hot melt adhesive of the present invention are specifically used in various applications such as building materials, electronic materials, and automotive fields. Is available.
- the laminated product it is not necessary to use a special apparatus, and it can be produced using a generally known production line including a transporter, a coater, a press machine, a heater, and a cutting machine.
- a generally known production line including a transporter, a coater, a press machine, a heater, and a cutting machine.
- the moisture curable hot melt adhesive of the present invention is applied to a substrate or an adherend by a coater while flowing the substrate and the adherend with a conveyor.
- the temperature at the time of application is controlled to a predetermined temperature with a heater.
- the adherend is lightly pressed against the substrate with a press, and the adherend and the substrate are bonded together via a moisture-curable hot melt adhesive.
- the adhered adherend and the substrate are allowed to cool, and are allowed to flow as they are with a transport machine to solidify the moisture-curable hot melt adhesive. Then, the base material with the adherend is cut into an appropriate size with a cutting machine.
- the moisture-curing hot melt adhesive has a high initial adhesive strength and a short tack-free time, so that it is possible to cut a laminated product at an early stage, thereby improving production efficiency.
- a moisture curable hot melt adhesive comprising a urethane prepolymer having an isocyanate group at its end, (A) including urethane-modified rosin, the residual ratio of the isocyanate compound is 5.0% by weight or less, A moisture-curing hot melt adhesive having a heat-resistant softening temperature of 60 ° C. or higher after moisture curing.
- the urethane-modified rosin is the moisture-curable hot melt adhesive according to the above 1, obtained by a reaction between an isocyanate compound and a rosin derivative having a hydroxyl group.
- (I) a step of obtaining a urethane-modified rosin by reaction of an isocyanate compound and a rosin derivative having a hydroxyl group; (Ii) (A) A method for producing a moisture-curable hot melt adhesive, which comprises a step of mixing a urethane-modified rosin, a polyol and an isocyanate compound. 7).
- the method for producing a moisture-curable hot melt adhesive according to the above 6, comprising a step of obtaining a urethane prepolymer by mixing a polyol and an isocyanate compound, The residual ratio of the isocyanate compound is 5.0% by weight or less,
- the moisture-curable hot melt adhesive according to any one of 1 to 5, which is produced by the production method according to 6 or 7.
- Example 1 [Production of urethane-modified rosin]
- a reaction vessel was charged with 90 parts by weight of rosin ester (A′-4; Superester A100 (trade name) manufactured by Arakawa Chemical Co., Ltd .: hydroxyl value 15, weight average molecular weight 920, softening point 100 ° C.) in an oven at 120 ° C.
- the reaction vessel was heated in a 120 ° C. oil bath and stirred for 1 hour under reduced pressure to remove moisture.
- Example 2 to 4 A moisture curable hot melt adhesive was produced with the composition shown in Table 1. Manufacturing conditions and manufacturing operations are the same as those in Example 1.
- Example 5 [Production of urethane-modified rosin]
- a reaction vessel was charged with 90 parts by weight of rosin ester (A′-4) and 1.7 parts by weight of cyclohexanedimethanol (hereinafter also referred to as “CHDM”) (manufactured by Eastman Chemical Co .: weight average molecular weight 144) at 120 ° C.
- CHDM cyclohexanedimethanol
- the molecular weight of the urethane-modified rosin (A-2) is the molecular weight of (A′-4). It was confirmed that it was about twice. As a result of infrared spectroscopic analysis (IR analysis), it was confirmed that the absorption at 2300 cm ⁇ 1 by the isocyanate group almost disappeared.
- IR analysis infrared spectroscopic analysis
- ⁇ Test method> 1 Compatibility of urethane-modified rosin (phase separation of moisture-curing hot melt adhesive)
- the presence or absence of phase separation of the moisture curable hot melt adhesive was examined. That is, the moisture-curable hot melt adhesives of Examples and Comparative Examples were collected in containers, left in an oven at 120 ° C. for 1 hour, and visually observed for the presence or absence of phase separation. Separately, the moisture curable hot melt adhesives of the above Examples and Comparative Examples were applied to a transparent polyethylene terephthalate (PET) substrate. The film was dried at 20 ° C. for 1 hour, a film having a thickness of 100 ⁇ m was produced on the PET substrate, and the uniformity of the film was visually determined. When the adhesive was not separated and the film was uniform, the compatibility was good ( ⁇ ), and when the separation was confirmed or the film was non-uniform, the compatibility was evaluated as poor (x).
- PET polyethylene terephthalate
- reaction resin (Z) 10 mg was placed in an ampule bottle, 2 ml of THF was added to the reaction resin (Z) with a measuring pipette, and the resin was dissolved to obtain a THF solution for GPC measurement. 20 ⁇ l of THF solution was applied to GPC, the peak of the reaction resin (Z) was compared with the calibration curve of the sample resin, and the amount of the reaction product (X) of methanol and MDI contained in the reaction resin (Z) (ie, The amount of unreacted isocyanate compound) was calculated, and the residual ratio of the isocyanate compound was determined.
- the residual ratio (%) of the isocyanate compound was calculated using the following formula (I).
- the amount of the reactant (X) and the amount of the reaction resin (Z) are applied to the above formula in g (gram) units.
- the residual ratio of the isocyanate compound is calculated by the following formula (II).
- the tack-free time was 120 ° C., and the moisture-curable hot melt adhesives of Examples and Comparative Examples were applied to PET at a thickness of 100 ⁇ m.
- the time until the paper piece that had been destroyed was no longer material-destructed was defined as tack-free time. .
- Those with a tack free time of 2 minutes or less were evaluated as ( ⁇ ), and those with more than 2 minutes were evaluated as ( ⁇ ).
- the moisture-curable hot melt adhesives of Examples 1 to 7 were obtained by mixing (A) urethane-modified rosin, polyol, and isocyanate compound.
- A Since the urethane-modified rosin does not substantially participate in the reaction between the polyol and the isocyanate compound, a desired urethane prepolymer can be obtained as it is, and it is not necessary to mix an excess isocyanate compound.
- the compatibility and heat resistance are excellent, the residual ratio of the isocyanate compound is low (5.0 wt% or less), the tack-free time is short (within 2 minutes), the film strength before moisture curing is high, and the initial adhesive strength is excellent.
- a moisture curable hot melt adhesive was obtained.
- the moisture curable hot melt adhesive of Comparative Example 4 has the same heat resistance as that of the example, but an excess isocyanate compound is mixed to increase the heat resistance, and the residual ratio of the isocyanate compound is increased (5. 5% by weight), which is environmentally unfavorable.
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Abstract
Description
しかし、粘着付与樹脂や熱可塑性樹脂は、湿気硬化型ホットメルト接着剤の主成分であるウレタンプレポリマーとの相溶性が必ずしも十分ではない。
(A)ウレタン変性ロジンを含み
イソシアネート化合物の残存率は5.0重量%以下であり、
湿気硬化後の耐熱軟化温度は60℃以上である
湿気硬化型ホットメルト接着剤を提供する。
本発明は、他の態様において、(A)ウレタン変性ロジン、ポリオール及びイソシアネート化合物を混合することで得られる湿気硬化型ホットメルト接着剤を提供する。
本発明は、他の好ましい態様において、更に、(B)熱可塑性樹脂を含んで成る湿気硬化型ホットメルト接着剤を提供する。
(i)イソシアネート化合物と水酸基を有するロジン誘導体の反応で(A)ウレタン変性ロジンを得る工程、及び
(ii)(A)ウレタン変性ロジン、ポリオール及びイソシアネート化合物を混合する工程
を有する湿気硬化型ホットメルト接着剤の製造方法を提供する。
イソシアネート化合物の残存率は5.0重量%以下であり、
湿気硬化後の耐熱軟化温度は60℃以上である
湿気硬化型ホットメルト接着剤の製造方法を提供する。
「初期接着強度」とは、湿気硬化型ホットメルト接着剤を溶融して被着体に塗布した後、接着剤の温度が低下して接着剤が固化して固体になった時の接着強度をいう。初期接着強度は、濡れ性や凝集力に影響される。
「濡れ性」とは、加熱して溶融した湿気硬化型ホットメルト接着剤を基材(固体)に接触させたとき、溶融した接着剤が基材と接触する端部が作る角度(α)の大きさで測ることができる。αが小さいほど濡れ性が大きく、接着し易い。
「凝集力」とは、加熱溶融した湿気硬化型ホットメルト接着剤を、アプリケーターを用いて塗布した後、冷える過程で生じる、接着剤中の分子間に働く相互作用に起因する力をいう。
「最終接着強度」とは、溶融した湿気硬化型ホットメルト接着剤が固化後、接着剤中のイソシアネート基と大気中の水分が反応して硬化した後の、即ち、湿気硬化後の接着強度をいう。
(A)ウレタン変性ロジンを含み
イソシアネート化合物の残存率は5.0重量%以下であり、
湿気硬化後の耐熱軟化温度は60℃以上であるので、
環境面、相溶性、初期接着強度、タックフリータイム及び湿気硬化後の耐熱性等のバランスに優れる。
本発明の湿気硬化型ホットメルト接着剤で、基材(木質材料やプラスチック)と、被着体(フィルム、化粧シート、プラスチック)とを貼り合わせて積層品を製造すると、基材と被着体を貼り合わせた後、積層品を裁断加工するまでの時間が多少短くとも、被着体が剥がれたり、加工面にバリが生じたりすることがない。
従って、積層品の生産効率を考慮すると、本発明の湿気硬化型ホットメルト接着剤は極めて有効である。
(i)イソシアネート化合物と水酸基を有するロジン誘導体の反応で(A)ウレタン変性ロジンを得る工程、
(ii)(A)ウレタン変性ロジン、ポリオール及びイソシアネート化合物を混合する工程
を有する製造方法なので、
(A)ウレタン変性ロジンは、ポリオールとイソシアネート化合物との反応に関与しないので、イソシアネート化合物を過剰に加えることなく、湿気硬化型ホットメルト接着剤の湿気硬化後の耐熱性を高めることができる。
更に、本願製造方法は、イソシアネート化合物の残存率を低く維持できるので、環境面も優れる。さらに、得られた湿気硬化型ホットメルト接着剤は、タックフリータイムが短くなり、初期凝集力が高くなるので初期接着力にも優れる。
(ii)工程において、ポリオールとイソシアネート化合物を混合することで、ウレタンプレポリマーを得る工程を含む、湿気硬化型ホットメルト接着剤の製造方法であって、
湿気硬化型ホットメルト接着剤のイソシアネート化合物の残存率は5.0重量%以下であり、湿気硬化後の耐熱軟化温度は60℃以上としているので、
イソシアネート化合物が(A)ウレタン変性ロジンと実質的に反応しないから、湿気硬化型ホットメルト接着剤中のイソシアネート化合物の残存率がより低いにも関わらず、湿気硬化後の耐熱性が高い湿気硬化型ホットメルト接着剤を製造することができる。
本発明に係る「イソシアネート基を末端に有するウレタンプレポリマー」とは、目的とする湿気硬化型ホットメルト接着剤を得ることができる限り、特に制限されるものではない。このようなウレタンプレポリマーは、ポリオールとイソシアネート化合物とを従来既知の方法にしたがって反応させることで得られる。尚、本明細書では、「イソシアネート基を末端に有するウレタンプレポリマー」を、単に「ウレタンプレポリマー」とも記載する。
上記製造方法は、ホルマリン変性ロジン、変性ロジンアルコール等についても適用することができ、さらにフェノール化などの変性を施したロジンについても適用できる。
湿気硬化型ホットメルト接着剤の「湿気硬化後の耐熱軟化温度」は、60℃以上、特に70℃以上であることが好ましい。
即ち、イソシアネート化合物の残存率は、下記式(I)で示される。
式(I):
イソシアネート化合物の残存率(重量%)
=未反応イソシアネート化合物量(g)×100/湿気硬化型ホットメルト接着剤量(g)
次に、本発明の湿気硬化型ホットメルト接着剤とメタノールとを実際に反応させて、得られた反応樹脂をGPCで測定して、反応物(X)のピークを得る。そのピークと上述の検量線から、未反応イソシアネート化合物量(g)を算出することができる。
最後に、測定した湿気硬化型ホットメルト接着剤の重量(g)と算出した未反応イソシアネート化合物量(g)からイソシアネート化合物の残存率を算出する。
先ず、湿気硬化型ホットメルト接着剤でパーティクルボードと易接着処理されたシートとを貼り合わせ、約120分後に、カッターを用いて25mm×150mmの大きさの試験片に切断する。20℃、湿度60%の条件で、約120時間養生後、500gの錘を試験片の耳部に吊り下げ、加熱浴槽の中で温度を上昇させる。接着剤が軟化し、重りが落下したときの温度を耐熱軟化温度とする。耐熱軟化温度は、耐熱性を示す温度であり、高いほど好ましい。
本発明における「(B)熱可塑性樹脂」は、目的とする湿気硬化型ホットメルト接着剤の性能を妨げないものであれば、一般的に熱可塑性樹脂とよばれるものであってよく、特に限定されることはない。(B)熱可塑性樹脂は、通常、モノマーを重合して製造されるが、その原料となるモノマーとして、例えば(メタ)アクリル酸メチル、(メタ)アクリル酸エチル、(メタ)アクリル酸n-プロピル、(メタ)アクリル酸n-ブチル、(メタ)アクリル酸sec-ブチル、(メタ)アクリル酸t-ブチル、(メタ)アクリル酸n-オクチル、アクリル酸2-エチルヘキシル、(メタ)アクリル酸、無水マレイン酸、イタコン酸、酢酸、酢酸ビニル、エチレン酢酸ビニル等を例示できる。モノマーは、単独で又は組み合わせて使用することができる。
「酸化防止剤」として、例えばフェノール系酸化防止剤、ホスファイト系酸化防止剤、チオエーテル系酸化防止剤、アミン系酸化防止剤等を例示できる。
「顔料」として、例えば酸化チタン、カーボンブラック等を例示できる。
「光安定剤」として、例えばベンゾトリアゾール、ヒンダードアミン、ベンゾエート、ベンゾトリアゾール等を例示できる。
「難燃剤」として、例えばハロゲン系難燃剤、リン系難燃剤、アンチモン系難燃剤、金属水酸化物系難燃剤等を例示できる。
「ワックス」として、例えばパラフィンワックスやマイクロクリスタリンワックス等のワックスを例示できる。
(i)イソシアネート化合物と水酸基を有するロジン誘導体の反応で(A)ウレタン変性ロジンを得る工程、
(ii)(A)ウレタン変性ロジン、ポリオール及びイソシアネート化合物を混合する工程
を有する。
(ii)工程の(A)ウレタン変性ロジン、ポリオール及びイソシアネート化合物を混合する方法は、既知の混合方法を用いて行うことができる。
(i)工程に係る「混合」と(ii)工程に係る「混合」は、同様にして行うことができる。
フィルムは、無色であっても着色されていても、透明であっても不透明であってもよいが、例えば、ポリオレフィン樹脂、ポリエステル樹脂、アセテート樹脂、ポリスチレン樹脂、塩化ビニル樹脂が挙げられる。ポリオレフィン樹脂としては、ポリエチレン、ポリプロピレンを例示でき、ポリエステル樹脂として、例えば、ポリエチレンテレフタレートを例示できる。
例えば、以下のようにして製造することができる。基材及び被着体を搬送機で流しながら、本発明の湿気硬化型ホットメルト接着剤をコーターで基材若しくは被着体に塗布する。塗布する時の温度は、ヒーターで所定の温度に制御する。被着体をプレス機で基材に軽く押し付け、湿気硬化型ホットメルト接着剤を介して、被着体と基材とを貼り合わせる。その後、貼りあわされた被着体と基材を放冷し、そのまま搬送機で流して、湿気硬化型ホットメルト接着剤を固化させる。その後、被着体が貼られた基材を裁断機で適当な大きさに裁断加工する。
本発明では、湿気硬化型ホットメルト接着剤の初期接着強度が高く、タックフリータイムが短いので、早い段階での積層品の裁断加工が可能となり、生産効率が向上する。
1.イソシアネート基を末端に有するウレタンプレポリマーを含む湿気硬化型ホットメルト接着剤であって、
(A)ウレタン変性ロジンを含み
イソシアネート化合物の残存率は5.0重量%以下であり、
湿気硬化後の耐熱軟化温度は60℃以上
である湿気硬化型ホットメルト接着剤。
2.(A)ウレタン変性ロジンは、イソシアネート化合物と、水酸基を有するロジン誘導体の反応で得られる上記1に記載の湿気硬化型ホットメルト接着剤。
3.(A)ウレタン変性ロジン、ポリオール及びイソシアネート化合物を混合することで得られる上記1又は2に記載の湿気硬化型ホットメルト接着剤。
4.上記ウレタンプレポリマーは、ポリオールとイソシアネート化合物の反応で得られる上記1~3のいずれかに記載の湿気硬化型ホットメルト接着剤。
5.更に、(B)熱可塑性樹脂を含んで成る上記1~4のいずれかに記載の湿気硬化型ホットメルト接着剤。
6.(i)イソシアネート化合物と水酸基を有するロジン誘導体の反応で(A)ウレタン変性ロジンを得る工程、
(ii)(A)ウレタン変性ロジン、ポリオール及びイソシアネート化合物を混合する工程
を有する湿気硬化型ホットメルト接着剤の製造方法。
7.(ii)工程において、ポリオールとイソシアネート化合物を混合することで、ウレタンプレポリマーを得る工程を含む、上記6に記載の湿気硬化型ホットメルト接着剤の製造方法であって、
イソシアネート化合物の残存率は5.0重量%以下であり、
湿気硬化後の耐熱軟化温度は60℃以上である
湿気硬化型ホットメルト接着剤の製造方法。
8.上記6又は7に記載の製造方法で製造される上記1~5のいずれかに記載の湿気硬化型ホットメルト接着剤。
[ウレタン変性ロジンの製造]
反応容器にロジンエステル(A’-4;荒川化学社製のスーパーエステルA100(商品名):水酸基価15、重量平均分子量920、軟化点100℃)を90重量部仕込み、120℃のオーブン中でロジンエステルを溶融した後、反応容器を120℃オイル浴で加熱しながら減圧下、1時間攪拌して、水分を取り除いた。
次に120℃で、4,4’-ジフェニルメタンジイソシアネート(以下、「MDI」ともいう)(日本ポリウレタン工業社製ミリオネートMT)を3.3重量部仕込み、減圧下、120℃で2時間攪拌し、ウレタン変性ロジン(A-1)を得た。
ウレタン変性ロジン(A-1)の分子量分布をゲルパーミェーションクロマトグラフィー分析(GPC分析)で測定した結果、ウレタン変性ロジン(A-1)の分子量は、(A’-4)の分子量の約2倍であることが確認された。又、赤外分光スペクトル分析(IR分析)を行った結果、イソシアネート基による2300cm-1の吸収は、ほぼ消失していることが確認された。
ウレタン変性ロジン(A-1)27.5重量部、(B)熱可塑性樹脂である(B-1)エチレン酢酸ビニル樹脂(以下、「EVA樹脂」ともいう)(東ソー社製のウルトラセン726(商品名):メルトインデックス700、酢酸ビニル含有量31%)9.2重量部を反応容器に仕込み、次に、120℃でポリオール(1)(豊国製油社製のHS 2H-351A(商品名):水酸基価32、融点55℃、結晶性)41.2重量部、ポリオール(2)(豊国製油社製のHS 2F-306P(商品名):水酸基価37、ガラス転移点27℃、非晶性)13.7重量部を仕込み、減圧下、1時間攪拌して、水分を取り除いた。次に、120℃でMDIを8.4重量部仕込み、減圧下、2時間攪拌し、湿気硬化型ホットメルト接着剤を得た。
表1に示される組成で湿気硬化型ホットメルト接着剤を製造した。製造条件、製造操作は、実施例1の条件及び操作と同様である。実施例3では、実施例1で用いなかった3種類のポリオール、即ち、ポリオール(3)(宇部興産社製のエタナコール3010(商品名:水酸基価32、融点74℃、結晶性)、ポリオール(4)(豊国製油社製のHS 2H-359T(商品名):水酸基価32、融点110℃、結晶性)、ポリオール(5)(日本油脂社製のPEG#100U(商品名):水酸基価112、融点40℃、結晶性)を使用した。
[ウレタン変性ロジンの製造]
反応容器にロジンエステル(A’-4)を90重量部、シクロヘキサンジメタノール(以下、「CHDM」ともいう)(イーストマンケミカル社製:重量平均分子量144)を1.7重量部仕込み、120℃オーブン中でロジンエステルを溶融後、反応容器を120℃オイル浴中で加熱して、減圧下、1時間攪拌して、水分を取り除いた。次に、120℃でMDIを6.6重量部仕込み、減圧下、2時間攪拌して、ウレタン変性ロジン(A-2)を得た。
ウレタン変性ロジン(A-2)27.5重量部及び、EVA樹脂9.2重量部を反応容器に仕込み、次に120℃でポリオール(1)を55.0重量部仕込み、減圧下、1時間攪拌して、水分を除去した。次に、120℃でMDIを8.3重量部仕込み、減圧下、2時間攪拌して、湿気硬化型ホットメルト接着剤を得た。
[ウレタン変性ロジンの製造]
反応容器にロジンエステル(A’-5)(荒川化学社製のパインクリスタルKE359(商品名):水酸基価43、重量平均分子量900、軟化点100℃)を90重量部仕込み、120℃オーブン中でロジンエステルを溶融後、反応容器を120℃オイル浴中に浸し、減圧下、1時間攪拌して、水分を除去した。次に、120℃でMDIを7.7重量部仕込み、120℃で減圧下、2時間攪拌して、ウレタン変性ロジン(A-3)を得た。
ウレタン変性ロジン(A-3)の分子量分布をゲルパーミェーションクロマトグラフィー分析(GPC分析)で測定した結果、(A’-5)の分子量の約2倍の分子量をもつウレタン変性ロジンが出来ていることが確認できた。又、赤外分光スペクトル分析(IR分析)を行った結果、イソシアネート基による2300cm-1の吸収がほぼ消失していることが確認された。
[湿気硬化型ホットメルト接着剤の製造]
ウレタン変性ロジン(A-3)を用い、表1に示される組成で湿気硬化型ホットメルト接着剤を作製した。製造条件については、実施例1と同様である。
MDI以外の全ての原料を表1に示される組成で反応容器に仕込み、120℃オーブン中にて樹脂を溶融後、反応容器を120℃オイル浴中で、減圧下、1時間攪拌して、水分を取り除いた。次いで、120℃で、表1に示される組成でMDIを仕込み、減圧下、2時間攪拌して、湿気硬化型ホットメルト接着剤を得た。
1.ウレタン変性ロジンの相溶性(湿気硬化型ホットメルト接着剤の相分離)
湿気硬化型ホットメルト接着剤の相分離の有無を調べた。
即ち、実施例および比較例の湿気硬化型ホットメルト接着剤を容器に採取し、120℃オーブン中で1時間放置し、目視で、相分離の有無を観察した。
これとは別に、透明なポリエチレンテレフタレート(PET)基材に、上記実施例及び比較例の湿気硬化型ホットメルト接着剤を塗工した。20℃で1時間乾燥させ、PET基材上に、厚さ100μmのフィルムを作製し、フィルムの均一性を目視で判断した。接着剤の分離がなく、尚且つ、フィルムが均一なものについて相溶性が良好(○)、分離が確認される又はフィルムが不均一なものについては相溶性が不良(×)と評価した。
[検量線作成]
ジフェニルメタンジイソシアネート(MDI)5gを反応容器にとり、脱水トルエン20ml、脱水メタノール10mlを加え、室温で8時間以上攪拌しながら反応させた。次に100℃オーブン中にて8時間乾燥させた後、白色粉末状態の検量線作成用サンプル樹脂を得た。
サンプル樹脂1mg、2.5mg、5mg、10mgをアンプル瓶に夫々採取し、テトロヒドロフラン(THF)をメスピペットにて10ml加え、THF溶液を調製した。調製した4種類の溶液をGPCにかけ、サンプル樹脂のピークから検量線を作成した。
実施例および比較例の湿気硬化型ホットメルト接着剤5gを反応容器にとり、脱水トルエン20ml、脱水メタノール10mlを加え、室温で8時間攪拌し、湿気硬化型ホットメルト接着剤の末端イソシアネート基及び未反応イソシアネート化合物と、メタノールとを反応させた。この反応によって得られた反応樹脂(Z)を100℃オーブン中で8時間乾燥させた。尚、反応樹脂(Z)の量を、本発明の湿気硬化型ホットメルト接着剤の量と考えて、イソシアネート化合物の残存量(g)を算出した。反応樹脂(Z)10mgをアンプル瓶にとり、THF2mlをメスピペットで反応樹脂(Z)に加え、樹脂を溶解させてGPC測定用のTHF溶液とした。
THF溶液20μlをGPCにかけ、反応樹脂(Z)のピークと、サンプル樹脂の検量線とを比較し、反応樹脂(Z)中に含まれるメタノールとMDIとの反応物(X)の量(即ち、未反応イソシアネート化合物の量)を算出し、イソシアネート化合物の残存率を求めた。
式(I):
イソシアネート化合物の残存率(重量%)
=未反応イソシアネート化合物量(g)×100/湿気硬化型ホットメルト接着剤量(g)
=メタノールとMDIの反応物(X)のGPC算出量×100/反応樹脂(Z)の量
=メタノールとMDIの反応物(X)のGPC算出量×100/((アンプル瓶に採取された反応樹脂(Z)の量/2×10-3)×20×10-6)
=メタノールとMDIの反応物(X)のGPC算出量×100×2×10-3/(アンプル瓶に採取された反応樹脂(Z)の量×20×10-6)
=メタノールとMDIの反応物(X)のGPC算出量×100×2×103/(アンプル瓶に採取された反応樹脂(Z)の量×20)
=メタノールとMDIの反応物(X)のGPC算出量×100×100/(アンプル瓶に採取された反応樹脂(Z)の量)
=メタノールとMDIの反応物(X)のGPC算出量×104/(アンプル瓶に採取された反応樹脂(Z)の量)
式(II):
イソシアネート化合物の残存率(%)
=メタノールとMDIのGPC算出反応物(X)の量×104/10(mg)×10-3
=メタノールとMDIのGPC算出反応物(X)の量×106
実施例および比較例の湿気硬化型ホットメルト接着剤を、40g/m2の量でパーティクルボードに塗布後、易接着処理したシートをラミネートした。シートをラミネートしたパーティクルボードを20℃、湿度60%の環境下で5日間養生した。養生後、シートを幅25mm、長さ150mmの形状にカッターで切断して、試験片とした。500gの錘を試験片の耳部に吊り下げ、50℃、湿度60%の環境下にて1時間放置した。次に、60℃、70℃と昇温し、それぞれの温度で1時間放置した。各温度下で、負荷(500gの錘)をかけられているにもかかわらず、変形等の変化が認められない場合に耐熱性良好(○)、クリープを生じたり、完全に凝集破壊して剥がれた場合を耐熱性不良(×)と評価した。
120℃で、実施例および比較例の湿気硬化型ホットメルト接着剤を、100μmの厚さで、PETに塗工した。20℃の環境中に配置したPET上の塗工した接着剤に紙片に押し当てて、紙片を剥がす際、当初、材料破壊していた紙片が材料破壊しなくなるまでの時間をタックフリータイムとした。タックフリータイムが2分以内のものを(○)、2分を超えるものを(×)と評価した。
実施例および比較例の湿気硬化型ホットメルト接着剤を離型フィルム間に、厚さ100μmになるように120℃で塗工し、室温(20℃)で2分後、離型フィルムを剥がして25mm幅、150mm長さのフィルムを切り出した。フィルムの上下50mmを持ち手とし、間50mmを測定箇所として、引張り試験機(インストロン社製 モデル5585)を用い、20℃で引張り速度100mm/分でフィルムの強度を測定した。尚、硬化前フィルム強度は、初期接着強度とほぼ対応する。
[関連出願]
尚、本出願は、2008年11月27日に日本国でされた出願番号2008-302038を基礎出願とするパリ条約第4条に基づく優先権を主張する。この基礎出願の内容は、参照することによって、本明細書に組み込まれる。
Claims (2)
- イソシアネート基を末端に有するウレタンプレポリマーを含む湿気硬化型ホットメルト接着剤であって、
(A)ウレタン変性ロジンを含み
イソシアネート化合物の残存率は5.0重量%以下であり、
湿気硬化後の耐熱軟化温度は60℃以上
である湿気硬化型ホットメルト接着剤。 - (i)イソシアネート化合物と水酸基を有するロジン誘導体の反応で(A)ウレタン変性ロジンを得る工程、
(ii)(A)ウレタン変性ロジン、ポリオール及びイソシアネート化合物を混合する工程
を有する湿気硬化型ホットメルト接着剤の製造方法。
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| EP20090829007 EP2380939A1 (en) | 2008-11-27 | 2009-11-18 | Moisture-curable hot melt adhesive |
| BRPI0921170A BRPI0921170A2 (pt) | 2008-11-27 | 2009-11-18 | adesivos termo fundidos de cura por umidade |
| CN200980152897.7A CN102264856B (zh) | 2008-11-27 | 2009-11-18 | 可湿气固化的热熔性胶粘剂 |
| US13/116,573 US8324299B2 (en) | 2008-11-27 | 2011-05-26 | Moisture-curable hot melt adhesive |
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| JP2008302038A JP5580982B2 (ja) | 2008-11-27 | 2008-11-27 | 湿気硬化型ホットメルト接着剤 |
| JP2008-302038 | 2008-11-27 |
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| US13/116,573 Continuation US8324299B2 (en) | 2008-11-27 | 2011-05-26 | Moisture-curable hot melt adhesive |
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| US (1) | US8324299B2 (ja) |
| EP (1) | EP2380939A1 (ja) |
| JP (1) | JP5580982B2 (ja) |
| CN (1) | CN102264856B (ja) |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013122019A (ja) * | 2011-12-12 | 2013-06-20 | Nitto Denko Corp | 熱伝導性粘着樹脂組成物および熱伝導性粘着シート |
| JP2025502082A (ja) * | 2022-01-07 | 2025-01-24 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 反応性ホットメルト接着剤組成物およびその使用 |
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| CN103320045A (zh) * | 2013-07-11 | 2013-09-25 | 苏州毫邦新材料有限公司 | 一种反应型异方导电热熔胶粘剂 |
| JP6111190B2 (ja) * | 2013-12-25 | 2017-04-05 | 株式会社ブリヂストン | サイド補強式ランフラットタイヤ |
| JP6660545B2 (ja) * | 2014-12-16 | 2020-03-11 | Dic株式会社 | 湿気硬化型ホットメルトウレタン組成物及び接着剤 |
| CN106499152B (zh) * | 2016-10-21 | 2019-08-06 | 肖文辉 | Pvc复合地板 |
| CN112789175B (zh) * | 2018-09-28 | 2023-05-02 | 大日本印刷株式会社 | 装饰片和使用了其的装饰材料 |
| CN110229645B (zh) * | 2019-07-12 | 2021-10-08 | 重庆韩拓科技有限公司 | 高初粘单组份湿气固化反应型聚氨酯热熔胶及其制备方法 |
| US11732166B2 (en) | 2019-08-26 | 2023-08-22 | H.B. Fuller Company | Fast set moisture curable hot melt adhesive composition and articles including the same |
| CN116238014A (zh) * | 2023-04-12 | 2023-06-09 | 邦弗特新材料股份有限公司 | 一种饰面板材的制备方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4377510A (en) * | 1981-11-30 | 1983-03-22 | Arizona Chemical Company | Urethane-modified rosin ester and process for preparing the same |
| JPS62277420A (ja) * | 1986-05-09 | 1987-12-02 | ピ−ピ−ジ−・インダストリ−ズ・インコ−ポレイテッド | ウレタン変性ロジンエステル |
| JPH05214312A (ja) * | 1992-02-07 | 1993-08-24 | Sunstar Eng Inc | 湿気硬化性熱溶融型ポリウレタン系接着剤 |
| JPH07179559A (ja) * | 1993-12-24 | 1995-07-18 | Arakawa Chem Ind Co Ltd | ロジン骨格を有するポリウレタンおよび該ポリウレタンを含有してなるポリウレタン系接着剤 |
| JPH07278498A (ja) * | 1994-04-11 | 1995-10-24 | Harima Chem Inc | 低水酸基価変性ロジン、ロジン誘導体の水酸基価を低下させる方法、感圧性接着剤の粘着付与剤並びに感圧性接着剤組成物 |
| JP3317698B2 (ja) | 1990-11-28 | 2002-08-26 | 積水化学工業株式会社 | 反応性ホットメルト型接着剤組成物 |
| JP2003515637A (ja) | 1999-12-01 | 2003-05-07 | エイチ・ビー・フラー・ライセンシング・アンド・ファイナンシング・インコーポレイテッド | 改良された反応型ホットメルト接着剤 |
| JP2007051282A (ja) * | 2005-07-21 | 2007-03-01 | Sanyo Chem Ind Ltd | 反応性ホットメルト接着剤 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5518571A (en) * | 1990-08-24 | 1996-05-21 | Henkel Kommanditgesellschaft Auf Aktien | Use of polyester resins as hot-melt adhesives |
| JPH0751282A (ja) | 1993-08-09 | 1995-02-28 | Olympus Optical Co Ltd | レーザ治療用具 |
| CA2214311A1 (en) * | 1996-09-06 | 1998-03-06 | Air Products And Chemicals, Inc. | Hot melt adhesives comprising low free monomer, low oligomer isocyanate prepolymers |
| US6660376B1 (en) * | 2000-06-06 | 2003-12-09 | H. B. Fuller Licensing & Financing Inc. | Method of bonding permeable substrates with hot melt moisture cure adhesive having low viscosity and high green strength |
| CN1300274C (zh) * | 2005-09-28 | 2007-02-14 | 东北林业大学 | 湿固化聚氨酯热熔胶黏剂的制备方法 |
-
2008
- 2008-11-27 JP JP2008302038A patent/JP5580982B2/ja not_active Expired - Fee Related
-
2009
- 2009-11-18 CN CN200980152897.7A patent/CN102264856B/zh not_active Expired - Fee Related
- 2009-11-18 WO PCT/JP2009/069534 patent/WO2010061759A1/ja not_active Ceased
- 2009-11-18 EP EP20090829007 patent/EP2380939A1/en not_active Withdrawn
- 2009-11-18 BR BRPI0921170A patent/BRPI0921170A2/pt not_active IP Right Cessation
-
2011
- 2011-05-26 US US13/116,573 patent/US8324299B2/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4377510A (en) * | 1981-11-30 | 1983-03-22 | Arizona Chemical Company | Urethane-modified rosin ester and process for preparing the same |
| JPS62277420A (ja) * | 1986-05-09 | 1987-12-02 | ピ−ピ−ジ−・インダストリ−ズ・インコ−ポレイテッド | ウレタン変性ロジンエステル |
| JP3317698B2 (ja) | 1990-11-28 | 2002-08-26 | 積水化学工業株式会社 | 反応性ホットメルト型接着剤組成物 |
| JPH05214312A (ja) * | 1992-02-07 | 1993-08-24 | Sunstar Eng Inc | 湿気硬化性熱溶融型ポリウレタン系接着剤 |
| JPH07179559A (ja) * | 1993-12-24 | 1995-07-18 | Arakawa Chem Ind Co Ltd | ロジン骨格を有するポリウレタンおよび該ポリウレタンを含有してなるポリウレタン系接着剤 |
| JPH07278498A (ja) * | 1994-04-11 | 1995-10-24 | Harima Chem Inc | 低水酸基価変性ロジン、ロジン誘導体の水酸基価を低下させる方法、感圧性接着剤の粘着付与剤並びに感圧性接着剤組成物 |
| JP2003515637A (ja) | 1999-12-01 | 2003-05-07 | エイチ・ビー・フラー・ライセンシング・アンド・ファイナンシング・インコーポレイテッド | 改良された反応型ホットメルト接着剤 |
| JP2007051282A (ja) * | 2005-07-21 | 2007-03-01 | Sanyo Chem Ind Ltd | 反応性ホットメルト接着剤 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013122019A (ja) * | 2011-12-12 | 2013-06-20 | Nitto Denko Corp | 熱伝導性粘着樹脂組成物および熱伝導性粘着シート |
| JP2025502082A (ja) * | 2022-01-07 | 2025-01-24 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 反応性ホットメルト接着剤組成物およびその使用 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102264856A (zh) | 2011-11-30 |
| BRPI0921170A2 (pt) | 2018-08-07 |
| CN102264856B (zh) | 2015-11-25 |
| JP2010126615A (ja) | 2010-06-10 |
| EP2380939A1 (en) | 2011-10-26 |
| JP5580982B2 (ja) | 2014-08-27 |
| US8324299B2 (en) | 2012-12-04 |
| US20110275767A1 (en) | 2011-11-10 |
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