[go: up one dir, main page]

WO2010058009A2 - Procédé pour faire pivoter un lingot découpé en tranches et dispositif correspondant - Google Patents

Procédé pour faire pivoter un lingot découpé en tranches et dispositif correspondant Download PDF

Info

Publication number
WO2010058009A2
WO2010058009A2 PCT/EP2009/065650 EP2009065650W WO2010058009A2 WO 2010058009 A2 WO2010058009 A2 WO 2010058009A2 EP 2009065650 W EP2009065650 W EP 2009065650W WO 2010058009 A2 WO2010058009 A2 WO 2010058009A2
Authority
WO
WIPO (PCT)
Prior art keywords
container
wafers
liquid
wafer
wafer block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2009/065650
Other languages
German (de)
English (en)
Other versions
WO2010058009A3 (fr
Inventor
Patrik MÜLLER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gebrueder Schmid GmbH and Co
Original Assignee
Gebrueder Schmid GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gebrueder Schmid GmbH and Co filed Critical Gebrueder Schmid GmbH and Co
Publication of WO2010058009A2 publication Critical patent/WO2010058009A2/fr
Publication of WO2010058009A3 publication Critical patent/WO2010058009A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements

Definitions

  • the invention relates to a method and to a device suitable for rotating a jarred wafer block, in particular after the sawing of a wafer block into individual wafers for the production of solar cells
  • the zerware wafer block or the individual wafers from the carrier solved by dissolving or removing the adhesive
  • the zerware wafer block is in a horizontal position, the individual wafers are thus vertically after loosening of the Bonding with the carrier, they are held in the carrier device or are fixed, preferably by abutment on lateral, elongate brackets such as side brushes according to DE 102005028112 A1 or rod-like equipment in this carrier device, the wafer are then erected in a vertical position, so that the wafer lie horizontally flat So will a stack is formed, from which the wafers can then be removed automatically
  • the invention has for its object to provide an aforementioned method and a corresponding device with which the disadvantages of the prior art can be eliminated and in particular the formation of a vertical stack of wafers, ie in a vertical position to allow at low risk of damage to the wafers.
  • the sawed wafer block together with the carrier device can be held in a horizontal position or with vertical alignment. tion of the individual wafers in a container.
  • This container has holes or drains that are either always open or at least partially open and closed in the manner of flaps, valves or the like ..
  • the wafers lie at least partially, so to speak, in the water bath on each other, in particular completely.
  • the wafers experience a kind of guidance by, for example, the carrier device, so that they can not deviate laterally too far from the underlying wafer or the ideal orientation of the wafer stack.
  • the above-mentioned clamping devices or support means of the carrier device can only be moved far enough away from the wafers that they are no longer held, but at the same time provide guidance with a low degree of lateral movement, for example, a few millimeters distance.
  • the liquid can also have certain proper movements and self-current flows, as will be discussed in more detail below
  • the container is already filled with liquid after the introduction of the wafer block and only then is rotated into the vertical position.
  • This has the great advantage that such a rotation of the wafer in the water bath reduces mechanical loads, as it were
  • liquid is drained from the container
  • it is controlled discharged, in particular not abruptly, but rather slowly, so that the wafers
  • the slowness of the liquid level in the container can be kept approximately constant in a particularly advantageous manner so as not to cause any uneven loads or effects on the wafers
  • the liquid or a liquid level is always slightly above the uppermost wafer, at least until the wafers are deposited on each other at least in the upper region, in particular completely.
  • the container In order to remove, so to speak, the liquid from the container or to achieve the aforementioned liquid flow, it can be provided in a first embodiment of the invention that the container is placed in the vertical position in a water bath. He has along its longitudinal direction to the aforementioned holes or processes, which are in particular open. The container is simply pulled upwards out of the water bath or the entire water bath is slowly drained off. This should be done so that the container with the wafers is moved therein at a constant relative speed to the water bath, so either pulled up or the water bath is drained accordingly. Such a container can then be relatively easily formed in the manner of a container made of perforated plate or in the manner of a sieve.
  • the container has closable and apparent holes or processes.
  • the holes or drains are opened so that the liquid from the Behalter can be drained to the sinking of the wafers, which have been released simultaneously by the carrier device or shortly before
  • the holes or drains are opened from top to bottom to drain the liquid.
  • only the insignificantly located under the liquid level holes or drain can be opened so the emergence of a flow of liquid in the container from top to bottom substantially prevented, as it were only in the uppermost area, for example in the top centimeters, the liquid side
  • the wafers can be lowered substantially without being affected by a liquid flow, if desired.
  • the liquid could be sucked upwards.
  • holes or drains on a lower end wall of the container for draining the liquid can serve as a maximum flow of the liquid in the container he generated from top to bottom to support the deposition of the wafers on each other
  • a further embodiment of the invention can be provided that after turning the container in the vertical position, so when the wafer form a vertical stack, all wafers are released or released at one time by the carrier device.
  • This essentially eliminates the forces on the side edges of the wafers, by which they have previously been held, so that even if there are already several wafers resting on one wafer at the top, the latter is not exposed to any risk of damage as soon as it touches the wafer below it lying or lying calmly, the weight forces can be carried by its entire surface, so that they can be better absorbed Furthermore, just this lowering damped by a liquid located between the wafers and only receding.
  • the wafers are first released from the carrier device one after the other. This could be done, for example, from bottom to top, so that substantially always only one wafer drauzier on the underlying or lowered to it. However, this would mean that the uppermost wafers would have to pass freely through the liquid for a relatively long distance, which is associated with a considerable risk of a change in position and consequent unclean stacking or even damage.
  • the carrier device For holding the wafers in the carrier device can be provided that they are held in the horizontal position of the sawn wafer block left and right, preferably non-positively. They can also be held from below or rest with their lower edge on a kind of support device.
  • the support device or the lateral supports can then be solved later, as described above, for all wafers simultaneously or successively. At the same time they can still serve as a guide for the lowering or destacking of the wafer at a distance of a few millimeters.
  • a chamber in the previously in the wafer from a carrier, for example, the aforementioned glass carrier or beam to which the wafer block was glued before sawing solved are.
  • a chamber is advantageously a Dekklebehunt, as has been described for example in DE 102008053598.2.
  • a container belonging to the invention can be retracted into such a decoating chamber, advantageously counter to the main direction of movement of the scraper chamber. Wafer block, and it just the carrier device with the sawn wafer block are introduced into it. The erecting of the wafer block or of the container and possibly also the stacking of the wafers can indeed also take place in the decapping chamber.
  • it is carried out in a further device.
  • the liquid for the liquid bath for example, water can be used. It can be brought to a certain temperature, for example slightly heated, to influence certain viscosity properties or to protect the wafers by heating from damage during stacking. Alternatively, other liquids can be used or additives are added, which are mainly used to influence the viscosity.
  • electro-rheological fluids described for example in US 2,417,850, magneto-rheological fluids or ferrofluids may be used. These fluids are also known as smart fluids.
  • the viscosity of the liquid can be adjusted and controlled and changed specifically during rotation or lowering.
  • the device can generate an electric field, advantageously with two lateral electrodes. Alternatively, it can generate a magnetic field with a coil around the wafer block. The strength of the fields can be adjusted depending on the liquid used by applying a higher voltage or higher current.
  • emulsions can be used as a liquid, whereby the lowering speed can be kept constant by increasing the viscosity at higher flow velocities even with a resulting stack with increasing weight.
  • FIG. 3 shows an elongated container in horizontal position with holes in side walls and an open top
  • FIG. 4 shows the method step of inserting the carrier device together with wafer according to FIG. 2 into the container according to FIG. 3, FIG.
  • Fig. 5 shows the step of attaching grippers to the container with support means therein and erecting from the horizontal to the vertical position and
  • Fig. 6 shows the step of stacking the wafer in the carrier device or in the container by pulling the container or discharging water from the container.
  • FIG. 1 once again shows, by way of illustration, how a sawed wafer block 11 consisting of individual wafers 12, with a gap 13 therebetween, which has been produced by sawing, is fastened to a support 15 in a horizontal position. This attachment is advantageous a bond.
  • the gap 13 between the wafers is shown considerably enlarged and in practice is a few 100 .mu.m, whereby it lies approximately in the region of the thickness of a wafer 12.
  • Fig. 2 it is shown how the zerimie wafer block 11 and the individual wafer 12 are inserted into a carrier unit 18 and are held by this. This can already be done if the sawn wafer block 11 still hangs on the carrier 15, but has already been sawn.
  • the carrier 15 is already removed
  • the individual wafer 12 of zerwaren Wafer blocks 1 1 are held by the support rods 21 a to d.
  • support rods 21 a and 21 b are provided on the left and right of the wafers 12 and support rods 21 c and 21 d below. These support rods 21a to d hold or support the wafers 12 by slight lateral pressure.
  • Further holding devices or spacing devices can be provided, for example elongated brushes according to DE 10 2005 028 112 A1.
  • the support means 18 has a front side plate 19a and a rear and lower side plate 19b, respectively. These side plates 19a and b are firmly connected to each other via the support rods 21a to d. They form a kind of partially closed cage for the wafers 12. Another possible embodiment of such a carrier device 18 is apparent from DE 102008053597.4.
  • a container 23 is shown, which is elongated and cuboid.
  • the container has four elongated side walls 24a-d.
  • On the side wall 24b a plurality of holes 28 are shown. These holes 28 are formed as simple holes, but they can also, as has been described, be formed closable. This is easy to realize for the skilled person.
  • the container has a bottom 25 and a substantially open top 26. Both the bottom 25 and the other side walls 24b to d can with similar holes or recesses or the like. be provided. Not shown in Fig. 3 is how the container 23 has holding means with which the carrier means 18 together with wafers 12 can be held therein. However, this is easy to do.
  • FIGS. 4 to 6 The essential steps of the method according to the invention are described in FIGS. 4 to 6.
  • a step according to FIG. 4 the horizontally lying wafer block 11 with the wafers 12 in the carrier device 18 is introduced into the likewise horizontal container 23.
  • the front side plate 19a lie in the middle of the open top 26 or advantageously also be held therein. This can be seen from the left-hand illustration in FIG. 5, which shows how the carrier device 18 together with wafers 12 lies in the container 23.
  • FIG. 5 left illustration, two grippers 30 a and 30 b are brought to the container 23. How exactly the grippers 30 are formed and from which side they engage the container 23 is secondary. There are a variety of different training opportunities. From the horizontal position on the left in Fig. 5, the container 23 is rotated with the support means 18 therein and the wafers 12 in the vertical position shown in FIG. 5. This rotational movement can be performed or performed variously. So it may be a pure rotary motion, a pivoting movement or a combination thereof. An advantageous possibility is a rotation about an axis through the wafer block 1 1 or the carrier device 18, so that on average the rotational movement is as slight as possible and as few forces as possible are exerted on the individual wafers 12.
  • the wafers 12 are immersed in liquid before they are rotated or before they are erected.
  • the entire container 23, including the wafers 12, may be located therein in a water bath or a filled basin and then erected therein. Whether the wafers 12 together with the container 23 are moved into a remote basin or whether such a basin is formed around it, for example, as described in the aforementioned DE 102008053598.2, can be decided on a case-by-case basis.
  • the advantage of erecting the wafers 12 on the support means 18 in a water bath or in a water-filled container 23 is that the forces on the wafers are less. Although the wafers 12 do not fully float due to the silicon material, which of course is heavier than water. Nevertheless, part of their weight is carried by the water, which already significantly reduces the strain.
  • the wafers 12 are released from the carrier device 18, for example by slightly moving the support rods 21a to 21d or at least the two opposing support rods 21a and 21b away from the wafers 12. This can be in the range of a few millimeters. Either all wafers 12 are released at the same time and begin to deposit or stack down.
  • the wafers 12 can be released from the carrier device 18 or the support rods 21 in succession, from top to bottom or advantageously from bottom to top.
  • FIG. 6 shows what is only intended to be an example of how the uppermost wafers 12 are already resting directly on one another.
  • the extraction of the container 23 from the water band 32 can take place so slowly that the water level 33 in the container 23 coincides with that outside the container, that is, the water can drain off sufficiently quickly.
  • the grippers 30a and 30b hold the container 23 only while either the entire water bath 32 is lowered or the water level 33, advantageously by draining the water bath 32.
  • the above-described relative movement between wafers 12 and water is then the the same, but it eliminates the effort and mechanical stress that would otherwise arise from the movement of the container 23.
  • the container 23 can be filled with water. Then both the water requirement is lower and the mechanical structure easier.
  • the water can be let out of the container 23 only through holes 28 as shown in FIG. As explained in detail in the beginning, this can be done either through holes 28 in the side walls 24 or through corresponding holes in the bottom 25. If holes are provided, which can be opened individually or in groups, similar to the withdrawal of the container 23 from the Water bath as shown in FIG. 6, to be determined more precisely, where the water exits laterally from the container 23.
  • the wafer 12 After the complete stacking of the wafer 12, in which the remaining wafer stack is only about half as long as compared to that of FIG. 1, it can be taken out of the container 23 in the carrier device 18, but then advantageously still in vertical position. Finally, it is passed on to a separating device, as described, for example, in DE 10 2007 061 410 A1 is known. The individual wafers are taken away from the wafer stack and further processed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un procédé pour faire pivoter un lingot découpé en tranches individuelles, selon lequel le lingot est maintenu le long d'au moins un côté par un dispositif support et est découpé en tranches individuelles, les différentes tranches étant encore maintenues de ce côté par le dispositif support. L'ensemble constitué par le lingot tranché et le dispositif support est introduit en position horizontale dans un contenant présentant des trous ou des orifices d'écoulement. Une fois le lingot mis en place, le contenant est rempli de liquide et pivoté en position verticale. Les tranches orientées horizontalement sont ensuite détachées du dispositif support et forment automatiquement une sorte d'empilement vertical en se déposant les unes sur les autres. Cet empilement est freiné par le déplacement du liquide se trouvant entre les tranches.
PCT/EP2009/065650 2008-11-24 2009-11-23 Procédé pour faire pivoter un lingot découpé en tranches et dispositif correspondant Ceased WO2010058009A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008060012.1 2008-11-24
DE102008060012A DE102008060012A1 (de) 2008-11-24 2008-11-24 Verfahren zum Drehen eines zersägten Waferblocks und Vorrichtung dafür

Publications (2)

Publication Number Publication Date
WO2010058009A2 true WO2010058009A2 (fr) 2010-05-27
WO2010058009A3 WO2010058009A3 (fr) 2011-04-21

Family

ID=41581455

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/065650 Ceased WO2010058009A2 (fr) 2008-11-24 2009-11-23 Procédé pour faire pivoter un lingot découpé en tranches et dispositif correspondant

Country Status (3)

Country Link
DE (1) DE102008060012A1 (fr)
TW (1) TW201036049A (fr)
WO (1) WO2010058009A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011054510A3 (fr) * 2009-11-04 2011-10-13 Solar Semi Engineering Limited Traitement de galettes

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2538437A1 (fr) * 2011-06-23 2012-12-26 Meyer Burger AG Dispositif de support pour l'agencement de plusieurs tranches
EP2711978A1 (fr) 2012-09-24 2014-03-26 Meyer Burger AG Méthode de fabrication de plaquettes
EP2711979A1 (fr) 2012-09-24 2014-03-26 Meyer Burger AG Système de découpe de tranche
EP2720258A1 (fr) 2012-10-12 2014-04-16 Meyer Burger AG Système de manipulation de tranche
EP2944444A1 (fr) 2014-05-16 2015-11-18 Meyer Burger AG Procédé de traitement de plaque

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2417850A (en) 1942-04-14 1947-03-25 Willis M Winslow Method and means for translating electrical impulses into mechanical force
JP3160483B2 (ja) * 1994-11-11 2001-04-25 株式会社カイジョー 基板自動処理装置
US5950643A (en) * 1995-09-06 1999-09-14 Miyazaki; Takeshiro Wafer processing system
JPH1022244A (ja) * 1996-06-29 1998-01-23 Komatsu Electron Metals Co Ltd 半導体ウェハの洗浄用バスケット
DE19904834A1 (de) * 1999-02-07 2000-08-10 Acr Automation In Cleanroom Vorrichtung zum Ablösen, Vereinzeln und Einlagern von dünnen, bruchempfindlichen scheibenförmigen Substraten
DE102005028112A1 (de) 2005-06-13 2006-12-21 Schmid Technology Systems Gmbh Verfahren zur Positionierung und Lageerhaltung von Substraten, insbesondere von dünnen Siliziumwafern nach dem Drahtsägen zu deren Vereinzelung
DE102006052910B4 (de) * 2006-11-08 2008-12-04 Deutsche Solar Ag Wafer-Herstellungs-Verfahren und -Vorrichtung
DE102007061410A1 (de) 2007-12-11 2009-06-18 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zum Vereinzeln von Wafern von einem Waferstapel
DE102008053596A1 (de) 2008-10-15 2010-04-22 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zur Reinigung eines Waferblocks sowie Trägereinrichtung für einen Waferblock
DE102008053597A1 (de) 2008-10-15 2010-04-22 Gebr. Schmid Gmbh & Co. Reinigungsvorrichtung für einen Waferblock
DE102008053598A1 (de) 2008-10-15 2010-04-22 Gebr. Schmid Gmbh & Co. Verfahren zum Lösen von Wafern von einem Waferträger und Vorrichtung dafür

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011054510A3 (fr) * 2009-11-04 2011-10-13 Solar Semi Engineering Limited Traitement de galettes

Also Published As

Publication number Publication date
DE102008060012A1 (de) 2010-05-27
WO2010058009A3 (fr) 2011-04-21
TW201036049A (en) 2010-10-01

Similar Documents

Publication Publication Date Title
DE19549487C2 (de) Anlage zur chemischen Naßbehandlung
WO2010058009A2 (fr) Procédé pour faire pivoter un lingot découpé en tranches et dispositif correspondant
EP2923397B1 (fr) Dispositif et procédé pour remplir les cellules d'un accumulateur avec du liquide éléctrolytique
DE2030617A1 (de) Scheidevorrichtung
DE1652329A1 (de) Verfahren und Vorrichtung zur Aufbringung einer Fluessigkeit auf einer Oberflaeche
DE2707872A1 (de) Absetztank
WO2010057671A2 (fr) Procédé et dispositif pour manipuler un lingot découpé en tranches
DE1640604A1 (de) Verfahren und Vorrichtung zum UEberziehen unter Vakuum von Materialien in Form von Scheiben,Tafeln od.dgl. durch kathodische Verdampfung der UEberzugssubstanz
DE19644254A1 (de) Vorrichtung zum Behandeln von Substraten
DE102007058260A1 (de) Verfahren und Vorrichtung zur Reinigung eines gesägten Waferblocks
DE102008004548A1 (de) Waferstapelreinigung
DE1542385B2 (de) Verteiler für ein Emulsions-Behandlungsgerät
DE102015013183A1 (de) Vorrichtung und Verfahren zum Behandeln von Werkstücken
DE102014117276A1 (de) Verfahren und Vorrichtung zur unterseitigen Behandlung eines Substrats
EP2321851A2 (fr) Support pour cellules solaires et procédé de fabrication d'un ensemble de cellules solaires
EP1957247A1 (fr) Dispositif et procédé de nettoyage d'un bloc scie de galettes semi-conductrices
EP2611513B1 (fr) Dispositif et procédé de dégazage de fluides
DE102010038298B4 (de) Abscheider, insbesondere Fettabscheider
DE102012110916B4 (de) Verfahren und Vorrichtung zum Transport flacher Substrate
DE102008053596A1 (de) Verfahren und Vorrichtung zur Reinigung eines Waferblocks sowie Trägereinrichtung für einen Waferblock
DE102013221856B3 (de) Verfahren zur Oldtimer-Restaurierung
DE19703646C2 (de) Vorrichtung und Verfahren zum Behandeln von Substraten in einem Fluid-Behälter
EP2405064A1 (fr) Dispositif de retenue pour un agencement de traitement d'eaux usées, unité de construction constituée du dispositif de retenue et de l'agencement de traitement d'eaux usées
DE102013113659B4 (de) Sedimentationsanlage zur Reinigung von Flüssigkeiten und Verfahren zum Betrieb einer solchen Sedimentationsanlage
DE102013107153A1 (de) Reinigungsschacht sowie Verfahren zur dezentralen Regenwasserbehandlung

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09760834

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09760834

Country of ref document: EP

Kind code of ref document: A2