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WO2010052032A8 - Thermal conductivity of thin films - Google Patents

Thermal conductivity of thin films Download PDF

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Publication number
WO2010052032A8
WO2010052032A8 PCT/EP2009/053367 EP2009053367W WO2010052032A8 WO 2010052032 A8 WO2010052032 A8 WO 2010052032A8 EP 2009053367 W EP2009053367 W EP 2009053367W WO 2010052032 A8 WO2010052032 A8 WO 2010052032A8
Authority
WO
WIPO (PCT)
Prior art keywords
thermal conductivity
test structure
thin films
presented
fabrication
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2009/053367
Other languages
French (fr)
Other versions
WO2010052032A1 (en
Inventor
Ziyang Wang
Paolo Fiorini
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Katholieke Universiteit Leuven
Interuniversitair Microelektronica Centrum vzw IMEC
Original Assignee
Katholieke Universiteit Leuven
Interuniversitair Microelektronica Centrum vzw IMEC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Katholieke Universiteit Leuven, Interuniversitair Microelektronica Centrum vzw IMEC filed Critical Katholieke Universiteit Leuven
Publication of WO2010052032A1 publication Critical patent/WO2010052032A1/en
Publication of WO2010052032A8 publication Critical patent/WO2010052032A8/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
    • G01N25/22—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on combustion or catalytic oxidation, e.g. of components of gas mixtures
    • G01N25/28—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on combustion or catalytic oxidation, e.g. of components of gas mixtures the rise in temperature of the gases resulting from combustion being measured directly
    • G01N25/30—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on combustion or catalytic oxidation, e.g. of components of gas mixtures the rise in temperature of the gases resulting from combustion being measured directly using electric temperature-responsive elements
    • G01N25/32—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on combustion or catalytic oxidation, e.g. of components of gas mixtures the rise in temperature of the gases resulting from combustion being measured directly using electric temperature-responsive elements using thermoelectric elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K17/00—Measuring quantity of heat
    • G01K17/06—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device
    • G01K17/08—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature
    • G01K17/20—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature across a radiating surface, combined with ascertainment of the heat transmission coefficient
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

A test structure is presented to measure thermal conductivity of thin film materials based on the Seebeck effect. Furthermore, a method for the fabrication of the test structure and a method for measuring the thermal conductivity with the test structure is presented. The test structure is fabricated by surface micromachining technology having the advantage that it can be easily monolithically integrated together with VLSI circuits and MEMS devices.
PCT/EP2009/053367 2008-11-06 2009-03-23 Thermal conductivity of thin films Ceased WO2010052032A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11210108P 2008-11-06 2008-11-06
US61/112,101 2008-11-06

Publications (2)

Publication Number Publication Date
WO2010052032A1 WO2010052032A1 (en) 2010-05-14
WO2010052032A8 true WO2010052032A8 (en) 2010-07-29

Family

ID=40848200

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/053367 Ceased WO2010052032A1 (en) 2008-11-06 2009-03-23 Thermal conductivity of thin films

Country Status (1)

Country Link
WO (1) WO2010052032A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102564650A (en) * 2011-12-20 2012-07-11 华中科技大学 Micro electro mechanical system (MEMS) sensor for measuring stress of phase-change memory and preparation process for MEMS sensor
CN107153079B (en) * 2017-05-18 2024-03-29 金华职业技术学院 Method for measuring heat conductivity coefficient of film
CN108844990B (en) * 2018-04-10 2020-05-22 西安交通大学 MEMS (micro-electromechanical system) process based film strain thermal conductivity testing device and method
CN113533424B (en) * 2021-07-29 2022-12-09 东南大学 Nondestructive testing method for testing thermophysical properties of multilayer thin film structure
CN116087268A (en) * 2023-01-19 2023-05-09 苏州容启传感器科技有限公司 Test method and test system for thermal conductivity of thermal interface material, electronic equipment

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4410315A1 (en) * 1994-03-25 1995-11-30 Inst Physikalische Hochtech Ev Micro-sensor for measurement of heat conductivity of thin films
CN1206528C (en) * 2003-05-01 2005-06-15 东南大学 Device for measuring thermal conductivity of conductor thin film
DE102004022206B4 (en) * 2004-05-04 2006-05-11 Bundesrepublik Deutschland, vertr. d. d. Bundesministerium für Wirtschaft und Arbeit, dieses vertr. d. d. Präsidenten der Physikalisch-Technischen Bundesanstalt Sensor for measuring thermal conductivity comprises a strip composed of two parallel sections, and two outer heating strips
JP2007024603A (en) * 2005-07-13 2007-02-01 Toyota Motor Corp Method for measuring thin film samples

Also Published As

Publication number Publication date
WO2010052032A1 (en) 2010-05-14

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