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WO2010051249A1 - Antenne miniature à couches multiples pour dispositifs médicaux implantables et procédé de fabrication de celle-ci - Google Patents

Antenne miniature à couches multiples pour dispositifs médicaux implantables et procédé de fabrication de celle-ci Download PDF

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Publication number
WO2010051249A1
WO2010051249A1 PCT/US2009/062045 US2009062045W WO2010051249A1 WO 2010051249 A1 WO2010051249 A1 WO 2010051249A1 US 2009062045 W US2009062045 W US 2009062045W WO 2010051249 A1 WO2010051249 A1 WO 2010051249A1
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WIPO (PCT)
Prior art keywords
antenna
dielectric layers
dielectric
layer
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2009/062045
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English (en)
Inventor
Duane N. Mateychuk
Joyce K. Yamamoto
Gerard J. Hill
Charles S. Farlow
Robert S. Wentink
Michael W. Barrow
Charles R. Gordon
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Medtronic Inc
Original Assignee
Medtronic Inc
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Publication of WO2010051249A1 publication Critical patent/WO2010051249A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/37211—Means for communicating with stimulators
    • A61N1/37217—Means for communicating with stimulators characterised by the communication link, e.g. acoustic or tactile
    • A61N1/37223—Circuits for electromagnetic coupling
    • A61N1/37229—Shape or location of the implanted or external antenna
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/375—Constructional arrangements, e.g. casings
    • A61N1/3752—Details of casing-lead connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/24—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the orientation by switching energy from one active radiating element to another, e.g. for beam switching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Definitions

  • the present invention relates generally to implantable medical devices (IMDs) and, more particularly, the present invention relates to telemetry antennas suitable for deployment in IMDs.
  • IMDs implantable medical devices
  • cardiac pacemakers cardioverter/defibrillators, cardiomyostimulators, cardiac event monitors, various physiological stimulators including nerve, muscle, and deep brain stimulators, various types of physiological monitors and sensors, and drug delivery systems, just to name a few.
  • IMDs typically include functional components contained within a hermetically sealed enclosure or housing, which is sometimes referred to as a "can.”
  • a connector header or connector block is attached to the housing, and the connector block facilitates interconnection with one or more elongated electrical medical leads.
  • the header block is typically molded from a relatively hard, dielectric, non-conductive polymer.
  • the header block includes a mounting surface that conforms to, and is mechanically affixed against, a mating sidewall surface of the housing.
  • the communication link between the IMD and the EMD is realized by encoded radio frequency ("RF") transmissions between an IMD telemetry antenna and transceiver and an EMD telemetry antenna and transceiver.
  • RF radio frequency
  • the IMD antenna is disposed within the hermetically sealed housing.
  • the typically conductive housing can limit the radiation efficiency of the IMD RF telemetry antenna, thereby traditionally limiting the data transfer distance between the programmer head and the IMD RF telemetry antenna to a few inches.
  • This type of system may be referred to as a "near field" telemetry system.
  • an antenna structure for an implantable medical device includes at least one antenna conductor formed on a dielectric layer and a plurality of discrete dielectric layers positioned above the antenna conductor serving as superstrates and below the antenna conductor serving as substrates.
  • the superstrate dielectric layers include respective dielectric constants that gradually change in value with each superstrate layer moving away from the antenna conductor to values more closely matching the environment (e.g., body tissue) surrounding the antenna structure, such that the superstrate dielectric layers provide a matching gradient between the antenna conductor and the surrounding environment to mitigate energy reflection effects at the transition from the antenna structure to the surrounding environment.
  • the antenna structure includes a biocompatible layer positioned as the outermost layer serving as an interface between the antenna structure and the surrounding environment, where the biocompatible layer may comprise one of the superstrate dielectric layers or another biocompatible layer positioned over the superstrate dielectric layers.
  • the antenna structure includes a shielding layer formed from a metalized material positioned under the antenna conductor that provides electromagnetic shielding for device circuitry inside of a hermetically sealed housing to which the antenna structure is attached.
  • the shielding layer may be positioned under the substrate dielectric layers as the innermost layer of the antenna structure.
  • the substrate dielectric layers may include respective dielectric constants that gradually change in value with each substrate layer moving away from the antenna conductor to values more closely matching the hermetically sealed housing to the antenna structure is attached.
  • At least one of the substrate dielectric layers or another substrate layer may comprise an electromagnetic bandgap positioned between the antenna conductor and the shielding layer (i.e., ground plane) to prevent or minimize a reduction in antenna radiation efficiency from occurring as a result of effects from the ground plane shielding layer.
  • the shielding layer i.e., ground plane
  • the antenna structure may be formed as a monolithic structure derived from the plurality of discrete dielectric layers (superstrates and substrates) having an antenna conductor embedded within multiple layers of the plurality of dielectric layers.
  • the dielectric constants of the plurality of dielectric layers can be selected or controlled to provide desired gradient matching and the dimensions of the overall antenna structure can be minimized to provide a miniature antenna structure.
  • a plurality of different antenna conductor segments having different antenna characteristics may be embedded within the antenna structure, such that different antenna conductor segments or combinations of antenna conductor segments can be selected and/or switched for use in order to provide a tunable antenna to suit the needs of the particular IMD and/or the particular implant location.
  • a plurality of different antenna conductors may be formed on the same dielectric layer.
  • the antenna structure may include a plurality of discrete dielectric layers with at least one antenna conductor respectively positioned on each discrete dielectric layers with an outermost biocompatible layer and an innermost shielding (or grounding) layer, such that the effective dielectric between the antenna conductor and both the surrounding environment and the shielding/grounding plane can be switched to suit the needs of the particular IMD and/or the particular implant location.
  • At least one of the plurality of dielectric layers used to form the antenna structure may include metamaterials to produce an effective permittivity and/or permeability having a negative value.
  • the metamaterials may be epsilon-negative (ENG), mu- negative (MNG) or double negative (DNG).
  • An antenna structure including at least one dielectric layer including metamaterials can be used to create effective permittivities and/or permeabilities that result in a desired impedance match condition for the metamaterial antenna structure having improved radiation efficiencies compared to similar antenna structures including natural double-positive (DPS) dielectric materials.
  • DPS natural double-positive
  • the dielectric layers comprise at least one of a low temperature co-fire ceramic (LTCC) material and/or a high temperature co-fire ceramic (HTCC) material, where the ceramic dielectric layers, the antenna conductor(s), the biocompatible outermost layer, and the innermost shielding layer can be co-fired together to form a monolithic antenna structure.
  • LTCC low temperature co-fire ceramic
  • HTCC high temperature co-fire ceramic
  • FIG. 1 illustrates an implantable medical device implanted in a human body in accordance with one or more embodiments of the present disclosure.
  • FIG. 2 is a schematic block diagram illustration of exemplary implantable medical device in accordance with one or more embodiments of the present disclosure.
  • FIG. 3 is a perspective, exploded view of an antenna structure for an implantable medical device formed in accordance with one or more embodiments of the present disclosure.
  • FIG. 4 is a cross-sectional side view of an antenna structure for an implantable medical device formed in accordance with one or more embodiments of the present disclosure.
  • FIG. 5 is a cross-sectional side view of a co-fired monolithic antenna structure for an implantable medical device formed in accordance with one or more embodiments of the present disclosure.
  • FIG. 6 is a schematic block diagram illustration of an antenna structure connected to implantable medical device in accordance with one or more embodiments of the present disclosure.
  • FIG. 7 is a perspective, exploded view of an antenna structure for an implantable medical device formed in accordance with one or more embodiments of the present disclosure.
  • FIG. 8 is a partial top view of a layer of an antenna structure for an implantable medical device formed in accordance with one or more embodiments of the present disclosure.
  • FIGS. 9A-9F are schematic illustrations of different antenna conductor configurations in accordance with one or more embodiments of the present disclosure.
  • FIG. 10 is an enlarged, partial cutaway, perspective view of an anodized antenna conductor in accordance with one or more embodiments of the present disclosure.
  • FIG. 11 is an exploded perspective view of an anodized antenna conductor having a superstrate radome in accordance with one or more embodiments of the present disclosure.
  • FIG. 12 is a cross-sectional side view of an antenna structure for an implantable medical device formed in accordance with one or more embodiments of the present disclosure.
  • connection means that one component/feature is directly or indirectly connected to another component/feature, and not necessarily mechanically.
  • coupled means that one component/feature is directly or indirectly coupled to another component/feature, and not necessarily mechanically.
  • an IMD having a monolithic antenna structure derived from a plurality of discrete dielectric layers is provided.
  • conventional techniques and aspects related to RF antenna design, IMD telemetry, RF data transmission, signaling, IMD operation, connectors for IMD leads, and other functional aspects of the systems (and the individual operating components of the systems) may not be described in detail herein.
  • the connecting lines shown in the various figures contained herein are intended to represent example functional relationships and/or physical couplings between the various elements. It should be noted that many alternative or additional functional relationships or physical connections may be present in a practical embodiment.
  • An IMD antenna generally has two functions: to convert the electromagnetic power of a downlink telemetry transmission of an EMD telemetry antenna propagated through the atmosphere (and then through body tissues) into a signal (e.g., a UHF signal or the like) that can be processed by the IMD transceiver into commands and data that are intelligible to the IMD electronic operating system; and to convert the uplink telemetry signals (e.g., a UHF signal or the like) of the IMD transceiver electronics into electromagnetic power propagated through the body tissue and the atmosphere so that the EMD telemetry antenna or antennas can receive the signals.
  • a signal e.g., a UHF signal or the like
  • FIG. 1 is a perspective view of an IMD 10 implanted within a human body 12 in which one or more embodiments of the invention may be implemented.
  • IMD 10 comprises a hermetically sealed housing 14 (or “can") and connector header or block module 16 for coupling
  • IMD 10 to electrical leads and other physiological sensors arranged within body 12, such as pacing and sensing leads 18 connected to portions of a heart 20 for delivery of pacing pulses to a patient's heart 20 and sensing of heart 20 conditions in a manner well known in the art.
  • leads may enter at an end of header block 16 and be physically and electrically connected to conductive receptacles, terminals, or other conductive features located within header block 16.
  • IMD 10 may be adapted to be implanted subcutaneously in the body of a patient such that it becomes encased within body tissue and fluids, which may include epidermal layers, subcutaneous fat layers, and/or muscle layers. While IMD 10 is depicted in FIG. 1 in an ICD configuration, it is understood that this is for purposes of illustration only and IMD 10 may comprise any type of medical device requiring a telemetry antenna.
  • hermetically sealed housing 14 is generally circular, elliptical, prismatic, or rectilinear, with substantially planar major sides joined by perimeter sidewalls.
  • Housing 14 is typically formed from pieces of a thin- walled biocompatible metal such as titanium. Two half sections of housing 14 may be laser seam welded together using conventional techniques to form a seam extending around the perimeter sidewalls.
  • Housing 14 and header block 16 are often manufactured as two separate assemblies that are subsequently physically and electrically coupled together.
  • Housing 14 may contain a number of functional elements, components, and features, including (without limitation): a battery; a high voltage capacitor; integrated circuit (“IC") devices; a processor; memory elements; a therapy module or circuitry; an RF module or circuitry; and an antenna matching circuit.
  • IC integrated circuit
  • housing 14 and header block 16 may be suitably configured with IC connector pads, terminals, feedthrough elements, and other features for establishing electrical connections between the internal therapy module and the therapy lead connectors within header block 16 and for establishing connections between the internal RF module and a portion of a telemetry antenna located within header block 16.
  • IC connector pads, terminals, feedthrough elements, and other features for establishing electrical connections between the internal therapy module and the therapy lead connectors within header block 16 and for establishing connections between the internal RF module and a portion of a telemetry antenna located within header block 16.
  • Structures and techniques for establishing such electrical (and physical) feedthrough connections are known to those skilled in the art and, therefore, will not be described in detail herein.
  • Header block 16 is preferably formed from a suitable dielectric material, such as a biocompatible synthetic polymer.
  • the dielectric material of header block 16 may be selected to enable the passage of RF energy that is either radiated or received by a telemetry antenna (not shown in FIG. 1) encapsulated within header block 16.
  • the specific material for header block 16 may be chosen in response to the intended application of IMD 10, the electrical characteristics of the environment surrounding the implant location, the desired operating frequency range, the desired RF antenna range, and other practical considerations.
  • FIG. 2 is a simplified schematic representation of an IMD 10 and several functional elements associated therewith.
  • IMD 10 generally includes hermetically sealed housing 14 and header block 16 coupled to housing 14, a therapy module 22 contained within housing 14, and an RF module 24 contained within housing 14.
  • IMD 10 will also include a number of conventional components and features necessary to support the functionality of IMD 10 as known in the art. Such conventional elements will not be described herein.
  • Therapy module 22 may include any number of components, including, without limitation: electrical devices, ICs, microprocessors, controllers, memories, power supplies, and the like. Briefly, therapy module 22 is configured to provide the desired functionality associated with the IMD 10, e.g., defibrillation pulses, pacing stimulation, patient monitoring, or the like. In this regard, therapy module 22 may be coupled to one or more sensing or therapy leads 18. In practice, the connection ends of therapy leads 18 are inserted into header block 16, where they establish electrical contact with conductive elements coupled to therapy module 22. Therapy leads 18 may be inserted into suitably configured lead bores formed within header block 16. In the example embodiment, IMD 10 includes a feedthrough element 26 that bridges the transition between housing 14 and header block 16. Therapy leads 18 extend from header block 16 for routing and placement within the patient.
  • RF module 24 may include any number of components, including, without limitation: electrical devices, ICs, amplifiers, signal generators, a receiver and a transmitter (or a transceiver), modulators, microprocessors, controllers, memories, power supplies, and the like.
  • RF module 24 may further include a matching circuit or a matching circuit may be positioned between RF module 24 and antenna 28.
  • Matching circuit may include any number of components, including, without limitation: electrical components such as capacitors, resistors, or inductors; filters; baluns; tuning elements; varactors; limiter diodes; or the like, that are all suitably configured to provide impedance matching between antenna 28 and RF module 24, thus improving the efficiency of antenna 28.
  • RF module 24 supports RF telemetry communication for IMD 10, including, without limitation: generating RF transmit energy; providing RF transmit signals to antenna 28; processing RF telemetry signals received by antenna 28, and the like.
  • RF module 24 may be designed to leverage the conductive material used for housing 14 as an RF ground plane (for some applications), and RF module 24 may be designed in accordance with the intended application of IMD 10, the electrical characteristics of the environment surrounding the implant location, the desired operating frequency range, the desired RF antenna range, and other practical considerations.
  • Antenna 28 is coupled to RF module 24 to facilitate RF telemetry between IMD 10 and an EMD (not shown).
  • antenna 28 is suitably configured for RF operation (e.g., UHF or VHF operation, 401 to 406 MHz for the MICS/MEDS bands, 900 MHz / 2.4 GHz and other
  • antenna 28 is located within header block 16 and outside of housing 14.
  • the volume associated with the antenna 28 and the volume within the header block 16 required for the implementation of distance telemetry in implanted therapy and diagnostic devices can be a significant contributor to the size of the IMD 10.
  • Antenna 28 may have characteristics resembling a monopole antenna, characteristics resembling a dipole antenna, characteristics resembling a coplanar waveguide antenna, characteristics resembling a stripline antenna, characteristics resembling a microstrip antenna, and/or characteristics resembling a transmission line antenna.
  • Antenna 28 may also have any number of radiating elements, which may be driven by any number of distinct RF signal sources.
  • antenna 28 may have a plurality of radiating elements configured to provide spatial, pattern, or polarization diversity
  • antenna 28 is coupled to RF module 24 via an RF feedthrough in feedthrough 26, which bridges housing 14 and header block 16.
  • Antenna 28 may include a connection end that is coupled to RF feedthrough in feedthrough 26 via a conductive terminal or feature located within header block 16.
  • a practical feedthrough 26 includes a ferrule supporting a non-conductive glass or ceramic insulator. The insulator supports and electrically isolates a feedthrough pin from the ferrule. During assembly of housing 14, the ferrule is welded to a suitably sized hole or opening formed in housing 14. RF module 24 is then electrically connected to the inner end of the feedthrough pin.
  • connection to the inner end of the feedthrough pin can be made by welding the inner end to a substrate pad, or by clipping the inner end to a cable or flex wire connector that extends to a substrate pad or connector.
  • the outer end of the feedthrough pin serves as a connection point for antenna 28, or as a connection point for an internal connection socket, terminal, or feature that receives the connection end of antenna
  • the feedthrough 26 for antenna 28 may be located on any desired portion of housing 14 suitable for a particular design.
  • Antenna structure 100 includes at least one antenna conductor 106 formed on a dielectric layer 104.
  • a plurality of discrete dielectric layers 108 are positioned above the antenna conductor 106 serving as superstrates, and a plurality of discrete dielectric layers 112 are positioned below the antenna conductor 106 serving as substrates.
  • the antenna structure 100 includes a biocompatible layer 110 positioned as the outermost layer over the superstrate dielectric layers 108 serving as an interface between the antenna structure 100 and the surrounding environment.
  • the biocompatible layer 110 may comprise the outermost of the superstrate dielectric layers 108.
  • Different types of biocompatible materials can be selected based on the intended use of antenna structure 100 and IMD 10 and the intended surrounding environment.
  • outermost layer 110 may comprise inorganic materials, such as Alumina (AI2O3), zirconium oxide (ZrO 2 ), mixtures thereof, or bone-like systems [hydroxyapatite - Ca 5 (POH)(PO 4 ) S ], organic materials, such as silicone and its derivatives, and other traditionally implantable biocompatible materials.
  • inorganic materials such as Alumina (AI2O3), zirconium oxide (ZrO 2 ), mixtures thereof, or bone-like systems [hydroxyapatite - Ca 5 (POH)(PO 4 ) S ]
  • organic materials such as silicone and its derivatives, and other traditionally implantable biocompatible materials.
  • antenna structure 100 may include an shielding layer 114 positioned in a layer under the antenna conductor 106 formed from a metalized material that provides electromagnetic shielding of device circuitry inside of the hermetically sealed housing 14 to which the antenna structure 100 is attached through a feedthrough via 116.
  • the shielding layer 114 is positioned as the innermost layer of the antenna structure 100, while it is understood that shielding layer 114 can also be positioned within another intermediate substrate layer 112 positioned under the antenna conductor 106.
  • At least one of the substrate dielectric layers 112 or an electromagnetic bandgap layer 115 positioned under antenna conductor 106 may be selected from a material so as to function as an electromagnetic bandgap between antenna conductor 106 and shielding layer 114 (i.e., ground plane), as illustrated in FIG. 3 and further in the cross- sectional side view of antenna structure 100 in FIG. 4.
  • shielding layer 114 i.e., ground plane
  • the field radiated by the antenna element and the field reflected by the ground plane are 180° out of phase due to the reflection coefficient presented by the ground plane short circuit.
  • An electromagnetic bandgap layer 115 prevents this reduction in antenna radiation efficiency by introducing a ground perturbation known as an electromagnetic bandgap, or high impedance surface, between antenna conductor 106 and ground plane shielding layer 114.
  • the electromagnetic bandgap layer 115 prevents or minimizes a reduction in antenna radiation efficiency from occurring as a result of the close proximity of the antenna conductor 106 to the ground plane 114.
  • the electromagnetic bandgap layer 115 at resonance appears as an open circuit with a reflection coefficient in phase with the incident field.
  • the electromagnetic bandgap layer 115 will cause the field radiated from antenna conductor 106 and the field radiated by its ground plane image to be co-directed thus maintaining the same orientation and not canceling each other out.
  • the electromagnetic bandgap layer 115 further provides a high electromagnetic surface impedance that allows the antenna conductor 106 to lie directly adjacent to the ground plane 114 without being shorted out. This allows compact antenna designs where radiating elements are confined to limited spaces Thus, the electromagnetic bandgap layer 115 assists in miniaturization of the device by allowing the distance between antenna conductor 106 and ground plane shielding layer 114 to be reduced to a small distance.
  • electromagnetic bandgap layer 115 may be vacuum deposited on the surface of one of the layers of the device 100 or adhered via epoxy after ceramic densification in order to minimize material alterations induced by thermal excursion of the firing process.
  • the electromagnetic bandgap layer 115 may comprise a high impedance ground plane (e.g., artificial perfect magnetic conductor or PMC) that has the property of isolating the radiating elements from nearby electromagnetic surroundings.
  • the high impendence surface of the electromagnetic bandgap layer 115 further provides the benefit of directing radiated energy away from ground plane shielding layer 114 and improves the antenna radiated front-to-back ratio resulting in improved antenna efficiency.
  • the electromagnetic bandgap layer 115 is made of a periodic structure, such as a plurality of discrete metal areas or a plurality of periodic lattice cells that are connected electrically to neighboring lattice cells, where such an interconnected bandgap structure topology conducts DC currents but not AC currents within a forbidden band.
  • the physical geometry the electromagnetic bandgap layer 115 may comprise a metal sheet, textured with a 2D lattice of resonant elements which act as a 2D filter to prevent the propagation of electric currents, such as described in the paper, "A High Impedance Ground Plane Applied to a Cellphone Handset Geometry,” by Sievenpiper et al., IEEE MTT Vol.49 No.7
  • the electromagnetic bandgap layer 115 may comprise a reactive impedance substrate.
  • PMC surfaces are usually constructed from resonant structures operating at resonance.
  • the electromagnetic bandgap layer 115 can be engineered to exhibit normalized substrate impedance (image impedance) that could compensate for the stored energy in the source itself (antenna conductor 106). If the antenna conductor 106 shows a capacitive load and its image can store magnetic energy, a resonance can be achieved at a frequency much lower than the resonant frequency of the antenna conductor 106 in free space.
  • At least one of the plurality of dielectric layers 104, 108, or 112 may be formed to include metamaterials to produce an effective permittivity and/or permeability having a negative value for the particular dielectric layers 104, 108, or 112 including the metamaterials.
  • Metamaterials are artificial materials that exhibit electromagnetic properties that are not generally found in nature. For example, naturally occurring dielectric materials found in substrates are referred to as double-positive (DPS) as both epsilon ( ⁇ ) and mu ( ⁇ ) are positive.
  • DPS double-positive
  • metamaterials may be epsilon-negative (ENG), mu- negative (MNG) or double negative (DNG) in which both epsilon and mu are negative.
  • An antenna structure 100 including at least one dielectric layer 104, 108, or 112 including metamaterials can be used to create effective permittivities and/or permeabilities for antenna structure 100 that result in a desired impedance match condition for the antenna structure 100.
  • electrically small antennas i.e., those that are much shorter than a wavelength
  • an optimized metamaterial antenna structure 100 can demonstrate radiation efficiency improvements in excess of 35 dB when compared to the same antenna structure with natural DPS dielectric materials.
  • metamaterial period cells include, 1-D Split-Ring Structure, Symmetrical-Ring Structure, Omega Structure, Unit S Cell Structure, as described in the paper, "A Study Using Metamaterials As Antenna Substrate To Enhance Gain,” by Grzegorczyk et al.,
  • the edges 118 of the various layers of the antenna structure 100 i.e., dielectric layers 104, 108 and 112, outermost biocompatible layer
  • brazing 110 electromagnetic bandgap layer 115, and shielding layer 114 may be brazed or otherwise sealed to hermetically seal the edges 118 of antenna structure 100 to a ferrule or body that would enable integration of antenna structure 100 to the housing 14.
  • brazing involves melting and flowing a brazing material (e.g., a metal such as gold) around the portions of the desired surfaces to be brazed (e.g., the edges 118 of the layers of antenna structure 100 and housing 14).
  • a brazing material e.g., a metal such as gold
  • superstrate dielectric layers 108 can be selected to possess respective dielectric constants that gradually change in value with each superstrate layer
  • superstrate dielectric layers 108 provide a matching gradient between antenna conductor 106 and the surrounding environment to mitigate energy reflection effects at the transition from the antenna structure 100 to the surrounding environment.
  • the change in dielectric constants in the various superstrate layers 108 can be achieved by incorporating materials that are cof ⁇ reable, compatible and possess dielectric constants that differ from the other of the superstrate layers 108.
  • various biocompatible layers formed for the superstrate dielectric layers 108 may comprise polymers that are loaded with high dielectric constant powders so as to produce an antenna structure 100 that contains a graded dielectric constant extending from one portion of the antenna structure 100 to another portion.
  • powders with different dielectric constants can be loaded on the different polymer layers, different concentrations of powder loading can be performed on the different polymer layers, or the dielectric constant of each polymer layer can otherwise have its powder loading adjusted to produce a structure having a graded dielectric constant between various superstrate dielectric layers 108.
  • High dielectric loading may also modify the radio pattern of the antenna conductor 106 to reduce the power directly dissipated into the human body surrounding IMD 10.
  • the substrate dielectric layers 112 under antenna conductor 106 may comprise materials with higher dielectric values than dielectric layer 104 on which antenna conductor 106 is formed, such that the higher dielectric values associated with substrate dielectric layers 112 allow the distance between antenna conductor 106 and ground plane shielding layer 114 to be minimized, thereby allowing a reduction in size of antenna structure 100 to be achieved.
  • the high dielectric constant K of each layer may be achieved by incorporating cofireable materials having high dielectric constants K (e.g., capacitive materials).
  • a ceramic loaded printed wiring board PWB is another embodiment to the LTCC based structure.
  • LTCC materials offer the ability to embed passive components to spatially and functionally tailor the dielectric constant or capacitance to optimize packaging efficiency and/or performance.
  • substrate dielectric layers 112 and electromagnetic bandgap layer 115 may be separated and isolated from potential contact with body environment surrounding IMD 10 by the biocompatible materials used to form outermost biocompatible layer 110 or other superstrate dielectric layers 108. The isolation of substrate layers 112 and electromagnetic bandgap layer
  • dielectric oxide e.g., barium titanium oxide (BaTiO 3 )
  • dielectric constants k in the hundreds to thousands are possible.
  • the various layers used to form antenna structure 100 may be formed using any material layer deposition technique known in the art, including but not limited to depositing, spraying, screening, dipping, plating, etc.
  • MBE molecular beam epitaxy
  • ALD atomic layer deposition
  • vacuum deposited processes may be used to deposit the various layers building them on top of one another, such that ALD allows thin high dielectric materials to be used in forming substrate dielectric layers 112 and thin lower dielectric materials to be used in forming superstrate dielectric layers 108, thereby achieving size reduction and miniaturization of overall antenna structure 100 while still improving performing of antenna structure 100.
  • the metal layers can be stacked to form a stacked plate capacitor structure to increase the dielectric constant of the area surrounding the antenna conductor 106.
  • the various layers of antenna structure 100 and formed or otherwise deposited with respect to one another may be co-fired to a monolithic structure derived from the various layers, as illustrated in
  • FIG. 5 having antenna conductor 106 embedded within the resulting monolithic structure 102.
  • Feedthrough via 116 extends through monolithic structure 102 and may be used to connect antenna conductor 106 to housing 14, such as through a feedthrough.
  • the dielectric constants of the plurality of dielectric layers 104, 108 and 112 can be selected or controlled to provide desired gradient matching and the dimensions of the overall antenna structure can be minimized to provide a miniature antenna structure.
  • the plurality of dielectric layers 104, 108 and 112 can be selected such that they each possess gradually changing dielectric constants in the direction of arrows 120, such that the gradual changes can occur in either direction.
  • At least one interlayer metal material having a high dielectric constant may be positioned at one or more locations between layers of high temperature co-fired ceramic (HTCC) material when forming the dielectric layers 104, 108 or 112 in order to increase the effective dielectric constant of such layers without requiring changes to the materials in forming such layers.
  • the metal interlayers can be patterned to provide the high dielectric values only where desired or needed, which can be useful in reducing cofire issues when the materials are cofired together.
  • the metal interlayers can be deposited through the use of vacuum deposition, ALD, screen printed thick film processes or other deposition techniques.
  • the edges 118 or side surfaces of the various layers of the antenna structure 100 may be brazed or otherwise sealed to hermetically seal the edges 118 of antenna structure 100.
  • the brazed side edges 118 along with the outermost biocompatible layer 110 of antenna structure 100 provide a hermetic seal for antenna structure 100 so that it can be connected directly to housing 14 without requiring a header to enclose and seal the antenna conductor 106, as typically required with conventional far field telemetry antennas for IMDs. As illustrated in FIG.
  • antenna structure 100 may be coupled to housing 14 using brazing, glassing, diffusion bonding or other suitable bonding techniques that will provide a hermetic seal, as known to those skilled in the art.
  • the antenna structure 100 thus reduces the overall volume and physical dimension required for antenna conductor 106 for adequate radiation.
  • a header block 16 having reduced dimensions may still be utilized for connecting external leads to therapy module 16.
  • portions of the antenna structure 100 may be hermetically sealed to the housing 14 prior to overall formation of the co-fired monolithic structure 102, such that various layers used to form the co-fired monolithic structure 102 could be formed on one another after certain portions of the antenna structure 100 have been hermetically sealed to the housing 14.
  • antenna conductor 106 is formed from a biocompatible conductive material, such as but not limited to at least one of the following materials: Platinum, Iridium, Platinum-Iridium alloys, Alumina, Silver, Gold, Palladium, Silver-Palladium or mixtures thereof, or Niobium, Molybdenum and/or Moly-manganese or other suitable materials.
  • dielectric layers 104, 108 and 112 may be comprise at least one of a ceramic material, a semiconductor material, and/or a thin film dielectric material.
  • the dielectric layers 104 include at least one ceramic material
  • the dielectric layers 104, 108 and 112 may include at least one of a low temperature co-fired ceramic (LTCC) material or a high temperature co-fired ceramic (HTCC) material or a PWB material that enable the incorporation of materials having desired dielectric constant values.
  • LTCC low temperature co-fired ceramic
  • HTCC high temperature co-fired ceramic
  • PWB PWB material that enable the incorporation of materials having desired dielectric constant values.
  • LTCC material has a melting point between about 850 C° and 1150 C°
  • a HTCC material has a melting point between about 1100 C° and 1700 C°.
  • the ceramic dielectric layers 104, 108 and 112, antenna conductor 106, electromagnetic bandgap layer 115, outermost biocompatible layer 110 and innermost shielding layer 114 and via 116 are sintered or co-fired together to form a monolithic antenna structure 102 including an embedded antenna conductor 106, as illustrated in FIG. 5.
  • Methods for co-firing layers of ceramic materials together to form monolithic structures for use in IMDs are described, for example, in U.S. Patent No. 6,414,835 and U.S. Patent No. 7,164,572, the contents of both of which are hereby incorporated by reference in their entireties.
  • the use of a co-firing technique to form a monolithic antenna structure 102 including an embedded antenna 106 allows for the manufacture of low-cost, miniaturized, hermetically sealed antenna structures 100 suitable for implantation within tissue and/or in direct or indirect contact with diverse body fluids.
  • the monolithic antenna structure 102 can be hermetically connected directly to a portion of housing 14 of an IMD 10 or alternatively sealed within a header block 16.
  • the plurality of different individual discrete layers or sheets of materials (or segments of tape) that comprise the various ceramic dielectric layers 104, 108 and 112, antenna conductor 106, electromagnetic bandgap layer 115, outermost biocompatible layer 110 and innermost shielding layer 114 may be printed with a metalized paste and other circuit patterns, stacked on each other, laminated together and subjected to a predetermined temperature and pressure regimen, and then fired at an elevated temperature(s) during which the majority of binder material(s) (present in the ceramic) and solvent(s) (present in the metalized paste) vaporizes and/or is incinerated while the remaining material fuses or sinters.
  • the number of dielectric layers 104, 108 and 112 may be variably selected based on the desired antenna characteristics.
  • the materials suitable for use as cofireable conductors for forming the antenna conductor 106 are the biocompatible metal materials described herein or other materials suitable for the metalized paste.
  • the stacked laminates are then co-fired together at temperatures between about 850 C° and 1150 C° for LTCC materials and between about 1100 C° and 1700 C° for HTCC materials.
  • the dielectric layers 104, 108 and 112 include a plurality of planar ceramic layers. Each ceramic layer may be shaped in a green state to have a desired layer thickness.
  • planar ceramic layers starts with a ceramic slurry formed by mixing a ceramic particulate, a thermoplastic polymer and solvents. This slurry is spread into ceramic sheets of predetermined thickness, from which the solvents are volitized, leaving self-supporting flexible green sheets. Holes in certain dielectric layers 104 and 112 that will be filled with conductive material to form via 116 are made, using any conventional technique, such as drilling, punching, laser cutting, etc., through the green sheets from which the ceramic layers 104 and 112 are formed.
  • the materials suitable for use as cof ⁇ reable ceramics include alumina (Al 2 O 3 ), aluminum nitride, beryllium oxide, Silica (SiO 2 ), Zirconia (ZrO 2 ), glass-ceramic materials, glass suspended in an organic (polymer) binder, or mixtures thereof.
  • Antenna structure 200 may include a plurality of discrete dielectric layers 204a-204g with at least one antenna conductor 206 respectively positioned on each discrete dielectric layer 204.
  • An outermost biocompatible layer 110 and an innermost ground shielding layer 114 are respectively arranged as the upper and lower surfaces of antenna structure 200.
  • Each of the antenna conductors 206a-206g may possess the same antenna configuration or different antenna configurations from the other antenna conductors 206a-206g arranged on different dielectric layers 204a-204g. Further, each of the dielectric layers 204a-204g may have the same or different dielectric values from the other dielectric layers 204a-204g. At least one switch is provided in order to allow different respective antenna conductors 206a-206g to be selectively switched in or out based the desired operating characteristics for antenna structure 100.
  • antenna structure 100 can adapt to provide a specific desired radiation polarization, such that antenna structure 200 can be controlled to provide x-polarized, y-polarized and/or even circular polarizations with the simple toggling of switches to reconfigure antenna structure 200 to provide the desired performance.
  • antenna conductors 206a-206g may be selectively switched in or out to provide a specific desired radiation pattern.
  • the structure can be adapted to provide directivity so as to optimize the reception of a signal from a specific EMD or, alternatively, to optimize the transmission of a signal to a specific EMD.
  • MEMS switches may be utilized and located on respective layers of antenna structure 200 in order to maintain the miniaturization of antenna structure 100.
  • Antenna structure 200 is thus able to change frequencies by selectively switching the particular antenna conductors 206a-206g to utilize in order to increase or decrease the resultant antenna length.
  • multiple ones of antenna conductors 206a-206g may be switched to be connected and used together (e.g., through vias interconnecting antenna conductors 206a-206g).
  • the effective dielectric between the selected antenna conductor 206a-206g and both the surrounding environment and the ground shielding layer 114 can be switched to suit the needs of the particular IMD 10 and/or the particular implant location. Referring now to FIG.
  • a plurality of different antenna conductors 306a-306c may be formed on the same dielectric layer 304, as illustrated by the partial schematic illustrate of a single dielectric layer 304 of antenna 100.
  • Certain features and aspects of dielectric layer 304 and antenna conductors 306a-306c are similar to those described above in connection with dielectric layer 104 and antenna conductor 106, and shared features and aspects will not be redundantly described in the context of dielectric layer 304 and antenna conductors 306a-306c.
  • a switch 302 may interconnect antenna conductors 306a-306c to via 116, such that particular antenna conductors 306a-306c may be selectively switched to be used to reconfigure antenna structure 200 to provide the desired performance (e.g., desired antenna length, desired radiation polarization, desired radiation pattern, to account for particular IMD 10, particular implant location, and/or particular EMD location, etc.).
  • Each of the antenna conductors 306a-306c may possess the same or different antenna configurations as the other antenna conductors 306a-306c.
  • multiple antenna conductors 306a-306c on the same dielectric layer 304 may be connected and used together.
  • a plurality of different antenna conductors 306a-306c may be formed on a plurality of different dielectric layers, such as illustrated in FIG. 7, where specific dielectric layers may be selected and specific antenna conductors 306a-306c on a selected dielectric layer may be selected based on the desired antenna characteristics.
  • FIGS. 9A-9F multiple different possible types of antenna arrangements for any of the antenna conductors 106, 206a-206g, 306a-306c are illustrated in accordance with one or more embodiments.
  • a multi-layer ceramic antenna structure 100 comprised of co-fired materials provide for reduced antenna volume, increased device density and functionality, and the ability to provide embedded antenna functionality, all in a hermetically-sealed monolithic antenna structure 102.
  • a multi-layer ceramic antenna structure 100 having structural dimensions of 50 mm x 12.5 mm x 1.0 mm can be produced, while in another embodiment, a multi-layer ceramic antenna structure 100 having structural dimensions of 20 mm x 5 mm x 0.4 mm can be produced.
  • the antenna conductor 106 may simply be coated with a high dielectric constant superstrate 108 coating, as illustrated in FIG. 10.
  • the superstrate coating 108 may comprise one or more coatings of high dielectric constant material that are formed on the antenna conductor 106 by an anodization process. Anodization processes tend to be low in cost and highly reliable. It is also possible to deposit or form the high dielectric constant superstrate 108 coating on the antenna conductor 106 using other deposition techniques known to those skilled in the art. In this manner, an anodized antenna conductor 106 having a high dielectric constant superstrate coating 108 is provided.
  • Coating the antenna conductor 106 with the high dielectric constant superstrate 108 provides a simple manner of improving antenna performance with a minimal change to existing device configurations while providing a matching gradient of dielectric constant between the antenna conductor 106 and the surrounding environment.
  • High dielectric loading may also modify the radiation pattern to reduce the power directly dissipated into the human body.
  • the high dielectric constant superstrate 108 coating may comprise silicone doped with high dielectric constant materials, such as titanium dioxide or barium strontium titanate (BST).
  • the antenna conductor 106 may further be situated within the header 16 such that the superstrates 108 are formed as an antenna radome having a controlled dielectric gradient that encloses the antenna conductor 106 within the header 16, as illustrated in the exploded perspective view of FIG. 11.
  • the superstrates 108 may simply be formed within the header 16 between the antenna conductor 106 and a surface of the header 16.
  • a layer of high electromagnetic impedance material may be positioned below the antenna conductor 106 capable of suppressing the propagation of surface current in the ground (e.g., housing 14), thereby isolating the radiating elements from the nearby surroundings in order to further improve the radiation efficiency of the antenna conductor 106, as illustrated in FIG. 12.
  • one or more of the layers of the multi-layer ceramic antenna structure 100 may be patterned to possess a desired shape with respect to the antenna conductor 106.
  • one or more of the layers of the multi-layer ceramic antenna structure 100 could be patterned to possess a substantially similar shape as the antenna conductor 106 such that the multi-layer ceramic antenna structure 100 could be formed as described herein in connection with FIGS. 1-9 while having an overall shape that substantially mimics the shape of the antenna conductor 106 (e.g., such as the shape illustrated in FIG. 10).
  • some of the layers (e.g., superstrate layers 108) of the multilayer ceramic antenna structure 100 may be patterned to mimic the shape of the antenna conductor 106 while other layers in the multi-layer ceramic antenna structure 100 may be formed having different shapes.
  • the various layers of the multi-layer ceramic antenna structure 100 could be patterned to possess other shapes to provide desired operational characteristics for the multi-layer ceramic antenna structure 100.

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Abstract

La présente invention concerne une antenne pour un dispositif médical implantable (DMI) qui comprend une structure monolithique dérivée d’une pluralité de couches diélectriques discrètes ayant une antenne intégrée à l’intérieur de la structure monolithique. Les couches de superstrat diélectriques formées au-dessus de l’antenne peuvent fournir un gradient amélioré correspondant à l’environnement, pour atténuer les effets de la réflexion de l’énergie. Une couche biocompatible extérieure est positionnée sur les superstrats en tant qu’interface avec l’environnement. Une couche de protection est positionnée sous l’antenne pour fournir une protection électromagnétique au circuit du DMI. Les couches de substrat diélectriques formées en dessous de l’antenne peuvent posséder des valeurs diélectriques supérieures pour que la distance entre l’antenne et la couche de protection au sol puisse être réduite au minimum. Une couche de bande interdite électromagnétique peut être positionnée entre l’antenne et la couche de protection. Les couches diélectriques peuvent comprendre des couches de matériau céramique qui peuvent être cocuites avec l’antenne pour former une structure d’antenne monolithique hermétiquement fermée.
PCT/US2009/062045 2008-10-31 2009-10-26 Antenne miniature à couches multiples pour dispositifs médicaux implantables et procédé de fabrication de celle-ci Ceased WO2010051249A1 (fr)

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US12/347,597 US20100109966A1 (en) 2008-10-31 2008-12-31 Multi-Layer Miniature Antenna For Implantable Medical Devices and Method for Forming the Same

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011111008A1 (fr) * 2010-03-11 2011-09-15 Ecole Polytechnique Federale De Lausanne (Epfl) Système de télémesure pour applications de détection dans des milieux à perte
WO2012047967A1 (fr) * 2010-10-06 2012-04-12 Med-El Elektromedizinische Geraete Gmbh Conception de bobine souple pour dispositif implantable
WO2013147799A1 (fr) * 2012-03-29 2013-10-03 Advanced Bionics Ag Ensembles d'antennes implantables
EP2733784A1 (fr) * 2012-11-19 2014-05-21 Fujitsu Limited Antenne plane en F inverse
US9700731B2 (en) 2014-08-15 2017-07-11 Axonics Modulation Technologies, Inc. Antenna and methods of use for an implantable nerve stimulator
EP3241256A4 (fr) * 2014-12-31 2018-08-01 Micron Devices LLC Ensemble antenne plaque
WO2020080794A1 (fr) * 2018-10-18 2020-04-23 서울과학기술대학교 산학협력단 Antenne implantable pour collecter des biosignaux

Families Citing this family (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8195295B2 (en) 2008-03-20 2012-06-05 Greatbatch Ltd. Shielded three-terminal flat-through EMI/energy dissipating filter
US10080889B2 (en) 2009-03-19 2018-09-25 Greatbatch Ltd. Low inductance and low resistance hermetically sealed filtered feedthrough for an AIMD
US11147977B2 (en) 2008-03-20 2021-10-19 Greatbatch Ltd. MLCC filter on an aimd circuit board conductively connected to a ground pin attached to a hermetic feedthrough ferrule
US9463329B2 (en) 2008-03-20 2016-10-11 Greatbatch Ltd. Shielded three-terminal flat-through EMI/energy dissipating filter with co-fired hermetically sealed feedthrough
US8497804B2 (en) * 2008-10-31 2013-07-30 Medtronic, Inc. High dielectric substrate antenna for implantable miniaturized wireless communications and method for forming the same
US8983618B2 (en) * 2008-10-31 2015-03-17 Medtronic, Inc. Co-fired multi-layer antenna for implantable medical devices and method for forming the same
US8050771B2 (en) * 2008-12-29 2011-11-01 Medtronic, Inc. Phased array cofire antenna structure and method for operating the same
US8350777B2 (en) * 2010-02-18 2013-01-08 Raytheon Company Metamaterial radome/isolator
US8872713B1 (en) * 2010-04-21 2014-10-28 Rockwell Collins, Inc. Dual-polarized environmentally-hardened low profile radiating element
RU2484559C2 (ru) * 2010-06-08 2013-06-10 Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет "Высшая школа экономики" Печатная плата с подвешенной подложкой
JP5062382B2 (ja) 2010-09-07 2012-10-31 株式会社村田製作所 アンテナ装置
DE102011009860B4 (de) * 2011-01-31 2013-03-07 Heraeus Precious Metals Gmbh & Co. Kg Implantierbare Vorrichtung mit integrierter Keramikdurchführung
DE102011009862B4 (de) 2011-01-31 2012-11-08 Heraeus Precious Metals Gmbh & Co. Kg Cermethaltige Durchführung mit Halteelement für eine medizinisch implantierbare Vorrichtung
DE102011009858B8 (de) 2011-01-31 2013-11-07 Heraeus Precious Metals Gmbh & Co. Kg Cermethaltige Durchführung für eine medizinisch inplantierbare Vorrichtung mit Verbindungsschicht
DE102011009861B4 (de) 2011-01-31 2012-09-20 Heraeus Precious Metals Gmbh & Co. Kg Verfahren zur Herstellung einer cermethaltigen Durchführung
DE102011009867B4 (de) 2011-01-31 2013-09-05 Heraeus Precious Metals Gmbh & Co. Kg Keramikdurchführung für eine medizinisch implantierbare Vorrichtung
DE102011009865B4 (de) 2011-01-31 2012-09-20 Heraeus Precious Metals Gmbh & Co. Kg Kopfteil für eine medizinisch implantierbare Vorrichtung
DE102011009856B8 (de) 2011-01-31 2012-12-27 W.C. Heraeus Gmbh Elektrische Durchführung und Verfahren zur Herstellung einer cermethaltigen Durchführung für eine medizinisch implantierbare Vorrichtung
DE102011009859B4 (de) 2011-01-31 2012-09-20 Heraeus Precious Metals Gmbh & Co. Kg Keramikdurchführung mit Filter
DE102011009855B8 (de) 2011-01-31 2013-01-03 Heraeus Precious Metals Gmbh & Co. Kg Keramikdurchführung mit induktivem Filter
DE102011009857B8 (de) 2011-01-31 2013-01-17 Heraeus Precious Metals Gmbh & Co. Kg Elektrische Durchführung mit cermethaltigem Verbindungselement für eine aktive, implantierbare, medizinische Vorrichtung
US9427596B2 (en) 2013-01-16 2016-08-30 Greatbatch Ltd. Low impedance oxide resistant grounded capacitor for an AIMD
US11198014B2 (en) 2011-03-01 2021-12-14 Greatbatch Ltd. Hermetically sealed filtered feedthrough assembly having a capacitor with an oxide resistant electrical connection to an active implantable medical device housing
US10350421B2 (en) 2013-06-30 2019-07-16 Greatbatch Ltd. Metallurgically bonded gold pocket pad for grounding an EMI filter to a hermetic terminal for an active implantable medical device
US10596369B2 (en) 2011-03-01 2020-03-24 Greatbatch Ltd. Low equivalent series resistance RF filter for an active implantable medical device
US10272252B2 (en) 2016-11-08 2019-04-30 Greatbatch Ltd. Hermetic terminal for an AIMD having a composite brazed conductive lead
US9931514B2 (en) 2013-06-30 2018-04-03 Greatbatch Ltd. Low impedance oxide resistant grounded capacitor for an AIMD
US8556178B2 (en) 2011-03-04 2013-10-15 Hand Held Products, Inc. RFID devices using metamaterial antennas
US9931513B2 (en) 2011-03-29 2018-04-03 Nuvectra Corporation Feed-through connector assembly for implantable pulse generator and method of use
US8369951B2 (en) 2011-03-29 2013-02-05 Greatbatch Ltd. Feed-through connector assembly for implantable pulse generator and method of use
US8738141B2 (en) 2011-04-07 2014-05-27 Greatbatch, Ltd. Contact assembly for implantable pulse generator and method of use
US8843206B2 (en) 2011-04-13 2014-09-23 Spinal Modulation, Inc. Telemetry antennas for medical devices and medical devices including telemetry antennas
US9089712B2 (en) * 2011-04-29 2015-07-28 Cyberonics, Inc. Implantable medical device without antenna feedthrough
US9259582B2 (en) 2011-04-29 2016-02-16 Cyberonics, Inc. Slot antenna for an implantable device
US9240630B2 (en) 2011-04-29 2016-01-19 Cyberonics, Inc. Antenna shield for an implantable medical device
US9265958B2 (en) 2011-04-29 2016-02-23 Cyberonics, Inc. Implantable medical device antenna
EP2704794A4 (fr) 2011-05-06 2014-11-05 Ndsu Res Foundation Système auto-organisateur intelligent pour application de stimulation par électrode
WO2012163071A1 (fr) * 2011-06-01 2012-12-06 深圳光启高等理工研究院 Procédé de fabrication d'un substrat diélectrique ayant une constante diélectrique non homogène, procédé et métamatériau pour la fabrication d'une carte fonctionnelle à métamatériau
US9504843B2 (en) 2011-08-19 2016-11-29 Greatbach Ltd. Implantable cardioverter defibrillator designed for use in a magnetic resonance imaging environment
US20130046354A1 (en) 2011-08-19 2013-02-21 Greatbatch Ltd. Implantable cardioverter defibrillator designed for use in a magnetic resonance imaging environment
US8939905B2 (en) * 2011-09-30 2015-01-27 Medtronic, Inc. Antenna structures for implantable medical devices
DE102011119125B4 (de) 2011-11-23 2014-01-23 Heraeus Precious Metals Gmbh & Co. Kg Kontaktierungsanordnung mit Durchführung und Filterstruktur
JP5970556B2 (ja) 2011-12-13 2016-08-17 カーディアック ペースメイカーズ， インコーポレイテッド 埋め込み型医療装置のヘッダ及び方法
EP2790780B1 (fr) * 2011-12-13 2018-07-18 Cardiac Pacemakers, Inc. Collecteur pour dispositif implantable et procédé
EP2790779B1 (fr) 2011-12-13 2018-10-03 Cardiac Pacemakers, Inc. Dispositif médical implantable avec élément de tête comprenant une étiquette d'identification ou une fonction de fixation d'antenne
WO2013090302A1 (fr) 2011-12-13 2013-06-20 Cardiac Pacemakers, Inc. Dispositif implantable, collecteur et procédé associé
US9138586B2 (en) 2012-01-27 2015-09-22 Greatbatch Ltd. Contact block using spherical electrical contacts for electrically contacting implantable leads
AU2013249452B2 (en) * 2012-04-17 2015-06-11 Boston Scientific Neuromodulation Corporation Neurostimulation device having frequency selective surface to prevent electromagnetic interference during MRI
US9093974B2 (en) 2012-09-05 2015-07-28 Avx Corporation Electromagnetic interference filter for implanted electronics
US20140125532A1 (en) * 2012-11-08 2014-05-08 University Of Utah Tattooed antennas
USRE46699E1 (en) 2013-01-16 2018-02-06 Greatbatch Ltd. Low impedance oxide resistant grounded capacitor for an AIMD
US10966809B2 (en) * 2013-02-01 2021-04-06 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method and device for treating caries using locally delivered microwave energy
US9478959B2 (en) 2013-03-14 2016-10-25 Heraeus Deutschland GmbH & Co. KG Laser welding a feedthrough
EP2968942B1 (fr) * 2013-03-14 2021-02-17 Stimwave Technologies Incorporated Système pour un récepteur de puissance sans fil implantable
US9431801B2 (en) 2013-05-24 2016-08-30 Heraeus Deutschland GmbH & Co. KG Method of coupling a feedthrough assembly for an implantable medical device
US9403023B2 (en) 2013-08-07 2016-08-02 Heraeus Deutschland GmbH & Co. KG Method of forming feedthrough with integrated brazeless ferrule
US9387331B2 (en) 2013-10-08 2016-07-12 Medtronic, Inc. Implantable medical devices having hollow cap cofire ceramic structures and methods of fabricating the same
US9504841B2 (en) 2013-12-12 2016-11-29 Heraeus Deutschland GmbH & Co. KG Direct integration of feedthrough to implantable medical device housing with ultrasonic welding
US9610452B2 (en) 2013-12-12 2017-04-04 Heraeus Deutschland GmbH & Co. KG Direct integration of feedthrough to implantable medical device housing by sintering
US9610451B2 (en) 2013-12-12 2017-04-04 Heraeus Deutschland GmbH & Co. KG Direct integration of feedthrough to implantable medical device housing using a gold alloy
US9502754B2 (en) 2014-01-24 2016-11-22 Medtronic, Inc. Implantable medical devices having cofire ceramic modules and methods of fabricating the same
US9595756B1 (en) * 2014-01-31 2017-03-14 Rockwell Collins, Inc. Dual polarized probe coupled radiating element for satellite communication applications
KR101609216B1 (ko) * 2014-10-23 2016-04-05 현대자동차주식회사 안테나, 원형 편파 패치 안테나 및 이를 구비하는 자동차
US10741914B2 (en) 2015-02-26 2020-08-11 University Of Massachusetts Planar ultrawideband modular antenna array having improved bandwidth
KR101656723B1 (ko) * 2015-06-30 2016-09-12 재단법인 오송첨단의료산업진흥재단 피드스루 제조방법
US9770597B2 (en) * 2015-08-27 2017-09-26 Precision Medical Devices, Inc. Telemetry port for implanted medical device
US9832867B2 (en) 2015-11-23 2017-11-28 Medtronic, Inc. Embedded metallic structures in glass
US10646144B2 (en) 2015-12-07 2020-05-12 Marcelo Malini Lamego Wireless, disposable, extended use pulse oximeter apparatus and methods
US10583303B2 (en) 2016-01-19 2020-03-10 Cardiac Pacemakers, Inc. Devices and methods for wirelessly recharging a rechargeable battery of an implantable medical device
US10249415B2 (en) 2017-01-06 2019-04-02 Greatbatch Ltd. Process for manufacturing a leadless feedthrough for an active implantable medical device
JP7050795B2 (ja) 2017-01-30 2022-04-08 ニュースペラ メディカル インク ミッドフィールド送信機および受信機システム
WO2019003830A1 (fr) * 2017-06-28 2019-01-03 パナソニックＩｐマネジメント株式会社 Dispositif d'antenne
WO2019036568A1 (fr) 2017-08-18 2019-02-21 Cardiac Pacemakers, Inc. Dispositif médical implantable comprenant un concentrateur de flux et une bobine de réception disposée autour du concentrateur de flux
CN107732420B (zh) * 2017-10-27 2024-03-08 景昱医疗科技（苏州）股份有限公司 一种天线、植入式医疗器械及植入式医疗系统
US10561842B2 (en) * 2017-12-14 2020-02-18 NeuSpera Medical Inc. Layered midfield transmitter with dielectric tuning
US11596794B2 (en) 2017-12-14 2023-03-07 NeuSpera Medical Inc. Enhanced wireless communication and power transfer between external and implanted devices
US10659963B1 (en) 2018-02-12 2020-05-19 True Wearables, Inc. Single use medical device apparatus and methods
US10912945B2 (en) 2018-03-22 2021-02-09 Greatbatch Ltd. Hermetic terminal for an active implantable medical device having a feedthrough capacitor partially overhanging a ferrule for high effective capacitance area
US10905888B2 (en) 2018-03-22 2021-02-02 Greatbatch Ltd. Electrical connection for an AIMD EMI filter utilizing an anisotropic conductive layer
US11844881B2 (en) 2018-05-17 2023-12-19 The Curators Of The University Of Missouri Composite material with high dielectric constant and use in biocompatible devices
WO2019226860A1 (fr) 2018-05-23 2019-11-28 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Élément rayonnant à ouverture de fente non équilibrée (usa)
US11202914B2 (en) * 2018-12-21 2021-12-21 Medtronic, Inc. Passive propagation fractal antenna for intrabody transmissions
DE102019107600B4 (de) * 2019-03-25 2020-12-17 Tu Dresden Antennenanordnung
US11260226B2 (en) * 2019-08-16 2022-03-01 Advanced Bionics Ag Cochlear implant assemblies and methods of manufacturing the same
US20210111494A1 (en) * 2019-10-15 2021-04-15 Yellow Sands Technologies, Ltd. Antenna
EP3900782B1 (fr) 2020-02-21 2023-08-09 Heraeus Medical Components, LLC Ferrule dotée d'une entretoise de réduction des contraintes pour dispositif médical implantable
EP3900783B1 (fr) 2020-02-21 2023-08-16 Heraeus Medical Components, LLC Ferrule pour boîtier de dispositif médical non planaire
US12290690B2 (en) * 2020-02-25 2025-05-06 Pacesetter, Inc. Biostimulator having patch antenna
KR102474119B1 (ko) * 2020-07-14 2022-12-05 울산과학기술원 슈퍼스트레이트를 통해 전자기파를 이용하여 생체 정보를 센싱하는 바이오 센서
JP7568486B2 (ja) * 2020-11-10 2024-10-16 東芝テック株式会社 ウェアラブルデバイスに搭載されるアンテナ
US12199357B1 (en) * 2021-08-23 2025-01-14 Hrl Laboratories, Llc Surface antenna compensation
US12383750B2 (en) 2021-10-29 2025-08-12 Greatbatch Ltd. Feedthrough with an integrated charging antenna for an active implantable medical device
CN115664364B (zh) * 2022-12-22 2023-02-28 四川斯艾普电子科技有限公司 基于厚薄膜电路的大功率限幅器及实现方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6414835B1 (en) * 2000-03-01 2002-07-02 Medtronic, Inc. Capacitive filtered feedthrough array for an implantable medical device
US20040189528A1 (en) * 2003-03-31 2004-09-30 Killen William D. Arangements of microstrip antennas having dielectric substrates including meta-materials
WO2006039699A2 (fr) * 2004-10-01 2006-04-13 De Rochemont L Pierre Module d'antenne en ceramique et ses procedes de fabrication
US20070236861A1 (en) * 2006-04-05 2007-10-11 Burdon Jeremy W Implantable co-fired electrical feedthroughs

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5861019A (en) * 1997-07-25 1999-01-19 Medtronic Inc. Implantable medical device microstrip telemetry antenna
US6815739B2 (en) * 2001-05-18 2004-11-09 Corporation For National Research Initiatives Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates
US7903043B2 (en) * 2003-12-22 2011-03-08 Cardiac Pacemakers, Inc. Radio frequency antenna in a header of an implantable medical device
US7392015B1 (en) * 2003-02-14 2008-06-24 Calamp Corp. Calibration methods and structures in wireless communications systems
WO2005031911A2 (fr) * 2003-08-01 2005-04-07 The Penn State Research Foundation Dispositif a bande interdite electromagnetique a selectivite elevee, et systeme d'antenne
US20050203584A1 (en) * 2004-03-10 2005-09-15 Medtronic, Inc. Telemetry antenna for an implantable medical device
US7467014B2 (en) * 2005-04-28 2008-12-16 Medtronic, Inc. Compact and conformal telemetry antennas for implantable medical devices
US20070060970A1 (en) * 2005-09-15 2007-03-15 Burdon Jeremy W Miniaturized co-fired electrical interconnects for implantable medical devices
US7932869B2 (en) * 2007-08-17 2011-04-26 Ethertronics, Inc. Antenna with volume of material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6414835B1 (en) * 2000-03-01 2002-07-02 Medtronic, Inc. Capacitive filtered feedthrough array for an implantable medical device
US20040189528A1 (en) * 2003-03-31 2004-09-30 Killen William D. Arangements of microstrip antennas having dielectric substrates including meta-materials
WO2006039699A2 (fr) * 2004-10-01 2006-04-13 De Rochemont L Pierre Module d'antenne en ceramique et ses procedes de fabrication
US20070236861A1 (en) * 2006-04-05 2007-10-11 Burdon Jeremy W Implantable co-fired electrical feedthroughs

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011111008A1 (fr) * 2010-03-11 2011-09-15 Ecole Polytechnique Federale De Lausanne (Epfl) Système de télémesure pour applications de détection dans des milieux à perte
WO2012047967A1 (fr) * 2010-10-06 2012-04-12 Med-El Elektromedizinische Geraete Gmbh Conception de bobine souple pour dispositif implantable
WO2013147799A1 (fr) * 2012-03-29 2013-10-03 Advanced Bionics Ag Ensembles d'antennes implantables
US9393428B2 (en) 2012-03-29 2016-07-19 Advanced Bionics Ag Implantable antenna assemblies
EP2733784A1 (fr) * 2012-11-19 2014-05-21 Fujitsu Limited Antenne plane en F inverse
US9531063B2 (en) 2012-11-19 2016-12-27 Fujitsu Limited Planar inverted-F antenna
US9700731B2 (en) 2014-08-15 2017-07-11 Axonics Modulation Technologies, Inc. Antenna and methods of use for an implantable nerve stimulator
EP3241256A4 (fr) * 2014-12-31 2018-08-01 Micron Devices LLC Ensemble antenne plaque
US10056688B2 (en) 2014-12-31 2018-08-21 Micron Devices Llc Patch antenna assembly
US11128049B2 (en) 2014-12-31 2021-09-21 Stimwave Technologies Incorporated Patch antenna assembly
US9770596B2 (en) 2015-01-09 2017-09-26 Axonics Modulation Technologies, Inc. Antenna and methods of use for an implantable nerve stimulator
US10722721B2 (en) 2015-01-09 2020-07-28 Axonics Modulation Technologies, Inc. Antenna and methods of use for an implantable nerve stimulator
US11478648B2 (en) 2015-01-09 2022-10-25 Axonics, Inc. Antenna and methods of use for an implantable nerve stimulator
WO2020080794A1 (fr) * 2018-10-18 2020-04-23 서울과학기술대학교 산학협력단 Antenne implantable pour collecter des biosignaux

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