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WO2010041579A1 - Lentille à échelle de tranche, module de caméra à échelle de tranche et dispositif électronique - Google Patents

Lentille à échelle de tranche, module de caméra à échelle de tranche et dispositif électronique Download PDF

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Publication number
WO2010041579A1
WO2010041579A1 PCT/JP2009/067057 JP2009067057W WO2010041579A1 WO 2010041579 A1 WO2010041579 A1 WO 2010041579A1 JP 2009067057 W JP2009067057 W JP 2009067057W WO 2010041579 A1 WO2010041579 A1 WO 2010041579A1
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WO
WIPO (PCT)
Prior art keywords
lens
wafer scale
protrusion
camera module
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/067057
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English (en)
Japanese (ja)
Inventor
斎藤　仁
鎌田　亨
修二 矢野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of WO2010041579A1 publication Critical patent/WO2010041579A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding

Definitions

  • the present invention relates to a wafer scale lens, a wafer scale camera module having a wafer scale lens, and an electronic apparatus having a camera module in which the wafer scale camera module is separated into individual pieces.
  • Patent Document 1 discloses a camera module that meets such a demand for miniaturization. Specifically, in Patent Document 1, as one countermeasure for miniaturization, a camera module is miniaturized by forming a wafer scale camera module in which a lens and a semiconductor chip (imaging device) are integrated. It has been proposed that
  • FIG. 12 is a cross-sectional view of the wafer scale camera module of Patent Document 1.
  • the wafer scale camera module 200 has a configuration in which a lens wafer 201 and an imaging element wafer 202 are bonded together by an bonding portion 203.
  • the wafer scale camera module 200 is cut along a cutting line 204, whereby a plurality of camera modules 205 are separated into individual camera modules 205.
  • the number of mounted parts at the time of manufacture can be reduced, and the lens wafer 201 as an optical part can be directly mounted on the imaging element wafer 202. Therefore, it is possible to reduce the mounting size without causing a decrease in the lens focusing ability due to assembly variations.
  • Japanese Patent Publication Japanese Patent Laid-Open No. 2004-63751 (published on February 26, 2004)”
  • the camera module of Patent Document 1 has a problem that an accurate imaging test cannot be performed because the lens is easily damaged.
  • FIG. 13 is a cross-sectional view illustrating an imaging test of wafer scale camera module 200 of FIG.
  • an image picked up from the lens optical surface 206 is received by the image sensor 207.
  • the contact pin 209 is brought into contact with the electrode portion 208 formed on the back surface of the semiconductor chip on which the image sensor 207 is formed, and the reproducibility of the received image is determined.
  • the lens optical surface 206 protrudes, when the contact pin 209 is brought into contact with the electrode portion 208, stress is applied to the lens optical surface 206 in the direction of the arrow 211. As a result, the lens optical surface 206 and the holding member 210 come into contact with each other, so that the lens optical surface 206 is damaged. For this reason, an appropriate load is applied to the electrode portion 208, the contact pin 209 cannot be brought into contact, and the electrode portion 208 and the contact pin 209 cannot be brought into stable electrical contact. Therefore, an accurate imaging test cannot be performed.
  • the present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide a wafer scale lens and a wafer scale camera module capable of performing an accurate imaging test while preventing damage to the lens. And providing an electronic device.
  • a wafer scale lens of the present invention is a wafer scale lens having a plurality of lenses used in a camera module, outside the lens optical surface and higher than the highest position of the lens optical surface. It is characterized in that a projecting portion protruding high is formed.
  • the protrusion protrudes from the lens optical surface. For this reason, when an imaging test is performed while holding the wafer scale lens, the projection is weighted, but the lens optical surface is not directly weighted. Therefore, an accurate imaging test can be performed while preventing damage to the lens (lens optical surface).
  • the protrusion may be formed on a cutting region for dividing the lens into individual lenses.
  • the protrusion is formed on the cutting area for dividing the lens into individual lenses.
  • the protrusion may be formed on the lens forming surface.
  • the protrusion is formed on the lens forming surface. For this reason, even after the imaging test, even if the wafer scale lens is cut along the cutting region and divided into individual lenses, the protrusion remains on the lens forming surface. Therefore, the damage to the optical surface of the lens can be prevented by the protrusions both when the wafer scale lens is handled and when the divided lens is handled. In addition, the protrusions can reduce dust intrusion into the lens optical surface.
  • the protrusions may be provided in common to adjacent lenses.
  • the protrusion is shared between adjacent lenses. Thereby, the number of protrusions can be reduced as compared with the case where independent protrusions are formed on each lens. Therefore, the configuration of the protrusion can be simplified.
  • the protrusion may be formed on each lens.
  • the protrusion is formed on each lens. That is, the protrusions are uniformly arranged on the lens forming surface. For this reason, damage to each lens optical surface can be prevented more reliably.
  • the lens forming surface of the wafer scale lens can be stably held by a holding material (such as a tray).
  • the protrusion and the lens optical surface are formed in a lump.
  • the protrusion and the lens optical surface are formed in a lump.
  • the accuracy of the height (thickness) of the protrusion is increased, it is possible to lose the variation in the shape of the protrusion. That is, a protrusion having a uniform height is formed. Therefore, the wafer scale lens can be reliably held by the holding material (tray or the like) without tilting.
  • the number of manufacturing steps can be reduced.
  • Such batch formation can be performed by, for example, mold molding.
  • a path connecting adjacent lenses is formed in the protrusion.
  • a path connecting adjacent lenses is formed in the protrusion.
  • the protrusion may have a convex cross section in the optical axis direction.
  • the protrusion having a convex section in the optical axis direction is formed.
  • protrusion part itself becomes uneven
  • the convex portion functions to prevent damage to the lens optical surface, while the concave portion functions as a path connecting adjacent lenses. Therefore, the warp and tilt of the wafer scale lens can be corrected and absorbed. Therefore, a more accurate imaging test can be performed.
  • the top surface of the protrusion is flat.
  • the holding material (tray or the like) that holds the wafer scale lens and the top surface of the protrusion are in surface contact. Therefore, the wafer scale lens can be reliably held. Therefore, the warp and tilt of the wafer scale lens can be corrected and absorbed. Therefore, a more accurate imaging test can be performed.
  • the protrusion has a light shielding property.
  • a wafer scale camera module includes an imaging unit corresponding to each lens of the wafer scale lens described above, and an electrode unit is formed on the back surface of the imaging unit. It is characterized by that.
  • an electronic apparatus is characterized by including the wafer scale camera module in order to solve the above problems.
  • the wafer scale lens of the present invention has a configuration in which a protrusion protruding higher than the highest position of the lens optical surface is formed outside the lens optical surface. Therefore, it is possible to perform an accurate imaging test while preventing damage to the lens (lens optical surface).
  • FIG. 1 It is a perspective view which shows the projection part formed in the wafer scale lens of this invention. It is a perspective view which shows the projection part formed in the wafer scale lens of this invention.
  • 2 is a cross-sectional view of a wafer scale camera module of Patent Document 1.
  • FIG. It is sectional drawing which shows the imaging test of the wafer scale camera module of FIG.
  • FIG. 1 is a cross-sectional view of a wafer scale camera module 100 of the present embodiment.
  • FIG. 2 is a perspective view of the wafer scale camera module 100 of the present embodiment.
  • the wafer scale camera module 100 has a configuration in which a plurality of camera modules 110 are arranged in a matrix.
  • the camera module 110 is mounted on various electronic devices such as a mobile phone, for example.
  • the wafer scale camera module 100 has a configuration in which the lens wafer 1 and the imaging element wafer 2 are bonded to each other by the bonding portion 3.
  • the wafer scale camera module 100 is separated into individual camera modules 110 by being cut along the cutting region 12.
  • the lens wafer 1 is provided with a plurality of photographing optical systems (lenses) that form subject images corresponding to the camera modules 110.
  • the lens wafer 1 is made of, for example, transparent glass or transparent resin.
  • a plurality of imaging units corresponding to the camera modules 110 are arranged on the imaging element wafer 2.
  • the protrusion 11 is formed on the cutting region 12. However, the protrusions 11 are cut together when the wafer scale camera module 100 is cut along the cutting region 12. Details of the protrusion 11 will be described later.
  • FIG. 3 is a cross-sectional view of the camera module 110 separated into pieces.
  • the lens 10 is laminated on the imaging unit 20 via the bonding unit 3.
  • the lens 10 is an optical system for forming an image of light from the subject on the imaging unit 20.
  • the lens surface 13 is a convex lens having a convex lens optical surface 14.
  • the imaging unit 20 converts the subject image formed by the lens 10 into an electrical signal.
  • the imaging unit 20 includes an imaging element 21 formed on a surface facing the back surface of the lens 10 and an electrode unit 22 formed on the back surface of the imaging unit 20.
  • the image sensor 21 is a sensor device that photoelectrically converts incident light incident from the lens 10.
  • a light receiving surface (not shown) in which a plurality of pixels are arranged in a matrix is formed on the surface (upper surface) of the image sensor 21. Then, the optical image formed on the light receiving surface is converted into an electrical signal and output as an analog image signal.
  • the image sensor 21 is, for example, a charge-coupled device (CCD) image sensor, a complementary metal-oxide semiconductor (CMOS) image sensor, or a VMIS image sensor (Threshold Voltage Modulation Image Sensor).
  • the imaging unit 20 controls the camera module 110 by using a DSP (digital signal processor) (not shown) for adjusting the optical axis, a CPU for performing various arithmetic processes according to a program, a ROM for storing the program, An electronic component such as a RAM for storing processing data or the like may also be provided.
  • DSP digital signal processor
  • the electrode part 22 performs input / output of an electric signal. That is, the electrode unit 22 takes out an electrical signal from the image sensor 21 and outputs the electrical signal to the outside. An external electrical signal is input to the imaging unit 20 via the electrode unit 22.
  • Such imaging by the camera module 110 is performed when the imaging unit 20 captures incident light transmitted through the lens 10.
  • the imaging test of the wafer scale camera module 100 is performed in a state where the wafer scale camera module 100 is held on a holding material such as a tray.
  • a holding material such as a tray.
  • the lens optical surface comes into contact with the tray holding the wafer scale camera module, the lens is easily damaged, and an accurate imaging test cannot be performed.
  • the protrusion 11 is formed on the lens wafer 1.
  • the protrusion 11 is formed outside the lens optical surface 14 and is set higher (thicker) than the height (thickness) of the lens optical surface 14.
  • FIG. 4 is a partial plan view of the lens wafer 1.
  • the lens 10 formed on the lens wafer 1 has a convex lens optical surface 14 formed on the lens surface 13.
  • a cutting area 12 (shaded portion in the figure) for separating adjacent lenses 10 into individual lenses 10 is formed around the lens surface 13. Note that the cutting region 12 is a region shared by adjacent lenses 10.
  • the arrangement position of the protrusion 11 is not particularly limited as long as it is formed outside the lens optical surface 14. That is, the protrusion 11 may be formed on the cutting region 12 as illustrated in FIG. 1, may be formed on the lens surface 13, or may be formed on either the cutting region 12 or the lens surface 13. It may be formed, or may be formed from the cutting region 12 to the lens surface 13.
  • the protrusion 11 may be provided in common between the lenses 10 adjacent to each other, or may be formed for each lens 10. Further, the protrusion 11 may be formed every several camera modules 110.
  • FIG. 5 is a cross-sectional view showing an imaging test of the wafer scale camera module 100 of FIG.
  • the imaging test is performed with the wafer scale camera module 100 held by the tray 40.
  • a subject is photographed by each camera module 110 formed on the wafer scale camera module 100.
  • the contact pin 50 is brought into contact with the electrode portion 22 on the back surface of the wafer scale camera module 100, and the performance of the camera module 110 is evaluated based on the image data of the subject imaged and output by the camera module 110 to be inspected. To do.
  • the protrusion 11 protrudes from the lens optical surface 14. For this reason, when the wafer scale camera module 100 is held on the tray 40 and an imaging test is performed, the protrusion 11 is weighted, but the lens optical surface 14 is not directly weighted. Therefore, an accurate imaging test can be performed while preventing damage to the lens 10 (lens optical surface 14).
  • the protrusions 11 are formed on the cutting region 12 for dividing into the individual camera modules 110.
  • the projection 11 can be removed at the same time as the camera module 110 is divided into pieces. Therefore, as will be described later, it is possible to make the lens wafer 1 thinner and hence the camera module 110 thinner than when the protrusions 11 remain on the lens surface 13.
  • the protrusion 11 formed on the lens wafer 1 is provided in common to the lenses 10 adjacent to each other. That is, in the present embodiment, the protrusion 11 is shared between the camera modules 110 adjacent to each other (between the lenses 10). Thereby, the number of the protrusion parts 11 can be reduced rather than the case where the protrusion parts 11 independent in each camera module 110 are formed. Therefore, the structure of the protrusion part 11 can be simplified.
  • the protrusion 11 is formed on each camera module 110 (each lens 10). That is, the protrusions 11 are uniformly arranged on each lens surface 13. For this reason, damage to each lens optical surface 14 can be prevented more reliably. Further, the wafer scale camera module 100 can be stably held by the tray 40.
  • the tray 40 holding the wafer scale camera module 100 and the top surface of the protrusion 11 are in surface contact. Therefore, the wafer scale camera module 100 can be reliably held. Therefore, the warp and tilt of the wafer scale camera module 100 can be corrected and absorbed. Therefore, a more accurate imaging test can be performed.
  • the protrusion 11 has a tapered structure in consideration of the angle of view of the camera module 110 (lens 10). That is, the protrusion 11 becomes thinner as the distance from the lens optical surface 14 increases. Thereby, the angle of view of the camera module 110 (lens 10) is ensured. For this reason, shooting by the camera module 110 is not hindered by the protrusion 11. Therefore, an accurate imaging test can be performed.
  • FIGS. 6 and 7 are sectional views showing imaging tests of other wafer scale camera modules 101 and 102 according to the present invention. In the following, differences from the above-described protrusion 11 will be mainly described.
  • the protrusion 11 is formed not only on the cutting area 12 but also on the lens surface 13. Further, in a state before cutting along the cutting region 12 (the state of the wafer scale camera module 101), the protruding portion 11 is provided in common with the adjacent camera module 110. More specifically, they are formed symmetrically between adjacent camera modules 110 with the cutting region 12 as the axis of symmetry.
  • the protrusion 11 formed on the cutting area 12 is removed, whereas the protrusion 11 formed on the lens surface 13 is cut. Thereafter, the protrusions 11a and 11b remain on the camera module 110.
  • the protrusion 11 is formed on the lens surface 13. For this reason, even if the wafer scale camera module 101 is cut along the cutting region 12 and divided into individual camera modules 110 after the imaging test, the protrusions 11 a and 11 b remain on the lens surface 13. Therefore, the damage to the lens optical surface 14 can be prevented by the protrusions 11 both when the wafer scale camera module 101 is handled and when the divided camera module 110 is handled. Further, the protrusion 11 can reduce dust intrusion into the lens optical surface 14.
  • the protrusions 11a and 11b are formed on the lens surface 13 and are not formed on the cutting region 12. That is, the protrusion 11 in FIG. 7 is configured not to be formed on the cutting region 12 in the protrusion 11 in FIG. 6. Therefore, whether the wafer scale camera module 102 is handled or when the divided camera module 110 is handled, the protrusions 11a and 11b can prevent the lens optical surface 14 from being damaged. Further, the intrusion of dust into the lens optical surface 14 can be reduced by the protrusions 11a and 11b.
  • the wafer scale camera modules 100, 101, and 102 are in a wafer state. For this reason, when holding by the tray 40, a curvature and a tilt may occur. Therefore, the tray 40 preferably holds (suctions) and holds the wafer scale camera modules 100, 101, and 102 (lens wafer 1). Thereby, it is possible to correct and absorb the warp and tilt of the wafer scale camera modules 100, 101, and 102 (lens wafer 1).
  • a path connecting the adjacent camera modules 110 is formed in the protrusion 11.
  • 8 to 11 are cross-sectional views or top views of the protrusion 11 on which a path P connecting adjacent camera modules 110 is formed.
  • the protrusion 11 is formed so that the entire periphery (lens surface 13) of the camera module 110 is not surrounded.
  • the protrusion 11 is partially formed around the camera module 110. Moreover, in FIG. 9, the protrusion part 11 is formed at intervals. That is, a path (air path) P connecting adjacent camera modules 110 (lenses 10) is formed in the protrusion 11.
  • a path (air path) P connecting adjacent camera modules 110 (lenses 10) is formed in the protrusion 11.
  • the path P becomes an intake path.
  • the entire lens surface 13 can be reliably adsorbed (sucked). Therefore, it is possible to correct and absorb the warp and tilt of the wafer scale camera module. Therefore, a more accurate imaging test can be performed.
  • the cross-sectional shape of the protrusion 11 in the optical axis direction may be rectangular as shown in FIG. 10 or may be convex as shown in FIG. In FIG. 10, an interval is further formed between the protrusions 11. As a result, like the protrusion 11 in FIGS. 8 and 9, this interval becomes a path P, and the warp and tilt of the wafer scale camera module can be corrected and absorbed. Therefore, a more accurate imaging test can be performed.
  • the protrusion 11 in FIG. 11 has a convex cross section in the optical axis direction. For this reason, protrusion part 11 itself becomes uneven
  • such a projection part 11 has a light-shielding property. Thereby, the light outside the angle of view is blocked or absorbed by the projection 11 having the light shielding property. For this reason, the entrance of light outside the angle of view and the irregular reflection of light outside the angle of view can be prevented. Therefore, a more accurate imaging test can be performed.
  • a protrusion 11 may be formed as a part of the lens wafer 1 or may be formed as another member.
  • the protrusion 11 can be formed by, for example, mold molding. In this case, the protrusion 11 and the lens optical surface 14 are collectively formed. Thereby, since the precision of the height (thickness) of the projection part 11 increases, the variation in the shape of the projection part 11 can be lost. That is, the protrusion 11 having a uniform height is formed. Therefore, the wafer scale camera modules 100, 101, 102 (lens wafer 1) can be reliably held by the tray 40 without being tilted. In addition, the number of manufacturing steps can be reduced.
  • the height (thickness) of the protrusion 11 is not particularly limited and can be arbitrarily set. However, if the protrusion 11 remains after being divided into the individual camera module 110 (lens 10), if the protrusion 11 is too thick, the individual camera module 110 (lens 10) itself becomes thick. On the other hand, if the protrusion 11 is too thin, the protection effect of the lens optical surface 14 and the effect of preventing water and dust from entering the lens optical surface 14 are reduced. Therefore, in consideration of these, the height of the protrusion 11 is preferably 30 ⁇ m or more, and more preferably 100 ⁇ m or more.
  • the present invention has the greatest feature in that the structure of the lens optical surface 14 of the wafer scale lens, that is, the protrusion 11 is provided. Thereby, the accurate imaging test can be performed while preventing the lens optical surface 14 from being damaged by the protrusion 11. The effect can be obtained if at least one protrusion 11 is formed on the lens surface 13.
  • the imaging test of the wafer scale camera module has been described as an example.
  • the imaging test of the wafer scale lens is the same as the imaging test of the wafer scale camera module because the imaging test is performed by regarding the wafer scale lens as a camera module. That is, in the case of an imaging test of a wafer scale lens, a subject is photographed by each lens formed on the wafer scale lens.
  • an imaging unit (light receiving unit) is brought close to or in contact with the back surface of the wafer scale lens, and an object photographed by the lens to be inspected is received by the imaging unit. Then, the lens performance is evaluated based on the image data output from the imaging unit.
  • an accurate imaging test can be performed while preventing damage to the lens (lens optical surface).
  • the imaging test can be performed at the wafer level, the imaging test can be performed quickly, in large quantities, and with high quality, so that the manufacturing cost can be greatly reduced and the quality can be improved.
  • the protrusions 11 are provided on the wafer scale camera modules 100, 101, and 102 (lens wafer 1), but the same effect can be obtained by providing the protrusions 11 on the tray 40. That is, even when the projection 11 is installed on the tray 40, an imaging test can be performed without contacting the lens optical surface 14.
  • the present invention can also be expressed as follows.
  • the wafer scale camera module of the present invention has a protrusion (protrusion) in which a portion outside the lens optical surface protrudes from the lens optical surface. It can be said that at least one protrusion is formed.
  • the wafer scale camera module of the present invention may have a configuration in which irregularities are formed in the protruding portion.
  • the protrusion may be formed in an area to be cut into pieces.
  • an air path may be formed by providing irregularities in a portion protruding from the lens optical surface.
  • irregularities on the protrusions it can be tightly fixed to the holding material (tray) by air adsorption or the like, and the holding material installed in the wafer scale camera module is displaced due to the movement during the test of the wafer scale camera module. Stable testing is possible without any errors.
  • the protruding portion that protrudes from the lens optical surface may be formed in a cutting area that is cut into individual pieces outside the lens optical surface.
  • the protruding portion protruding from at least one or more lens optical surfaces may be formed on the outer peripheral portion.
  • the protruding portion may have a portion protruding from a lens optical surface shared with an adjacent wafer scale camera module. It may be a wafer tray that holds only the image sensor electrode surface of the wafer scale camera module. Thereby, the wafer can be fixed only by the tray in contact with the imaging element electrode surface of the wafer scale camera module.
  • the protruding portion may have a portion protruding from a lens optical surface of each adjacent wafer scale camera module.
  • the present invention can be suitably used for various electronic devices including a camera module such as a digital still camera, a mobile phone with a camera, and a surveillance camera.
  • a camera module such as a digital still camera, a mobile phone with a camera, and a surveillance camera.
  • Lens wafer (wafer scale lens) 2 Image sensor wafer 3 Adhesion part 10 Lens 11 Protrusion part 12 Cutting area 13 Lens surface (lens formation surface) 14 Lens optical surface 20 Imaging unit 21 Imaging element 22 Electrode unit 40 Tray 50 Contact pin 100, 101, 102 Wafer scale camera module P path

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

Dans le cadre de la présente invention, une section saillante (11) qui fait saillie plus haut que la position la plus élevée d’une surface optique de lentille (14) est formée à l’extérieur de la surface optique de lentille (14) sur une tranche de lentille (1). Ainsi, la tranche de lentille (1), un module de caméra à échelle de tranche (100) et un dispositif électronique, qui peuvent réaliser un essai d’image précis, tout en éliminant la rupture, sont proposés.
PCT/JP2009/067057 2008-10-10 2009-09-30 Lentille à échelle de tranche, module de caméra à échelle de tranche et dispositif électronique Ceased WO2010041579A1 (fr)

Applications Claiming Priority (2)

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JP2008264365A JP5165524B2 (ja) 2008-10-10 2008-10-10 ウエハスケールレンズ、ウエハスケールモジュール、および、電子機器
JP2008-264365 2008-10-10

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WO2010041579A1 true WO2010041579A1 (fr) 2010-04-15

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WO2012011326A1 (fr) * 2010-07-23 2012-01-26 オリンパス株式会社 Dispositif de capture d'image, endoscope et procédé de fabrication d'un dispositif de capture d'image
JP2015062321A (ja) * 2014-12-26 2015-04-02 オリンパス株式会社 撮像装置
WO2017022190A1 (fr) * 2015-07-31 2017-02-09 Sony Semiconductor Solutions Corporation Procédé de fabrication de substrat de lentille

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WO2006109638A1 (fr) * 2005-04-08 2006-10-19 Konica Minolta Opto, Inc. Élément d’acquisition d’image a l’état solide et son procédé de fabrication
JP2007017974A (ja) * 2005-07-06 2007-01-25 Ashu Kogaku Kofun Yugenkoshi マイクロ撮影装置及びその製造方法
JP2007129164A (ja) * 2005-11-07 2007-05-24 Sharp Corp 光学装置用モジュール、光学装置用モジュールの製造方法、及び、構造体

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