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WO2009137022A1 - Système de caméra comprenant un blindage contre les rayonnements et procédé de blindage contre les rayonnements - Google Patents

Système de caméra comprenant un blindage contre les rayonnements et procédé de blindage contre les rayonnements Download PDF

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Publication number
WO2009137022A1
WO2009137022A1 PCT/US2009/002755 US2009002755W WO2009137022A1 WO 2009137022 A1 WO2009137022 A1 WO 2009137022A1 US 2009002755 W US2009002755 W US 2009002755W WO 2009137022 A1 WO2009137022 A1 WO 2009137022A1
Authority
WO
WIPO (PCT)
Prior art keywords
camera system
sensor substrate
optics stack
opaque material
feature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2009/002755
Other languages
English (en)
Inventor
James Morris
Michael Feldman
Greg Kintz
Hongtao Han
Michael Bereziuk
Vage Oganesian
David Ovrutsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DigitalOptics Corp East
Original Assignee
Tessera North America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tessera North America Inc filed Critical Tessera North America Inc
Publication of WO2009137022A1 publication Critical patent/WO2009137022A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Definitions

  • Example embodiments relate to a camera system and associated methods. More particularly, example embodiments relate to a camera system including a radiation shield for blocking unwanted radiation and reducing noise.
  • Noise in a camera system may arise due to multiple external sources.
  • ambient light i.e., light not used for forming a desired image
  • electromagnetic radiation interference (EMI) etc.
  • EMI electromagnetic radiation interference
  • Conventional shields for blocking the unwanted radiation may be larger than the camera system in order to accommodate alignment tolerances. This may lead to significantly increased camera height. Further, conventional shields may be an individually assembled with individual cameras, leading to higher assembly time and cost.
  • Example embodiments are therefore directed to a camera system including an optics stack and methods thereof, which substantially overcome one or more of the problems due to the limitations and disadvantages of the related art.
  • a camera system including an optics stack including first and second substrates secured together in a stacking direction, one of the first and seconds substrates including an optical element, a detector on a sensor substrate, and a feature shielding the camera system, the feature being external to the optics stack.
  • the feature may be an opaque material, e.g., an opaque curable encapsulant, extending substantially from a surface of the optics stack furthest from the sensor substrate to the sensor substrate along a stacking direction of the optics stack.
  • the opaque material may shield the camera system from at least one of electro-magnetic interference radiation and light at wavelengths to be detected by the detector.
  • the camera system may include an additional structure in electrical communication with the detector, wherein the opaque material extends along the sensor substrate and the additional structure.
  • the feature may be on a surface of the optics stack furthest from the sensor substrate and extends above a surface on which the optical element is provided.
  • the feature may be an absorptive polymer.
  • the camera system may include a conductive material, e.g., a metal, on the absorptive polymer.
  • the absorptive material may be provided on a plurality of optics stacks secured to a plurality of detectors on a common substrate.
  • the absorptive material may be provided on a plurality of optics stacks secured on a common substrate.
  • the camera system may include a mechanical feature on the common substrate, and an absorptive polymer substantially filling a region between the feature and the mechanical feature.
  • a conductive material e.g., metal, may be on the absorptive polymer.
  • the feature may be an opaque material extending substantially from a surface of the optics stack furthest from the sensor substrate to the sensor substrate along a stacking direction of the optics stack.
  • the opaque material may partially overlap the surface of the optics stack furthest from the sensor substrate.
  • the opaque material may be adjacent the optics stack, may abut the optics stack, may extend along the sensor substrate, may directly contact the sensor substrate, and/or may be directly on a surface of the sensor substrate having the detector.
  • a conductive layer e.g., a metal layer, may be on the opaque material.
  • the opaque material may be shorter than a tallest element on the surface of the optics stack furthest from the sensor substrate.
  • the tallest element may be a refractive surface.
  • At least one of the above and other features and advantages may be realized by providing a method of shielding radiation for a camera system including an imaging system and a detector, the method including providing a plurality of imaging systems secured to a plurality of detectors on a common substrate, and providing a plurality of features shielding the camera systems, each feature being external to a corresponding optics stack.
  • FIGS. IA to IH illustrate cross-sectional views in stages of a method of providing a radiation shield in accordance with an embodiment of the present invention
  • FIG. 2 illustrates a cross-sectional view of a camera system in accordance with an example embodiment of the present invention
  • FIG. 3 illustrates a cross-sectional view of a camera system in accordance with another example embodiment of the present invention
  • FIG. 4 illustrates a cross-sectional view of a camera system in accordance with an example embodiment of the present invention
  • FIG. 5 illustrates a cross-sectional view of a camera system in accordance with another example embodiment of the present invention
  • FIG. 6 illustrates a cross-sectional view of a camera system in accordance with another example embodiment of the present invention
  • FIGS. 7A and 7B illustrate cross-sectional views in stages of a method of providing a radiation shield in accordance with an embodiment of the present invention
  • FIGS. 8 A and 8B illustrate top views of a resultant structure in accordance with the example embodiment of FIGS. 7A and 7B
  • FIG. 9 illustrates a cross-sectional view of a camera system in accordance with another example embodiment of the present invention
  • FIG. 10 illustrates a cross-sectional view of a camera system in accordance with another example embodiment of the present invention.
  • the term "wafer” should be understood as meaning any substrate on which a plurality of components are formed which are to be vertically separated prior to final use.
  • the term “camera system” should be understood as meaning any system including an optical imaging system relaying optical signals to a detector, e.g., an image capture system, which outputs information, e.g., an image. Dashed lines dividing a plurality of camera systems indicate lines along which the camera systems may be singulated, e.g., diced.
  • a shield for blocking unwanted radiation may be provided at a wafer level, i.e., before final singualtion into individual cameras.
  • a shield for blocking radiation may be integral with a camera system.
  • a shield for blocking radiation may provided such blocking without substantially increasing a thickness of the camera.
  • Such a shield may be, e.g., opaque, absorptive and/or conductive.
  • an electrical I/O mount 110 may include a printed circuit board (PCB) substrate 120 and a passivation layer 130.
  • the PCB substrate 120 may include a conductive pad 122, part of which may be exposed through the passivation layer 130, electrical interconnects 124 extending through the PCB substrate 120, and terminal electrical contacts 126.
  • the first and second spacers 182, 184 may be an optically absorbing material, e.g., a raw polyimide (e.g., Kapton® from DuPont Electronics), a pigmented (e.g., black) polyimide, another type of polymer (e.g., PSKTM 2000 from Brewer Science Specialty Materials), a black chrome, another type of metal, anodized metal, dry film, ceramic, a pigmented, e.g., black, adhesive, glass, or silicon, a photosensitive glass (e.g., Foturan® from Schott AG or PEG3 from Hoya Corporation of Tokyo, Japan), etc.
  • a raw polyimide e.g., Kapton® from DuPont Electronics
  • a pigmented (e.g., black) polyimide e.g., another type of polymer (e.g., PSKTM 2000 from Brewer Science Specialty Materials)
  • a black chrome e.g., another type of metal
  • optically absorbing materials may be provided in sheets, i.e., in solid form, and punched, drilled, or otherwise patterned without necessarily using lithographic techniques.
  • the optical absorbing material may be spun, coated, or laminated onto an adjacent substrate. Further, any of the optically absorbing materials may be further coated to further enhance their suppression properties.
  • optically absorbing materials may be flexible, conformal, and/or compressible in the stacking direction, which may help facilitate the securing thereof to a surface that is not substantially planar, e.g., has surface roughness, warpage, or partially covers a feature on the surface. Additionally, the surface may be warped due to stress of provision of different components, e.g. dielectric thin films, polymers, etc.
  • first and second spacers 182, 184 may be formed from spacer wafers, which may be made of optically absorbing and/or coated plastics. While sidewalls of the first and second spacers 182, 184 are shown as being straight, e.g., formed by dicing or patterning, they may be angled in accordance with how the first and second spacers 182, 184 are formed, e.g., at an etch angle of a particular material used for the first and second spacers 182, 184.
  • first and second spacers 182, 184 may be an adhesive material, e.g., an epoxy that is precisely provided on planar portions of one or both adjacent substrates, e.g., as disclosed in commonly assigned U.S. Patent No. 6,669,803, the contents of which are herein incorporated by reference in their entirety.
  • first and second spacers 182, 184 are illustrated as being a separate element from the adjacent substrates, the first and second spacers 182, 184 may be integral with either one or both of the adjacent substrates.
  • the first substrate 155 may include a first refractive convex surface 156, which may assist in imaging the light input thereto.
  • a second surface 158 of the first substrate 155 may be planar.
  • An infrared (IR) filter may be on the second surface 158.
  • the second substrate 160 may include a planar first surface 162 and a second refractive convex surface 164.
  • the third substrate 165 may include a refractive, concave surface 166 and a planar surface 168 facing the sensor substrate 170.
  • the concave surface 166 may flatten the field of the image, so that all image points may be imaged at the same plane onto an active area of a detector array on the sensor substrate 170.
  • FIG. 1 B and other embodiments provided herein are exemplary, and that different locations, different numbers of optical surfaces, and different shapes of optical surfaces, including concave, convex, and aspheric surfaces, may be incorporated into a particular optical design for a particular camera system 140. Further, while a wire-bond is illustrated in FIG. IB, different mechanisms for realizing external electrical connections may be employed.
  • a single lens system may be used for all colors, and a color filter (e.g., a Bayer filter) may be provided directly on a detector array (i.e., an array of detectors/sensors, each of which is device for receiving light and generating an electrical signal representing an intensity of the received light).
  • this lens system may be provided in any number, e.g., three or four, sub-cameras for each camera system, with a design and/or location of the color filters may be varied.
  • Such lens stack designs for a camera, as well as alternative electrical connections may be found, for example, in commonly assigned, co-pending U.S. Provisional Patent Application No. 60/855,365 filed October 31, 2006, U.S.
  • the third substrate 165 of the optics stack 150 may serve as a cover plate for the sensor substrate 170. Alternatively, a separate cover plate may be provided.
  • a standoff 180, providing accurate spacing between the optics stack 150 and the sensor substrate 170, may be provided between the optics stack 150 and the sensor substrate 170.
  • the sensor substrate 170 may include a detector array 172 and an array of microlenses 174 on top of the detector array 172.
  • the detector array 172 may be a CMOS photodiode array or a CCD array.
  • the third substrate 165 and the standoff 180 may seal the active area of the detector array 172.
  • the third substrate 165 may be formed directly on the standoff 180. While the standoff 180 is illustrated as being a separate element from the sensor substrate 170 and the third substrate 165, the standoff may be integral with either one or both of the sensor substrate 170 and the third substrate 165.
  • the standoff 180 may be made of any materials and/or processes noted above regarding the first and second spacers 182, 184, or may be constructed of plated metal or polymer.
  • the sensor substrate 170 may further include bonding pads 176 external to the seal.
  • a wire bond 178 may electrically connect the bonding pads 176 to the conductive pads 1 12 on the PCB substrate 120.
  • the plurality of camera systems 140 may be encapsulated with an opaque material 190, i.e., opaque at a design thickness, e.g., about 20-30 microns, to wavelengths to which the detector array is sensitive.
  • the opaque material 190 may have a refractive index similar to that of a majority of material used for the optics stack 150. For example, when the majority of the optics stack 150 is glass, having a refractive index of about 1.46, the refractive index of the opaque material 190 may be between about 1.4 and 1.6.
  • the opaque material 190 may have a low viscosity, so that it may be readily dispensable.
  • Other practical specifications for consideration in selecting the opaque material 190 may include a low coefficient of thermal expansion (CTE), preferably as low as possible, a low modulus, low shrinkage after application, good adhesion to the optics stack 150, and low cost.
  • CTE coefficient of thermal expansion
  • the opaque material 190 may be a polymer, e.g., Cookson Group STAYCHIP®
  • the opaque material 190 may be provided on the camera system 140 using, e.g., injection molding, replication, and/or coating. As illustrated in FIG. 1C, the opaque material 190 is not to cover the first refractive convex surface 156. If replication is used to supply the opaque material 190, using a tool 192 as illustrated in FIG. 1C, the opaque material 190 may be a photoimageable polymer that may be developed and removed from the top of the camera system 150. If coating is used, spray coating a photoimageable polymer while continuously spinning a photoimageable polymer on a heated chuck may be employed. Thus, a plurality of encapsulated camera systems 200 may be realized.
  • the method may proceed to metallization, as illustrated in FIGS. ID to IH.
  • a conductive material 210 may be provided, e.g., sputtered, on the encapsulated camera systems 200.
  • a photoresist 212 may be provided on the conductive material 210. Since the topography of the encapsulated camera system 200 may be extreme, making uniform application of the photoresist difficult, the photoresist 212 may be electrophoretically coated.
  • the photoresist 212 may be then processed, e.g., soft cured, exposed, and developed, to form a photoresist pattern 214, as illustrated in FIG. IF, i.e., leaving the conductive material 212 covering an upper surface of the encapsulated camera system 200, here, the first refractive surface 156, exposed. Then, the exposed conductive material 210 may be removed, e.g., etched, to form a conductive pattern 220, as illustrated in FIG. IG. As illustrated in FIG. IH, the photoresist pattern 214 may then be removed and the electrical I/O mount 110 may be singulated to form a plurality of individual metallized, encapsulated camera systems 240.
  • a conductive pattern 220' may be electrically connected to one of the conductive pads 122 so that it is grounded.
  • additional structure may be in communication with the I/O mount 1 10 and may be encapsulated.
  • a system 290 may include an additional device 280, e.g., a signal processor or memory, secured between the camera system 140 and the electrical I/O mount 110, and may further be electrically connected to one of the conductive pads 122.
  • the opaque material on the upper surface of the optics stack 150 may not be sufficiently thick to serve as a sun shield. In other words, this material may not adequately block light outside the field of view (FOV) incident on the upper surface.
  • FOV field of view
  • a camera system 40 including a sun shield 480 is illustrated in FIG. 4.
  • the camera system 40 may include an optics stack 400 and a sensor substrate 470.
  • the optics stack 400 may include a first substrate 410, a second substrate 420, and a third substrate 430 secured together as a stack.
  • adjacent substrates in the optics stack 400 may be secured via first and second spacers 440, 450.
  • the first and second spacers 440, 450 may be made in accordance with any of the material and/or techniques noted above.
  • the first substrate 410 may include a first surface 412 and a second surface 414.
  • the first surface 412 may have a refractive convex element 416, which may assist in imaging the light input thereto.
  • the second surface 414 may be planar.
  • the second substrate 420 may include a first surface 422 and a second surface
  • the first surface 422 may have a refractive concave element 426, which may assist in imaging the light input thereto.
  • the second surface 424 may include a refractive element 428, and radii of curvature may vary across the refractive element 428.
  • the refractive element 428 may have a central convex region having a first radius of curvature and a peripheral concave region having a varying radius of curvature.
  • the third substrate 430 may include a first surface 432 and a second surface 434.
  • the first surface 432 may have a refractive element 436, and radii of curvature may vary across the refractive element 436.
  • the refractive element 436 may include a central concave region having a second radius of curvature and a peripheral convex region having a third radius of curvature.
  • the second surface 434 may be substantially planar and may be directly secured to a cover plate 460 for the sensor substrate 470.
  • the third substrate 430 may be secured to the cover plate 460 using adhesive materials, e.g., epoxy, solder, UV cured adhesives, thermally cured adhesives, etc.
  • adhesive materials e.g., epoxy, solder, UV cured adhesives, thermally cured adhesives, etc.
  • the adhesive materials may be used on the first and third substrates 410 to 430 to attach the respective substrates together via the first and second spacers 440, 450, respectively.
  • Other adjoining techniques may be used to attach the substrates to adjacent substrate/plates.
  • the substrates 410 to 430 in the optics stack 400 may all be the same material or may be different materials. Additionally, some or all of the optical elements in the optics stack 400 may be replicated and be in plastic, rather than transferred to the substrate.
  • the optics stack 400 may further include the sun shield 480 on the first surface
  • the sun shield 480 may be made at the wafer level or may be part of an encapsulation process in which a bead is added on the top surface of the optics stack.
  • the sun shield 480 may block light incident thereon at an angle of greater than +/- 30 degrees.
  • the sun shield 480 may be configured as a spacer, similar to the spacers 440 and 450.
  • the sun shield 480 when configured as a spacer wafer, while sidewalls 482 are illustrated as being straight, they may also be angled or slanted, as long as the sidewalls 482 block stray light from entering the camera system 40.
  • the sun shield may be as thin as possible while blocking substantially all light outside the FOV to which the detector is sensitive.
  • the sun shield 480 may extend less the
  • the sun shield 480 may add less than about 10% to overall system height. The closer the sun shield 480 is provided to the optical aperture, the thinner the sun shield 480 may be while sufficiently blocking unwanted light.
  • an absorptive or opaque coating may be provided on the sidewalls 482 to facilitate blocking stray light.
  • the sun shield 480 and/or the optics stack 400 along a stacking direction may further be coated with a conductive material, as discussed above.
  • a high pressure tip located close to the top surface of the optics stack 400 may be used provide the further blocking material.
  • the refractive convex element 416 on the uppermost surface 412 of the optics stack 400 is made of a replication material, some of that replication material may still be present along dicing lanes for singulation of the optics stack 400. The presence of this replication material may result in delamination of the refractive convex element 416 during singulation.
  • delamination may be prevent or mitigated by the sunshield 480.
  • adhesive properties of the material for creating the sun shield 480 may further be considered during selection thereof.
  • sun shields 480 of adjacent optics stacks 400 may be formed by dicing through a continuous portion of material.
  • a camera system 50 may include a sun shield 580, an optics stack 500, and the sensor substrate 470.
  • the optics stack 500 may include the first substrate 410, the second substrate 420, the third substrate 430, and the second spacer 450, as in the optics stack 400. Therefore, details of these substrates may not be provided in detail hereinafter.
  • the sun shield 580 may block light only from higher angles relative to the z-direction.
  • a typical sun shield may block all light greater than a FOV, e.g., ⁇ 30°.
  • baffles e.g., a spacer 540
  • the sun shield may only be required to block all light incident at angles greater than about ⁇ 45°.
  • the sun shield 580 may be thinner than the sun shield 480.
  • a camera system 60 includes a sun shield 680, the optics stack 400, and the sensor substrate 470.
  • the sun shield 680 is smaller, e.g., is reduced in x-direction and y-direction compared to the sun shield 480, in order to accommodate a housing 600 over the optics stack 400.
  • the housing 600 may extend along a stacking direction, i.e., a z direction, of the optics stack 400. While shown as further extending substantially to the sensor substrate 470, the housing 600 may also surround the sensor substrate 470.
  • sun shield 680 is illustrated in FIG. 6 as being separate from the housing 600, the sun shield 680 and the housing 600 may be integral. In other words, after the assembly of the optics stack, the sun shield 680 may be assembled with the housing 600 so that the sun shield 680 may be part of the housing 600.
  • the housing 600 may protect and provide mechanical support to the optics stack
  • the housing 600 may be allowed to slide over the optics stack 400 and enclose substantially the entire optics stack 400. As such, the housing 600 may be used without adding significant height to the camera system 60. Further, the housing 600 may be conductive or have a conductive coating thereon to further shield the camera system 60 from EMI radiation. Further, while the housing 600 may provide a general seal for the optics stack 400, additional sealing may be realized by providing an encapsulant 620 between the housing 600 and the optics stack 400.
  • the encapsulant 620 may be an adhesive resin, e.g., AbleBond 8387, to secure the housing 600 and the optics stack 400.
  • FIGS. 7 A and 7B illustrate stages in a method of providing both a sun shield and an encapsulant for shielding a camera system 70 using dam structures in accordance to example embodiments.
  • a sun shield 780 may be formed on the upper surface of first substrate 155. Further, mechanical features 790 may be formed on the electrical I/O mount 1 10. The sun shield 780 and the mechanical feature 790 may be formed of a same material and may be simultaneously created.
  • the sun shield 780 may be formed before securing the optics stack
  • the mechanical feature 790 may be formed before wire bonding the sensor substrate 170 to the electrical I/O mount 110. Further, one or both of the sun shield 780 and the mechanical feature 790 may be formed after the wire bonded individual cameras have been singulated.
  • the sun shield 780 may both block light and may serve, with the mechanical feature 790, as a dam for a fill material 750 to encapsulate the camera system 140.
  • a shape of the sun shield 780, as seen from a top view, may be generally rectangular (as shown in FIG. 8A) or may be generally circular (as shown in FIG. 8B). These shapes may be applicable to any of the above embodiments, as well as to the mechanical feature 790.
  • the mechanical feature 790 may be provided on a top surface of the electrical I/O mount 110, e.g., outside of and adjacent to the pad 122 to which the camera system 140 is to be wire bonded. Thus, all elements of the camera system 140, including the wire bonds 178, may be encapulsated by the fill material 750, as illustrated in FIG. 7B.
  • the sun shield 780, the mechanical feature 790, and the fill material 750 maybe made of any of the dispensable materials noted above regarding the opaque material 190.
  • the sun shield 780 and the mechanical feature 790 may be formed by dispensing an opaque epoxy. Then, another epoxy may be used as the fill material 750, with the sun shield 780 and the mechanical feature 790 impeding the flow of the fill material 750, encapsulating the camera system 140.
  • the mechanical features 790 may be made of Loctite® Hysol FP 4551 or Loctite® Hysol FP 4551 TD, and the fill material 750 may be Loctite® Hysol FP 4450, Loctite® Hysol FP 4450 LV, Loctite® Hysol FP 4450 HF, or Loctite® Hysol FP 4450 HA, and so forth.
  • the epoxy used for the fill material 750 may have a viscosity that is relatively lower than that used for the sun shield 780 and the mechanical feature 790.
  • the sun shield 780 and the mechanical feature 790 may be cured before provision of the fill material 750, simultaneously with curing of the fill material 750, or after curing of the fill material 750.
  • the fill material 750 may be opaque, so as to block light. Further, the fill material 750 may be conductive or have a conductive layer thereon to further block EMI.
  • FIG. 9 illustrates a schematic cross-section of a camera system 80 in which shielding may be realized using an encapsulant 910 according to an embodiment.
  • the encapsulant 910 having a sufficiently high viscosity that the beads of the encapsulant 910 may be stacked to surround the optics stack 150.
  • the encapsulant 910 may be an adhesive resin, e.g., AbleBond 8387.
  • Use of the encapsulant 910 alone may allow the resultant camera system 80 to have a smaller footprint than in previous embodiments employing the same optics stack.
  • the remaining elements of the camera 80 may be the same as in previous embodiments, so a detailed description thereof will not be repeated.
  • FIG. 10 illustrates a schematic cross-section of a camera system 90 in which shielding may be realized using the encapsulant 910 according to an embodiment.
  • the camera system 90 illustrated in FIG. 10 may use the optics stack 150, but may use a different electrical connection scheme that previous embodiments.
  • a sensor substrate 920 may have vias or through holes extending from a top surface having a detector to a bottom surface.
  • Conductive features 930 may be accessible from the bottom surface of the sensor substrate 920 to provide external electrical connections to the detector. Details of such electrical connection may be found, for example, in the patent applications noted and incorporated above.
  • the refractive convex element 156 on the uppermost surface of the optics stack 150 is made of a replication material, some of that replication material may still be present along dicing lanes for singulation of the optics stack 150. The presence of this replication material may result in delamination of the refractive convex element 156 during singulation.
  • the encapsulant 910 along the uppermost surface and sidewalls of the optics stack 150 i.e., in the x-direction over the optics stack 150 as well as in the z-direction, as illustrated in FIGS. 9 and 10
  • delamination may be mitigated.
  • the encapsulant 910 may fill any area between the replication material and the upper substrate due to delamination, stabilizing the structure.
  • a shield at appropriate positions outside the camera system, unwanted radiation may be reduced or eliminated.
  • such a shield may not increase the thickness of the camera, may not significantly increase the thickness of the camera, and/or may be made on a wafer level.
  • first and second etc. may be used herein to describe various elements, regions, substrates or layers, and should not be limited by these terms. These terms are only used to distinguish an element, region, substrates or layer from another elements, regions, substrates or layers. Thus, a first element, region, substrates or layer discussed herein could be termed a second element, region, substrates or layer without departing from the teachings of example embodiments.
  • Example embodiments have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation. Accordingly, it will be understood by those of ordinary skill in the art that various changes in form and details may be made without departing from the spirit and scope of the example embodiments as set forth in the following claims.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

L'invention porte sur un système de caméra qui comprend un empilement optique comprenant des premier et second substrats fixés l'un à l'autre dans une direction d'empilement, l'un des premier et second substrats comprenant un élément optique, un détecteur sur un substrat de capteur, et une caractéristique (680) blindant le système de caméra, la caractéristique étant externe à l'empilement optique et s'étendant depuis une surface de l'empilement optique la plus éloignée du substrat de capteur.
PCT/US2009/002755 2008-05-06 2009-05-05 Système de caméra comprenant un blindage contre les rayonnements et procédé de blindage contre les rayonnements Ceased WO2009137022A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US7157408P 2008-05-06 2008-05-06
US61/071,574 2008-05-06

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WO2009137022A1 true WO2009137022A1 (fr) 2009-11-12

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EP2390702A1 (fr) * 2010-05-27 2011-11-30 VisEra Technologies Company Limited Module de caméra et son procédé de fabrication
CN102809876A (zh) * 2011-06-03 2012-12-05 采钰科技股份有限公司 相机模块及其制造方法
US9851478B2 (en) 2016-02-10 2017-12-26 Microsoft Technology Licensing, Llc Optical cross talk mitigation for optical device having disrupting features formed on a shield
US10911656B2 (en) 2017-11-21 2021-02-02 Microsoft Technology Licensing, Llc Optical isolation systems for displays

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EP1160875A1 (fr) * 2000-05-13 2001-12-05 Tyco Electronics AMP GmbH Composant électro-optique comprenant un boitier recouvert d'un métal
WO2004027880A2 (fr) * 2002-09-17 2004-04-01 Koninklijke Philips Electronics N.V. Dispositif camera, procede de fabrication associe, ensemble tranche
EP1434426A2 (fr) * 2002-12-18 2004-06-30 Sanyo Electric Co., Ltd. Module de prise de vue et sa méthode de fabrication
WO2005041561A1 (fr) * 2003-10-27 2005-05-06 Koninklijke Philips Electronics N.V. Module à caméra et son procédé de fabrication
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WO2008011003A2 (fr) * 2006-07-17 2008-01-24 Tessera North America, Inc. Système de caméra et méthodes associées
WO2008060630A2 (fr) * 2006-11-17 2008-05-22 Tessera North America, Inc. Structures de réduction de bruit interne dans des systèmes de caméra employant une pile optique et des procédés associés
WO2008063528A2 (fr) * 2006-11-16 2008-05-29 Tessera North America, Inc. Régulateur de lumière parasite dans des systèmes de caméra utilisant un empilement d'éléments optiques, et procédés associés

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EP1160875A1 (fr) * 2000-05-13 2001-12-05 Tyco Electronics AMP GmbH Composant électro-optique comprenant un boitier recouvert d'un métal
WO2004027880A2 (fr) * 2002-09-17 2004-04-01 Koninklijke Philips Electronics N.V. Dispositif camera, procede de fabrication associe, ensemble tranche
EP1434426A2 (fr) * 2002-12-18 2004-06-30 Sanyo Electric Co., Ltd. Module de prise de vue et sa méthode de fabrication
WO2005041561A1 (fr) * 2003-10-27 2005-05-06 Koninklijke Philips Electronics N.V. Module à caméra et son procédé de fabrication
US20050237415A1 (en) * 2004-04-26 2005-10-27 Yung-Cheol Kong Image sensor module having auto-aligned lens, and method of fabricating the same, and method of automatically controlling focus of lens
WO2008011003A2 (fr) * 2006-07-17 2008-01-24 Tessera North America, Inc. Système de caméra et méthodes associées
WO2008063528A2 (fr) * 2006-11-16 2008-05-29 Tessera North America, Inc. Régulateur de lumière parasite dans des systèmes de caméra utilisant un empilement d'éléments optiques, et procédés associés
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EP2390702A1 (fr) * 2010-05-27 2011-11-30 VisEra Technologies Company Limited Module de caméra et son procédé de fabrication
CN102279506A (zh) * 2010-05-27 2011-12-14 采钰科技股份有限公司 照相模块及其制造方法
TWI475674B (zh) * 2010-05-27 2015-03-01 采鈺科技股份有限公司 照相模組及其製造方法
CN102809876A (zh) * 2011-06-03 2012-12-05 采钰科技股份有限公司 相机模块及其制造方法
CN102809876B (zh) * 2011-06-03 2015-01-21 采钰科技股份有限公司 相机模块及其制造方法
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US9502461B2 (en) 2011-06-03 2016-11-22 Visera Technologies Company Limited Methods of fabricating camera module and spacer of a lens structure in the camera module
US9851478B2 (en) 2016-02-10 2017-12-26 Microsoft Technology Licensing, Llc Optical cross talk mitigation for optical device having disrupting features formed on a shield
US10911656B2 (en) 2017-11-21 2021-02-02 Microsoft Technology Licensing, Llc Optical isolation systems for displays

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