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WO2009129989A1 - Dispositif et procédé de traitement de tranches de silicium ou d'objets plats - Google Patents

Dispositif et procédé de traitement de tranches de silicium ou d'objets plats Download PDF

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Publication number
WO2009129989A1
WO2009129989A1 PCT/EP2009/002881 EP2009002881W WO2009129989A1 WO 2009129989 A1 WO2009129989 A1 WO 2009129989A1 EP 2009002881 W EP2009002881 W EP 2009002881W WO 2009129989 A1 WO2009129989 A1 WO 2009129989A1
Authority
WO
WIPO (PCT)
Prior art keywords
transport
rollers
substrates
individual
transport shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2009/002881
Other languages
German (de)
English (en)
Inventor
Jörg LAMPPRECHT
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gebrueder Schmid GmbH and Co
Original Assignee
Gebrueder Schmid GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gebrueder Schmid GmbH and Co filed Critical Gebrueder Schmid GmbH and Co
Publication of WO2009129989A1 publication Critical patent/WO2009129989A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass

Definitions

  • the invention relates to a device for the treatment of silicon wafers or substrates or flat objects according to the preamble of claim 1 and to a method for the treatment of substrates or silicon wafers.
  • the invention relates to an etching device for substrates.
  • the pass-through path has transport means in the form of transport rollers on which the substrates rest with a lower side.
  • transport rollers On the top of the substrates are movable and resiliently mounted narrow contact rollers for electrical contacting for galvanizing the tops of the substrates.
  • the invention has for its object to provide an aforementioned device and a method by which disadvantages of the prior art can be avoided and in particular a uniform and full-surface texturing of the sides of the substrates is achieved with minimal mechanical stress on the substrates.
  • the means of transport for the transport of the substrates on the passage path through the treatment chamber have lower transport rollers, which thus form, so to speak, the passage path.
  • the substrates lie with their underside on these lower transport rollers and are transported to and from them, so to speak.
  • the transport means also have upper transport rollers, which are arranged above the lower transport rollers. These upper transport rollers lie on top of the substrates. They have individual, separate individual roles, which are arranged or mounted on an upper transport shaft. These individual rollers have a relatively small distance from one another, for example a few millimeters.
  • drive means are provided for each individual roller, so that they not only contribute to the safe and uniform transport of the substrates, but also, above all, do not grind on the upper side of the sensitive substrates or negatively adversely affect them, in particular mechanically. cally.
  • a storage of the individual rollers on the upper transport shaft has a radial clearance in such a way that a single roller relative to the transport shaft is movable, in the radial direction. This radial play makes it possible for each individual roller to bear on the top side of the substrates as well as possible with a rigid upper transport shaft.
  • a major advantage of the invention is that the top side of the substrate is not only additionally extended by the contact with the treatment medium by a single roller, which advantageously should extend over the entire width of a substrate to be treated with a plurality of substrates transported side by side on the passage path is wetted.
  • a treatment medium such as etching liquid or the like in a texturing of silicon wafers for solar cells resulting gas bubbles can be removed or pushed away.
  • the single rollers have no task such as electrical contacting of the substrates, but the uniform distribution of the treatment medium and the removal of gas bubbles at the top of the substrates against which they rest.
  • the radial clearance thus provides above all for a mobility of the single roller relative to the upper transport shaft and thus also relative to the other single rollers in the vertical direction, wherein advantageously the transport shaft - A -
  • a radial movability of a single roller relative to the upper transport shaft can be between 1% and 20% of the diameter of the single roller. It is advantageous about 5% to 10%, because then still a sufficiently good storage of the single role is ensured on the transport shaft.
  • a single-roller may have a longitudinal bore through which the transport shaft extends.
  • the diameter of the longitudinal bore is above the diameter of the transport shaft as formation of the radial clearance, whereby the single roller can be moved just on the transport shaft in the radial direction.
  • the diameter of the longitudinal bore is greater than the diameter of the upper transport shaft in the aforementioned measure. Transport shaft and longitudinal bore are advantageous circular.
  • the individual rollers should have so much distance from one another that they do not interfere with one another or that their respective radial movability is not impaired or impaired by an adjacent single roller.
  • they should be relatively wide to cover the widest possible wide substrates and to squeeze liquid from the surface thereof.
  • a distance of the individual rollers to each other of a maximum of a few millimeters, for example 1 mm to 10 mm or even only up to 5 mm.
  • the individual rollers extend on the upper transport shaft over the entire width of the passage path. Substrates to be treated can then, as it were, be laid in webs one behind the other on the pass-through track and are each covered by a single roller over their entire width. Furthermore, it is advantageous if the zel rollers are slightly wider than the substrates. They may be, for example, 5% to 20% wider or laterally survive.
  • the aforesaid drive means for a single reel also advantageously have play in their engagement with the single reel, both in the radial direction corresponding to the radial play of the bearing and in the circumferential direction.
  • the drive means may have a projecting from the transport shaft projection which engages in a correspondingly larger recess formed on the single-role.
  • a projection on a single roller can engage in a corresponding recess in the transport shaft.
  • a projection is advantageously formed as a separate component, which is attached to the transport shaft or the single-role, preferably permanently or permanently attached.
  • the projections for individual rollers on a transport shaft have a different orientation or orientation to each other, ie, preferably each have in different directions. Then, as the transport shaft rotates, possible jerky motions due to the intermeshing of the drive means are distributed, so that this does not occur simultaneously with several or all single rollers.
  • the projections can be rotated in each case by the same amount against each other, so divided by about 360 ° by the number of individual roles.
  • the surface of a single roll can be made of a hard plastic material in solid or one-piece production.
  • it is soft, for example made of a rubber or rubber-like material.
  • either a hard core of the single roll, in particular with the aforementioned through hole for the transport shaft, can be coated with rubber.
  • a replaceable rubber coating can be applied, for example formed in a tubular form and then pulled up under stretching. So it is possible to replace a used or damaged rubber flooring relatively easily and quickly.
  • FIG. 1 is a view of a treatment device according to the invention in the direction of the continuous path seen with lower transport rollers and upper single rollers,
  • Fig. 2 is an enlarged view from the side illustrating the radial play of a single roller on a transport shaft
  • Fig. 3 is a view similar to Fig. 2 showing the drive means.
  • a treatment device 11 according to the invention is shown, as it can be configured as a whole system, for example, similar to the aforementioned DE 102005038450 A1. It has a plurality of lower transport rollers 13, which extend over the entire width of a passage path formed by them. Furthermore, the transport rollers 13 are driven in a manner not shown. On top of them, there are five silicon wafers 15 next to one another, so that, as it were, five long rows of silicon wafers 15 are transported by the transport rollers 13 on the passage path. For example, a single such silicon wafer 15 may be square or square with an edge length of about 15 cm.
  • the passage path or the silicon wafers 15 are located in an etching bath, not shown, with an etching solution into which they are immersed or which is brought to an underside 16 of the silicon wafer 15 and at the top 17 thereof.
  • an etching solution into which they are immersed or which is brought to an underside 16 of the silicon wafer 15 and at the top 17 thereof.
  • This is known in principle from the initially mentioned DE 102005038450 A1.
  • five individual rollers 22 are arranged on an upper transport shaft 20, which is a continuous driven shaft. These single roles are, as described above, for example, made of plastic and each identical.
  • the individual rollers 22 have a central longitudinal bore 23. Through this, the transport shaft 20 is guided.
  • the diameter of the longitudinal bore 23 is larger by about 20% than the diameter of the transport shaft 20. This results in the invention radial play with the mobility of the single roller 22 relative to the transport shaft 20 and thus, for example, also in the direction perpendicular above.
  • the diameter of the longitudinal bore 23 should not be so above the diameter of the transport shaft 20 therein that a guide of the individual rollers 22 parallel to each other and at right angles to the direction of passage of the silicon wafer 15 is at risk.
  • Fig. 2 it can be seen that in the event that a single roller 22 rests right with its outer side 24 on a top 17 of the silicon wafer 15, the single roller 22 does not depend on the transport shaft 20 so to speak. Rather, the weight of the single roller 22 is supported by the silicon wafer 15. This can also be recognized by the fact that between the top of the transport shaft 20 and the opposite inner side of the longitudinal bore 23 there is a certain distance. This thus causes the single roller 22 rests with its weight on the silicon wafer 15 and thus with a corresponding pressing force, which can be adjusted so to speak about the weight of the single-role. Due to this contact, etching solution, which is located on the upper side 17 of the silicon wafer 15, is well distributed, mixed and refreshed.
  • the leftmost single-role is not on a silicon wafer 15 and therefore depends, so to speak, only on the transport shaft and at the same time on the transport roller 13.
  • the difference in height of the individual roles can be recognized from a comparison of the dashed line to the dot-dash line.
  • the dashed line passes through the center of the transport shafts 20, the dot-dash line through the leftmost single role.
  • each individual roller 22 can be placed on an upper side 17 of the silicon wafer 15 by the movable bearing with its weight force and eliminate gas bubbles or the like there. Furthermore, as can be seen, for example, from FIG. 2 on the left, it is also possible without problems that, for example, in one of the five tracks according to FIG. 1, no silicon wafer 15 is up.
  • the corresponding single roller 20 can then lower to the underlying lower transport roller 13 or be held only by the transport shaft 20. In this respect, it is also generally of some advantage to provide the single roller 22 just above the lower transport rollers 13.
  • the single roll 22 lifts up almost automatically and rolls off on its upper side 17.
  • One of the tasks of the upper transport shaft 20 is thus both an approximate support and positioning of the individual rollers 22 and a drive of the individual rollers, which will be discussed below.
  • FIG. 3 An aforementioned inventive drive of the single rollers 22 on the upper transport shaft 20, by which the rolling of the upper side 17 of the silicon wafer 15 is improved, can be seen in Fig. 3.
  • clamping rings 26 are attached, for example screwed, glued or welded. These clamping rings 26 have on one side an integrally formed protruding projection 27, so that the cross section of a clamping ring 26 is circular with protruding protrusion 27.
  • the clamping ring 26 is attached to an edge region of a single roller 22 on the transport shaft 20, for example, in the individual rollers 22 as shown in FIG. 1 each in the right end.
  • a single roller 22 not only the circular longitudinal bore 23, but a recess 29 which corresponds in shape to the above-described cross section of the clamping ring 26 together with projection 27.
  • a recess 29 in the single roller 22 is a piece larger, for example, each with 2 to 5 mm distance thereto, see Fig. 3.
  • this distance is similar to the difference between the radius of the longitudinal bore 23 and radius of the transport shaft 20th as shown in FIG. 2, possibly something below.
  • This ensures that the drive means with the clamping ring 26 and projection 27, the mobile storage or the radial clearance of the single roller 22 on the transport shaft 20 does not restrict or affect, especially in the vertical direction.
  • this also achieves a certain amount of play in terms of torque transmission, that is to say in terms of torque transmission. This also serves for good free mobility of the single roller 22 on the transport shaft 20th
  • each different orientation of the projections 27 of the clamping rings 26 are detected, as on a single transport shaft 20, the five individual rollers 22 as shown in FIG. 1 similarly rotated projections 27 have.
  • the offset of the projections 27 along a transport shaft for example, each 90 °.
  • the distance between the individual rollers 22 to each other is a few millimeters. He can also be a bit less.
  • a further, basically similar clamping ring may be provided, for example at the respective other end of a single roller. He may also have a projection similar to the projection 27 of FIG. 3 and thus also be used as a drive means, but he does not have this.
  • Another general advantage of this single-roll design is that it does not require separate or additional means to achieve radial play and mobility.
  • the design is therefore both very simple and very robust and easy to manufacture as well as safe and reliable in operation.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)

Abstract

L'invention concerne un dispositif de traitement pour la texturation par gravure de tranches de silicium, ce dispositif comportant une bande continue traversant une chambre de traitement contenant une solution de gravure ainsi que des moyens transporteurs pour le transport des substrats. Les moyens transporteurs comprennent des rouleaux transporteurs inférieurs placés le long de la bande continue, sur laquelle les tranches de silicium reposent par leur face inférieure. Les moyens transporteurs comprennent également des galets transporteurs supérieurs situés au-dessus des rouleaux transporteurs inférieurs et destinés à venir s'appuyer sur la face supérieure des substrats, les galets transporteurs supérieurs comprenant des galets individuels séparés et juxtaposés sur un arbre de transport supérieur à une très faible distance les uns des autres. Les galets individuels sont montés sur l'arbre de transport supérieur avec un jeu radial, qui permet aux galets individuels de se déplacer dans le sens radial par rapport à l'arbre de transport, et peuvent être adaptés à des substrats de différente épaisseur. Des moyens d'entraînement sont prévus pour chaque galet individuel.
PCT/EP2009/002881 2008-04-24 2009-04-21 Dispositif et procédé de traitement de tranches de silicium ou d'objets plats Ceased WO2009129989A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008022282.8 2008-04-24
DE102008022282A DE102008022282A1 (de) 2008-04-24 2008-04-24 Einrichtung und Verfahren zur Behandlung von Silizium-Wafern oder flachen Gegenständen

Publications (1)

Publication Number Publication Date
WO2009129989A1 true WO2009129989A1 (fr) 2009-10-29

Family

ID=40872484

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/002881 Ceased WO2009129989A1 (fr) 2008-04-24 2009-04-21 Dispositif et procédé de traitement de tranches de silicium ou d'objets plats

Country Status (3)

Country Link
DE (1) DE102008022282A1 (fr)
TW (1) TW201003825A (fr)
WO (1) WO2009129989A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011078686A1 (fr) 2009-12-21 2011-06-30 Rec Wafer Norway As Nettoyage d'une pile de plaquettes
CN117858367A (zh) * 2024-03-06 2024-04-09 广州市巨龙印制板设备有限公司 一种pcb板加工用褪洗装置

Families Citing this family (6)

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Publication number Priority date Publication date Assignee Title
DE102009060931A1 (de) 2009-12-23 2011-06-30 Gebr. Schmid GmbH & Co., 72250 Verfahren und Vorrichtung zur Behandlung von Siliziumsubstraten
CN101862738A (zh) * 2010-05-14 2010-10-20 苏州聚晶科技有限公司 硅片水平清洗机滚轮
DE102011000861A1 (de) * 2011-02-22 2012-08-23 Rena Gmbh Verfahren zum Behandeln eines Objekts, insbesondere eines Solarzellensubstrats, und Vorrichtung zur Durchführung des Verfahrens
CN103668377B (zh) * 2012-09-14 2017-06-30 无锡尚德太阳能电力有限公司 太阳电池设备及其自重式软接触传导装置
CN104695026A (zh) * 2015-03-20 2015-06-10 青海大学 多晶硅片的制绒方法
DE202018005266U1 (de) 2018-11-14 2019-03-22 H2GEMINI Technology Consulting GmbH Vorrichtung zur Ätzung von Silizium Substraten

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US5007445A (en) * 1990-02-26 1991-04-16 Advanced Systems Incorporated Dynamic flood conveyor with weir
JPH1117316A (ja) * 1997-06-27 1999-01-22 Matsushita Electric Ind Co Ltd プリント配線板の製造方法
WO2001081657A2 (fr) * 2000-04-20 2001-11-01 Atotech Deutschland Gmbh Element de contact elastique
EP1354830A1 (fr) * 2002-04-15 2003-10-22 Rena Sondermaschinen GmbH Rouleau de convoyeur, dispositif de maintien et système de transport pour pièces plates

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AT64515B (de) 1910-12-31 1914-04-25 Universal Speed Control Compan Expansionssteuerung mit Füllungsänderung für Kraftmaschinen mit kreisenden, zur Drehachse parallelen Zylindern.
ATE64515T1 (de) * 1985-11-15 1991-06-15 Leeb Karl Erik Vorrichtung zur verwendung bei der herstellung von leiterplatten, sowie verfahren zur herstellung dieser vorrichtung.
DE10210538B4 (de) * 2002-03-05 2004-11-18 Atotech Deutschland Gmbh Horizontal-Durchlaufanlage und Verfahren zum galvanotechnischen Behandeln von Behandlungsgut
DE102005038450A1 (de) 2005-08-03 2007-02-08 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Substraten
DE102005039100A1 (de) * 2005-08-09 2007-02-15 Gebr. Schmid Gmbh & Co. Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung
DE102005057109A1 (de) * 2005-11-26 2007-05-31 Kunze-Concewitz, Horst, Dipl.-Phys. Vorrichtung und Verfahren für mechanisches Prozessieren flacher, dünner Substrate im Durchlaufverfahren
DE102007026081A1 (de) 2007-05-25 2008-11-27 Gebr. Schmid Gmbh & Co. Verfahren zur Behandlung von Siliziumwafern, Behandlungsflüssigkeit und Siliziumwafer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5007445A (en) * 1990-02-26 1991-04-16 Advanced Systems Incorporated Dynamic flood conveyor with weir
JPH1117316A (ja) * 1997-06-27 1999-01-22 Matsushita Electric Ind Co Ltd プリント配線板の製造方法
WO2001081657A2 (fr) * 2000-04-20 2001-11-01 Atotech Deutschland Gmbh Element de contact elastique
EP1354830A1 (fr) * 2002-04-15 2003-10-22 Rena Sondermaschinen GmbH Rouleau de convoyeur, dispositif de maintien et système de transport pour pièces plates

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011078686A1 (fr) 2009-12-21 2011-06-30 Rec Wafer Norway As Nettoyage d'une pile de plaquettes
CN117858367A (zh) * 2024-03-06 2024-04-09 广州市巨龙印制板设备有限公司 一种pcb板加工用褪洗装置
CN117858367B (zh) * 2024-03-06 2024-06-11 广州市巨龙印制板设备有限公司 一种pcb板加工用褪洗装置

Also Published As

Publication number Publication date
TW201003825A (en) 2010-01-16
DE102008022282A1 (de) 2009-10-29

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