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WO2009114372A3 - Thermal interconnect and integrated interface systems, methods of production and uses thereof - Google Patents

Thermal interconnect and integrated interface systems, methods of production and uses thereof Download PDF

Info

Publication number
WO2009114372A3
WO2009114372A3 PCT/US2009/036113 US2009036113W WO2009114372A3 WO 2009114372 A3 WO2009114372 A3 WO 2009114372A3 US 2009036113 W US2009036113 W US 2009036113W WO 2009114372 A3 WO2009114372 A3 WO 2009114372A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat spreader
layer
coupling
spreader component
thermally conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2009/036113
Other languages
French (fr)
Other versions
WO2009114372A2 (en
Inventor
Patrick Underwood
Arthur Falk
Paul Silinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Priority to US12/666,004 priority Critical patent/US20100319898A1/en
Publication of WO2009114372A2 publication Critical patent/WO2009114372A2/en
Publication of WO2009114372A3 publication Critical patent/WO2009114372A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)

Abstract

Heat spreader assemblies are disclosed that include a heat spreader component, at least one coupling layer, and at least one thermally conductive layer, wherein the heat spreader component is coupled to the at least one thermally conductive layer through the at least one coupling layer. In some instances, heat spreader assemblies include an aluminum-based heat spreader component, at least one coupling layer, wherein the coupling layer comprises zinc, a zinc-based material, tin, a tin-based material or a combination thereof, and at least one thermally conductive layer comprising nickel, wherein the heat spreader component is coupled to the at least one thermally conductive layer through the at least one coupling layer. Methods of forming heat spreader assemblies are also disclosed that include providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; providing at least one coupling material, wherein the coupling material is directly deposited onto the bottom surface of the heat spreader component; and depositing, applying or coating at least one thermally conductive coating, film or layer on at least part of the bottom surface of the heat spreader component. In several embodiments, heat spreader component comprises a native oxide layer, an oxide barrier layer or a combination thereof that is removed before application of the at least one coupling material.
PCT/US2009/036113 2008-03-13 2009-03-05 Thermal interconnect and integrated interface systems, methods of production and uses thereof Ceased WO2009114372A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/666,004 US20100319898A1 (en) 2008-03-13 2009-03-05 Thermal interconnect and integrated interface systems, methods of production and uses thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3639708P 2008-03-13 2008-03-13
US61/036,397 2008-03-13

Publications (2)

Publication Number Publication Date
WO2009114372A2 WO2009114372A2 (en) 2009-09-17
WO2009114372A3 true WO2009114372A3 (en) 2009-12-03

Family

ID=41065764

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/036113 Ceased WO2009114372A2 (en) 2008-03-13 2009-03-05 Thermal interconnect and integrated interface systems, methods of production and uses thereof

Country Status (3)

Country Link
US (1) US20100319898A1 (en)
TW (1) TW200949185A (en)
WO (1) WO2009114372A2 (en)

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US20100038066A1 (en) * 2008-08-14 2010-02-18 Tai-Her Yang Thermal conducting principle and device for prestressed clamping type multi-layered structure
US20100129648A1 (en) * 2008-11-26 2010-05-27 Jun Xu Electronic packaging and heat sink bonding enhancements, methods of production and uses thereof
EP2597041A1 (en) * 2011-11-22 2013-05-29 Active Space Technologies GmbH Thermal strap
US9390998B2 (en) * 2012-02-17 2016-07-12 Invensas Corporation Heat spreading substrate
DE102012104593B4 (en) * 2012-05-29 2016-02-25 Sma Solar Technology Ag Semiconductor device
US9190341B2 (en) * 2012-06-05 2015-11-17 Texas Instruments Incorporated Lidded integrated circuit package
EP2754524B1 (en) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Method of and apparatus for laser based processing of flat substrates being wafer or glass element using a laser beam line
EP2781296B1 (en) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Device and method for cutting out contours from flat substrates using a laser
DE202013103599U1 (en) * 2013-08-09 2014-11-13 Trafomodern Transformatorengesellschaft M.B.H. Electrical component
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9815144B2 (en) 2014-07-08 2017-11-14 Corning Incorporated Methods and apparatuses for laser processing materials
LT3169477T (en) 2014-07-14 2020-05-25 Corning Incorporated System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter
US10695872B2 (en) * 2015-03-11 2020-06-30 Lockheed Martin Corporation Heat spreaders fabricated from metal nanoparticles
WO2016154284A1 (en) 2015-03-24 2016-09-29 Corning Incorporated Laser cutting and processing of display glass compositions
JP7082042B2 (en) 2015-07-10 2022-06-07 コーニング インコーポレイテッド A method for continuously forming holes in a flexible substrate sheet and related products.
JP6923284B2 (en) 2016-09-30 2021-08-18 コーニング インコーポレイテッド Equipment and methods for laser machining transparent workpieces using non-axisymmetric beam spots
WO2018081031A1 (en) 2016-10-24 2018-05-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US11791237B2 (en) 2018-06-27 2023-10-17 Intel Corporation Microelectronic assemblies including a thermal interface material
DE102018115509A1 (en) * 2018-06-27 2020-01-02 Infineon Technologies Ag Heat dissipation device, semiconductor packaging system and method of manufacturing the same
US12166004B2 (en) 2019-05-08 2024-12-10 Intel Corporation Solder thermal interface material (STIM) with dopant
US11682605B2 (en) 2019-05-28 2023-06-20 Intel Corporation Integrated circuit packages with asymmetric adhesion material regions
US12272614B2 (en) 2019-05-28 2025-04-08 Intel Corporation Integrated circuit packages with solder thermal interface materials with embedded particles
US11476178B2 (en) * 2019-07-22 2022-10-18 Raytheon Company Selectively-pliable chemical vapor deposition (CVD) diamond or other heat spreader
US11469154B2 (en) * 2021-01-17 2022-10-11 Amulaire Thermal Technology, Inc. IGBT module with heat dissipation structure having specific layer thickness ratio
US11889662B1 (en) 2022-10-12 2024-01-30 Lunar Energy, Inc. Thermal interface sandwich
US11849536B1 (en) 2022-10-12 2023-12-19 Lunar Energy, Inc. Gantry for thermal management
US11997812B2 (en) 2022-10-12 2024-05-28 Lunar Energy, Inc. Cover for sealing a power module
WO2024081005A1 (en) * 2022-10-12 2024-04-18 Lunar Energy, Inc. Gantry for thermal management

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060040112A1 (en) * 2002-07-15 2006-02-23 Nancy Dean Thermal interconnect and interface systems, methods of production and uses thereof
US20060237838A1 (en) * 2003-02-19 2006-10-26 Mark Fery Thermal interconnect systems methods of production and uses thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060040112A1 (en) * 2002-07-15 2006-02-23 Nancy Dean Thermal interconnect and interface systems, methods of production and uses thereof
US20060237838A1 (en) * 2003-02-19 2006-10-26 Mark Fery Thermal interconnect systems methods of production and uses thereof

Also Published As

Publication number Publication date
US20100319898A1 (en) 2010-12-23
WO2009114372A2 (en) 2009-09-17
TW200949185A (en) 2009-12-01

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