[go: up one dir, main page]

WO2009112997A1 - Appareil d'éclairage sur substrat transparent - Google Patents

Appareil d'éclairage sur substrat transparent Download PDF

Info

Publication number
WO2009112997A1
WO2009112997A1 PCT/IB2009/050957 IB2009050957W WO2009112997A1 WO 2009112997 A1 WO2009112997 A1 WO 2009112997A1 IB 2009050957 W IB2009050957 W IB 2009050957W WO 2009112997 A1 WO2009112997 A1 WO 2009112997A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
transparent substrate
lighting apparatus
lighting
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2009/050957
Other languages
English (en)
Inventor
Dirk Hente
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Intellectual Property and Standards GmbH
Koninklijke Philips NV
Original Assignee
Philips Intellectual Property and Standards GmbH
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Intellectual Property and Standards GmbH, Koninklijke Philips Electronics NV filed Critical Philips Intellectual Property and Standards GmbH
Publication of WO2009112997A1 publication Critical patent/WO2009112997A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/37—Converter circuits
    • H05B45/3725—Switched mode power supply [SMPS]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2109/00—Light sources with light-generating elements disposed on transparent or translucent supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to the field of lighting devices and more specifically to a lighting apparatus on a transparent substrate.
  • Point light sources such as light emitting diodes (LEDs) are placed on or between glass plates, and power is transmitted to the lighting devices through a transparent conducting layer.
  • LEDs light emitting diodes
  • US2006/0239037 discloses a method of fabrication of transparent LED devices in which a series of conducting paths are provided on a transparent under layer. The conducting paths are connected to an electronic control means.
  • a lighting apparatus comprising at least one transparent substrate, and a plurality of lighting devices situated on the at least one transparent substrate.
  • the at least one transparent substrate has at least one conducting layer.
  • Each lighting device comprises a light emitting diode and a point of load converter.
  • Embodiments of the present invention are particularly advantageous as the point of load converter and the light emitting diode are situated at the same place on the substrate. Therefore, power may be transmitted to the lighting device at a higher voltage than the supply voltage of the light emitting diode, with the point of load converter converting from the higher voltage to the supply voltage of the light emitting diode.
  • the power transmitted across the transparent substrate may be transmitted at a higher voltage and therefore, a lower current is required for the power transmission across the transparent substrate. Therefore, undesired voltage drops across the transparent substrate are avoided.
  • the point of load converter comprises an address line for controlling the power supply to the light emitting diode.
  • Embodiments of the present invention are advantageous as the use of an address line allows a single power supply to all the lighting devices without the requirement for individual connections and switching between the power supply and the lighting devices.
  • the point of load converter comprises a resonant circuit having a resonant frequency.
  • a method for manufacturing a lighting device comprises mounting a plurality of lighting devices on a transparent substrate.
  • Each lighting device of the plurality of lighting devices comprises a light emitting diode and a point of load converter and the transparent substrate comprises at least one conducting layer.
  • the method further comprises laminating the transparent substrate onto a glass plate.
  • a method for supplying power to a plurality of light emitting diodes mounting on a transparent substrate comprises transmitting power across the transparent substrate using a voltage higher than the supply voltage of the light emitting diodes of the plurality of light emitting diodes, and converting to the supply voltage of each light emitting diode of the plurality of light emitting diodes at the location on the substrate of each light emitting diode.
  • the method further comprises transmitting an address signal across the transparent substrate, the address signal indicating at least one of the plurality of light emitting diodes.
  • power transmitted across the transparent substrate is transmitted as an alternating current.
  • the alternating current has a frequency, and the frequency is used to select at least one of the plurality of light emitting diodes.
  • Fig. 1 shows a view of a lighting apparatus
  • Fig. 2 shows a cross section of a lighting apparatus
  • Fig. 3 A shows a cross section of a transparent film
  • Fig. 3B shows a cross section of a lighting apparatus
  • Fig. 4 shows a schematic view of a lighting apparatus
  • Fig. 5 shows a schematic view of a lighting apparatus
  • Fig. 6 shows a schematic view of a lighting apparatus.
  • Fig. 1 shows a lighting apparatus 100.
  • Lighting apparatus 100 consists of transparent layer 102 having a number of lighting devices 104 situated on layer 102 or within layer 102.
  • Lighting apparatus 100 may comprise two glass plates with lighting devices 104 between the two glass plates.
  • Lighting devices 104 receive power transmitted through transparent layer 102.
  • the structure of layer 102 and the mounting of lighting devices 104 within layer 102 is discussed with reference to figs. 2 and 3 below which depict a cross section of a lighting apparatus for cross section 106.
  • Lighting devices 104 comprise a light emitting diode, and a point of load converter.
  • the point of load converter converts a supply voltage applied to transparent layer 102 to an input voltage for the light emitting diode.
  • Fig. 2 shows a cross section of a lighting apparatus for example 106 in fig. 1.
  • the lighting apparatus 200 has a transparent layer 202 which may be for example glass. Upon transparent layer 202, a transparent conducting layer 204 is attached. Transparent conducting layer 204 may be for example indium tin oxide, or a thin metal layer such as aluminium or copper. A number of lighting devices 206 are electrically coupled to transparent conducting layer 204. The lighting devices 206 comprise an LED and a point of load converter. Lighting apparatus 200 further comprises a second transparent conducting layer 208. In the example shown in fig. 2, the top plane transparent conducting layer 204 may be connected to the first terminal (e.g.
  • Lighting apparatus 200 further comprises a second transparent layer 210.
  • Layers 202 and 210 may be for example glass sheets.
  • Lighting apparatus discussed in reference to figs. 1 and 2 includes lighting devices which includes an LED for converting electrical energy into light and additionally a point of load converter for converting from a transmission voltage to a supply voltage for the light emitting diodes.
  • the inclusion of the point of load converter at the same location as the light emitting diode has the result that power can be transmitted across the transparent surface through for example layers 204 and 208 at a higher voltage than the supply voltage of the light emitting diodes. This means that a smaller current is required to supply the same power to the light emitting diodes. Thus, a lower voltage drop across the conducting layers 204 and 208 is realized.
  • Transparent film 320 comprises carrier foil 314.
  • Carrier foil 314 is flexible and transparent.
  • Carrier foil 314 may for example be PET.
  • Carrier foil 314 has transparent conducting layer 308.
  • Transparent conducting layer 308 may for example be indium tin oxide.
  • Lighting devices 306 comprising light emitting diodes and point of load converters are attached to transparent conducting layer 308.
  • Transparent film 320 contains the electrical and conductive elements required to produce a lighting apparatus such as that shown in fig. 3B.
  • a lighting apparatus such as that shown in fig. 3B may be realized from transparent film 320 by laminating transparent film 320 between 2 transparent layers such as glass plates.
  • Fig. 3B shows a cross section of a lighting apparatus 300.
  • Lighting apparatus 300 comprises a transparent film laminated between glass layers 302 and 310.
  • Transparent polymer layers 312 and 316 are used to laminate the device shown in fig. 3A onto glass layers 302 and 310.
  • a polymer such as PVB is used to laminate the device between the glass layers.
  • lighting devices 306 are attached to transparent conducting layer 308 and carrier foil 314. As shown in fig.
  • conducting layer 308 may be produced to form both terminal (e.g. "plus” and “minus” for dc driving) connections for lighting devices 306.
  • Conducting layer 308 may be indium tin oxide, tin oxide, or a very thin metal layer such as aluminium, silver, gold, nickel or chrome.
  • Transparent conducting layer 308 may be applied to transparent carrier foil layer 314 by a chemical vapor deposition technique, or a physical vapor deposition technique. Alternatively, a second conducting layer may be included in the top layer of the lighting apparatus as in fig. 2.
  • the lighting apparatus of figs. 3 A and 3B has the advantage that the electronic part containing the light emitting diodes, the point of load converters, and the conducting layer or conducting layers can be produced as a flexible layer. This layer can then be laminated on the glass at a later time. Because the process of lamination onto glass layers using polymers such as PVB is a well known technique, a structure such as that shown in fig. 3 would allow parts of the construction of a lighting device to be realized using existing manufacturing techniques.
  • Fig. 4 shows a schematic view of a lighting apparatus 400. Glass object
  • DC/DC converter 406 which is connected to terminals 408 and 410.
  • a DC voltage is applied across terminals 408 and 410.
  • Terminals 408 and 410 are connected to conducting elements 414 and 412 respectively.
  • Conducting elements 412 and 414 are transparent conducting elements. They may be separate conducting layers or may be parts of the same conducting layer.
  • a number of lighting devices are attached across conducting elements 412 and 414. Each lighting element consists of a light emitting diode 416, 420, 424, and a point of load converter, 418, 422 and 426.
  • the point of load converters 418, 422 and 426 may be switched mode power supplies operating at frequencies in the MHz range.
  • Switch mode power supplies include buck, boost, and flyback power supplies, or similar devices known to those of skill in the art.
  • Fig. 5 shows a further embodiment of a lighting apparatus 500.
  • Lighting apparatus 500 consists of glass plane 502.
  • Lighting apparatus 500 is powered by power supply 504 which is connected to converter 506.
  • Lighting apparatus 500 additionally consists of address controller 530.
  • Address controller 530 is connected to element 512 and is used to supply an address signal to the lighting devices.
  • Lighting devices of lighting apparatus 500 now comprise address modules 517, 521 and 525. This is in addition to light emitting diodes 516, 520 and 524 and point of load converters 518, 522 and 526.
  • Address module 530 can be used to select LEDs from 516, 520 and 524 for illumination.
  • Element 514 is connected to converter 506 and supplies power to the lighting devices.
  • lighting apparatus 500 can be used to display patterns or characters on a transparent surface.
  • Fig. 6 shows a lighting apparatus 600.
  • Lighting apparatus 600 is contained in glass plane 602.
  • Power supply 604 is an AC power supply and converter 606 generates a high frequency voltage which is fed into the structure 602 via terminals 608 and 610.
  • Terminals 608 and 610 are connected to elements 614 and 612 respectively.
  • a number of lighting devices are connected across elements 612 and 614.
  • Lighting devices comprising light emitting diode 616 and point of load converter 618, lighting device comprising light emitting diode 620 and point of load converter 622 and a lighting device comprising light emitting diode 624 and point of load converter 626 are connected across elements 612 and 614.
  • point of load converters 618, 622 and 626 may be simple resonant circuits.
  • the resonant frequency of the resonant circuits may be different for different lighting devices or different groups of lighting devices. Then, light emitting diodes or groups of light emitting diodes may be selected for illumination by supplying a voltage at different frequencies across terminals 608 and 610.
  • the lighting devices which comprise light emitting diodes and point of load converters may be realized as system-on-chip devices for the converter components, and a light emitting diode all mounted on a single substrate.
  • the substrate may be a flexible substrate. Such a flexible substrate may be folded into a tubular shape and placed between the transparent surfaces.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

Cette invention se rapporte à un appareil d'éclairage (100 ; 200 ; 300 ; 400 ; 500 ; 600) qui comprend au moins un substrat transparent (102) et une pluralité de dispositifs d'éclairage (206 ; 306) situés sur le ou les substrats transparents. Le ou les substrats transparents présentent au moins une couche conductrice (204 ; 208 ; 308) destinée à fournir de la puissance à la pluralité de dispositifs d'éclairage. Chaque dispositif d'éclairage comprend une diode électroluminescente (516, 520, 524) et un convertisseur de point de charge (518, 522, 526). Les convertisseurs de point de charge se situent au même emplacement sur le substrat transparent que les diodes électroluminescentes pour permettre la transmission de la puissance aux bornes du substrat transparent à une tension différente de la tension d'alimentation des diodes électroluminescentes.
PCT/IB2009/050957 2008-03-13 2009-03-09 Appareil d'éclairage sur substrat transparent Ceased WO2009112997A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08102578 2008-03-13
EP08102578.5 2008-03-13

Publications (1)

Publication Number Publication Date
WO2009112997A1 true WO2009112997A1 (fr) 2009-09-17

Family

ID=40821650

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2009/050957 Ceased WO2009112997A1 (fr) 2008-03-13 2009-03-09 Appareil d'éclairage sur substrat transparent

Country Status (2)

Country Link
TW (1) TW200945937A (fr)
WO (1) WO2009112997A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9209353B2 (en) 2010-07-13 2015-12-08 Koninklijke Philips N.V. Low cost mounting of LEDs in TL-retrofit tubes

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI536613B (zh) 2013-12-16 2016-06-01 隆達電子股份有限公司 固態發光模組

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040252500A1 (en) * 2003-06-13 2004-12-16 Yuan Lin Strip light with constant current
US20050211998A1 (en) * 2004-03-29 2005-09-29 Daniels John J Light active sheet material
US20060061303A1 (en) * 2004-09-17 2006-03-23 Koito Manufacturing Co., Ltd. Lighting control circuit for vehicle lighting equipment
US20060197444A1 (en) * 2005-03-03 2006-09-07 Koito Manufacturing Co., Ltd. Light emitting apparatus
WO2007045786A1 (fr) * 2005-10-21 2007-04-26 Saint-Gobain Glass France Structure lumineuse comportant au moins une diode electroluminescente, sa fabrication et ses applications

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040252500A1 (en) * 2003-06-13 2004-12-16 Yuan Lin Strip light with constant current
US20050211998A1 (en) * 2004-03-29 2005-09-29 Daniels John J Light active sheet material
US20060061303A1 (en) * 2004-09-17 2006-03-23 Koito Manufacturing Co., Ltd. Lighting control circuit for vehicle lighting equipment
US20060197444A1 (en) * 2005-03-03 2006-09-07 Koito Manufacturing Co., Ltd. Light emitting apparatus
WO2007045786A1 (fr) * 2005-10-21 2007-04-26 Saint-Gobain Glass France Structure lumineuse comportant au moins une diode electroluminescente, sa fabrication et ses applications

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9209353B2 (en) 2010-07-13 2015-12-08 Koninklijke Philips N.V. Low cost mounting of LEDs in TL-retrofit tubes
EP2593709B1 (fr) * 2010-07-13 2017-09-13 Philips Lighting Holding B.V. Fixation à faible coût de del dans des lampes à tube transformées

Also Published As

Publication number Publication date
TW200945937A (en) 2009-11-01

Similar Documents

Publication Publication Date Title
CN101683009B (zh) 柔性电路
US9386640B2 (en) LED package with capacitive couplings
CN101228649A (zh) 具有密封的集成驱动电路的发光器件
RU2664952C2 (ru) Конструкционный элемент с по меньшей мере одним электронным компонентом и связанный с ним способ
EP1788640A1 (fr) Module d'émission de lumière et méthode de fabrication de celui-ci
US11369021B2 (en) Customizable animated LED display for product package insert
JP2017044868A (ja) シースルー型のｌｅｄ表示装置
JP2009530789A (ja) 発光素子
CN105980768A (zh) 照明膜结构
US20130120979A1 (en) Flat cable unit with light emitting elements
WO2009112997A1 (fr) Appareil d'éclairage sur substrat transparent
WO2012052889A2 (fr) Puits de chaleur multifonctionnel de faible coût destiné à des réseaux de diodes électroluminescentes
US7952113B2 (en) Flat lighting device and a method for the production thereof
CN106848037A (zh) 带电压补偿的双层导电led光电玻璃及其制造工艺
WO2008141500A1 (fr) Carte de circuits imprimés pour dissipation de chaleur
US5720639A (en) Method for manufacturing electroluminescent lamp systems
WO2010125494A1 (fr) Circuit à diodes électroluminescentes organiques doté d'un capot
US20140117843A1 (en) Electroluminescent display and method for production
WO1996041501A9 (fr) Procede de fabrication de systemes de lampes electroluminescentes
KR20120021901A (ko) 금속 판넬을 가지는 조명장치
EP4394247A1 (fr) Petit module de diode électroluminescente (del) et son procédé de préparation
CN218352757U (zh) 石墨烯远红外发射模组
CN219659954U (zh) 一种led产品及其恒流驱动源
WO2016104609A1 (fr) Substrat d'élément à del, module monté sur une del et dispositif d'affichage à del les utilisant
CN223261697U (zh) 一种金属基覆铜板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09720352

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09720352

Country of ref document: EP

Kind code of ref document: A1