[go: up one dir, main page]

WO2009110311A1 - Lentille d'imagerie, dispositif d'imagerie et procédé de fabrication de lentille d'imagerie - Google Patents

Lentille d'imagerie, dispositif d'imagerie et procédé de fabrication de lentille d'imagerie Download PDF

Info

Publication number
WO2009110311A1
WO2009110311A1 PCT/JP2009/052659 JP2009052659W WO2009110311A1 WO 2009110311 A1 WO2009110311 A1 WO 2009110311A1 JP 2009052659 W JP2009052659 W JP 2009052659W WO 2009110311 A1 WO2009110311 A1 WO 2009110311A1
Authority
WO
WIPO (PCT)
Prior art keywords
lens
imaging
imaging lens
block
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/052659
Other languages
English (en)
Japanese (ja)
Inventor
貴志 川崎
慶二 松坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Opto Inc
Original Assignee
Konica Minolta Opto Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto Inc filed Critical Konica Minolta Opto Inc
Publication of WO2009110311A1 publication Critical patent/WO2009110311A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/0035—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having three lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
    • G02B13/006—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element at least one element being a compound optical element, e.g. cemented elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present invention relates to an imaging lens of an imaging apparatus using a solid-state imaging device such as a CCD (Charge Coupled Device) type image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) type image sensor, and more specifically for mass production.
  • a solid-state imaging device such as a CCD (Charge Coupled Device) type image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) type image sensor, and more specifically for mass production.
  • the present invention relates to an imaging lens partially using a suitable wafer-scale lens, an imaging device using the imaging lens, and a manufacturing method of the imaging lens.
  • a compact and very thin imaging device (hereinafter also referred to as a camera module) is used in portable terminals that are compact and thin electronic devices such as mobile phones and PDAs (Personal Digital Assistants), and also uses a zoom lens.
  • Small imaging devices are used for small digital cameras, video cameras, and the like.
  • an image pickup element used in these image pickup apparatuses a solid-state image pickup element such as a CCD type image sensor or a CMOS type image sensor is used. In recent years, the number of pixels of an image sensor has been increased, and higher resolution and higher performance have been achieved.
  • an imaging lens for forming a subject image on these imaging elements is required to be compact in response to miniaturization of the imaging element, and the demand tends to increase year by year.
  • an optical system composed of a resin material lens and an optical system composed of a glass lens and a resin material lens are generally well known.
  • the optical performance is significantly deteriorated due to a manufacturing error in the lens manufacturing (for example, the optical axis of the lens does not match the optical axis of the optical system). Therefore, it can be said that it is difficult to achieve both further ultra-compactness and mass productivity required for these imaging devices.
  • a single focus lens is a triplet type lens as described in Patent Document 1
  • a zoom lens is a lens with optimized power arrangement and surface spacing as in Patent Document 2
  • Patent Document 3 Such alignment methods have been proposed. JP 2006-308789 A JP 2005-055592 A JP 2006-148662 A
  • the present invention has been made in view of such a situation, and an object thereof is to provide an imaging lens that suppresses performance deterioration due to a manufacturing error and is excellent in mass productivity.
  • the imaging lens according to claim 1 integrates at least two lens blocks each having a lens portion formed on at least one of an object side surface and an image side surface of a lens substrate, which is a parallel plate, via an interval defining portion.
  • lens substrate For the purpose of mass production and cost reduction of imaging lenses built in portable terminals, a large number of lens parts are simultaneously formed on a several inch wafer (lens substrate) by the replica method, and these are combined with the sensor wafer and then separated.
  • a method of mass-producing camera modules is known.
  • a lens substrate and a lens part formed in large quantities on the lens substrate are collectively referred to as a lens block unit, and one separated from the lens block unit is referred to as a lens block.
  • a lens that passes through a position where axial light rays are high is subject to collapsing due to a manufacturing error (the optical axis shift of the lens in a direction perpendicular to the optical axis of the optical system).
  • the so-called “one-sided blur” in which the resolving power on the image sensor becomes asymmetrical may occur, and the performance may be significantly degraded. That is, in order to suppress performance degradation due to manufacturing errors, it is necessary to align the optical axis of a lens with a high axial ray height with the optical axis of the optical system.
  • a lens group having a high axial ray height which is a constituent element of an imaging lens, is included in this lens group by integrating at least two lens blocks via a space defining part such as a spacer.
  • the maximum ray height of the on-axis light beam means the height (distance from the optical axis) of the light beam that forms the image on the optical axis and intersects the optical surface farthest from the optical axis.
  • imaging lens includes a so-called zoom lens having a zooming function.
  • the shape is limited due to the lens substrate being a parallel plate, but at least one lens group other than the lens group configured by a plurality of lens blocks is used.
  • the imaging lens which has a lens the freedom degree of a shape increases and it can be set as a higher performance imaging lens.
  • the imaging lens according to claim 2 is the invention according to claim 1, wherein the lens group includes at least two lens block units each having a plurality of lens blocks formed in a lattice shape. And a step of adhering via the interval defining portion, and a step of cutting the adhered lens block unit and the interval defining portion at the position of the lattice frame of the interval defining portion. It is characterized by being.
  • another lens block unit is laminated and bonded via a space defining portion such as a spacer member on the lens block unit formed with a large number of lens portions, and bonded. Disconnect.
  • a lens group having a small parallel decentration which is composed of at least two lens blocks and whose optical axes are aligned with high accuracy, can be produced in large quantities and at low cost in a short time. Furthermore, since it is bonded and fixed, it is possible to prevent the optical axes of the lens blocks from being shifted after the production.
  • this manufacturing method is not limited to the camera module, and a lens group in which a plurality of lens blocks are bonded can be mass-produced except for the sensor wafer.
  • the imaging lens according to claim 3 is the imaging lens according to claim 1 or 2, wherein E is a parallel decentering sensitivity at 70% image height of each of the lens groups, and each of the lens blocks.
  • Emax is the maximum absolute value of the 70% parallel decentration sensitivity
  • the lens group includes a parallel decentering sensitivity lens block having a sign opposite to Emax, and satisfies the following conditional expression: To do.
  • the parallel decentering sensitivity is a value of ⁇ M / ⁇ when the change amount ⁇ M of the meridional image plane with respect to the decentering amount ⁇ of the lens in the direction perpendicular to the optical axis of the image pickup lens is 70% image height. Is a height of 70% that is 1/2 of the diagonal length of the rectangular effective pixel region of the solid-state imaging device.
  • the lens group that is a component of the imaging lens includes a lens block having a parallel eccentricity sensitivity of the opposite sign to the lens block having the highest absolute value of the parallel eccentricity sensitivity.
  • conditional expression (1) even when the sensitivity of parallel decentering of the lens blocks constituting the lens group is high, the tilt of the image plane due to the parallel decentering of the lens group is reduced, and performance degradation due to single blurring is suppressed to a minimum. be able to.
  • conditional expression (1) is satisfied at a position where the value of
  • parallel decentering sensitivity means the value of ⁇ M / ⁇ when the change amount ⁇ M of the meridional image plane between the optical axis of the imaging lens and the decentering amount ⁇ of the lens in the vertical direction.
  • reverse sign means that the meridional image plane moves in the opposite direction parallel to the optical axis with respect to the eccentricity of each of the two lenses in the same vertical direction as the optical axis. The surface on which the meridional light beam forms the sharpest image is assumed.
  • the imaging lens according to claim 4 is an aperture stop on any lens substrate of the lens block forming the lens group in the invention according to any one of claims 1 to 3. It is characterized by having.
  • An aperture stop can be easily formed on the lens substrate by applying a light-shielding member on the surface of the lens substrate or by vacuum deposition.
  • the imaging lens according to claim 5 is the imaging lens according to any one of claims 1 to 4, wherein the lens portion is made of a resin material and the lens substrate is made of a glass material. It is characterized by.
  • An imaging lens that is easy to polish by using a glass substrate for the lens substrate, which is a parallel plate, and that has a complicated shape and a resin material with good moldability, so that high performance can be achieved at low cost. Can be formed.
  • the imaging lens according to claim 6 is characterized in that, in the invention according to any one of claims 1 to 5, the surface of the lens portion that contacts air is an aspherical surface. .
  • the difference in refractive index is the largest at the boundary surface between the air and the lens part, and the effect of the aspheric surface can be utilized to the maximum. Further, by making the lens surfaces all aspherical, the occurrence of various aberrations can be minimized, and high performance can be easily achieved.
  • the imaging lens according to claim 7 is characterized in that, in the invention according to any one of claims 1 to 6, the lens portion is made of an energy curable resin.
  • the energy curable resin material refers to a thermosetting resin material that is cured by heat, an ultraviolet (UV) curable resin material that is cured by light, or the like.
  • the energy curable resin material is preferably composed of a UV curable resin material.
  • the imaging lens according to claim 8 is the invention according to claims 1 to 7, wherein inorganic fine particles having a length of 30 nanometers or less are dispersed in the resin material. It is characterized by.
  • Dispersing inorganic fine particles of 30 nanometers or less in a lens part made of a resin material can reduce performance deterioration and image point position fluctuations even when the temperature changes, and also reduce light transmittance.
  • an imaging lens having excellent optical characteristics regardless of environmental changes can be provided.
  • the size of the fine particles should be smaller than the wavelength of the transmitted light beam. Thus, substantially no scattering can occur.
  • the resin material has a disadvantage that the refractive index is lower than that of the glass material, but it has been found that the refractive index can be increased by dispersing inorganic particles having a high refractive index in the resin material as a base material. Specifically, by dispersing inorganic particles of 30 nanometers or less in the resin material as the base material, preferably 20 nanometers or less, more preferably 15 nanometers or less in the resin material as the base material, A material having any temperature dependency can be provided.
  • the refractive index of the resin material decreases as the temperature rises
  • inorganic particles whose refractive index increases as the temperature rises are dispersed in the resin material as the base material, these properties will cancel each other. It is also known that the refractive index change with respect to the temperature change can be reduced. On the other hand, it is also known that when the inorganic particles whose refractive index decreases as the temperature rises are dispersed in the resin material as the base material, the refractive index change with respect to the temperature change can be increased.
  • inorganic particles of 30 nanometers or less in the resin material as the base material preferably 20 nanometers or less, more preferably 15 nanometers or less in the resin material as the base material, A material having any temperature dependency can be provided.
  • the temperature change A of the refractive index is expressed by the following equation by differentiating the refractive index n with respect to the temperature t based on the Lorentz-Lorentz equation (Equation 1).
  • the contribution of the second term is generally smaller than the first term in the formula, and can be almost ignored.
  • the contribution of the second term of the above formula is substantially increased, so as to cancel out the change due to the linear expansion of the first term. .
  • the mixing ratio can be appropriately increased or decreased in order to control the rate of change of the refractive index with respect to the temperature, and a plurality of types of nano-sized inorganic particles can be blended and dispersed.
  • the imaging lens according to claim 9 is the imaging lens according to any one of claims 1 to 8, wherein the lens substrate and the lens portion are formed through a thin film. It is characterized by having.
  • the optical member By forming an aperture stop or infrared cut filter formed of a thin film between the lens portion and the lens substrate, the optical member can be simplified and the cost can be reduced.
  • the imaging lens according to claim 10 is the invention according to any one of claims 1 to 9, wherein the lens group has a lens block in which a lens portion is formed only on one side. It is characterized by.
  • the aberration correction function is assigned to a surface having no curvature by design, so that the influence on the aberration performance can be reduced without forming a resin portion on one side. In such a case, it is better not to form the lens portion considering the balance between good aberration performance and low cost. Further, if one side has no curvature, a function such as infrared cut can be provided by depositing a thin film on the surface.
  • the imaging lens according to claim 11 is the imaging lens according to any one of claims 1 to 10, wherein the lens block is provided on one of the lens portion and the lens substrate, respectively. Means for aligning the optical axis is formed.
  • the optical axes can be aligned more accurately, the time for aligning the optical axes can be shortened, and mass productivity can be improved.
  • the imaging device according to claim 12 is characterized by using the imaging lens according to any one of claims 1 to 11, so that it can be used in a low-cost and high-humidity environment. Can be provided.
  • the imaging lens manufacturing method is a lens block unit in which a plurality of lens blocks each having a lens portion formed on at least one of an object side surface and an image side surface of a lens substrate that is a parallel plate are formed.
  • the present invention it is possible to provide an imaging lens that suppresses performance degradation due to manufacturing errors and is excellent in mass productivity.
  • FIG. 2 is a cross-sectional view of the configuration of FIG. 1 taken along line II-II and viewed in the direction of the arrow. It is a figure which shows the state equipped with the imaging device 50 in the mobile telephone 100 as a portable terminal.
  • 3 is a control block diagram of the mobile phone 100.
  • FIG. It is a figure which shows the process of manufacturing the imaging lens concerning this Embodiment. It is sectional drawing of 1st Example.
  • FIG. 4 is an aberration diagram of the imaging lens shown in Example 1. It is sectional drawing of 2nd Example.
  • FIG. 6 is an aberration diagram of the imaging lens shown in Example 2.
  • FIG. 6 is an aberration diagram of the imaging lens shown in Example 2.
  • FIG. 6 is an aberration diagram of the imaging lens shown in Example 2.
  • FIG. 6 is an aberration diagram of the imaging lens shown in Example 2.
  • FIG. 6 is an aberration diagram of the imaging lens shown in Example 2.
  • 3rd Example FIG. 6 is an aberration diagram of the imaging lens shown in Example 3.
  • Imaging lens 20 Case 50 Imaging device 51 Image sensor 51a Photoelectric conversion part 51b Signal processing circuit 52 Board
  • FIG. 1 is a perspective view of an imaging apparatus 50 according to the present embodiment
  • FIG. 2 is a cross-sectional view of the configuration of FIG. 1 taken along the line II-II and viewed in the direction of the arrow.
  • the imaging device 50 includes a CMOS image sensor 51 as a solid-state imaging device having a photoelectric conversion unit 51 a, an imaging lens 10 that causes the photoelectric conversion unit 51 a of the image sensor 51 to capture a subject image, A substrate 52 having an external connection terminal (not shown) for holding the image sensor 51 and transmitting / receiving the electric signal is provided, and these are integrally formed.
  • the imaging lens 10 is held by a housing 20 and includes a first lens block B1, a second lens block B2, and a third lens L3.
  • a photoelectric conversion unit 51a as a light receiving unit in which pixels (photoelectric conversion elements) are two-dimensionally arranged is formed in the center of a plane on the light receiving side.
  • a processing circuit 51b is formed.
  • the signal processing circuit 51b forms a picture signal output by using a drive circuit unit that sequentially drives each pixel to obtain a signal charge, an A / D conversion unit that converts each signal charge into a digital signal, and the digital signal. It consists of a signal processing unit and the like.
  • a number of pads (not shown) are arranged near the outer edge of the plane on the light receiving side of the image sensor 51, and are connected to the substrate 52 via wires (not shown).
  • the image sensor 51 converts the signal charge from the photoelectric conversion unit 51a into an image signal such as a digital YUV signal, and outputs the image signal to a predetermined circuit on the substrate 52 via a wire (not shown).
  • Y is a luminance signal
  • the solid-state imaging device is not limited to the CMOS image sensor, and other devices such as a CCD may be used.
  • the substrate 52 that supports the image sensor 51 is communicably connected to the image sensor 51 through a wiring (not shown).
  • the substrate 52 is connected to an external circuit (for example, a control circuit included in a host device of a portable terminal mounted with an imaging device) via an external connection terminal (not shown), and a voltage for driving the image sensor 51 from the external circuit. And a clock signal can be received, and a digital YUV signal can be output to an external circuit.
  • an external circuit for example, a control circuit included in a host device of a portable terminal mounted with an imaging device
  • an external connection terminal not shown
  • a clock signal can be received, and a digital YUV signal can be output to an external circuit.
  • the upper part of the image sensor 51 is sealed with a flat optical member F such as an infrared cut filter fixed on the upper surface of the substrate 52.
  • a flat optical member F such as an infrared cut filter fixed on the upper surface of the substrate 52.
  • the lower end of the third spacer SP3 which is a space defining portion, is fixed.
  • the flange portion of the third lens L3 is fixed to the upper end of the third spacer SP3, and the lower end of the second spacer SP2 that is the interval defining portion is fixed to the upper surface of the flange portion of the third lens L3.
  • the periphery of the second lens substrate B2b of the second lens block B2 is fixed to the upper end of the second spacer SP2, and the lower end of the first spacer SP1 that is the interval defining portion is fixed to the upper surface of the periphery of the second lens substrate B2b.
  • the periphery of the first lens substrate B1b of the first lens block B1 is fixed to the upper end of the first spacer SP1.
  • the first to third spacers SP1 to SP3 are configured as separate members as the interval defining portion.
  • the present invention is not limited to this.
  • the lens portion B1c formed on the lens substrate A shape corresponding to the function of the first spacer SP1 may be integrally formed as at least one of B2a as the space defining portion.
  • a shape corresponding to the second spacer SP2 and the third spacer SP3 may be formed as a spacer portion integrally with the flange portion of the third lens L3.
  • the first lens block B1 is formed on a first lens substrate B1b which is a glass parallel plate, a resin-made first object-side lens portion B1a formed on the object side surface, and an image side surface of the first lens substrate B1b.
  • the first image side lens portion B1c made of resin.
  • An aperture stop S is formed between the first object side lens unit B1a and the first lens substrate B1b by an optical thin film formed on the surface of the first lens substrate B1b.
  • the second lens block B2 is formed on a second lens substrate B2b which is a glass parallel plate, a resin second object side lens portion B2a formed on the object side surface, and an image side surface of the second lens substrate B2b.
  • the second image side lens portion B2c made of resin.
  • the maximum light beam height of the axial light beam passing through the lens group LG is the maximum light beam height of the axial light beam of the imaging lens 10.
  • Each lens part B1a, B1c, B2a, B2c is preferably made of a thermosetting resin or an ultraviolet curable resin material in which inorganic fine particles having a maximum length of 30 nanometers or less are dispersed. Is preferably an aspherical surface.
  • the lens part may be formed only on the object side surface or the image side surface of the lens substrates B1b and B2b.
  • FIG. 3 is a diagram illustrating a state in which the imaging device 50 is mounted on a mobile phone 100 as a mobile terminal that is a digital device.
  • FIG. 4 is a control block diagram of the mobile phone 100.
  • the imaging device 50 is provided, for example, such that the object-side end surface of the imaging lens is provided on the back surface of the mobile phone 100 (the liquid crystal display unit side is the front surface) and is located at a position corresponding to the lower side of the liquid crystal display unit.
  • the external connection terminal (not shown) of the imaging device 50 is connected to the control unit 101 of the mobile phone 100 and outputs an image signal such as a luminance signal or a color difference signal to the control unit 101 side.
  • the mobile phone 100 controls each unit in an integrated manner, and also supports a control unit (CPU) 101 that executes a program corresponding to each process, and inputs a number and the like with keys.
  • An input unit 60 a display unit 70 for displaying captured images and videos, a wireless communication unit 80 for realizing various information communications with an external server, a system program and various processing programs for the mobile phone 100,
  • a storage unit (ROM) 91 that stores necessary data such as a terminal ID, and various processing programs and data executed by the control unit 101, processing data, imaging data by the imaging device 50, and the like are temporarily stored.
  • a temporary storage unit (RAM) 92 used as a work area to be stored, a non-volatile storage unit 93 that records captured images and videos, and a non-illustrated my , It is equipped with a speaker or the like.
  • an image signal of a still image or a moving image is captured by the image sensor 51.
  • the image signal input from the imaging device 50 is displayed on the display unit 70 by the control unit 101 or recorded in the nonvolatile storage unit 93, and further externally as video information via the wireless communication unit 80. Will be sent.
  • FIG. 5 is a diagram illustrating a process of manufacturing a lens group that is a component of the imaging lens according to the present embodiment.
  • a lens block unit UT in which a plurality of lens blocks B are two-dimensionally arranged is manufactured. Since the first lens block unit UT1 and the second lens block unit UT2 are manufactured in the same process, only the first lens block unit UT1 will be described.
  • a replica method is used for the first lens block unit UT1, and a large number of lens portions B1a and B1c are formed on the lens substrate B1b.
  • the number of lens blocks included in the lens block unit is at least two, the lens portions formed on the lens substrate do not need to be provided on both sides, and may be provided on only one side.
  • lens group LG which is a component of imaging lens 10 is manufactured using lens block units UT1 and UT2 manufactured by such a method.
  • An example of the subsequent manufacturing process of this lens group LG is shown in FIGS.
  • the first lens block unit UT1 includes a first lens substrate B1b that is a parallel plate, a plurality of first object-side lens portions B1a formed on one plane thereof, and a plurality of first lenses formed on the other plane. And an image side lens portion B1c.
  • the first lens substrate B1b and the first object-side lens portion B1a are formed via a diaphragm S (see FIG. 2) formed of an optical thin film. It is preferable to provide the infrared cut filter and the diaphragm on the lens substrate because the number of constituent members can be reduced as compared with the case where it is provided separately.
  • the lens portions B1a and B1c are preferably formed directly on the lens substrate B1b, but may be formed using an adhesive or the like.
  • the second lens block unit UT2 includes a second lens substrate B2b that is a parallel plate, a plurality of second object-side lens portions B2a formed on one plane thereof, and a plurality of second lenses formed on the other plane. And an image side lens portion B2c.
  • a second lens substrate B2b that is a parallel plate
  • an image side lens portion B2c Similarly, if an antireflection coating is provided on the lens substrate, reflection between the lens portion and the lens substrate can be prevented, and flare and ghost can be reduced.
  • lens part B2a and B2c directly on lens board
  • a plurality of openings are formed, and a spacer SP as an interval defining portion formed of a light shielding material in a lattice shape is interposed between the first lens block unit UT1 and the second lens block unit UT2, and both lenses
  • the interval between the block units UT1 and UT2 is kept constant. In such a state, adjustment is made so that the optical axes of the lens portions B1a, B1c, B2a, and B2c located at the respective openings of the spacer SP are accurately aligned.
  • the lens substrate B1b and B2b, or the lens unit B1a or B1c and B2a or B2c is formed with a position reference mark that is observed as a feature point having different brightness from other parts
  • the optical axes of the lens block B1 and the lens block B2 can be aligned with high precision by adjusting the position so that they coincide with each other (see Japanese Patent Laid-Open No. 2006-146043).
  • the spacer SP is interposed between the first lens block unit UT1 and the second lens block unit UT2, the lens substrates B1b and B2b (the first image side lens unit B1c and the second object side) are arranged. Lens part B2a) is sealed and integrated.
  • the lens group LG is arranged at a position on the optical axis where the surface of the imaging lens 10 having the maximum light flux of the on-axis light beam is located in the lens group LG, and combined with the third lens L3. Further, the imaging lens 10 and the optical member F thus formed are held by the housing 20 so as to face the image sensor 51 assembled to the substrate 52, whereby the imaging apparatus shown in FIG. Obtainable.
  • each of the imaging lenses 10 Lens interval adjustment and assembly are simplified. Therefore, mass production of imaging devices that are expected to have high image quality is possible.
  • the spacer SP since the spacer SP has a lattice shape, the spacer SP also serves as a mark when the lens groups LG are separated. Therefore, the lens group LG can be easily cut out, and it does not take time and effort. As a result, the lens group LG can be mass-produced at a low cost.
  • the lens block units B1 and B2 each having a plurality of lens blocks each having a lens portion formed on the lens substrate are opened at positions corresponding to the lens portions.
  • the step of adhering via the lattice-shaped interval defining portion in which the portion is formed see FIG. 5B
  • the two lens block units integrated by adhesion and the interval defining portion at the position of the lattice frame And a step of cutting (see FIG. 5C).
  • Such a manufacturing method can reduce the mass production of the lens system.
  • the spacer that is the space defining portion is not a separate member, and a functional portion corresponding to the spacer SP may be integrally formed as a space defining portion on at least one of the lens portions B1c and B2a formed on the lens substrate. .
  • f Focal length of the entire imaging lens system
  • FB Back focus
  • F F number 2Y: Diagonal length of imaging surface of solid-state imaging device (diagonal length of rectangular effective pixel area of solid-state imaging device)
  • ENTP entrance pupil position (distance from the first surface to the entrance pupil)
  • EXTP Exit pupil position (distance from image plane to exit pupil)
  • H1 Front principal point position (distance from the first surface to the front principal point)
  • H2 Rear principal point position (distance from the final surface to the rear principal point)
  • R radius of curvature of refracting surface
  • D spacing between upper surfaces of axis
  • Nd refractive index of d-line of lens material at room temperature
  • ⁇ d Abbe number of lens material
  • the aspherical shape has an apex at the surface as the origin, light The X axis is taken in the axial direction, and the height
  • a power of 10 (for example, 2.5 ⁇ 10 ⁇ 02 ) is expressed using E (for example, 2.5E-02).
  • E for example, 2.5E-02
  • the surface number of the lens data was given in order with the object side of the first lens as one surface.
  • the unit of the numerical value showing the length as described in an Example shall be mm.
  • Example 1 Lens data of the imaging lens of Example 1 is shown in the following (Table 1).
  • Table 2 shows the maximum height (axial beam height) that intersects each lens surface among luminous fluxes (axial luminous flux) imaged on the optical axis in the imaging lens of Example 1.
  • FIG. 6 is a cross-sectional view of the imaging lens according to the first example.
  • a first lens block B1 including a first object side lens unit B1a, an aperture stop S, a first lens substrate B1b, and a first image side lens unit B1c;
  • a lens group LG composed of a second lens block B2 composed of a second object side lens unit B2a, a second lens substrate B2b, and a second image side lens unit B2c; a third lens L3 that is a single lens;
  • An optical member F which is a flat plate assuming an optical low-pass filter, an infrared cut filter, a seal glass of a solid-state imaging device, and the like is disposed.
  • Example 1 is an imaging surface of the solid-state imaging device. Further, in Example 1, all the air contact surfaces of the lens portions constituting the lens block have an aspherical shape, and the first lens block B1 and the second lens block B2 are bonded via a spacer SP.
  • the imaging lens of Example 1 has the highest light flux of the axial light beam on the first surface (surface in contact with the air of the lens unit B1a) constituting the lens group LG. ing. That is, the lens surface that has the maximum ray height of the axial light beam of the imaging lens of Example 1 is in the lens group LG configured by the first lens block B1 and the second lens block B2.
  • FIG. 7 is an aberration diagram (spherical aberration diagram (a), astigmatism diagram (b), distortion diagram (c), meridional coma aberration diagram (d)) of the imaging lens shown in Example 1.
  • the solid line represents the d line and the dotted line represents the g line
  • the solid line represents the sagittal image plane and the dotted line represents the meridional image plane.
  • Example 2 Lens data of the imaging lens of Example 2 is shown in the following (Table 3) and (Table 4).
  • Table 5 shows the maximum height (axial beam height) that intersects each lens surface among luminous fluxes (axial luminous flux) imaged on the optical axis in the imaging lens of Example 2.
  • FIG. 8 is a cross-sectional view of an imaging lens according to Example 2 which is a zoom lens.
  • Example 2 in order from the object side along the optical axis, a first lens group G1 having a negative refractive power, a second lens group G2 having a positive refractive power (including an aperture stop S), and a positive refractive power
  • the third lens group G3, and an optical member F that is a flat plate assuming an optical low-pass filter, an infrared cut filter, a seal glass of a solid-state imaging device, and the like are disposed.
  • IS is an imaging surface of the solid-state imaging device.
  • the position of the third lens group G3 on the optical axis is unchanged, and the first lens group G1 moves to the image side as indicated by the arrow A, and then moves to the object side. Then, as the second lens group G2 is indicated by an arrow B, zooming can be performed by gradually moving toward the object side and changing the interval between the lens groups.
  • the second lens group G2 of Example 2 constitutes a lens group composed of lens blocks B3 and B4.
  • the material, manufacturing method, etc. are the same as those of the above-described example except for the shape thereof, and thus the description thereof is omitted. To do.
  • the first lens group G1 includes a negative lens L1 and a positive lens L2
  • the second lens group G2 includes a third object side lens unit B3a, a third lens substrate B3b, and a third image side lens unit.
  • a positive third lens block B3 composed of B3c
  • a negative fourth lens block B4 composed of a fourth object side lens unit B4a, a fourth lens substrate B4b, and a fourth image side lens unit B4c.
  • the third lens group G3 comprises solely a positive lens L5. All the air contact surfaces of the lens unit of the lens group including the lens blocks B3 and B4 are aspherical, and the third lens block B3 and the fourth lens block B4 are bonded via a spacer SP.
  • the imaging lens of Example 2 has a fifth surface in the lens group consisting of lens blocks B3 and B4 over the entire range from the wide-angle end (Wide) to the telephoto end (Tele).
  • the beam height of the axial light beam is the highest. That is, the lens surface that has the maximum ray height of the on-axis light beam of the imaging lens of the second embodiment is in the lens group that includes the third lens block B3 and the fourth lens block B4.
  • FIG. 9 to 11 are aberration diagrams (spherical aberration diagram (a), astigmatism diagram (b), distortion diagram (c), and meridional coma aberration (d)) of the imaging lens shown in Example 2.
  • FIG. . 9 is an aberration diagram with a focal length of 4.550 mm
  • FIG. 10 is an aberration diagram with a focal length of 8.640 mm
  • FIG. 11 is an aberration diagram with a focal length of 12.423 mm.
  • Example 3 Lens data of the imaging lens of Example 3 is shown in (Table 6) below.
  • Table 7 shows the maximum height (axial beam height) that intersects each lens surface among luminous fluxes (axial luminous flux) imaged on the optical axis in the imaging lens of Example 3.
  • FIG. 12 is a cross-sectional view of the imaging lens according to the third example.
  • a first lens block B1 including a first object side lens unit B1a, an aperture stop S, a first lens substrate B1b, and a first image side lens unit B1c;
  • a lens group LG composed of a second lens block B2 composed of a second object side lens portion B2a and a second lens substrate B2b, a third lens L3 that is a single lens, an optical low-pass filter, and an infrared cut filter
  • An optical member F which is a parallel plate assuming a sealing glass of a solid-state imaging device is disposed.
  • IS is an imaging surface of the solid-state imaging device.
  • all air contact surfaces of the lens portions constituting the lens block have an aspherical shape, and the first lens block B1 and the second lens block B2 are bonded via the spacer SP.
  • the imaging lens of Example 3 has the highest ray height of the axial light beam on the first surface (surface in contact with the air of the lens unit B1a) constituting the lens group LG. It has become. That is, the lens surface that has the maximum ray height of the on-axis light beam of the imaging lens of the third embodiment is in the lens group LG configured by the first lens block B1 and the second lens block B2.
  • FIG. 13 is an aberration diagram (spherical aberration diagram (a), astigmatism diagram (b), distortion diagram (c), meridional coma aberration diagram (d)) of the imaging lens shown in Example 3.
  • Example 2 shows the values of the example corresponding to the conditional expression (1).
  • Example 2 is a value at a focal length of 8.640 mm where the value of Expression (1) is the largest.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Lenses (AREA)

Abstract

L'invention porte sur une lentille d'imagerie dans laquelle une détérioration de la performance due à une erreur de fabrication est supprimée, et laquelle lentille d'imagerie est fabriquée avec une excellente productivité. Au moins deux groupes de lentilles, qui sont comprises dans la lentille d'imagerie et ont une hauteur de faisceau axiale élevée, sont fabriqués par un procédé de reproduction. Ainsi, l'axe optique d'un bloc lentille compris dans le groupe de lentilles est aligné avec précision, et, par réduction de l'excentricité parallèle du groupe de lentilles, une détérioration de la performance due à une erreur de fabrication peut être supprimée.
PCT/JP2009/052659 2008-03-07 2009-02-17 Lentille d'imagerie, dispositif d'imagerie et procédé de fabrication de lentille d'imagerie Ceased WO2009110311A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008057893 2008-03-07
JP2008-057893 2008-03-07

Publications (1)

Publication Number Publication Date
WO2009110311A1 true WO2009110311A1 (fr) 2009-09-11

Family

ID=41055872

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/052659 Ceased WO2009110311A1 (fr) 2008-03-07 2009-02-17 Lentille d'imagerie, dispositif d'imagerie et procédé de fabrication de lentille d'imagerie

Country Status (1)

Country Link
WO (1) WO2009110311A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115023638A (zh) * 2020-03-31 2022-09-06 株式会社藤仓 光运算装置、以及光运算装置的制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005539276A (ja) * 2002-09-17 2005-12-22 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法
JP2006323365A (ja) * 2005-05-18 2006-11-30 Samsung Electro-Mechanics Co Ltd ウェーハスケールレンズ及びこれを具備する光学系
JP2006349948A (ja) * 2005-06-15 2006-12-28 Canon Inc 光学系及びそれを有する光学機器
JP4022246B1 (ja) * 2007-05-09 2007-12-12 マイルストーン株式会社 撮像レンズ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005539276A (ja) * 2002-09-17 2005-12-22 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法
JP2006323365A (ja) * 2005-05-18 2006-11-30 Samsung Electro-Mechanics Co Ltd ウェーハスケールレンズ及びこれを具備する光学系
JP2006349948A (ja) * 2005-06-15 2006-12-28 Canon Inc 光学系及びそれを有する光学機器
JP4022246B1 (ja) * 2007-05-09 2007-12-12 マイルストーン株式会社 撮像レンズ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115023638A (zh) * 2020-03-31 2022-09-06 株式会社藤仓 光运算装置、以及光运算装置的制造方法
CN115023638B (zh) * 2020-03-31 2025-06-03 株式会社藤仓 光运算装置、以及光运算装置的制造方法

Similar Documents

Publication Publication Date Title
CN102483512B (zh) 单焦点光学系统、摄像装置及数字设备
JP5321954B2 (ja) 撮像レンズ、撮像装置及び携帯端末
US9557536B2 (en) Zoom lens and image pickup device
JP5440032B2 (ja) 撮像レンズ及び小型撮像装置
JP5311043B2 (ja) 撮像レンズ、撮像装置、携帯端末、撮像レンズの製造方法及び撮像装置の製造方法。
JP5267825B2 (ja) 撮像レンズ、撮像装置、デジタル機器、及び撮像レンズの製造方法
JP2009251367A (ja) 撮像レンズ、撮像レンズの製造方法及び撮像装置
CN102197329B (zh) 摄像透镜、摄像装置及便携终端
CN103827722A (zh) 摄像镜头、摄像装置以及便携终端以及数字设备
KR20100087623A (ko) 촬상 렌즈, 촬상 장치, 휴대 단말기 및 촬상 렌즈의 제조 방법
JP5648689B2 (ja) 撮像レンズ及び撮像装置
JP5621782B2 (ja) ズームレンズ及び撮像装置
JPWO2009069467A1 (ja) 撮像レンズ、撮像装置及び携帯端末
JP2009251366A (ja) 撮像レンズの製造方法、撮像レンズ及び撮像装置
WO2009125654A1 (fr) Procédé de fabrication de bloc de lentille, bloc de lentille, lentille de formation d'image, dispositif de formation d'image et terminal portatif
JP5391822B2 (ja) 撮像レンズ，撮像装置及び携帯端末
JP5267773B2 (ja) 撮像レンズ、撮像装置、デジタル機器、及び撮像レンズの製造方法
KR20080020717A (ko) 줌렌즈 광학계 및 이를 구비한 디지털 촬영기기
WO2009110311A1 (fr) Lentille d'imagerie, dispositif d'imagerie et procédé de fabrication de lentille d'imagerie
KR20120109515A (ko) 광학 유닛 및 촬상 장치
JP2009251368A (ja) 撮像レンズ及び撮像装置
WO2010140415A1 (fr) Lentille de prise d'image, dispositif de prise d'image et terminal portable
WO2010146899A1 (fr) Objectif de prise d'image, dispositif de prise d'image et terminal portable
JP2004199037A (ja) 撮像レンズ
JP2009204877A (ja) 撮像レンズ及び撮像装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09716564

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09716564

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP