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WO2009038190A1 - 接着剤組成物及び接合体 - Google Patents

接着剤組成物及び接合体 Download PDF

Info

Publication number
WO2009038190A1
WO2009038190A1 PCT/JP2008/067017 JP2008067017W WO2009038190A1 WO 2009038190 A1 WO2009038190 A1 WO 2009038190A1 JP 2008067017 W JP2008067017 W JP 2008067017W WO 2009038190 A1 WO2009038190 A1 WO 2009038190A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive composition
bonded body
adhesive
melting point
disclosed
Prior art date
Application number
PCT/JP2008/067017
Other languages
English (en)
French (fr)
Inventor
Hiroyuki Izawa
Shigeki Katogi
Sunao Kudou
Tomoyasu Honda
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to CN200880107505.0A priority Critical patent/CN101802118B/zh
Priority to JP2009533204A priority patent/JP5349316B2/ja
Priority to KR1020097017752A priority patent/KR101240009B1/ko
Publication of WO2009038190A1 publication Critical patent/WO2009038190A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Abstract

　（ａ）融点が４０°C～８０°Cである結晶性樹脂と、（ｂ）ラジカル重合性化合物と、（ｃ）ラジカル重合開始剤と、を含む接着剤組成物を提供する。このような接着剤組成物は、接着強度に優れ、且つ信頼性試験後においても安定した性能を維持し、取扱性にも優れる。
PCT/JP2008/067017 2007-09-19 2008-09-19 接着剤組成物及び接合体 WO2009038190A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880107505.0A CN101802118B (zh) 2007-09-19 2008-09-19 粘接剂组合物和连接体
JP2009533204A JP5349316B2 (ja) 2007-09-19 2008-09-19 接着剤組成物及び接合体
KR1020097017752A KR101240009B1 (ko) 2007-09-19 2008-09-19 접착제 조성물 및 접합체

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007242217 2007-09-19
JP2007-242217 2007-09-19
JP2008071763 2008-03-19
JP2008-071763 2008-03-19

Publications (1)

Publication Number Publication Date
WO2009038190A1 true WO2009038190A1 (ja) 2009-03-26

Family

ID=40467999

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067017 WO2009038190A1 (ja) 2007-09-19 2008-09-19 接着剤組成物及び接合体

Country Status (4)

Country Link
JP (2) JP5349316B2 (ja)
KR (1) KR101240009B1 (ja)
CN (1) CN101802118B (ja)
WO (1) WO2009038190A1 (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012067281A (ja) * 2010-08-24 2012-04-05 Hitachi Chemical Co Ltd 回路接続材料、これを用いた回路部材の接続方法、回路接続構造体、及び、回路接続構造体の製造方法
WO2014045931A1 (ja) * 2012-09-18 2014-03-27 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
KR20140064651A (ko) * 2012-11-19 2014-05-28 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 접속 방법, 및 접합체
JP2015147832A (ja) * 2014-02-05 2015-08-20 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法、並びに、接続方法及び接合体
CN106104929A (zh) * 2014-03-11 2016-11-09 迪睿合株式会社 各向异性导电膜、以及连接方法及接合体
JP2016201365A (ja) * 2016-06-29 2016-12-01 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP2017117794A (ja) * 2017-01-11 2017-06-29 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP2018125291A (ja) * 2018-02-14 2018-08-09 デクセリアルズ株式会社 異方性導電フィルム、並びに、接続方法及び接合体
KR20200111667A (ko) 2018-01-30 2020-09-29 타츠타 전선 주식회사 도전성 접착제 조성물
KR20210133949A (ko) 2019-03-04 2021-11-08 타츠타 전선 주식회사 도전성 접착제 조성물
EP4163347A4 (en) * 2020-06-05 2024-06-12 Dexerials Corporation METHOD FOR PRODUCING A BONDED BODY, BONDED BODY AND HOT-MELT ADHESIVE FILM WITH ELECTRICALLY CONDUCTIVE PARTICLES

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013161713A1 (ja) * 2012-04-25 2013-10-31 日立化成株式会社 回路接続材料、回路接続構造体、接着フィルム及び巻重体
JP6123547B2 (ja) * 2013-07-26 2017-05-10 日立化成株式会社 回路接続材料、回路接続構造体、回路接続構造体の製造方法、接着剤組成物、及び接着剤シート
CN103774440A (zh) * 2014-01-20 2014-05-07 南通全技纺织涂层有限公司 一种轻质弹性耐磨尼龙面料
CN104916346A (zh) * 2015-01-05 2015-09-16 深圳市思迈科新材料有限公司 一种低温固化感光性导电银浆组合物
JP2018044117A (ja) * 2016-09-16 2018-03-22 日本合成化学工業株式会社 熱硬化性樹脂組成物、熱硬化性接着剤組成物、それを用いた熱硬化性接着シート及び薄型平板スピーカー用振動板
WO2025142949A1 (ja) * 2023-12-25 2025-07-03 セメダイン株式会社 ラジカル重合性接着剤

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6069180A (ja) * 1983-09-27 1985-04-19 Nitto Electric Ind Co Ltd 光硬化性接着テ−プもしくはシ−ト
JPH08277818A (ja) * 1994-10-28 1996-10-22 Basf Ag 化学的固定技術のための自立性埋め込み材料、その製造法およびその使用法
JP2002518576A (ja) * 1998-06-19 2002-06-25 ヘンケル・コマンディットゲゼルシャフト・アウフ・アクチエン 数段階で硬化する接着剤
WO2004031296A1 (ja) * 2002-10-01 2004-04-15 Ube Industries, Ltd. ポリオール混合物および該混合物より得られる反応性ホットメルト組成物ならびに該組成物を使用して得られる成形品
JP2006161016A (ja) * 2004-12-08 2006-06-22 Lg Cable Ltd Ｐｔｃ特性を有する異方導電性接着剤
JP2006257208A (ja) * 2005-03-16 2006-09-28 Hitachi Chem Co Ltd 接着剤、回路接続用接着剤、接続体及び半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5889118A (en) * 1996-06-03 1999-03-30 Minnesota Mining And Manufacturing Company Thermomorphic "smart" pressure sensitive adhesives
JP2004010731A (ja) * 2002-06-05 2004-01-15 Kao Corp リグノセルロース用接着剤
CN101369098B (zh) * 2003-06-04 2012-01-04 积水化学工业株式会社 固化性树脂组合物、液晶显示元件用密封剂和液晶显示元件

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6069180A (ja) * 1983-09-27 1985-04-19 Nitto Electric Ind Co Ltd 光硬化性接着テ−プもしくはシ−ト
JPH08277818A (ja) * 1994-10-28 1996-10-22 Basf Ag 化学的固定技術のための自立性埋め込み材料、その製造法およびその使用法
JP2002518576A (ja) * 1998-06-19 2002-06-25 ヘンケル・コマンディットゲゼルシャフト・アウフ・アクチエン 数段階で硬化する接着剤
WO2004031296A1 (ja) * 2002-10-01 2004-04-15 Ube Industries, Ltd. ポリオール混合物および該混合物より得られる反応性ホットメルト組成物ならびに該組成物を使用して得られる成形品
JP2006161016A (ja) * 2004-12-08 2006-06-22 Lg Cable Ltd Ｐｔｃ特性を有する異方導電性接着剤
JP2006257208A (ja) * 2005-03-16 2006-09-28 Hitachi Chem Co Ltd 接着剤、回路接続用接着剤、接続体及び半導体装置

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012067281A (ja) * 2010-08-24 2012-04-05 Hitachi Chemical Co Ltd 回路接続材料、これを用いた回路部材の接続方法、回路接続構造体、及び、回路接続構造体の製造方法
US9723715B2 (en) 2012-09-18 2017-08-01 Dexerials Corporation Anisotropic conductive film, connection method, and assembly
WO2014045931A1 (ja) * 2012-09-18 2014-03-27 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP2014060025A (ja) * 2012-09-18 2014-04-03 Dexerials Corp 異方性導電フィルム、接続方法、及び接合体
KR20140064651A (ko) * 2012-11-19 2014-05-28 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 접속 방법, 및 접합체
JP2014102943A (ja) * 2012-11-19 2014-06-05 Dexerials Corp 異方性導電フィルム、接続方法、及び接合体
KR102161430B1 (ko) * 2012-11-19 2020-10-05 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 접속 방법, 및 접합체
JP2015147832A (ja) * 2014-02-05 2015-08-20 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法、並びに、接続方法及び接合体
US10202524B2 (en) 2014-03-11 2019-02-12 Dexerials Corporation Anisotropic conductive film, connection method, and joined body
EP3118934A4 (en) * 2014-03-11 2017-11-08 Dexerials Corporation Anisotropic conductive film, connection method, and joined body
CN106104929A (zh) * 2014-03-11 2016-11-09 迪睿合株式会社 各向异性导电膜、以及连接方法及接合体
JP2016201365A (ja) * 2016-06-29 2016-12-01 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP2017117794A (ja) * 2017-01-11 2017-06-29 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
KR20200111667A (ko) 2018-01-30 2020-09-29 타츠타 전선 주식회사 도전성 접착제 조성물
JP2018125291A (ja) * 2018-02-14 2018-08-09 デクセリアルズ株式会社 異方性導電フィルム、並びに、接続方法及び接合体
KR20210133949A (ko) 2019-03-04 2021-11-08 타츠타 전선 주식회사 도전성 접착제 조성물
EP4163347A4 (en) * 2020-06-05 2024-06-12 Dexerials Corporation METHOD FOR PRODUCING A BONDED BODY, BONDED BODY AND HOT-MELT ADHESIVE FILM WITH ELECTRICALLY CONDUCTIVE PARTICLES

Also Published As

Publication number Publication date
JP2013007048A (ja) 2013-01-10
JPWO2009038190A1 (ja) 2011-01-13
JP5349316B2 (ja) 2013-11-20
CN101802118A (zh) 2010-08-11
KR101240009B1 (ko) 2013-03-06
CN101802118B (zh) 2014-05-28
KR20100009528A (ko) 2010-01-27

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