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WO2009034854A1 - 移送ロボットおよび移送方法および制御方法 - Google Patents

移送ロボットおよび移送方法および制御方法 Download PDF

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Publication number
WO2009034854A1
WO2009034854A1 PCT/JP2008/065491 JP2008065491W WO2009034854A1 WO 2009034854 A1 WO2009034854 A1 WO 2009034854A1 JP 2008065491 W JP2008065491 W JP 2008065491W WO 2009034854 A1 WO2009034854 A1 WO 2009034854A1
Authority
WO
WIPO (PCT)
Prior art keywords
transfer
horizontal arm
arm mechanism
transfer robot
hand section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/065491
Other languages
English (en)
French (fr)
Inventor
Satoshi Sueyoshi
Kentaro Tanaka
Tomohiro Matsuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yaskawa Electric Corp
Original Assignee
Yaskawa Electric Corp
Yaskawa Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Electric Corp, Yaskawa Electric Manufacturing Co Ltd filed Critical Yaskawa Electric Corp
Priority to EP08831053A priority Critical patent/EP2199035B1/en
Priority to JP2008558990A priority patent/JP4466785B2/ja
Priority to KR1020127008535A priority patent/KR101321618B1/ko
Priority to KR1020127008536A priority patent/KR101321684B1/ko
Priority to KR1020107005420A priority patent/KR101183807B1/ko
Publication of WO2009034854A1 publication Critical patent/WO2009034854A1/ja
Priority to US12/720,670 priority patent/US7905699B2/en
Anticipated expiration legal-status Critical
Priority to US13/014,722 priority patent/US8596950B2/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm
    • Y10T74/20329—Joint between elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

　本発明は、比較的小さな設置面積に配置でき、上下への昇降範囲が広くできるとともに、安全にワークを移送することが可能な移送ロボットを提供する。 　搬送物を載置するハンド部（１４）と、前記ハンド部（１４）と連結され、少なくとも２つ以上の回転関節を備え、前記ハンド部（１４）を一方向に移動するように伸縮し、軸方向に対向するように配置された水平アーム機構（３０）と、前記水平アーム機構（３０）を上下に移動するリンク機構からなる昇降機構（２０）から構成され、前記昇降機構（２０）が、ベース部材（２）に備えられた少なくとも２組のリンク機構から構成され、前記水平アーム機構（３０）が最下降位置に移動した際に、前記水平アーム機構（３０）は前記昇降機構（２０）の間に配置されるものである。
PCT/JP2008/065491 2007-09-13 2008-08-29 移送ロボットおよび移送方法および制御方法 Ceased WO2009034854A1 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
EP08831053A EP2199035B1 (en) 2007-09-13 2008-08-29 Transfer robot
JP2008558990A JP4466785B2 (ja) 2007-09-13 2008-08-29 移送ロボットおよび移送ロボットの制御方法
KR1020127008535A KR101321618B1 (ko) 2007-09-13 2008-08-29 이송 로봇 및 이의 제어 방법
KR1020127008536A KR101321684B1 (ko) 2007-09-13 2008-08-29 이송 로봇 및 이의 제어 방법
KR1020107005420A KR101183807B1 (ko) 2007-09-13 2008-08-29 이송 로봇, 이송 로봇의 이송 방법, 및 이송 로봇의 제어 방법
US12/720,670 US7905699B2 (en) 2007-09-13 2010-03-10 Transfer robot, transfer method, and control method
US13/014,722 US8596950B2 (en) 2007-09-13 2011-01-27 Transfer robot

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007237500 2007-09-13
JP2007-237500 2007-09-13
JP2007299120 2007-11-19
JP2007-299120 2007-11-19

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/720,670 Continuation US7905699B2 (en) 2007-09-13 2010-03-10 Transfer robot, transfer method, and control method

Publications (1)

Publication Number Publication Date
WO2009034854A1 true WO2009034854A1 (ja) 2009-03-19

Family

ID=40451863

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065491 Ceased WO2009034854A1 (ja) 2007-09-13 2008-08-29 移送ロボットおよび移送方法および制御方法

Country Status (6)

Country Link
US (2) US7905699B2 (ja)
EP (1) EP2199035B1 (ja)
JP (3) JP4466785B2 (ja)
KR (3) KR101321684B1 (ja)
TW (1) TWI436868B (ja)
WO (1) WO2009034854A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011125947A (ja) * 2009-12-17 2011-06-30 Yaskawa Electric Corp 移送ロボット
JP2011143500A (ja) * 2010-01-14 2011-07-28 Yaskawa Electric Corp 基板搬送装置
JP2013094896A (ja) * 2011-10-31 2013-05-20 Yaskawa Electric Corp 搬送ロボット
US8761929B2 (en) 2011-10-03 2014-06-24 Kabushiki Kaisha Yaskawa Denki Robot system

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5387622B2 (ja) * 2011-06-17 2014-01-15 株式会社安川電機 搬送ロボット
US20130309048A1 (en) * 2012-05-16 2013-11-21 Lam Research Ag Apparatus and method for transporting wafer-shaped articles
JP5794454B2 (ja) * 2012-06-18 2015-10-14 株式会社ダイフク 天井搬送車
KR101441480B1 (ko) * 2012-07-11 2014-09-17 주식회사 에스에프에이 평면디스플레이용 화학 기상 증착장치
CN103662821B (zh) * 2012-08-31 2016-03-30 鸿富锦精密工业（深圳）有限公司 搬运装置
KR101382673B1 (ko) * 2012-10-19 2014-04-14 현대중공업 주식회사 글라스용 반송로봇구조
JP5532111B2 (ja) * 2012-11-16 2014-06-25 株式会社安川電機 ロボットアーム、ロボットおよびロボットの動作方法
JP6384195B2 (ja) 2014-08-20 2018-09-05 株式会社安川電機 ロボットシステムおよびロボット教示方法
CN104860066B (zh) * 2015-04-30 2017-11-03 洛阳理工学院 一种玻璃基板搬运装置
JP6372950B2 (ja) * 2015-07-08 2018-08-15 株式会社デンソー アルミニウム合金クラッド材及びその製造方法
JP6088601B2 (ja) * 2015-08-10 2017-03-01 ファナック株式会社 走行軸付きロボットにおけるツール先端の振れを抑制するロボット制御装置
US10332767B2 (en) * 2015-12-17 2019-06-25 Asm Ip Holding B.V. Substrate transport device and substrate processing apparatus
CN108689173B (zh) * 2018-06-08 2024-05-28 佛山市光华智能设备有限公司 全自动卸板机
CN111196499B (zh) * 2018-11-16 2024-08-27 合肥欣奕华智能机器股份有限公司 一种搬运装置及基板的搬运方法
WO2022049782A1 (ja) * 2020-09-03 2022-03-10 川崎重工業株式会社 基板搬送ロボットシステム
CN112476446B (zh) * 2020-11-19 2022-03-18 郑州科技学院 一种智能送货机器人
CN114212524B (zh) * 2021-12-24 2023-08-22 上海精测半导体技术有限公司 柔性铰链组件及基板抬升机构

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JPH06338555A (ja) * 1992-12-21 1994-12-06 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH0750334A (ja) * 1993-08-03 1995-02-21 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH09162257A (ja) * 1995-12-05 1997-06-20 Metsukusu:Kk 薄型基板の搬送装置
JPH11188669A (ja) * 1997-12-25 1999-07-13 Mitsubishi Electric Corp 搬送装置
JPH11238779A (ja) 1998-02-23 1999-08-31 Mecs Corp 薄型基板搬送多関節ロボット
JP2000243809A (ja) * 1999-02-24 2000-09-08 Hirata Corp 多関節ロボット装置
JP2001274218A (ja) * 2000-03-23 2001-10-05 Sankyo Seiki Mfg Co Ltd ダブルアーム型ロボット
JP2002210684A (ja) 2000-11-14 2002-07-30 Daihen Corp トランスファロボット
JP2004106167A (ja) * 2002-09-18 2004-04-08 Samsung Electronics Co Ltd 基板搬送ロボット
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JP2006176276A (ja) 2004-12-22 2006-07-06 Shinko Electric Co Ltd 昇降装置

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JPH06338555A (ja) * 1992-12-21 1994-12-06 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH0750334A (ja) * 1993-08-03 1995-02-21 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH09162257A (ja) * 1995-12-05 1997-06-20 Metsukusu:Kk 薄型基板の搬送装置
JPH11188669A (ja) * 1997-12-25 1999-07-13 Mitsubishi Electric Corp 搬送装置
JPH11238779A (ja) 1998-02-23 1999-08-31 Mecs Corp 薄型基板搬送多関節ロボット
JP2000243809A (ja) * 1999-02-24 2000-09-08 Hirata Corp 多関節ロボット装置
JP2001274218A (ja) * 2000-03-23 2001-10-05 Sankyo Seiki Mfg Co Ltd ダブルアーム型ロボット
JP2002210684A (ja) 2000-11-14 2002-07-30 Daihen Corp トランスファロボット
JP2004106167A (ja) * 2002-09-18 2004-04-08 Samsung Electronics Co Ltd 基板搬送ロボット
JP2005150575A (ja) * 2003-11-19 2005-06-09 Nachi Fujikoshi Corp ダブルアーム型ロボット
JP2006176276A (ja) 2004-12-22 2006-07-06 Shinko Electric Co Ltd 昇降装置

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* Cited by examiner, † Cited by third party
Title
See also references of EP2199035A4 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011125947A (ja) * 2009-12-17 2011-06-30 Yaskawa Electric Corp 移送ロボット
JP2011143500A (ja) * 2010-01-14 2011-07-28 Yaskawa Electric Corp 基板搬送装置
US8761929B2 (en) 2011-10-03 2014-06-24 Kabushiki Kaisha Yaskawa Denki Robot system
JP2013094896A (ja) * 2011-10-31 2013-05-20 Yaskawa Electric Corp 搬送ロボット

Also Published As

Publication number Publication date
JP5013281B2 (ja) 2012-08-29
KR101321684B1 (ko) 2013-10-23
US8596950B2 (en) 2013-12-03
KR20120049392A (ko) 2012-05-16
JP2010158769A (ja) 2010-07-22
JP2010131750A (ja) 2010-06-17
US20100199797A1 (en) 2010-08-12
KR101183807B1 (ko) 2012-09-17
JP4822085B2 (ja) 2011-11-24
US7905699B2 (en) 2011-03-15
KR20100068250A (ko) 2010-06-22
TW200924925A (en) 2009-06-16
EP2199035B1 (en) 2012-08-01
EP2199035A4 (en) 2011-08-03
EP2199035A1 (en) 2010-06-23
JP4466785B2 (ja) 2010-05-26
KR101321618B1 (ko) 2013-10-23
TWI436868B (zh) 2014-05-11
KR20120051757A (ko) 2012-05-22
JPWO2009034854A1 (ja) 2010-12-24
US20110123305A1 (en) 2011-05-26

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