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WO2009031841A3 - Method of coating metallic material - Google Patents

Method of coating metallic material Download PDF

Info

Publication number
WO2009031841A3
WO2009031841A3 PCT/KR2008/005233 KR2008005233W WO2009031841A3 WO 2009031841 A3 WO2009031841 A3 WO 2009031841A3 KR 2008005233 W KR2008005233 W KR 2008005233W WO 2009031841 A3 WO2009031841 A3 WO 2009031841A3
Authority
WO
WIPO (PCT)
Prior art keywords
metal substrate
alloy
coating method
metallic material
anodic oxidation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2008/005233
Other languages
French (fr)
Other versions
WO2009031841A2 (en
Inventor
Jae-Seung Jo
Sung-In Park
Jung-Ho Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JEIS CO Ltd
Original Assignee
JEIS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JEIS CO Ltd filed Critical JEIS CO Ltd
Publication of WO2009031841A2 publication Critical patent/WO2009031841A2/en
Publication of WO2009031841A3 publication Critical patent/WO2009031841A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/20—Electrolytic after-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/24—Chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Automation & Control Theory (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Disclosed is a coating method of tungsten to metal substrate comprising the steps of: anodizing a metal substrate including Al or Al-alloy to form an anodic oxidation layer, electroplating or electroless plating the metal substrate to form a tungsten layer on the anodic oxidation layer, and heating. By the coating method, the product manufactured by Al or Al-alloy has a high corrosion resistant, plasma resistant, and heat- and abrasion resistant, resulting in improvement of lifetime and reduction of contaminant of an autoclave, electrode or its accessories in semiconductor industry.
PCT/KR2008/005233 2007-09-05 2008-09-04 Method of coating metallic material Ceased WO2009031841A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2007-0089986 2007-09-05
KR1020070089986A KR100820744B1 (en) 2007-09-05 2007-09-05 Tungsten Coating Method of Metal Matrix

Publications (2)

Publication Number Publication Date
WO2009031841A2 WO2009031841A2 (en) 2009-03-12
WO2009031841A3 true WO2009031841A3 (en) 2009-05-07

Family

ID=39534299

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/005233 Ceased WO2009031841A2 (en) 2007-09-05 2008-09-04 Method of coating metallic material

Country Status (3)

Country Link
KR (1) KR100820744B1 (en)
TW (1) TWI421373B (en)
WO (1) WO2009031841A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101736381B (en) * 2009-12-28 2012-07-25 新疆众和股份有限公司 Electrolyte and method for preparing aluminum oxide template with big hole pitch
KR20150129660A (en) 2013-03-14 2015-11-20 어플라이드 머티어리얼스, 인코포레이티드 High purity aluminum top coat on substrate
US9663870B2 (en) 2013-11-13 2017-05-30 Applied Materials, Inc. High purity metallic top coat for semiconductor manufacturing components
US20180171497A1 (en) * 2015-06-02 2018-06-21 Seung Kyun Ryu Structure for increasing strength and method for manufacturing the same
KR102464817B1 (en) * 2016-03-31 2022-11-09 에이비엠 주식회사 Metal component and manufacturing method thereof and process chamber having the metal component
KR102443973B1 (en) * 2017-12-11 2022-09-16 (주)코미코 Method for manufacturing anodized aluminum or aluminum alloy member with excellent corrosion resistance and insulating properties and surface-treated semiconductor device
KR101980609B1 (en) * 2018-03-22 2019-05-21 유주티엔씨(주) EMI Shielding Coating Method for Smart Car, Mobile Device and Wearable Device
KR102047397B1 (en) * 2019-08-23 2019-11-22 김현곤 Manufacturing method of stud bolt for car using cold forging process
WO2021177013A1 (en) * 2020-03-06 2021-09-10 富士フイルム株式会社 Filled microstructure and conveyance method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07157884A (en) * 1993-12-02 1995-06-20 Three Tec:Kk Method for plating tungsten alloy
JPH07286296A (en) * 1994-04-15 1995-10-31 Asahi Techno Purodeyuusu:Kk Method for electroless nickel plating aluminum or aluminum alloy
KR20000059295A (en) * 1999-03-02 2000-10-05 류근성 Method of preparing for tungsten alloys on substrate using electroless plating as a anti-corrosion medium
KR20020027373A (en) * 1999-06-30 2002-04-13 리차드 에이치. 로브그렌 Corrosion resistant component of semiconductor processing equipment and method of manufacturing thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5482749A (en) * 1993-06-28 1996-01-09 Applied Materials, Inc. Pretreatment process for treating aluminum-bearing surfaces of deposition chamber prior to deposition of tungsten silicide coating on substrate therein
US20040134427A1 (en) * 2003-01-09 2004-07-15 Derderian Garo J. Deposition chamber surface enhancement and resulting deposition chambers

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07157884A (en) * 1993-12-02 1995-06-20 Three Tec:Kk Method for plating tungsten alloy
JPH07286296A (en) * 1994-04-15 1995-10-31 Asahi Techno Purodeyuusu:Kk Method for electroless nickel plating aluminum or aluminum alloy
KR20000059295A (en) * 1999-03-02 2000-10-05 류근성 Method of preparing for tungsten alloys on substrate using electroless plating as a anti-corrosion medium
KR20020027373A (en) * 1999-06-30 2002-04-13 리차드 에이치. 로브그렌 Corrosion resistant component of semiconductor processing equipment and method of manufacturing thereof

Also Published As

Publication number Publication date
KR100820744B1 (en) 2008-04-11
TW200923129A (en) 2009-06-01
WO2009031841A2 (en) 2009-03-12
TWI421373B (en) 2014-01-01

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