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WO2009031262A1 - 配線基板 - Google Patents

配線基板 Download PDF

Info

Publication number
WO2009031262A1
WO2009031262A1 PCT/JP2008/001891 JP2008001891W WO2009031262A1 WO 2009031262 A1 WO2009031262 A1 WO 2009031262A1 JP 2008001891 W JP2008001891 W JP 2008001891W WO 2009031262 A1 WO2009031262 A1 WO 2009031262A1
Authority
WO
WIPO (PCT)
Prior art keywords
board
wiring
base layer
sub
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/001891
Other languages
English (en)
French (fr)
Inventor
Tadashi Nakamura
Takayuki Kita
Kota Fukasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007227739A external-priority patent/JP2009060019A/ja
Priority claimed from JP2007227738A external-priority patent/JP2009060018A/ja
Priority claimed from JP2007227737A external-priority patent/JP5130833B2/ja
Priority claimed from JP2007227735A external-priority patent/JP5194653B2/ja
Priority claimed from JP2007227736A external-priority patent/JP2009060016A/ja
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to US12/514,383 priority Critical patent/US8253033B2/en
Priority to EP08776850A priority patent/EP2056655B1/en
Publication of WO2009031262A1 publication Critical patent/WO2009031262A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

　配線基板は、下側子配線基板と、下側子配線基板上に設けられた接続層と、接続層上に設けられた上側子配線基板とを備える。下側子配線基板は、上面を有する第１の基材層と、第１の基材層の上面に設けられた第１の配線パターンとを有する。上側子配線基板は、下面を有する第２の基材層と、第２の基材層の下面に設けられた第２の配線パターンとを有する。接続層は、第１の基材層の上面上に位置する下面と、第２の基材層の下面上に位置する上面とを有する絶縁層と、絶縁層を貫通しかつ第１の配線パターンと第２の配線パターンとに接続されたビア導体とを有する。上側子配線基板と接続層は、下側子配線基板の上面の一部を露出させる。絶縁層は、熱硬化性樹脂と、熱硬化性樹脂に分散する無機フィラーと、熱硬化性樹脂に分散するエラストマーとを含有する。この配線基板では、子配線基板間を高密度にビア導体で接続することができる。
PCT/JP2008/001891 2007-09-03 2008-07-15 配線基板 Ceased WO2009031262A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/514,383 US8253033B2 (en) 2007-09-03 2008-07-15 Circuit board with connection layer with fillet
EP08776850A EP2056655B1 (en) 2007-09-03 2008-07-15 Wiring board

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2007-227739 2007-09-03
JP2007-227738 2007-09-03
JP2007-227736 2007-09-03
JP2007-227735 2007-09-03
JP2007227739A JP2009060019A (ja) 2007-09-03 2007-09-03 立体プリント配線板
JP2007227738A JP2009060018A (ja) 2007-09-03 2007-09-03 立体プリント配線板
JP2007227737A JP5130833B2 (ja) 2007-09-03 2007-09-03 立体プリント配線板
JP2007227735A JP5194653B2 (ja) 2007-09-03 2007-09-03 立体プリント配線板
JP2007227736A JP2009060016A (ja) 2007-09-03 2007-09-03 プリント配線板
JP2007-227737 2007-09-03

Publications (1)

Publication Number Publication Date
WO2009031262A1 true WO2009031262A1 (ja) 2009-03-12

Family

ID=40428587

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001891 Ceased WO2009031262A1 (ja) 2007-09-03 2008-07-15 配線基板

Country Status (4)

Country Link
US (1) US8253033B2 (ja)
EP (1) EP2056655B1 (ja)
TW (1) TWI422301B (ja)
WO (1) WO2009031262A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013247334A (ja) * 2012-05-29 2013-12-09 Fujitsu Semiconductor Ltd 半導体装置とその製造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2010113448A1 (ja) * 2009-04-02 2012-10-04 パナソニック株式会社 回路基板の製造方法および回路基板
JP2011096900A (ja) * 2009-10-30 2011-05-12 Fujitsu Ltd 導電体およびプリント配線板並びにそれらの製造方法
US9589914B2 (en) * 2014-11-28 2017-03-07 Infineon Technologies Ag Semiconductor chip
FR3044864B1 (fr) * 2015-12-02 2018-01-12 Valeo Systemes De Controle Moteur Dispositif electrique et procede d'assemblage d'un tel dispositif electrique
KR20230046708A (ko) 2021-09-30 2023-04-06 삼성전자주식회사 열경화성 본딩 시트를 포함하는 전자 장치

Citations (9)

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Publication number Priority date Publication date Assignee Title
JPS6257387U (ja) * 1985-09-30 1987-04-09
JPH06268345A (ja) 1992-05-06 1994-09-22 Matsushita Electric Ind Co Ltd 回路形成用基板の製造方法および回路形成用基板
JPH07111379A (ja) * 1993-10-12 1995-04-25 Toppan Printing Co Ltd マルチチップモジュール実装型プリント配線板
JPH08315946A (ja) * 1995-03-14 1996-11-29 Fujikura Rubber Ltd 基板の接続方法および接続装置
JPH11154783A (ja) * 1997-09-16 1999-06-08 Seimi Chem Co Ltd 半田用フラックスの這い上がりを防止する組成物
JP2000077457A (ja) * 1998-08-31 2000-03-14 Hitachi Chem Co Ltd 半導体装置、半導体実装用基板及び半導体装置の製造方法
JP2001244368A (ja) 2000-02-29 2001-09-07 Kyocera Corp 電気素子内蔵配線基板
JP2002208763A (ja) 2000-11-09 2002-07-26 Matsushita Electric Ind Co Ltd 回路基板とその製造方法
JP2004253774A (ja) 2003-01-30 2004-09-09 Shinko Seisakusho:Kk 電子部品埋込み用の窪みを備える多層プリント配線板およびその製造方法

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JPS6257387A (ja) 1985-09-05 1987-03-13 Matsushita Electric Ind Co Ltd 映像記録再生装置
JP3061059B2 (ja) 1989-08-07 2000-07-10 ジャパンゴアテックス株式会社 Ｉｃパッケージ
US5948533A (en) * 1990-02-09 1999-09-07 Ormet Corporation Vertically interconnected electronic assemblies and compositions useful therefor
JPH04254826A (ja) 1991-02-07 1992-09-10 Sharp Corp 回路基板の接続構造
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EP0831528A3 (en) 1996-09-10 1999-12-22 Hitachi Chemical Company, Ltd. Multilayer wiring board for mounting semiconductor device and method of producing the same
DE69806007T2 (de) * 1997-07-15 2002-11-28 Seimi Chemical Co. Ltd., Chigasaki Zusammensetzung zum vermeiden des kriechens eines weichlötflussmittels
JPH1167965A (ja) 1997-08-26 1999-03-09 Hitachi Chem Co Ltd 半導体素子搭載用多層配線板の製造方法
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JP2001308145A (ja) * 2000-04-25 2001-11-02 Fujitsu Ltd 半導体チップの実装方法
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JP2002094200A (ja) * 2000-09-18 2002-03-29 Matsushita Electric Ind Co Ltd 回路基板用電気絶縁材と回路基板およびその製造方法
JP2002151551A (ja) * 2000-11-10 2002-05-24 Hitachi Ltd フリップチップ実装構造、その実装構造を有する半導体装置及び実装方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6257387U (ja) * 1985-09-30 1987-04-09
JPH06268345A (ja) 1992-05-06 1994-09-22 Matsushita Electric Ind Co Ltd 回路形成用基板の製造方法および回路形成用基板
JPH07111379A (ja) * 1993-10-12 1995-04-25 Toppan Printing Co Ltd マルチチップモジュール実装型プリント配線板
JPH08315946A (ja) * 1995-03-14 1996-11-29 Fujikura Rubber Ltd 基板の接続方法および接続装置
JPH11154783A (ja) * 1997-09-16 1999-06-08 Seimi Chem Co Ltd 半田用フラックスの這い上がりを防止する組成物
JP2000077457A (ja) * 1998-08-31 2000-03-14 Hitachi Chem Co Ltd 半導体装置、半導体実装用基板及び半導体装置の製造方法
JP2001244368A (ja) 2000-02-29 2001-09-07 Kyocera Corp 電気素子内蔵配線基板
JP2002208763A (ja) 2000-11-09 2002-07-26 Matsushita Electric Ind Co Ltd 回路基板とその製造方法
JP2004253774A (ja) 2003-01-30 2004-09-09 Shinko Seisakusho:Kk 電子部品埋込み用の窪みを備える多層プリント配線板およびその製造方法

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* Cited by examiner, † Cited by third party
Title
See also references of EP2056655A4

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013247334A (ja) * 2012-05-29 2013-12-09 Fujitsu Semiconductor Ltd 半導体装置とその製造方法

Also Published As

Publication number Publication date
EP2056655A1 (en) 2009-05-06
TWI422301B (zh) 2014-01-01
TW200913843A (en) 2009-03-16
US20100051337A1 (en) 2010-03-04
US8253033B2 (en) 2012-08-28
EP2056655B1 (en) 2012-06-20
EP2056655A4 (en) 2011-03-02

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