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WO2009031091A1 - Dispositif d'émission de lumière - Google Patents

Dispositif d'émission de lumière Download PDF

Info

Publication number
WO2009031091A1
WO2009031091A1 PCT/IB2008/053533 IB2008053533W WO2009031091A1 WO 2009031091 A1 WO2009031091 A1 WO 2009031091A1 IB 2008053533 W IB2008053533 W IB 2008053533W WO 2009031091 A1 WO2009031091 A1 WO 2009031091A1
Authority
WO
WIPO (PCT)
Prior art keywords
light source
substrates
source device
light
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2008/053533
Other languages
English (en)
Inventor
Maarten M. J. W. Van Herpen
Markus C. Vermeulen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of WO2009031091A1 publication Critical patent/WO2009031091A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10174—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10706—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer being photo-polymerized
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2109/00—Light sources with light-generating elements disposed on transparent or translucent supports or substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Definitions

  • This invention relates to light output devices, in particular using discrete light sources associated with a light transmissive substrate structure.
  • LED in glass One known example of this type of lighting device is a so-called "LED in glass” device.
  • An example is shown in Figure 1.
  • a glass plate is used, with a transparent conductive coating (for example ITO) forming electrodes.
  • the conductive coating is patterned in order to make the electrodes, that are connected to a semiconductor LED device.
  • the assembly is completed by laminating the glass, with the LEDs inside a thermoplastic layer (for example polyvinyl butyral, PVB).
  • the glass used may be safety glass.
  • Applications of this type of device are shelves, showcases, facades, office partitions, wall cladding, and decorative lighting.
  • the lighting device can be used for illumination of other objects, for display of an image, or simply for decorative purposes.
  • One problem with devices of this type is that the product when turned off may not have an attractive appearance.
  • the individual LED devices can be seen as an array of small squares.
  • Another problem related to this type of design is that light emission typically only occurs in one direction, because the LED package does not allow light to be transmitted in a downwards direction.
  • a light output device comprising: a light transmissive substrate arrangement comprising first and second light transmissive substrates; at least one light source device integrated into the structure of the substrate arrangement between the first and second substrates; and - an electrode arrangement formed on one of the substrates and between the substrates, with the light source device or devices connected to the electrode arrangement, wherein the light source device or devices each comprise a semiconductor device, the or each semiconductor device formed in a substantially transparent light source device package, and the light source device package or packages are embedded in a substantially transparent material layer which at least partially fills the spacing between the substrates.
  • the device may be desired to take the appearance of a window, shelf or other panel.
  • a dedicated transparent package can be used to protect the light source device against stress and at the same time make the device more suited for manufacturing of a light output system in which light source devices are embedded in a further transparent material.
  • the electrode arrangement can comprise an at least semi-transparent conductor arrangement.
  • the electrical contacts of the light source devices are then connected to regions of the transparent conductor arrangement.
  • the light source devices preferably comprise LED devices.
  • each package forms a substantially transparent layer on opposite sides of the semiconductor light source device, such that light emission from the semiconductor light source device passes through both substrates.
  • the first and second light transmissive substrates can comprise glass plates, and the substrate arrangement can further comprise a thermoplastic layer between the glass plates.
  • the electrode arrangement can comprise a transparent conductive oxide.
  • Figure 1 shows a known LED in glass illumination device
  • Figure 2 shows a single LED of the device of Figure 1 in more detail
  • Figure 3 shows a known manufacturing method for an LED chip
  • Figure 4 shows an example of LED chip suitable for use in the device of the invention.
  • FIG. 5 shows an example of device of the invention.
  • the same reference numbers are used to denote similar parts in the different figures.
  • the structure of an LED in glass illumination device is shown in Figure 2.
  • the lighting device comprises glass plates 1 and 2. Between the glass plates are (semi-) transparent electrodes 7a and 7b (for example formed using ITO), and a LED 4 connected to the transparent electrodes 7a and 7b.
  • a layer of thermoplastic material 5 is provided between glass plates 1 and 2 (for example PVB or UV resin).
  • the glass plates typically may have a thickness of 1.1mm - 2.1 mm.
  • the spacing between the electrodes connecting to the LED is typically 0.01 - 3 mm, for example around 0.15 mm.
  • the thermoplastic layer has a typical thickness of 0.3mm- 2mm, and the electrical resistance of the electrodes is in the range 2 - 80 Ohm, or 10- 30 Ohms/square.
  • the electrodes are preferably substantially transparent, so that they are imperceptible to a viewer in normal use of the device. If the conductor arrangement does not introduce a variation in light transmission (for example because it is not patterned, or because the pattern cannot be seen), a transparency of greater than or equal to 50% may be sufficient for the system to be transparent. More preferably, the transparency is greater than 70%, more preferably 90%, and even more preferably 99%. If the conductor arrangement is patterned (for example because thin wires are used), the transparency is preferably greater than 80%, more preferably 90%, but most preferably greater than 99%.
  • the electrodes can be made of a transparent material such as ITO or they can be made of an opaque material such as copper but be sufficiently thin so that they are not visible in normal use. Examples of suitable materials are disclosed in US 5 218 351.
  • the LED 4 comprises a transparent package which is embedded in a further transparent layer.
  • a light emitting diode typically comprises a LED chip within a (non-transparent) package, for example a leadframe package.
  • the leadframe package typically comprises a moulded plastics body which encapsulates one or more LED chips, optionally a lens or phosphor portion, and thin metal leads connecting to the LED chip and extending outside the plastic body.
  • the metal leads supply power but also can act to draw heat away from the LED chip.
  • the use of a package enables modern electronic assembly processes to be used, such as high speed automated insertion and automatic mass-soldering. Compatibility with such automated processes is critical fro large-scale commercial viability of the LED products.
  • the LED may for example be provided in a glass package.
  • heat conduction levels of a glass package may require low power operation of the LED.
  • the LED package preferably has an LED chip with a transparent substrate, the chip also being mounted within a transparent package.
  • LEDs with a transparent substrate are known.
  • One example of a manufacturing method for such LEDs is described in US5376580.
  • the main application of such LEDs is the use of a "mirror substrate", referring to a reflective layer between the substrate and the LED device layers. Light emitted by the device in a downwards direction is redirected by the reflective layer towards the top surface, preventing loss and enhancing brightness.
  • the reflective layer is inserted into the device by a wafer-bonding process.
  • the process flow is shown in Figure 3, and comprises depositing an ohmic contact metal and a high-reflectivity metal layer onto an LED epiwafer, in the form of a GaAs substrate carrying the LED layer.
  • a solder layer is deposited onto a separate substrate (silicon, metal, SiC etc). The two prepared substrates are shown in Figure 3 (a). In Figure 3(b), the mirror metal and solder layers are then bonded together at a low temperature.
  • the GaAs substrate is removed by lapping and chemical etching.
  • top and bottom ohmic contact metals are then deposited and annealed.
  • the preferred device of the invention uses an LED package with a transparent substrate and no reflecting layer, such that light is emitted in both upward and downward directions.
  • Figure 4 shows an example of a possible LED device 4.
  • the LED layer 9 does not have a reflecting layer on its substrate 6. Instead, it has an ohmic contact layer 7 and a solder 8 that is translucent. This may for example be achieved by using very thin layers of a metal such as Cu, or by using a transparent conductive material such as ITO.
  • the LED device also has two electrode contacts 10. The LED is conventionally packaged in a non-transparent material.
  • the package also allows light to be transmitted in both upwards and downwards directions. This may be achieved in several ways: One preferred approach is to provide the package with an opening in both up and downwards direction.
  • the openings can for example be filled with a phosphor used for light conversion, in particular for converting blue light into white light.
  • the package can alternatively be made of a material that is transparent.
  • a material that is transparent For example, glass or an epoxy resin may be used.
  • the disadvantage of such materials is their limited heat conduction, which quickly leads to overheating of the LED.
  • this approach should only be used in combination with a LED operating at low power.
  • a transparent ceramic material for example MgO, may be used as packaging material.
  • Low power transparent packaged LEDs are available from Nichia
  • the resulting structure is still partially opaque where the LED chip is located.
  • a LED chip is considerably smaller than the LED package that is currently used in LED in glass devices.
  • a LED package has dimensions in the order of 1-3 mm, and the LED chip has dimensions in the order of 0.1 mm.
  • parts of the structure may be non-transparent when a non-transparent conductor arrangement is used inside the package.
  • the packages are then embedded in the thermoplastic (or other transparent) layer 5, to provide the desired mechanical robustness of the complete device.
  • LED devices without a package, and embed these in an insulating layer between the substrates, for example PVB.
  • FIG 5 shows the structure of the device of the invention, in which the same reference numerals as in Figure 2 have been used.
  • the LED 4 comprises the LED chip 4a and a surrounding transparent package 4b, with the complete package embedded in the thermoplastic layer 5.
  • the LED chip 4a will have a maximum linear dimension (in the plane of the substrate, i.e. a dimension of the area rather than the height) of less than 0.5mm, more preferably less than 0.3mm and even more preferably less than 0.1mm.
  • the package 4b will have a maximum linear dimension (in the plane of the substrate, i.e. a dimension of the area rather than the height) of more than 0.5mm, preferably more than lmm. This dimension of the package 4b will typically be less than 10mm, more preferably less than 5mm and even more preferably less than 3mm.
  • the examples above use glass substrates, but it will be apparent that plastic substrates may also be used.
  • any shape may be used in which a transparent package with LED is embedded in a further transparent package and connected to a conductor arrangement.
  • a small number of possible materials to form the transparent (or at least semi-transparent) electrodes have been outlined above. Others include electrically conductive wires, strands made of a resin such as polyester or nylon wires the outer surface of which is coated with metal by vapor deposition, metal plating or the like. Conductive films of vapor-deposited SiO2-indium alloy can also be used. A conductive ink can also be used.
  • some components have been described as substantially transparent. This is intended to mean that at least 50% of the energy of the visible light spectrum is transmitted, and more preferably at least 75% or 85%.
  • the term transparent is intended to mean "light transmitting", and the transparent components may be translucent (i.e. with some image distortion).
  • the invention can be applied to a light output device having only one light source device, or to a device with many light source devices, for example arranged in an array.
  • light source devices When there are multiple light source devices, they may be individual discrete components which are spaced apart (as shown in Figure 1). However, a group of multiple LEDs may be provided at each location, with each group formed as a single chip.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un composant d'émission de lumière qui comprend un agencement de substrats transmettant la lumière comportant des premier et second substrats (1, 2) transmettant la lumière. Au moins un dispositif source de lumière (4) est intégré dans la structure de l'agencement de substrats entre les substrats, et un agencement d'électrodes (7a, 7b) est formé sur l'un des substrats et entre les substrats, le ou les dispositifs source de lumière (4) étant reliés à l'agencement d'électrodes. Le ou les dispositifs (4) source de lumière comprennent chacun un dispositif à semiconducteur (4a) formé dans un boîtier (4b) de dispositif source de lumière sensiblement transparent, et le ou les boîtiers de dispositif source de lumière sont intégrés dans une couche de matériau sensiblement transparent (5) entre les substrats. Cet agencement permet au dispositif de présenter une apparence visuelle sensiblement uniforme lorsqu'il est hors tension et ceci est considéré comme souhaitable par des utilisateurs dans de nombreuses applications différentes.
PCT/IB2008/053533 2007-09-04 2008-09-01 Dispositif d'émission de lumière Ceased WO2009031091A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07115578.2 2007-09-04
EP07115578 2007-09-04

Publications (1)

Publication Number Publication Date
WO2009031091A1 true WO2009031091A1 (fr) 2009-03-12

Family

ID=40003039

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2008/053533 Ceased WO2009031091A1 (fr) 2007-09-04 2008-09-01 Dispositif d'émission de lumière

Country Status (2)

Country Link
TW (1) TW200935627A (fr)
WO (1) WO2009031091A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020201144A1 (fr) 2019-04-02 2020-10-08 Proqr Therapeutics Ii B.V. Oligonucléotides antisens pour l'immunothérapie

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004009349A1 (fr) * 2002-07-19 2004-01-29 Pilkington Plc. Panneau de vitrage stratifie
WO2004062908A2 (fr) * 2003-01-10 2004-07-29 Glaverbel Vitrage comportant des composants electroniques
WO2007045786A1 (fr) * 2005-10-21 2007-04-26 Saint-Gobain Glass France Structure lumineuse comportant au moins une diode electroluminescente, sa fabrication et ses applications
WO2007057459A1 (fr) * 2005-11-21 2007-05-24 Agc Flat Glass Europe Sa Produit en verre

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004009349A1 (fr) * 2002-07-19 2004-01-29 Pilkington Plc. Panneau de vitrage stratifie
WO2004062908A2 (fr) * 2003-01-10 2004-07-29 Glaverbel Vitrage comportant des composants electroniques
WO2007045786A1 (fr) * 2005-10-21 2007-04-26 Saint-Gobain Glass France Structure lumineuse comportant au moins une diode electroluminescente, sa fabrication et ses applications
WO2007057459A1 (fr) * 2005-11-21 2007-05-24 Agc Flat Glass Europe Sa Produit en verre

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"LEUCHTENDE BILDER IN GLASSCHEIBEN", INTERNET CITATION, XP002241074, Retrieved from the Internet <URL:www.schott.com/architecture/english/news/press.html> [retrieved on 20030513] *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020201144A1 (fr) 2019-04-02 2020-10-08 Proqr Therapeutics Ii B.V. Oligonucléotides antisens pour l'immunothérapie

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Publication number Publication date
TW200935627A (en) 2009-08-16

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