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WO2009030149A1 - Metallic-base antiseptic patch, its preformed body, its preparing method using magnetron sputtering and its use - Google Patents

Metallic-base antiseptic patch, its preformed body, its preparing method using magnetron sputtering and its use Download PDF

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Publication number
WO2009030149A1
WO2009030149A1 PCT/CN2008/072150 CN2008072150W WO2009030149A1 WO 2009030149 A1 WO2009030149 A1 WO 2009030149A1 CN 2008072150 W CN2008072150 W CN 2008072150W WO 2009030149 A1 WO2009030149 A1 WO 2009030149A1
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Prior art keywords
metal
antibacterial
source layer
substrate
patch
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Ceased
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PCT/CN2008/072150
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French (fr)
Chinese (zh)
Inventor
Tao Zhang
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Individual
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Individual
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Publication of WO2009030149A1 publication Critical patent/WO2009030149A1/en
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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • AHUMAN NECESSITIES
    • A01AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01NPRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF; BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES OR AS HERBICIDES; PEST REPELLANTS OR ATTRACTANTS; PLANT GROWTH REGULATORS
    • A01N25/00Biocides, pest repellants or attractants, or plant growth regulators, characterised by their forms, or by their non-active ingredients or by their methods of application, e.g. seed treatment or sequential application; Substances for reducing the noxious effect of the active ingredients to organisms other than pests
    • A01N25/34Shaped forms, e.g. sheets, not provided for in any other sub-group of this main group
    • AHUMAN NECESSITIES
    • A01AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01NPRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF; BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES OR AS HERBICIDES; PEST REPELLANTS OR ATTRACTANTS; PLANT GROWTH REGULATORS
    • A01N59/00Biocides, pest repellants or attractants, or plant growth regulators containing elements or inorganic compounds
    • A01N59/16Heavy metals; Compounds thereof
    • DTEXTILES; PAPER
    • D06TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06MTREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M11/00Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
    • D06M11/83Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles

Definitions

  • Metal-based antibacterial patch, preform thereof, preparation method and application by magnetron sputtering method Metal-based antibacterial patch, preform thereof, preparation method and application by magnetron sputtering method
  • the invention relates to a metal-based antibacterial patch and a preparation method thereof, and more particularly to a metal-based antibacterial patch capable of providing metal ion sterilization, and also relates to a preform of the patch, a preparation method and application thereof .
  • Background technique
  • Chinese Patent Authorization Announcement CN1162075C discloses an antibacterial and environmentally-friendly functional lining and a production method, which is permeable with ANTIBIO-994 antibacterial agent in the base fabric.
  • the antibacterial agent is mainly used for sterilization, but after long-term washing, the antibacterial effect is remarkably reduced.
  • China Patent Licensing Publication CN2528257Y discloses a shoe lining sheet having an antibacterial and fragrant function, which is needle-punched into a sheet from a polyester staple fiber and coated with a layer of propyl bismuth on the outer layer of the polyester staple fiber.
  • the above antibacterial product uses a fiber fabric as a carrier, and then the antibacterial filler is placed in the carrier to constitute an antibacterial product, and the durability thereof is limited, and such a problem is solved by the antibacterial action of the metal material.
  • Chinese Patent Authorization Announcement CN1410587 discloses a surface copper-containing antibacterial stainless steel and a manufacturing process thereof, and the surface copper-containing antibacterial stainless steel comprises a galvanized substrate containing a ⁇ -Cu plating layer, and the copper plating layer has a copper content of 1.5-30wt. %.
  • the preparation of the antibacterial stainless steel it is necessary to use an infiltrant of CuO, CuCl and NH 4 C1, which will generate waste liquid during the preparation process, which may cause environmental pollution if not treated properly.
  • the composition and composition of the alloy layer obtained by the plating have many limitations, and therefore, the antibacterial Sex will be restricted.
  • Citride No. CN1158363 discloses a stainless steel which is improved in antibacterial property by adding 0.4-5.0% by weight of copper and a copper-rich phase precipitated at a ratio of 0.2% by volume.
  • a copper-silver bimetallic colloidal antibacterial agent and a preparation method thereof are disclosed in Chinese Patent Publication No. CN1262043.
  • a silver-ion-protected silver ion is added to the copper colloid to cause a silver ion to undergo a replacement reaction with copper, and a part or all of the surface of the copper particle is coated with silver particles to form a copper-silver bimetallic colloidal antibacterial agent.
  • an object of the present invention is to provide a metal-based antibacterial patch which uses a metal element as an antibacterial source layer and a metal material as a matrix to provide quality.
  • Metal-based antibacterial patch with excellent stability and durability.
  • the present invention provides a metal-based antimicrobial patch.
  • a metal-based antibacterial patch characterized in that it consists of a metal antibacterial source layer, a metal substrate and an adhesive layer, which is deposited by magnetron sputtering or one or more The metal is formed on the upper portion of the metal substrate, and the adhesive layer is disposed on the bottom of the metal substrate.
  • the metal-based antibacterial patch of the present invention has a metal material as a matrix, and is closely combined with a metal antibacterial source layer deposited thereon by magnetron sputtering, thereby improving antibacterial durability; and the metal antibacterial source layer It is deposited on the metal substrate by magnetron sputtering, so it can be used on a metal substrate of various metal materials; and the metal antibacterial source layer produced by the magnetron sputtering method is nanometer-scale, and can also be used in combination.
  • a variety of antibacterial metals so the antibacterial effect is good; and the metal material of the metal antibacterial source layer and the metal material of the metal matrix can be combined as needed; and the metal antibacterial source layer is produced by magnetron sputtering, and no chemical substances remain. , thereby preventing environmental pollution caused by chemical residues.
  • a metal-based antimicrobial patch according to a preferred embodiment of the present invention is characterized in that one or more metal substrates are provided between the metal antibacterial source layer and the adhesive layer. In order to solve the problem of bonding between various metals and to make a better combination between the metals, a multilayer substrate can be provided.
  • a metal-based antimicrobial patch according to a preferred embodiment of the present invention is characterized in that the multilayer metal substrate can be made of the same or different materials.
  • a metal-based antimicrobial patch according to a preferred embodiment of the present invention is characterized in that the adhesive layer is an adhesive layer similar to a wound patch, and any adhesive layer having a tackiness can be used.
  • the adhesive layer is mainly for fixing the metal-based antimicrobial patch to the article to be used, thereby improving the arbitrariness of use.
  • the metal antibacterial source layer preferably contains gold, vanadium, chromium, manganese, iron, cobalt, nickel, copper One or more alloys of silver, rare earth elements, and tin.
  • the metal antibacterial source layer is gold, copper, silver, iron or an element.
  • the above metals are non-toxic and stable in performance, so they are preferred.
  • the metal antibacterial source layer is copper, silver or an alloy of copper and silver, which is preferred because it has a good antibacterial effect.
  • all metal substrates which can be deposited thereon by a magnetron sputtering method and which are non-toxic and harmless can be used, wherein the preferred metal substrate is magnesium, aluminum or titanium. , a metal of vanadium, chromium, manganese, iron, cobalt, copper, rhenium, zirconium, hafnium, phase, palladium, silver, platinum, or an alloy thereof, or an atomic ratio of 20% or more of the element An alloy of metals.
  • the above metals are common metals and are known to be harmless to the human body or elements required by the human body. They are used as a metal matrix, which is safe and durable, and has a certain antibacterial effect itself, and is closely combined with the metal antibacterial source layer thereon.
  • a metal-based antibacterial patch according to a particularly preferred embodiment of the present invention, characterized in that the metal antibacterial source layer is copper, silver or a copper-silver alloy, and the metal substrate is a copper sheet, a silver sheet or an aluminum sheet, and such a combination is most preferable.
  • the metal antibacterial source layer is tightly combined with the metal substrate, is harmless to the human body, and greatly improves the antibacterial effect and antibacterial durability.
  • the metal-based antimicrobial patch has a thickness of 0.00005 to 1 mm. If the thickness of the metal antibacterial source layer is less than 0.00005 mm, the durability of the metal-based antibacterial patch may be affected. If the thickness of the metal antibacterial source layer is higher than 1 mm, It is inconvenient to use, and the above thickness makes the metal-based antibacterial patch and the human body have better practicality when used in direct and indirect contact with the human body, and does not cause or cause foreign body sensation. Considering the durability and high-efficiency antibacterial property of the metal-based antibacterial patch, the thickness of the metal antibacterial source layer is preferably 0.001 to 0.8 mm, more preferably 0.005 to 0.1 mm.
  • a metal-based antimicrobial patch according to a preferred embodiment of the present invention, characterized in that the thickness of each of the metal substrates is preferably 0.0005 to 1 mm.
  • the above thickness is more practical when used in direct and indirect contact with the human body so as not to cause or cause a foreign body sensation.
  • the total thickness of the metal antibacterial source layer and the metal substrate is preferably 0.001 to 2 mm.
  • the above thickness is more practical when used in direct and indirect contact with the human body so as not to cause or cause a foreign body sensation.
  • a metal-based antibacterial patch according to a preferred embodiment of the present invention, characterized in that the metal substrate is preferably a copper sheet, an iron sheet, a silver sheet or an aluminum sheet having a thickness of 0.002 to 1.5 mm, or a thickness of 0.002 - 1.5 mm. Copper-based alloy sheets, iron-based alloy sheets, silver-based alloy sheets or aluminum-based alloy sheets. The above thickness is more practical when used in direct and indirect contact with the human body so as not to cause or a little foreign body sensation; and the above metal is not harmful to the human body, and the overall antibacterial durability of the metal-based antibacterial patch can be improved.
  • a method of preparing a metal-based antimicrobial patch according to a preferred embodiment of the present invention characterized in that a metal antibacterial source layer having two or more metal elements is simultaneously deposited on a metal substrate during magnetron sputtering deposition Formed from two or more metal elements.
  • the metal antibacterial source layer has two or more kinds of metal elements uniformly, and works at the same time, thereby improving the antibacterial effect, expanding the antibacterial range and the applicable occasion.
  • the invention also provides a preparation method for preparing the above metal-based antibacterial patch, characterized in that the method comprises the steps of: depositing one or more metals on the upper part of the metal substrate by magnetron sputtering to form a metal antibacterial source layer, The adhesive layer is placed on the bottom of the metal substrate.
  • different targets are mounted on a plurality of target stages of the magnetron sputtering apparatus, and two kinds of metal substrates can be simultaneously deposited during magnetron sputtering deposition.
  • a metal antibacterial source layer of two or more metal materials The method allows two or more metal materials to be uniformly deposited on the metal substrate, thereby improving the antibacterial effect of the metal-based antimicrobial patch.
  • the method of depositing a metal antibacterial source layer on the upper portion of the metal substrate by magnetron sputtering includes the following steps:
  • the current is 0.01 ⁇ 0.2A
  • the voltage is 200 ⁇ 350V
  • the target is deposited for 5 ⁇ 10min.
  • the metal-based antibacterial patch prepared by the above method has stable performance and improved antibacterial durability.
  • the magnetron sputtering method used in the application of the present invention is not limited to the above specific method, as long as the metal antibacterial source layer is deposited on the metal substrate of the present invention by using a known magnetron sputtering method, which is within the protection scope of the present application. .
  • the present invention also provides the use of the above metal-based antimicrobial patch for sterilizing a mobile phone, a computer keyboard, a garment or a wallet.
  • the invention also provides a preform for a metal-based antibacterial patch comprising a metal antibacterial source layer and a metal matrix, the metal antibacterial source layer depositing the metal matrix by one or more metals by magnetron sputtering Formed on the top.
  • the invention also provides a metal-based antibacterial patch, comprising: a metal antibacterial source layer, a metal substrate and an adhesive layer, wherein the metal antibacterial source layer deposits one or more metals by magnetron sputtering The upper portion of the metal substrate is formed, and the adhesive layer is disposed at the bottom of the metal substrate.
  • the invention also provides a metal-based antibacterial patch comprising a metal antibacterial source layer, a metal substrate and an adhesive layer, the metal antibacterial source layer being one or more metal ions, atoms and/or radicals by magnetron sputtering. Formed on the upper portion of the metal substrate, the adhesive layer is disposed on the bottom of the metal substrate.
  • the beneficial effects of the present invention are as follows: (1) The use of a metal material as a carrier improves the durability of the antibacterial; (2) and the metal antibacterial source layer is deposited on the upper portion of the metal substrate by magnetron sputtering to form Preform, so it can be used on a variety of metal materials; (3) The metal material in the metal antibacterial source layer deposited by magnetron sputtering is nanometer-scale, and the antibacterial effect is good; (4) A combination of a variety of different antimicrobial metals, so it is convenient to choose the material with the best antibacterial effect according to your needs;
  • the type of the antibacterial metal material of the metal antibacterial source layer and the metal material of the metal matrix may be combined as needed to make the bonding between them tight and enhance the durability; (6) using magnetron sputtering, no residue Chemical substances, thus preventing environmental pollution caused by chemical residues.
  • FIG. 1 is a cross-sectional view of a metal-based antimicrobial patch according to an embodiment of the present invention
  • FIG. 2 is a cross-sectional view of a metal-based antimicrobial patch according to another embodiment of the present invention; wherein: a metal antibacterial source layer, a 2-metal substrate, a 3-adhesive layer, and a 4-metal substrate A.
  • the invention relates to a metal-based antibacterial patch which uses a metal material as a base, and is characterized in that it comprises a metal antibacterial source layer 1, a metal substrate 2 and an adhesive layer 3.
  • the upper part of the metal substrate is a metal antibacterial source layer 1, and the metal substrate 2
  • the bottom of the layer is the adhesive layer 3.
  • the total thickness of the metal antibacterial source layer 1 and the metal substrate 2 is preferably 0.001 to 2 mm.
  • the adhesive layer 3 may be a conventional paper single-sided adhesive tape, such as a sticker for wounds, or other adhesive layer.
  • the metal substrate 2 is preferably a copper sheet, an iron sheet, a silver sheet or an aluminum sheet having a thickness of 0.002 to 1.5 mm, or a copper-based alloy sheet having a thickness of 0.002 to 1.5 mm, and iron.
  • the metal antibacterial source layer is preferably gold, copper, silver, iron or a word.
  • the metal-based antibacterial patch of the present invention uses a metal material as a matrix (or carrier) and the antibacterial agent also uses a metal element
  • the inventors have adopted advanced techniques to prepare a preform for a metal-based antibacterial patch (including Metal antibacterial source layer 1 and metal matrix 2).
  • a metal antibacterial source layer 1 is first prepared on a metal substrate 2 by a magnetron sputtering method, and a preform of a metal-based antibacterial patch is obtained.
  • the method may be conventional.
  • a magnetron sputtering method for example, preferably, the method comprises the steps of:
  • the current is 0.01 ⁇ 0.2A
  • the voltage is 200 ⁇ 350V
  • the target is removed after 5 ⁇ 10min, so that the metal antibacterial source layer is magnetron sputtered on the metal substrate 2.
  • the preform is obtained by the above-mentioned method, and the metal antibacterial source layer on the metal substrate is deposited and has good durability.
  • the metal substrate of the preform obtained by the step (7) is pasted onto the adhesive layer 3 to obtain a metal-based antibacterial patch.
  • different targets can be mounted on a plurality of target stages of the magnetron sputtering apparatus, and two or more types can be simultaneously deposited in the magnetron sputtering deposition process.
  • the metal-based antibacterial patch of the invention releases the metal particles and metal atoms by the antibacterial metal element on the patch through the corrosive substances such as lactic acid and the mechanical friction in the sweat secreted by the human body under the temperature and humidity conditions of the human body. And metal ions, which play an antibacterial and bactericidal role.
  • the metal antibacterial patch prepared by the invention can be designed as an antibacterial patch applied to a mobile phone, an antibacterial patch for a computer keyboard, an antibacterial patch for clothing (shoes, socks, clothes) according to different applications. Antibacterial patches for wallets, etc.
  • an antibacterial patch used as an antibacterial patch on a mobile phone, and its size matches the size of the phone's keyboard.
  • an antibacterial patch used as a computer keyboard the size of which matches the keyboard size of the computer.
  • the antibacterial patch for clothing, and can be designed into various shapes, such as a circular shape, a square shape, and a special shape, and can be arbitrarily attached to any part of the clothing according to the user's preference and needs.
  • the term "metal antibacterial source layer" in the present application is a broad concept, and depending on the metal material used, the antibacterial effecting component may be a metal particle, a metal ion, a metal atom, a metal atomic group and/or a metal. Compounds, etc.
  • Example 1 Metal-based antibacterial patch for shoes
  • the metal substrate 2 is made of a copper sheet having a thickness of 1 mm, and the material of the metal antibacterial source layer 1 is elemental copper.
  • the preform of the metal-based antibacterial patch for the shoe having the metal antibacterial source layer 1 prepared by the magnetron sputtering method on the metal substrate 2 has the following steps:
  • the current is 0.1A
  • the voltage is 350V
  • the target is deposited for 10 minutes
  • the preform is prepared by magnetron sputtering on the copper sheet with the copper metal antibacterial source layer.
  • the copper metal antibacterial source layer has a thickness of 0.52 mm.
  • the bottom of the copper sheet of the preform obtained by the step (7) is pasted with a similar adhesive layer, that is, a product of a metal-based antibacterial patch for shoes.
  • the prepared shoe-based metal-based antibacterial patch was placed in the user's right shoe for 5 hours, and after observation by an optical microscope, the red bacterium and the staphylococcus in the right shoe were significantly more than the antibacterial paste of the present invention.
  • the left shoe of the piece is reduced by 20%.
  • the T. rubrum and Staphylococcus in the right shoe were reduced by more than 95% compared to the T. rubrum and Staphylococcus in the left shoe.
  • the same process conditions as described above were used, except that: On the other target of the magnetron sputtering apparatus, a silver target was mounted, and both copper and silver elements were deposited.
  • the preparation of the preform is the following steps: (1) mounting the elemental copper target on the first target stage, and the elemental silver target is mounted on the second target stage;
  • the current is 0.1A
  • the voltage is 350V
  • the target power source of the sputter-deposited silver target is turned on
  • the current is 0.1 A
  • the voltage is 350V
  • the target is deposited for 1 min, then it is obtained.
  • a preform having a copper metal ion and a silver metal antibacterial source layer was magnetron sputtered on the copper sheet, and the thickness of the metal antibacterial source layer was measured to be 0.59 mm.
  • the bottom of the copper sheet of the preform obtained by the step (7) is pasted with a paste layer similar to the wound patch, thereby obtaining a product of the metal-based antimicrobial patch for shoes.
  • the obtained shoe-based metal-based antibacterial patch was placed in the user's right shoe for 5 hours, and after observation by an optical microscope, the E. coli in the right shoe was significantly reduced compared with the left shoe not using the antibacterial patch of the present invention. 28%. After 3 days of use, the red T. rubrum and staphylococci in the right shoe were more than 97% lower than the T. rubrum and staphylococcus in the left shoe.
  • Example 2 Metal-based antibacterial patch for computer keyboard
  • the metal substrate 2 is made of a 1 mm thick aluminum sheet, and the metal antibacterial source layer 1 is made of elemental copper.
  • the preform of the metal-based antibacterial patch for the computer keyboard using the magnetron sputtering method to prepare the metal antibacterial source layer 1 on the metal substrate 2 has the following steps:
  • the current is 0.1A
  • the voltage is 350V
  • the target is deposited for 10 minutes, and then the preform is prepared by magnetron sputtering on the aluminum sheet with the copper metal antibacterial source layer.
  • the copper metal antibacterial source layer has a thickness of 0.45 mm.
  • the bottom of the aluminum sheet of the preform obtained by the step (7) is pasted with a similar adhesive layer, that is, a product of a metal-based antibacterial patch for a computer keyboard.
  • the metal substrate 2 is made of a 1 mm thick silver piece, and the metal antibacterial source layer 1 is made of elemental copper.
  • the preform of the metal-based antibacterial patch for the underwear of the underwear is prepared by the magnetron sputtering method on the metal substrate 2 by the magnetron sputtering method.
  • the target power supply of the sputter deposition target is turned on, the current is 0.1 A, the voltage is 350 V, and the target is deposited for 10 min, and then the preform is prepared by magnetron sputtering on the silver sheet with the copper metal antibacterial source layer.
  • the copper metal antibacterial source layer has a thickness of 0.45 mm.
  • the bottom of the silver sheet of the preform obtained by the step (7) is pasted with a similar adhesive layer, that is, a product of a metal-based antibacterial patch for women's underwear.
  • the above-mentioned women's underwear was pasted with a metal-based antibacterial patch on the underwear of the lower right part of the user for 10 hours. After observation by an optical microscope, the mold, staphylococcus and Escherichia coli under the right armpit of the women's underwear were significantly better than The left ankle of the antibacterial patch of the present invention was reduced by 79%.

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Abstract

A metallic-base antiseptic patch consists of metal antiseptic layer, metallic base body and sticking layer. The metal antiseptic layer is coated on the metallic base body by magnetron sputtering. The sticking layer is stuck on the bottom of the metallic base body. The preparing method of the metallic-base antiseptic patch includes coating the metal antiseptic layer on the metallic base body by magnetron sputtering. The metallic-base antiseptic patch can be used in mobile telephone, computer keyboard, cloth or wallet for bacteriostasis.

Description

金属基抗菌贴片、 其预成型体、 利用磁控溅射法的制备方法及应用 技术领域 Metal-based antibacterial patch, preform thereof, preparation method and application by magnetron sputtering method

本发明涉及一种金属基抗菌贴片及其制备方法, 更具体地讲, 涉及一种 能够提供金属离子杀菌作用的金属基抗菌贴片, 还涉及该贴片的预成型体、 制备方法和应用。 背景技术  The invention relates to a metal-based antibacterial patch and a preparation method thereof, and more particularly to a metal-based antibacterial patch capable of providing metal ion sterilization, and also relates to a preform of the patch, a preparation method and application thereof . Background technique

众所周知, 有害细菌是人类致病及影响健康的重要因素。 因此, 怎样消 灭和抑制有害细菌是细菌被发现以来各国科学家们研究的重要课题之一。 随 着科学技术的不断发展, 各种各样的抗菌材料层出不穷。  It is well known that harmful bacteria are an important factor in human disease and affecting health. Therefore, how to eliminate and suppress harmful bacteria is one of the important topics studied by scientists all over the world since the discovery of bacteria. With the continuous development of science and technology, a variety of antibacterial materials are emerging.

近年来, 随着经济的快速发展, 生活水平的提高, 对日常用品的抗菌要 求越来越高。  In recent years, with the rapid development of the economy and the improvement of living standards, the antibacterial requirements for daily necessities have become higher and higher.

中国专利授权公告 CN1162075C中公开了一种抗菌环保功能型衬布及生 产方法, 是在底布中渗有 ANTIBIO-994抗菌剂。 主要利用抗菌剂实现杀菌, 但经长期的洗涤, 其抗菌效果明显降低。  Chinese Patent Authorization Announcement CN1162075C discloses an antibacterial and environmentally-friendly functional lining and a production method, which is permeable with ANTIBIO-994 antibacterial agent in the base fabric. The antibacterial agent is mainly used for sterilization, but after long-term washing, the antibacterial effect is remarkably reduced.

中国专利授权公告 CN2528257Y 中公开了一种具有抗菌散香功能的鞋 衬片材, 它由涤沦短纤维经针刺成片材, 并在涤沦短纤维外涂有一层由丙基 二曱基十八烷基季铵氯化物和能够緩释微香的涂层,该鞋衬片材通过释放微 香来驱除异味。  China Patent Licensing Publication CN2528257Y discloses a shoe lining sheet having an antibacterial and fragrant function, which is needle-punched into a sheet from a polyester staple fiber and coated with a layer of propyl bismuth on the outer layer of the polyester staple fiber. An octadecyl quaternary ammonium chloride and a coating capable of slow release of a slight scent, the shoe lining sheet repels odor by releasing a slight fragrance.

以上抗菌产品采用纤维织物作为载体, 然后将起到抗菌作用的填料放入 载体内构成抗菌产品, 其耐久性受到一定限制, 通过金属材料抗菌解决了这 样的问题。  The above antibacterial product uses a fiber fabric as a carrier, and then the antibacterial filler is placed in the carrier to constitute an antibacterial product, and the durability thereof is limited, and such a problem is solved by the antibacterial action of the metal material.

中国专利授权公告 CN1410587 中公开了一种表面含铜抗菌不锈钢及其 制造工艺, 表面含铜抗菌不锈钢包括不锈钢基材表面上有含 ε-Cu的渗镀层, 渗镀层的含铜量为 1.5-30wt%。 在制备该抗菌不锈钢时, 必须使用由 CuO、 CuCl和 NH4C1的渗剂, 在制备过程中会产生废液, 如不适当处理, 会造成环 境污染。 另外渗镀得到的合金层的组成及成份有很多的限制, 因此, 其抗菌 性会受到制约。 Chinese Patent Authorization Announcement CN1410587 discloses a surface copper-containing antibacterial stainless steel and a manufacturing process thereof, and the surface copper-containing antibacterial stainless steel comprises a galvanized substrate containing a ε-Cu plating layer, and the copper plating layer has a copper content of 1.5-30wt. %. In the preparation of the antibacterial stainless steel, it is necessary to use an infiltrant of CuO, CuCl and NH 4 C1, which will generate waste liquid during the preparation process, which may cause environmental pollution if not treated properly. In addition, the composition and composition of the alloy layer obtained by the plating have many limitations, and therefore, the antibacterial Sex will be restricted.

中国专利授权公告 CN1158363中公开了一种经过加入 0.4-5.0重量%的 铜及以 0.2容积%的比例沉淀出的富-铜相来改善抗菌性的不锈钢。  Chinese Patent Publication No. CN1158363 discloses a stainless steel which is improved in antibacterial property by adding 0.4-5.0% by weight of copper and a copper-rich phase precipitated at a ratio of 0.2% by volume.

中国专利授权公告 CN1262043 中公开了一种铜-银双金属胶体抗菌剂 及其制备方法。 在铜胶体中加入高分子保护的银离子, 使银离子与铜发生置 换反应, 并在铜粒子的表面部分或全部被银粒子所包覆, 形成一种铜 -银双 金属胶体抗菌剂。  A copper-silver bimetallic colloidal antibacterial agent and a preparation method thereof are disclosed in Chinese Patent Publication No. CN1262043. A silver-ion-protected silver ion is added to the copper colloid to cause a silver ion to undergo a replacement reaction with copper, and a part or all of the surface of the copper particle is coated with silver particles to form a copper-silver bimetallic colloidal antibacterial agent.

虽然存在以上现有技术, 但还存在潜在的需求, 要求进一步开发抗菌性 优越,质量稳定, 耐久性好的抗菌产品; 还进一步要求开发制造、使用方便, 可以方便地组合使用各种抗菌金属,且在制造和使用过程中对环境不造成污 染的抗菌产品。 发明内容  Although the above prior art exists, there is still a potential demand for further development of an antibacterial product having superior antibacterial properties, stable quality, and good durability; further development and manufacture are convenient, and various antibacterial metals can be conveniently combined. And antibacterial products that do not pollute the environment during manufacturing and use. Summary of the invention

为了克服现有技术中存在的各种缺陷,本发明的目的是提供一种金属基 抗菌贴片, 该金属基抗菌贴片采用金属元素作为抗菌源层, 同时采用金属材 料作为基体, 提供了质量稳定性、 耐久性优越的金属基抗菌贴片。  In order to overcome various defects existing in the prior art, an object of the present invention is to provide a metal-based antibacterial patch which uses a metal element as an antibacterial source layer and a metal material as a matrix to provide quality. Metal-based antibacterial patch with excellent stability and durability.

本发明提供了一种金属基抗菌贴片。  The present invention provides a metal-based antimicrobial patch.

根据本发明一种实施方式的金属基抗菌贴片, 其特征在于, 其由金属抗 菌源层、 金属基体和粘贴层组成, 该金属抗菌源层是通过磁控溅射法沉积一 种或多种金属于该金属基体上部而形成的, 该粘贴层设置于金属基体的底 部。  A metal-based antibacterial patch according to an embodiment of the present invention, characterized in that it consists of a metal antibacterial source layer, a metal substrate and an adhesive layer, which is deposited by magnetron sputtering or one or more The metal is formed on the upper portion of the metal substrate, and the adhesive layer is disposed on the bottom of the metal substrate.

本发明的金属基抗菌贴片, 由于采用金属材料作为基体, 其与经磁控溅 射法沉积于其上的金属抗菌源层结合紧密, 所以提高了抗菌的耐久性; 而且 该金属抗菌源层是通过磁控溅射法沉积于该金属基体上的,所以可以在多种 金属材料的金属基体上使用; 并且该磁控溅射法产生的金属抗菌源层为纳米 级的, 还可以组合使用多种抗菌金属, 所以抗菌效果佳; 并且还可根据需要 组合金属抗菌源层的金属材料和金属基体的金属材料的种类; 而且采用磁控 溅射法产生金属抗菌源层, 不会残留化学物质, 从而防止了化学残留物对环 境造成的污染。 根据本发明优选实施方式的金属基抗菌贴片, 其特征在于, 在所述金属 抗菌源层与该粘贴层之间设置一层或多层金属基体。 为了解决各种金属之间 的结合问题, 使金属之间有更好的结合, 可设置多层基体。 The metal-based antibacterial patch of the present invention has a metal material as a matrix, and is closely combined with a metal antibacterial source layer deposited thereon by magnetron sputtering, thereby improving antibacterial durability; and the metal antibacterial source layer It is deposited on the metal substrate by magnetron sputtering, so it can be used on a metal substrate of various metal materials; and the metal antibacterial source layer produced by the magnetron sputtering method is nanometer-scale, and can also be used in combination. A variety of antibacterial metals, so the antibacterial effect is good; and the metal material of the metal antibacterial source layer and the metal material of the metal matrix can be combined as needed; and the metal antibacterial source layer is produced by magnetron sputtering, and no chemical substances remain. , thereby preventing environmental pollution caused by chemical residues. A metal-based antimicrobial patch according to a preferred embodiment of the present invention is characterized in that one or more metal substrates are provided between the metal antibacterial source layer and the adhesive layer. In order to solve the problem of bonding between various metals and to make a better combination between the metals, a multilayer substrate can be provided.

根据本发明优选实施方式的金属基抗菌贴片, 其特征在于, 所述多层金 属基体可以由相同的或者不同的材料制成。  A metal-based antimicrobial patch according to a preferred embodiment of the present invention is characterized in that the multilayer metal substrate can be made of the same or different materials.

根据本发明优选实施方式的金属基抗菌贴片, 其特征在于, 该粘帖层是 类似创口贴的粘贴层, 可以使用任何具有粘性的粘贴层。 该粘贴层主要是为 了将金属基抗菌贴片固定于要使用的物品上, 从而提高了使用的随意性。  A metal-based antimicrobial patch according to a preferred embodiment of the present invention is characterized in that the adhesive layer is an adhesive layer similar to a wound patch, and any adhesive layer having a tackiness can be used. The adhesive layer is mainly for fixing the metal-based antimicrobial patch to the article to be used, thereby improving the arbitrariness of use.

只要起抗菌或杀菌作用的金属均可以作为金属抗菌源层,根据本发明优 选实施方式, 所述金属抗菌源层优选为含有金、 钒、 铬、 锰、 铁、 钴、 镍、 铜、 辞、 银、 稀土元素、 锡中的一种或一种以上的合金。  The metal antibacterial source layer preferably contains gold, vanadium, chromium, manganese, iron, cobalt, nickel, copper One or more alloys of silver, rare earth elements, and tin.

优选地, 所述金属抗菌源层为金、 铜、 银、 铁或者辞元素。 以上金属无 毒, 性能稳定, 所以是优选的。  Preferably, the metal antibacterial source layer is gold, copper, silver, iron or an element. The above metals are non-toxic and stable in performance, so they are preferred.

进一步优选, 所述金属抗菌源层为铜、 银或铜和银的合金, 其抗菌效果 好, 所以是优选的。  Further preferably, the metal antibacterial source layer is copper, silver or an alloy of copper and silver, which is preferred because it has a good antibacterial effect.

根据本发明优选实施方式,所有通过磁控溅射法可以在其上沉积金属抗 菌源层的、 且无毒无害的金属基体均可以使用, 其中优选的所述金属基体为 镁、 铝、 钛、 钒、 铬、 锰、 铁、 钴、 铜、 辞、 锆、 铌、 相、 钯、 银、 铂中的 一种金属或它们的合金,或者是含有所述元素 20%以上原子比的与其他金属 的合金。 上述金属为常用金属并且是已知的对人体无害或人体需要元素, 采 用它们作为金属基体, 安全、 耐久, 本身也有一定的抗菌作用, 且与其上的 金属抗菌源层结合紧密。  According to a preferred embodiment of the present invention, all metal substrates which can be deposited thereon by a magnetron sputtering method and which are non-toxic and harmless can be used, wherein the preferred metal substrate is magnesium, aluminum or titanium. , a metal of vanadium, chromium, manganese, iron, cobalt, copper, rhenium, zirconium, hafnium, phase, palladium, silver, platinum, or an alloy thereof, or an atomic ratio of 20% or more of the element An alloy of metals. The above metals are common metals and are known to be harmless to the human body or elements required by the human body. They are used as a metal matrix, which is safe and durable, and has a certain antibacterial effect itself, and is closely combined with the metal antibacterial source layer thereon.

根据本发明特别优选的实施方式的金属基抗菌贴片, 其特征在于, 金属 抗菌源层为铜、 银或铜银合金, 金属基体为铜片、 银片或铝片, 这样的组合 是最优选的, 金属抗菌源层与金属基体结合紧密, 对人体无危害, 且极大地 提高了抗菌效果和抗菌耐久性。  A metal-based antibacterial patch according to a particularly preferred embodiment of the present invention, characterized in that the metal antibacterial source layer is copper, silver or a copper-silver alloy, and the metal substrate is a copper sheet, a silver sheet or an aluminum sheet, and such a combination is most preferable. The metal antibacterial source layer is tightly combined with the metal substrate, is harmless to the human body, and greatly improves the antibacterial effect and antibacterial durability.

根据本发明优选实施方式的金属基抗菌贴片, 其特征在于, 所述金属抗 菌源层的厚度为 0.00005 ~ lmm。如果金属抗菌源层的厚度低于 0.00005mm, 则会影响金属基抗菌贴片的耐久性, 如果金属抗菌源层的厚度高于 1mm, 使用会不方便,且上述厚度使金属基抗菌贴片和人体直接和间接接触使用时 有更好的实用性, 不引起或少引起异物感。 考虑到金属基抗菌贴片的耐久性 和高效抗菌性, 优选金属抗菌源层的厚度为 0.001 ~ 0.8mm, 更优选 0.005 ~ 0.1mm„ According to a preferred embodiment of the present invention, the metal-based antimicrobial patch has a thickness of 0.00005 to 1 mm. If the thickness of the metal antibacterial source layer is less than 0.00005 mm, the durability of the metal-based antibacterial patch may be affected. If the thickness of the metal antibacterial source layer is higher than 1 mm, It is inconvenient to use, and the above thickness makes the metal-based antibacterial patch and the human body have better practicality when used in direct and indirect contact with the human body, and does not cause or cause foreign body sensation. Considering the durability and high-efficiency antibacterial property of the metal-based antibacterial patch, the thickness of the metal antibacterial source layer is preferably 0.001 to 0.8 mm, more preferably 0.005 to 0.1 mm.

根据本发明优选实施方式的金属基抗菌贴片, 其特征在于, 所述每层金 属基体的厚度优选为 0.0005 ~ lmm。上述厚度在和人体直接和间接接触使用 时有更好的实用性, 以便不引起或少引起异物感。  A metal-based antimicrobial patch according to a preferred embodiment of the present invention, characterized in that the thickness of each of the metal substrates is preferably 0.0005 to 1 mm. The above thickness is more practical when used in direct and indirect contact with the human body so as not to cause or cause a foreign body sensation.

根据本发明优选实施方式的金属基抗菌贴片,优选该金属抗菌源层与金 属基体的总厚度优选为 0.001 ~ 2mm。 上述厚度在和人体直接和间接接触使 用时有更好的实用性, 以便不引起或少引起异物感。  According to the metal-based antimicrobial patch of the preferred embodiment of the present invention, it is preferable that the total thickness of the metal antibacterial source layer and the metal substrate is preferably 0.001 to 2 mm. The above thickness is more practical when used in direct and indirect contact with the human body so as not to cause or cause a foreign body sensation.

根据本发明优选实施方式的金属基抗菌贴片, 其特征在于, 该金属基体 优选是厚度为 0.002 ~ 1.5mm的铜片、 铁片、 银片或铝片, 或者是厚度为 0.002 - 1.5mm的铜基合金片、 铁基合金片、 银基合金片或者铝基合金片。 上述厚度在和人体直接和间接接触使用时有更好的实用性, 以便不引起或少 引起异物感; 并且上述金属对人体没有危害, 可以提高金属基抗菌贴片的整 体抗菌耐久性。  A metal-based antibacterial patch according to a preferred embodiment of the present invention, characterized in that the metal substrate is preferably a copper sheet, an iron sheet, a silver sheet or an aluminum sheet having a thickness of 0.002 to 1.5 mm, or a thickness of 0.002 - 1.5 mm. Copper-based alloy sheets, iron-based alloy sheets, silver-based alloy sheets or aluminum-based alloy sheets. The above thickness is more practical when used in direct and indirect contact with the human body so as not to cause or a little foreign body sensation; and the above metal is not harmful to the human body, and the overall antibacterial durability of the metal-based antibacterial patch can be improved.

根据本发明优选实施方式的金属基抗菌贴片的制备方法, 其特征在于, 具有两种或两种以上金属元素的金属抗菌源层是通过在磁控溅射沉积过程 中在金属基体上同时沉积两种或两种以上金属元素而形成的。该金属抗菌源 层具有均匀的两种或两种以上金属元素, 同时起效, 从而提高了抗菌效果, 扩大了抗菌范围和适用场合。  A method of preparing a metal-based antimicrobial patch according to a preferred embodiment of the present invention, characterized in that a metal antibacterial source layer having two or more metal elements is simultaneously deposited on a metal substrate during magnetron sputtering deposition Formed from two or more metal elements. The metal antibacterial source layer has two or more kinds of metal elements uniformly, and works at the same time, thereby improving the antibacterial effect, expanding the antibacterial range and the applicable occasion.

本发明还提供制备上述金属基抗菌贴片的制备方法, 其特征在于, 该方 法包括步骤: 将一种或多种金属通过磁控溅射法沉积于该金属基体上部, 形 成金属抗菌源层, 将粘贴层设置于金属基体的底部。  The invention also provides a preparation method for preparing the above metal-based antibacterial patch, characterized in that the method comprises the steps of: depositing one or more metals on the upper part of the metal substrate by magnetron sputtering to form a metal antibacterial source layer, The adhesive layer is placed on the bottom of the metal substrate.

优选地, 在上述磁控溅射法中, 在磁控溅射仪器的多个靶台上安装不同 的靶材,在磁控溅射沉积过程中使金属基体上能够同时沉积出具有两种或两 种以上金属材料的金属抗菌源层。该方法使两种或两种以上金属材料可以均 匀地沉积于金属基体上, 从而可以提高金属基抗菌贴片的抗菌效果。  Preferably, in the above magnetron sputtering method, different targets are mounted on a plurality of target stages of the magnetron sputtering apparatus, and two kinds of metal substrates can be simultaneously deposited during magnetron sputtering deposition. A metal antibacterial source layer of two or more metal materials. The method allows two or more metal materials to be uniformly deposited on the metal substrate, thereby improving the antibacterial effect of the metal-based antimicrobial patch.

优选地,将金属抗菌源层通过磁控溅射法沉积于该金属基体上部的方法 包括以下步骤: Preferably, the method of depositing a metal antibacterial source layer on the upper portion of the metal substrate by magnetron sputtering Includes the following steps:

( 1 )将金属抗菌源层所需靶材安装在靶台上;  (1) mounting the target of the metal antibacterial source layer on the target platform;

( 2 )将金属基体清洗、 烘干, 安装在基片转台上;  (2) cleaning and drying the metal substrate and mounting it on the substrate turntable;

( 3 )抽真空, 使溅射腔室真空度达到 3xlO_4Pa; (3) vacuuming, so that the sputtering chamber vacuum degree reaches 3xlO_ 4 Pa;

( 4 )将高纯氩气引入溅射腔室, 达到所需氩气分压值 0.5 ~ 1.5Pa; ( 5 )预溅射靶材 1 ~ 5min, 电流 0.1 ~ 0·3Α、 电压 30 ~ 300V;  (4) Introducing high-purity argon into the sputtering chamber to achieve the desired argon partial pressure of 0.5 ~ 1.5Pa; (5) Pre-sputtering target for 1 ~ 5min, current 0.1 ~ 0·3Α, voltage 30 ~ 300V ;

( 6 )对金属基体进行反溅射 5 ~ lOmin, 电流 5 ~ 15A;  (6) Reverse sputtering of the metal substrate 5 ~ lOmin, current 5 ~ 15A;

( 7 )打开溅射沉积靶材的靶电源, 电流 0.01 ~ 0.2A、 电压 200 ~ 350V, 沉积靶材 5 ~ lOmin后取出。  (7) Turn on the target power supply of the sputter deposition target, the current is 0.01 ~ 0.2A, the voltage is 200 ~ 350V, and the target is deposited for 5 ~ 10min.

以上方法制备的金属基抗菌贴片, 性能稳定, 抗菌耐久性提高。  The metal-based antibacterial patch prepared by the above method has stable performance and improved antibacterial durability.

本发明申请中使用的磁控溅射法不只限于以上具体方法, 只要使用已知 的磁控溅射法在本发明的金属基体上沉积金属抗菌源层, 均在本发明申请的 保护范围之内。  The magnetron sputtering method used in the application of the present invention is not limited to the above specific method, as long as the metal antibacterial source layer is deposited on the metal substrate of the present invention by using a known magnetron sputtering method, which is within the protection scope of the present application. .

本发明还提供上述金属基抗菌贴片在用于对手机、 计算机键盘、 服装或 皮夹进行杀菌的用途。  The present invention also provides the use of the above metal-based antimicrobial patch for sterilizing a mobile phone, a computer keyboard, a garment or a wallet.

本发明还提供一种用于金属基抗菌贴片的预成型体, 包括金属抗菌源层 和金属基体,该金属抗菌源层是通过磁控溅射法将一种或多种金属沉积该金 属基体上而形成的。  The invention also provides a preform for a metal-based antibacterial patch comprising a metal antibacterial source layer and a metal matrix, the metal antibacterial source layer depositing the metal matrix by one or more metals by magnetron sputtering Formed on the top.

本发明还提供一种金属基抗菌贴片, 其特征在于, 包括金属抗菌源层、 金属基体和粘贴层,该金属抗菌源层是通过磁控溅射法将一种或多种金属沉 积于该金属基体上部而形成的, 该粘贴层设置于金属基体的底部。  The invention also provides a metal-based antibacterial patch, comprising: a metal antibacterial source layer, a metal substrate and an adhesive layer, wherein the metal antibacterial source layer deposits one or more metals by magnetron sputtering The upper portion of the metal substrate is formed, and the adhesive layer is disposed at the bottom of the metal substrate.

本发明还提供一种金属基抗菌贴片, 包括金属抗菌源层、 金属基体和粘 贴层, 该金属抗菌源层是通过磁控溅射法将一种或多种金属离子、原子和 / 或原子团沉积于该金属基体上部而形成, 该粘贴层设置于金属基体的底部。 本发明的有益效果是: (1 )由于采用金属材料作为载体, 所以提高了抗 菌的耐久性; (2 )而且该金属抗菌源层是通过磁控溅射法沉积于该金属基体 上部的, 形成预成型体, 所以可以在多种金属材料上使用; (3 )通过磁控溅 射法沉积的金属抗菌源层中的金属材料为纳米级, 抗菌效果佳; (4 )还可以 组合使用多种不同抗菌金属, 所以方便根据需要选择最佳抗菌效果的材料;The invention also provides a metal-based antibacterial patch comprising a metal antibacterial source layer, a metal substrate and an adhesive layer, the metal antibacterial source layer being one or more metal ions, atoms and/or radicals by magnetron sputtering. Formed on the upper portion of the metal substrate, the adhesive layer is disposed on the bottom of the metal substrate. The beneficial effects of the present invention are as follows: (1) The use of a metal material as a carrier improves the durability of the antibacterial; (2) and the metal antibacterial source layer is deposited on the upper portion of the metal substrate by magnetron sputtering to form Preform, so it can be used on a variety of metal materials; (3) The metal material in the metal antibacterial source layer deposited by magnetron sputtering is nanometer-scale, and the antibacterial effect is good; (4) A combination of a variety of different antimicrobial metals, so it is convenient to choose the material with the best antibacterial effect according to your needs;

( 5 )还可根据需要组合金属抗菌源层的抗菌金属材料和金属基体的金属材 料的种类, 使它们之间结合紧密, 增强其耐久性; (6 )采用磁控溅射法, 不 会残留化学物质, 从而防止了化学残留物对环境造成的污染。 (5) The type of the antibacterial metal material of the metal antibacterial source layer and the metal material of the metal matrix may be combined as needed to make the bonding between them tight and enhance the durability; (6) using magnetron sputtering, no residue Chemical substances, thus preventing environmental pollution caused by chemical residues.

以下将结合附图进一步说明本发明的实施方式,所列举的实施例仅用于 说明本发明, 并非用于限定本发明的范围, 任何本领域技术人员, 在不脱离 本发明的精神和范围内, 可加以变化与修改, 本发明的保护范围以所附的权 利要求为准。 附图说明  The embodiments of the present invention will be further described with reference to the accompanying drawings, and the embodiments of the present invention are not intended to limit the scope of the present invention. The scope of the invention is subject to change and modifications, and the scope of the invention is defined by the appended claims. DRAWINGS

图 1是本发明的一个实施方式的金属基抗菌贴片的剖视图;  1 is a cross-sectional view of a metal-based antimicrobial patch according to an embodiment of the present invention;

图 2是本发明的另一个实施方式的金属基抗菌贴片的剖视图; 图中: 1一金属抗菌源层, 2—金属基体, 3—粘贴层, 4一金属基体 A。 具体实施方式  2 is a cross-sectional view of a metal-based antimicrobial patch according to another embodiment of the present invention; wherein: a metal antibacterial source layer, a 2-metal substrate, a 3-adhesive layer, and a 4-metal substrate A. detailed description

本发明是一种采用金属材料作为基体的金属基抗菌贴片, 其特征在于, 由金属抗菌源层 1、 金属基体 2和粘贴层 3组成, 金属基体上部是金属抗菌 源层 1 , 金属基体 2的底部是粘贴层 3。  The invention relates to a metal-based antibacterial patch which uses a metal material as a base, and is characterized in that it comprises a metal antibacterial source layer 1, a metal substrate 2 and an adhesive layer 3. The upper part of the metal substrate is a metal antibacterial source layer 1, and the metal substrate 2 The bottom of the layer is the adhesive layer 3.

金属抗菌源层 1和金属基体 2的总厚度优选为 0.001 ~ 2mm。  The total thickness of the metal antibacterial source layer 1 and the metal substrate 2 is preferably 0.001 to 2 mm.

在本发明的实施方式中, 粘贴层 3可以为常规的纸质单面胶贴, 比如创 口贴用的胶贴等, 也可以是其他具有粘性的粘贴层。  In the embodiment of the present invention, the adhesive layer 3 may be a conventional paper single-sided adhesive tape, such as a sticker for wounds, or other adhesive layer.

在本发明的另一实施方式中, 金属基体 2 优选厚度为厚度为 0.002 ~ 1.5mm的铜片、 铁片、 银片或铝片, 或者是厚度为 0.002 ~ 1.5mm的铜基合 金片、 铁基合金片、 银基合金片或者铝基合金片。  In another embodiment of the present invention, the metal substrate 2 is preferably a copper sheet, an iron sheet, a silver sheet or an aluminum sheet having a thickness of 0.002 to 1.5 mm, or a copper-based alloy sheet having a thickness of 0.002 to 1.5 mm, and iron. Base alloy sheet, silver-based alloy sheet or aluminum-based alloy sheet.

在本发明的另一实施方式中, 所述金属抗菌源层优选为金、 铜、 银、 铁 或者辞。  In another embodiment of the invention, the metal antibacterial source layer is preferably gold, copper, silver, iron or a word.

由于本发明的金属基抗菌贴片采用金属材料作为基体(或载体), 同时 抗菌剂也采用金属元素,所以发明人采用了先进的技术手段制备用于金属基 抗菌贴片的预成型体(包括金属抗菌源层 1和金属基体 2 )。 本发明实施方式的制备金属基抗菌贴片的方法, 首先采用磁控溅射法在 金属基体 2上制备金属抗菌源层 1 , 得到金属基抗菌贴片的预成型体, 该方 法可以是常规的磁控溅射方法, 例如优选地, 该方法包括以下步骤: Since the metal-based antibacterial patch of the present invention uses a metal material as a matrix (or carrier) and the antibacterial agent also uses a metal element, the inventors have adopted advanced techniques to prepare a preform for a metal-based antibacterial patch (including Metal antibacterial source layer 1 and metal matrix 2). In the method for preparing a metal-based antibacterial patch according to an embodiment of the present invention, a metal antibacterial source layer 1 is first prepared on a metal substrate 2 by a magnetron sputtering method, and a preform of a metal-based antibacterial patch is obtained. The method may be conventional. A magnetron sputtering method, for example, preferably, the method comprises the steps of:

( 1 )将金属抗菌源层 1所需靶材安装在靶台上;  (1) mounting the target of the metal antibacterial source layer 1 on the target platform;

( 2 )将金属基体 2清洗、 烘干, 安装在基片转台上;  (2) cleaning and drying the metal substrate 2, and mounting it on the substrate turntable;

( 3 )抽真空, 使溅射胺室真空度达到 3xl(T4Pa; (3) vacuuming, so that the sputtering amine chamber vacuum reaches 3xl (T 4 Pa;

( 4 )将高纯氩气引入溅射腔室, 达到所需氩气分压值 0.5 ~ 1.5Pa; ( 5 )预溅射靶材 1 ~ 5min, 电流 0.1 ~ 0·3Α、 电压 30 ~ 300V;  (4) Introducing high-purity argon into the sputtering chamber to achieve the desired argon partial pressure of 0.5 ~ 1.5Pa; (5) Pre-sputtering target for 1 ~ 5min, current 0.1 ~ 0·3Α, voltage 30 ~ 300V ;

( 6 )对金属基体 2进行反溅射 5 ~ lOmin, 电流 5 ~ 15A;  (6) Reverse sputtering of the metal substrate 2 5 ~ lOmin, current 5 ~ 15A;

( 7 )打开溅射沉积靶材的靶电源, 电流 0.01 ~ 0.2A、 电压 200 ~ 350V, 沉积靶材 5 ~ lOmin后取出, 即制得在金属基体 2上磁控溅射有金属抗菌源 层的预成型体, 利用以上方法得到的预成型体, 在金属基体上的金属抗菌源 层沉积均勾, 耐久性好。  (7) Turn on the target power supply of the sputter deposition target, the current is 0.01 ~ 0.2A, the voltage is 200 ~ 350V, and the target is removed after 5 ~ 10min, so that the metal antibacterial source layer is magnetron sputtered on the metal substrate 2. The preform is obtained by the above-mentioned method, and the metal antibacterial source layer on the metal substrate is deposited and has good durability.

最后将经第(7 )步制得的预成型体的金属基体底部胶贴上粘贴层 3 , 即 得到金属基抗菌贴片。  Finally, the metal substrate of the preform obtained by the step (7) is pasted onto the adhesive layer 3 to obtain a metal-based antibacterial patch.

本发明公开的制备方法中,可以在磁控溅射仪器的多个靶台上安装不同 的靶材,在磁控溅射沉积过程中^^体上能够同时沉积出两种或两种以上的 抗菌源, 这样得到的具有多种金属材料的金属抗菌源层, 不同的金属材料分 布均勾, 耐久性好, 抗菌效果好。  In the preparation method disclosed in the present invention, different targets can be mounted on a plurality of target stages of the magnetron sputtering apparatus, and two or more types can be simultaneously deposited in the magnetron sputtering deposition process. The antibacterial source, the metal antibacterial source layer with various metal materials thus obtained, the different metal materials are distributed, the durability is good, and the antibacterial effect is good.

本发明的金属基抗菌贴片是在人体本身具有的温度、 湿度条件下, 通过 人体分泌的汗液中的乳酸等腐蚀性物质以及机械磨擦使贴片上的抗菌金属 元素释放出金属颗粒、 金属原子以及金属离子, 起到了抗菌、 杀菌作用。  The metal-based antibacterial patch of the invention releases the metal particles and metal atoms by the antibacterial metal element on the patch through the corrosive substances such as lactic acid and the mechanical friction in the sweat secreted by the human body under the temperature and humidity conditions of the human body. And metal ions, which play an antibacterial and bactericidal role.

本发明制得的金属抗菌贴片根据不同的应用场合,可以设计成应用到手 机上的抗菌贴片、计算机键盘用的抗菌贴片,服装用抗菌贴片(鞋用、袜用、 衣物)、 皮夹用的抗菌贴片等。  The metal antibacterial patch prepared by the invention can be designed as an antibacterial patch applied to a mobile phone, an antibacterial patch for a computer keyboard, an antibacterial patch for clothing (shoes, socks, clothes) according to different applications. Antibacterial patches for wallets, etc.

如用作手机上的抗菌贴片, 其尺寸与手机的键盘尺寸相匹配。 如用作计 算机键盘用的抗菌贴片, 其尺寸与计算机的键盘尺寸相匹配。  For example, it is used as an antibacterial patch on a mobile phone, and its size matches the size of the phone's keyboard. For example, an antibacterial patch used as a computer keyboard, the size of which matches the keyboard size of the computer.

如用作服装用抗菌贴片, 可以设计成各用造型, 如圓形、 方形、 异形, 根据使用者的爱好以及需要可以任意贴在衣物的任何部位。 在本发明申请中的术语 "金属抗菌源层" 是一种广义的概念, 根据使用 的金属材料的不同,抗菌起效的成份可以是金属颗粒、金属离子,金属原子, 金属原子团和 /或金属化合物等。 For example, it can be used as an antibacterial patch for clothing, and can be designed into various shapes, such as a circular shape, a square shape, and a special shape, and can be arbitrarily attached to any part of the clothing according to the user's preference and needs. The term "metal antibacterial source layer" in the present application is a broad concept, and depending on the metal material used, the antibacterial effecting component may be a metal particle, a metal ion, a metal atom, a metal atomic group and/or a metal. Compounds, etc.

实施例 1: 鞋用金属基抗菌贴片  Example 1: Metal-based antibacterial patch for shoes

金属基体 2材质为 1mm厚的铜片, 金属抗菌源层 1的材料为单质铜。 本实施例中采用磁控溅射法在金属基体 2上制备出金属抗菌源层 1的鞋 用金属基抗菌贴片的预成型体有下列步骤:  The metal substrate 2 is made of a copper sheet having a thickness of 1 mm, and the material of the metal antibacterial source layer 1 is elemental copper. In the present embodiment, the preform of the metal-based antibacterial patch for the shoe having the metal antibacterial source layer 1 prepared by the magnetron sputtering method on the metal substrate 2 has the following steps:

( 1 )将单质铜靶材安装在靶台上;  (1) mounting a single-mass copper target on a target platform;

(2)将铜片用酒精清洗后烘干, 然后安装在基片转台上;  (2) The copper sheet is washed with alcohol, dried, and then mounted on a substrate turntable;

(3 )抽真空, 使溅射胺室真空度达到 3xl(T4Pa; (3) vacuuming, so that the sputtering amine chamber vacuum reaches 3xl (T 4 Pa;

(4)将高纯氩气引入溅射腔室, 达到所需氩气分压值 0.5Pa;  (4) introducing high purity argon into the sputtering chamber to achieve a desired partial pressure of argon of 0.5 Pa;

( 5 )预溅射靶材 3min, 电流 0.3 A、 电压 50V;  (5) Pre-sputtering target for 3 min, current 0.3 A, voltage 50V;

( 6 )对铜片进行反溅射 5min, 电流 5A;  (6) Reverse sputtering of copper sheet for 5 min, current 5A;

(7)打开溅射沉积靶材的靶电源, 电流 0.1A、 电压 350V, 沉积靶材 lOmin后取出, 即制得在铜片上磁控溅射有铜金属抗菌源层的预成型体, 经 测量铜金属抗菌源层的厚度为 0.52mm。  (7) Turn on the target power supply of the sputter deposition target, the current is 0.1A, the voltage is 350V, and the target is deposited for 10 minutes, then the preform is prepared by magnetron sputtering on the copper sheet with the copper metal antibacterial source layer. The copper metal antibacterial source layer has a thickness of 0.52 mm.

最后将经第 (7) 步制得的预成型体的铜片底部胶贴上类似创口贴的粘 贴层, 即得到鞋用金属基抗菌贴片的产品。  Finally, the bottom of the copper sheet of the preform obtained by the step (7) is pasted with a similar adhesive layer, that is, a product of a metal-based antibacterial patch for shoes.

将制得的上述鞋用金属基抗菌贴片放入使用者的右鞋中使用 5小时后, 经光学显微镜观察后,右鞋中的红色毛癣菌和葡萄球菌明显比未使用本发明 抗菌贴片的左鞋减少了 20%。 在使用 3天后, 右鞋中的红色毛癣菌和葡萄球 菌比左鞋中的红色毛癣菌和葡萄球菌减少了 95%以上。  The prepared shoe-based metal-based antibacterial patch was placed in the user's right shoe for 5 hours, and after observation by an optical microscope, the red bacterium and the staphylococcus in the right shoe were significantly more than the antibacterial paste of the present invention. The left shoe of the piece is reduced by 20%. After 3 days of use, the T. rubrum and Staphylococcus in the right shoe were reduced by more than 95% compared to the T. rubrum and Staphylococcus in the left shoe.

采用上述相同的工艺条件, 不同之处在于: 在磁控溅射仪的另一个靶台 上安装有银靶材, 同时沉积铜和银两种元素。 预成型体的制备为下列步骤: ( 1 )将单质铜靶材安装在第一靶台上, 单质银靶材安装在第二靶台上; The same process conditions as described above were used, except that: On the other target of the magnetron sputtering apparatus, a silver target was mounted, and both copper and silver elements were deposited. The preparation of the preform is the following steps: (1) mounting the elemental copper target on the first target stage, and the elemental silver target is mounted on the second target stage;

(2)将铜片用洒精清洗后烘干, 然后安装在基片转台上; (2) The copper sheet is washed with a sprinkle and then dried, and then mounted on a substrate turntable;

(3 )抽真空, 使溅射腔室真空度达到 3xlO_4Pa; (3) vacuuming, so that the sputtering chamber vacuum degree reaches 3xlO_ 4 Pa;

(4)将高纯氩气引入溅射腔室, 达到所需氩气分压值 0.5Pa;  (4) introducing high purity argon into the sputtering chamber to achieve a desired partial pressure of argon of 0.5 Pa;

(5) 同时预溅射靶材: 预溅射铜靶材 3min, 电流 0.3A、 电压 50V, 预 溅射 4艮靶材 3min , 电流 0.3 A、 电压 50V ,; (5) Simultaneous pre-sputtering target: Pre-sputtered copper target for 3 min, current 0.3A, voltage 50V, pre Sputtering 4 艮 target for 3 min, current 0.3 A, voltage 50V,;

( 6 )对铜片进行反溅射 5min, 电流 5A;  (6) Reverse sputtering of copper sheet for 5 min, current 5A;

( 7 )打开溅射沉积铜靶材的靶电源, 电流 0.1A、 电压 350V, 打开溅射 沉积银靶材的靶电源, 电流 0.1 A、 电压 350V , 沉积靶材 1 Omin后取出, 即 制得在铜片上磁控溅射有铜金属离子和银金属抗菌源层的预成型体,经测量 金属抗菌源层的厚度为 0.59mm。  (7) Turn on the target power supply of the sputter-deposited copper target, the current is 0.1A, the voltage is 350V, and the target power source of the sputter-deposited silver target is turned on, the current is 0.1 A, the voltage is 350V, and the target is deposited for 1 min, then it is obtained. A preform having a copper metal ion and a silver metal antibacterial source layer was magnetron sputtered on the copper sheet, and the thickness of the metal antibacterial source layer was measured to be 0.59 mm.

最后, 将经第 (7 ) 步骤制得的预成型体的铜片底部胶贴上类似创口贴 的粘贴层, 即得到鞋用金属基抗菌贴片的产品。  Finally, the bottom of the copper sheet of the preform obtained by the step (7) is pasted with a paste layer similar to the wound patch, thereby obtaining a product of the metal-based antimicrobial patch for shoes.

将制得的上述鞋用金属基抗菌贴片放入使用者的右鞋中使用 5小时后, 经光学显微镜观察后,右鞋中的大肠杆菌明显比未使用本发明抗菌贴片的左 鞋减少了 28%。 在使用 3天后, 右鞋中的红色毛癣菌和葡萄球菌比左鞋中的 红色毛癣菌和葡萄球菌减少了 97%以上。 实施例 2: 计算机键盘用金属基抗菌贴片  The obtained shoe-based metal-based antibacterial patch was placed in the user's right shoe for 5 hours, and after observation by an optical microscope, the E. coli in the right shoe was significantly reduced compared with the left shoe not using the antibacterial patch of the present invention. 28%. After 3 days of use, the red T. rubrum and staphylococci in the right shoe were more than 97% lower than the T. rubrum and staphylococcus in the left shoe. Example 2: Metal-based antibacterial patch for computer keyboard

金属基体 2材质为 1mm厚的铝片, 金属抗菌源层 1的材料为单质铜。 本实施例中采用磁控溅射法在金属基体 2上制备出金属抗菌源层 1的计 算机键盘用金属基抗菌贴片的预成型体有下列步骤:  The metal substrate 2 is made of a 1 mm thick aluminum sheet, and the metal antibacterial source layer 1 is made of elemental copper. In the present embodiment, the preform of the metal-based antibacterial patch for the computer keyboard using the magnetron sputtering method to prepare the metal antibacterial source layer 1 on the metal substrate 2 has the following steps:

( 1 )将单质铜靶材安装在靶台上;  (1) mounting a single-mass copper target on a target platform;

( 2 )将铝片用酒精清洗后烘干, 然后安装在基片转台上;  (2) The aluminum sheet is washed with alcohol, dried, and then mounted on a substrate turntable;

( 3 )抽真空, 使溅射胺室真空度达到 3x l(T4Pa; (3) vacuuming, so that the sputtering amine chamber vacuum reaches 3x l (T 4 Pa;

( 4 )将高纯氩气引入溅射腔室, 达到所需氩气分压值 0.5Pa;  (4) introducing high purity argon into the sputtering chamber to achieve a desired partial pressure of argon of 0.5 Pa;

( 5 )预溅射靶材 3min, 电流 0.3 A、 电压 50V;  (5) Pre-sputtering target for 3 min, current 0.3 A, voltage 50V;

( 6 )对铝片进行反溅射 5min, 电流 5A;  (6) Reverse sputtering of aluminum sheet for 5 min, current 5A;

( 7 )打开溅射沉积靶材的靶电源, 电流 0.1A、 电压 350V, 沉积靶材 lOmin后取出, 即制得在铝片上磁控溅射有铜金属抗菌源层的预成型体, 经 测量铜金属抗菌源层的厚度为 0.45mm。  (7) Turn on the target power supply of the sputter deposition target, the current is 0.1A, the voltage is 350V, and the target is deposited for 10 minutes, and then the preform is prepared by magnetron sputtering on the aluminum sheet with the copper metal antibacterial source layer. The copper metal antibacterial source layer has a thickness of 0.45 mm.

最后将经第 (7 ) 步制得的预成型体的铝片底部胶贴上类似创口贴的粘 贴层, 即得到计算机键盘用金属基抗菌贴片的产品。  Finally, the bottom of the aluminum sheet of the preform obtained by the step (7) is pasted with a similar adhesive layer, that is, a product of a metal-based antibacterial patch for a computer keyboard.

将制得的上述计算机键盘用金属基抗菌贴片粘贴在第一台笔记本电脑 的键盘上使用 10小时后, 经光学显微镜观察后, 第一台笔记本电脑上键盘 上的红色毛癣菌、 葡萄球菌、 金黄色葡萄球菌、 链球菌、 大肠杆菌明显比未 使用本发明抗菌贴片的第二台笔记本电脑的键盘上减少了 50%。 实施例 3: 女士内衣用金属基抗菌贴片 Pasting the above-mentioned computer keyboard with a metal-based antibacterial patch on the first laptop After 10 hours of use on the keyboard, after observation by optical microscopy, the red tape on the keyboard of the first laptop, Staphylococcus aureus, Staphylococcus aureus, Streptococcus, Escherichia coli was significantly better than the antibacterial patch of the present invention. The second laptop has a 50% reduction on the keyboard. Example 3: Metal-based antibacterial patch for women's underwear

金属基体 2材质为 1mm厚的银片, 金属抗菌源层 1的材料为单质铜。 本实施例中采用磁控溅射法在金属基体 2上制备出金属抗菌源层 1的女 士内衣用金属基抗菌贴片的预成型体有下列步骤:  The metal substrate 2 is made of a 1 mm thick silver piece, and the metal antibacterial source layer 1 is made of elemental copper. In the present embodiment, the preform of the metal-based antibacterial patch for the underwear of the underwear is prepared by the magnetron sputtering method on the metal substrate 2 by the magnetron sputtering method.

( 1 )将单质铜靶材安装在靶台上;  (1) mounting a single-mass copper target on a target platform;

( 2 )将银片用酒精清洗后烘干, 然后安装在基片转台上;  (2) The silver piece is washed with alcohol, dried, and then mounted on a substrate turntable;

( 3 )抽真空, 使溅射胺室真空度达到 3x l(T4Pa; (3) vacuuming, so that the sputtering amine chamber vacuum reaches 3x l (T 4 Pa;

( 4 )将高纯氩气引入溅射腔室, 达到所需氩气分压值 0.5Pa;  (4) introducing high purity argon into the sputtering chamber to achieve a desired partial pressure of argon of 0.5 Pa;

( 5 )预溅射靶材 3min, 电流 0.3 A、 电压 50V;  (5) Pre-sputtering target for 3 min, current 0.3 A, voltage 50V;

( 6 )对银片进行反溅射 5min, 电流 5A;  (6) Reverse sputtering of silver sheet for 5 min, current 5A;

( 7 )打开溅射沉积靶材的靶电源, 电流 0.1A、 电压 350V, 沉积靶材 lOmin后取出, 即制得在银片上磁控溅射有铜金属抗菌源层的预成型体, 经 测量铜金属抗菌源层的厚度为 0.45mm。  (7) The target power supply of the sputter deposition target is turned on, the current is 0.1 A, the voltage is 350 V, and the target is deposited for 10 min, and then the preform is prepared by magnetron sputtering on the silver sheet with the copper metal antibacterial source layer. The copper metal antibacterial source layer has a thickness of 0.45 mm.

最后将经第 ( 7 ) 步制得的预成型体的银片底部胶贴上类似创口贴的粘 贴层, 即得到女士内衣用金属基抗菌贴片的产品。  Finally, the bottom of the silver sheet of the preform obtained by the step (7) is pasted with a similar adhesive layer, that is, a product of a metal-based antibacterial patch for women's underwear.

将制得的上述女士内衣用金属基抗菌贴片粘贴在使用者右腋下部分的 内衣上使用 10小时后, 经光学显微镜观察, 女士内衣右腋下的霉菌、 葡萄 球菌、 大肠杆菌明显比未使用本发明抗菌贴片的左腋下减少了 79%。  The above-mentioned women's underwear was pasted with a metal-based antibacterial patch on the underwear of the lower right part of the user for 10 hours. After observation by an optical microscope, the mold, staphylococcus and Escherichia coli under the right armpit of the women's underwear were significantly better than The left ankle of the antibacterial patch of the present invention was reduced by 79%.

Claims

权 利 要求 书 Claim 1. 一种金属基抗菌贴片, 其特征在于, 由金属抗菌源层、 金属基体和粘 贴层组成, 该金属抗菌源层是通过磁控溅射法将一种或多种金属沉积于该金 属基体上部而形成, 该粘贴层设置于金属基体的底部。 A metal-based antibacterial patch comprising: a metal antibacterial source layer, a metal substrate, and an adhesive layer, wherein the metal antibacterial source layer deposits one or more metals on the metal by magnetron sputtering The upper portion of the base body is formed, and the adhesive layer is disposed at the bottom of the metal base. 2. 根据权利要求 1所述的金属基抗菌贴片, 其特征在于, 在所述金属抗 菌源层与该粘贴层之间设置一层或多层金属基体。  The metal-based antimicrobial patch according to claim 1, wherein one or more metal substrates are provided between the metal antibacterial source layer and the adhesive layer. 3. 根据权利要求 1所述的金属基抗菌贴片, 其特征在于, 所述金属抗菌 源层的金属是具有杀菌作用的金属。  The metal-based antimicrobial patch according to claim 1, wherein the metal of the metal antibacterial source layer is a metal having a bactericidal action. 4. 根据权利要求 1至 3中任一项所述的金属基抗菌贴片, 其特征在于, 所述金属基体为选自镁、 铝、 钛、 钒、 铬、 锰、 铁、 钴、 镍、 铜、 辞、 锆、 铌、 相、 钯、 银、 铂中的一种金属或它们的合金, 或者是含有所述元素 20% 以上原子比的与其他金属的合金。  The metal-based antimicrobial patch according to any one of claims 1 to 3, wherein the metal substrate is selected from the group consisting of magnesium, aluminum, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, a metal of copper, rhodium, zirconium, hafnium, phase, palladium, silver, platinum or an alloy thereof, or an alloy of other metals containing an atomic ratio of 20% or more of the element. 5. 根据权利要求 1至 4中任一项所述的金属基抗菌贴片, 其特征在于, 所述金属抗菌源层含有选自金、 钒、 铬、 锰、 铁、 钴、 镍、 铜、 辞、 银、 稀 土元素、 锡中的一种金属或一种以上金属的合金。  The metal-based antibacterial patch according to any one of claims 1 to 4, wherein the metal antibacterial source layer contains a metal, vanadium, chromium, manganese, iron, cobalt, nickel, copper, Word, silver, rare earth element, a metal in tin or an alloy of more than one metal. 6. 根据权利要求 5所述的金属基抗菌贴片, 其特征在于, 所述金属抗菌源层 为铜、 银或铜银合金, 金属基体为铜片、 银片或铝片。  The metal-based antimicrobial patch according to claim 5, wherein the metal antibacterial source layer is copper, silver or a copper-silver alloy, and the metal substrate is a copper sheet, a silver sheet or an aluminum sheet. 7. 根据权利要求 1至 5中任一项所述的金属基抗菌贴片, 其特征在于, 所述金属抗菌源层为金、 铜、 银、 铁和 /或辞。  The metal-based antimicrobial patch according to any one of claims 1 to 5, wherein the metal antibacterial source layer is gold, copper, silver, iron, and/or rhodium. 8. 根据权利要求 1至 7中任一项所述的金属基抗菌贴片, 其特征在于, 所述金属抗菌源层的厚度为 0.00005 ~ lmm。  The metal-based antimicrobial patch according to any one of claims 1 to 7, wherein the metal antibacterial source layer has a thickness of 0.00005 to 1 mm. 9. 根据权利要求 1至 8中任一项所述的金属基抗菌贴片, 其特征在于, 所述每层金属基体的厚度为 0.00005 ~ lmm。  The metal-based antimicrobial patch according to any one of claims 1 to 8, wherein each of the metal substrates has a thickness of 0.00005 to 1 mm. 10. 根据权利要求 1至 9中任一项所述的金属基抗菌贴片, 其特征在于, 该金属抗菌源层与金属基体的总厚度为 0.001 ~ 2mm。  The metal-based antimicrobial patch according to any one of claims 1 to 9, wherein the metal antibacterial source layer and the metal substrate have a total thickness of 0.001 to 2 mm. 11. 根据权利要求 1至 5中任一项所述的金属基抗菌贴片, 其特征在于, 该金属基体是厚度为 0.002 ~ 1.5mm的铜片、 铁片、 银片或铝片, 或者是厚度 为 0.002 ~ 1.5mm的铜基合金片、 铁基合金片、 银基合金片或者铝基合金片。 The metal-based antibacterial patch according to any one of claims 1 to 5, wherein the metal substrate is a copper piece, an iron piece, a silver piece or an aluminum piece having a thickness of 0.002 to 1.5 mm, or A copper-based alloy sheet, an iron-based alloy sheet, a silver-based alloy sheet or an aluminum-based alloy sheet having a thickness of 0.002 to 1.5 mm. 12. 根据权利要求 1所述的金属基抗菌贴片, 其特征在于, 具有两种或 两种以上金属元素的金属抗菌源层是在磁控溅射沉积过程中在金属基体上同 时沉积两种或两种以上金属元素而形成的。 The metal-based antibacterial patch according to claim 1, wherein the metal antibacterial source layer having two or more metal elements is simultaneously deposited on the metal substrate during magnetron sputtering deposition. Or formed by two or more metal elements. 13. 如权利要求 1至 11中任一项所述的金属基抗菌贴片的制备方法, 其 特征在于, 该方法包括步骤: 将一种或多种金属通过磁控溅射法沉积于该金 属基体上部, 形成金属抗菌源层, 并且将粘贴层设置于金属基体的底部。  The method for preparing a metal-based antibacterial patch according to any one of claims 1 to 11, wherein the method comprises the steps of: depositing one or more metals on the metal by magnetron sputtering On the upper portion of the substrate, a metal antibacterial source layer is formed, and the adhesive layer is placed on the bottom of the metal substrate. 14. 根据权利要求 13所述的金属基抗菌贴片的制备方法, 其特征在于, 在上述磁控溅射法中, 磁控溅射仪器的多个靶台上安装不同的靶材, 在磁控 溅射沉积过程中使金属基体上同时沉积出具有两种或两种以上金属元素的金 属抗菌源层。  The method for preparing a metal-based antibacterial patch according to claim 13, wherein in the magnetron sputtering method, different targets are mounted on a plurality of target stages of the magnetron sputtering apparatus, and magnetic During the controlled sputtering deposition, a metal antibacterial source layer having two or more metal elements is simultaneously deposited on the metal substrate. 15. 根据权利要求 13或 14所述的金属基抗菌贴片的制备方法, 其特征 在于, 将金属抗菌源层通过磁控溅射法沉积于该金属基体上部的过程包括以 下步骤:  The method for preparing a metal-based antimicrobial patch according to claim 13 or 14, wherein the step of depositing the metal antibacterial source layer on the upper portion of the metal substrate by magnetron sputtering comprises the following steps: ( 1 )将金属抗菌源层所需靶材安装在靶台上;  (1) mounting the target of the metal antibacterial source layer on the target platform; ( 2 )将金属基体清洗、 烘干, 安装在基片转台上;  (2) cleaning and drying the metal substrate and mounting it on the substrate turntable; ( 3 )抽真空, 使溅射胺室真空度达到 3xlO—4Pa; (3) vacuuming, so that the vacuum of the sputtering amine chamber reaches 3xl - 4 Pa; ( 4 )将高纯氩气引入溅射腔室, 达到所需氩气分压值 0.5 ~ 1.5Pa;  (4) introducing high purity argon gas into the sputtering chamber to achieve a desired partial pressure of argon gas of 0.5 to 1.5 Pa; ( 5 )预溅射靶材 1 ~ 5min, 电流 0.1 ~ 0.3 A、 电压 30 ~ 300V;  (5) Pre-sputtering target 1 ~ 5min, current 0.1 ~ 0.3 A, voltage 30 ~ 300V; ( 6 )对金属基体进行反溅射 5 ~ lOmin, 电流 5 ~ 15A;  (6) Reverse sputtering of the metal substrate 5 ~ lOmin, current 5 ~ 15A; ( 7 )打开溅射沉积靶材的靶电源, 电流 0.01 ~ 0.2A、 电压 200 ~ 350V, 沉积靶材 5 ~ lOmin后取出。  (7) Turn on the target power supply of the sputter deposition target, the current is 0.01 ~ 0.2A, the voltage is 200 ~ 350V, and the target is deposited for 5 ~ 10min. 16. 如权利要求 1至 12中任一项所述的金属基抗菌贴片在用于对手机、 计算机键盘、 服装或皮夹进行杀菌的用途。  16. Use of a metal-based antimicrobial patch according to any one of claims 1 to 12 for sterilizing a mobile phone, a computer keyboard, a garment or a wallet. 17. 一种用于金属基抗菌贴片的预成型体, 包括金属抗菌源层和金属基 体, 该金属抗菌源层是通过磁控溅射法将一种或多种金属沉积于该金属基体 上而形成。  17. A preform for a metal-based antimicrobial patch comprising a metal antimicrobial source layer and a metal substrate, the metal antimicrobial source layer depositing one or more metals on the metal substrate by magnetron sputtering And formed. 18. 一种金属基抗菌贴片, 其特征在于, 包括金属抗菌源层、 金属基体 和粘贴层, 该金属抗菌源层是通过磁控溅射法将一种或多种金属沉积于该金 属基体上部而形成, 该粘贴层设置于金属基体的底部。 A metal-based antibacterial patch comprising a metal antibacterial source layer, a metal substrate and an adhesive layer, wherein the metal antibacterial source layer deposits one or more metals on the metal substrate by magnetron sputtering Formed on the upper portion, the adhesive layer is disposed at the bottom of the metal substrate. 19. 一种金属基抗菌贴片, 其特征在于, 包括金属抗菌源层、 金属基体 和粘贴层,该金属抗菌源层是通过磁控溅射法将一种或多种金属离子、原子和 /或原子团沉积于该金属基体上部而形成, 该粘贴层设置于金属基体的底部。 A metal-based antibacterial patch comprising a metal antibacterial source layer, a metal substrate and an adhesive layer, the metal antibacterial source layer being one or more metal ions, atoms and/or by magnetron sputtering. Or an atomic group is deposited on the upper portion of the metal substrate, and the adhesive layer is disposed on the bottom of the metal substrate.
PCT/CN2008/072150 2007-08-27 2008-08-26 Metallic-base antiseptic patch, its preformed body, its preparing method using magnetron sputtering and its use Ceased WO2009030149A1 (en)

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