WO2009028269A1 - Element assembly, and its manufacturing method - Google Patents
Element assembly, and its manufacturing method Download PDFInfo
- Publication number
- WO2009028269A1 WO2009028269A1 PCT/JP2008/062747 JP2008062747W WO2009028269A1 WO 2009028269 A1 WO2009028269 A1 WO 2009028269A1 JP 2008062747 W JP2008062747 W JP 2008062747W WO 2009028269 A1 WO2009028269 A1 WO 2009028269A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- recess
- mounting
- electrode
- cover
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C10/00—Adjustable resistors
- H01C10/10—Adjustable resistors adjustable by mechanical pressure or force
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
- H01G5/16—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
- H01G5/40—Structural combinations of variable capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F21/00—Variable inductances or transformers of the signal type
- H01F21/12—Variable inductances or transformers of the signal type discontinuously variable, e.g. tapped
- H01F2021/125—Printed variable inductor with taps, e.g. for VCO
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F21/00—Variable inductances or transformers of the signal type
- H01F21/02—Variable inductances or transformers of the signal type continuously variable, e.g. variometers
- H01F21/08—Variable inductances or transformers of the signal type continuously variable, e.g. variometers by varying the permeability of the core, e.g. by varying magnetic bias
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adjustable Resistors (AREA)
- Micromachines (AREA)
Abstract
In the upper face of a substrate (22), there are formed a plurality of recesses (25). In one recess, a variable condenser (27) is formed by mounting a plate-shaped stationary electrode (30) on the bottom face of the recess (25) and by mounting a plate-shaped movable electrode (31) in a confronting manner on the back of a cover (23). In another recess, a stationary electrode (33) is mounted on the bottom of the recess (25), and a moving electrode (34) is mounted in a confronting manner on the back of the cover (23), so that a high resistor (35) is formed between the two electrodes, thereby to form a variable resistor (28). In still another recess, a variable inductor (29) is formed by mounting a plate-shaped stationary electrode (36) on the bottom of the recess (25) and by mounting a zigzag-meandering movable electrode (37) in a confronting manner on the back of the cover (23).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-225487 | 2007-08-31 | ||
| JP2007225487A JP5352975B2 (en) | 2007-08-31 | 2007-08-31 | Element assembly and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009028269A1 true WO2009028269A1 (en) | 2009-03-05 |
Family
ID=40386998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/062747 Ceased WO2009028269A1 (en) | 2007-08-31 | 2008-07-15 | Element assembly, and its manufacturing method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5352975B2 (en) |
| TW (1) | TW200917301A (en) |
| WO (1) | WO2009028269A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3863176A4 (en) * | 2018-10-23 | 2021-10-27 | Huawei Technologies Co., Ltd. | PROCESS FOR PREPARING A MONOLITHIC INTEGRATED BAW RESONATOR |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101541906B1 (en) | 2007-11-07 | 2015-08-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Micro-electromechanical device and method of making same |
| JP5271674B2 (en) * | 2007-11-13 | 2013-08-21 | 株式会社半導体エネルギー研究所 | Micro electromechanical device |
| JP5317635B2 (en) * | 2007-11-30 | 2013-10-16 | 株式会社半導体エネルギー研究所 | Method for manufacturing micro electromechanical device |
| JP2009272354A (en) * | 2008-04-30 | 2009-11-19 | Omron Corp | Dielectric material for sealing variable capacitor, variable capacitor and element assembly |
| CN103430260B (en) * | 2011-03-16 | 2016-03-30 | 富士通株式会社 | There is electronic equipment and the manufacture method thereof of variable-capacitance element |
| WO2012164974A1 (en) | 2011-06-02 | 2012-12-06 | アルプス電気株式会社 | Variable capacitance capacitor |
| CN110459388B (en) * | 2019-09-03 | 2024-04-09 | 浙江江山变压器股份有限公司 | Radial free-arrangement continuous dry-type transformer winding and processing method thereof |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61119012A (en) * | 1984-11-15 | 1986-06-06 | Toyo Commun Equip Co Ltd | Loose coupling transformer |
| JPH04346278A (en) * | 1991-05-23 | 1992-12-02 | Kenichi Arai | Magnetostriction/electrostriction converting element and converter |
| JPH056802U (en) * | 1991-07-08 | 1993-01-29 | ホシデン株式会社 | Displacement-electric resistance conversion element |
| JPH0696957A (en) * | 1992-09-14 | 1994-04-08 | Murata Mfg Co Ltd | Chip type variable inductor |
| JPH0686325U (en) * | 1993-05-27 | 1994-12-13 | 株式会社村田製作所 | Variable capacitor |
| JPH08213282A (en) * | 1995-02-01 | 1996-08-20 | Murata Mfg Co Ltd | Variable capacitance capacitor |
| JPH09199376A (en) * | 1996-01-18 | 1997-07-31 | Murata Mfg Co Ltd | Variable-capacitance capacitor |
| JP2001320150A (en) * | 2000-02-29 | 2001-11-16 | Mitsui Chemicals Inc | Wiring board by stamper and manufacturing method thereof |
| WO2003069776A2 (en) * | 2002-02-13 | 2003-08-21 | Commissariat A L'energie Atomique | Tunable bulk acoustic wave mems microresonator |
| JP2005332802A (en) * | 2004-04-22 | 2005-12-02 | Ngk Insulators Ltd | Microswitch and manufacturing method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4675960A (en) * | 1985-12-30 | 1987-06-30 | Motorola, Inc. | Method of manufacturing an electrically variable piezoelectric hybrid capacitor |
| JPH06111971A (en) * | 1992-09-30 | 1994-04-22 | Toshiba Lighting & Technol Corp | Electrodeless discharge lamp lighting device |
| JP3544839B2 (en) * | 1997-10-13 | 2004-07-21 | シャープ株式会社 | Variable capacitance element |
| JP2003243254A (en) * | 2002-02-14 | 2003-08-29 | Murata Mfg Co Ltd | Variable capacitor |
| JP2004045178A (en) * | 2002-07-11 | 2004-02-12 | Nitta Ind Corp | Capacitance type sensor |
| US6958255B2 (en) * | 2002-08-08 | 2005-10-25 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined ultrasonic transducers and method of fabrication |
| KR100608927B1 (en) * | 2005-05-26 | 2006-08-08 | 한국과학기술원 | Manufacturing method of capacitor electrode layer and capacitor electrode layer, unit sensor using the electrode layer and tactile sensor using the unit sensor |
-
2007
- 2007-08-31 JP JP2007225487A patent/JP5352975B2/en not_active Expired - Fee Related
-
2008
- 2008-06-23 TW TW097123400A patent/TW200917301A/en unknown
- 2008-07-15 WO PCT/JP2008/062747 patent/WO2009028269A1/en not_active Ceased
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61119012A (en) * | 1984-11-15 | 1986-06-06 | Toyo Commun Equip Co Ltd | Loose coupling transformer |
| JPH04346278A (en) * | 1991-05-23 | 1992-12-02 | Kenichi Arai | Magnetostriction/electrostriction converting element and converter |
| JPH056802U (en) * | 1991-07-08 | 1993-01-29 | ホシデン株式会社 | Displacement-electric resistance conversion element |
| JPH0696957A (en) * | 1992-09-14 | 1994-04-08 | Murata Mfg Co Ltd | Chip type variable inductor |
| JPH0686325U (en) * | 1993-05-27 | 1994-12-13 | 株式会社村田製作所 | Variable capacitor |
| JPH08213282A (en) * | 1995-02-01 | 1996-08-20 | Murata Mfg Co Ltd | Variable capacitance capacitor |
| JPH09199376A (en) * | 1996-01-18 | 1997-07-31 | Murata Mfg Co Ltd | Variable-capacitance capacitor |
| JP2001320150A (en) * | 2000-02-29 | 2001-11-16 | Mitsui Chemicals Inc | Wiring board by stamper and manufacturing method thereof |
| WO2003069776A2 (en) * | 2002-02-13 | 2003-08-21 | Commissariat A L'energie Atomique | Tunable bulk acoustic wave mems microresonator |
| JP2005332802A (en) * | 2004-04-22 | 2005-12-02 | Ngk Insulators Ltd | Microswitch and manufacturing method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3863176A4 (en) * | 2018-10-23 | 2021-10-27 | Huawei Technologies Co., Ltd. | PROCESS FOR PREPARING A MONOLITHIC INTEGRATED BAW RESONATOR |
| US12028035B2 (en) | 2018-10-23 | 2024-07-02 | Huawei Technologies Co., Ltd. | Monolithic integrated BAW resonator production method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200917301A (en) | 2009-04-16 |
| JP2009059866A (en) | 2009-03-19 |
| JP5352975B2 (en) | 2013-11-27 |
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Legal Events
| Date | Code | Title | Description |
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| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
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