WO2009021734A1 - Capteur de suie avec des surfaces lisses d'al2o3 pures - Google Patents
Capteur de suie avec des surfaces lisses d'al2o3 pures Download PDFInfo
- Publication number
- WO2009021734A1 WO2009021734A1 PCT/EP2008/006688 EP2008006688W WO2009021734A1 WO 2009021734 A1 WO2009021734 A1 WO 2009021734A1 EP 2008006688 W EP2008006688 W EP 2008006688W WO 2009021734 A1 WO2009021734 A1 WO 2009021734A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- soot
- soot sensor
- sintered
- sio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/06—Investigating concentration of particle suspensions
- G01N15/0656—Investigating concentration of particle suspensions using electric, e.g. electrostatic methods or magnetic methods
Definitions
- the present invention relates to a soot sensor, the fouling of exhaust gases exposed objects such.
- DE 101 33 384 A1 has provided a sensor in which measuring electrodes are covered with a catching sleeve. According to DE 103 31 838 B3, the roughness of the surface of a sensor chip is increased.
- the object of the present invention is to increase the reliability of the soot measurement, in particular to ensure reversible results over the life of a vehicle with an internal combustion engine.
- the adsorption of soot on a chip surface is increased according to the invention, so once adsorbed on the surface soot is not entrained again by the Abgasström Ström.
- a chip surface is provided which is free of binder, which is used in the production of the ceramic substrates, in particular free of SiO 2 . Therefore, according to the invention, on the one hand, the burning skin of the chip substrate can be removed, in particular etched away.
- the substrate can be coated with a binder-free layer of aluminum oxide, in particular in thin-film technology.
- the production of a very smooth alumina surface in order to improve the adsorption forces is in particular helpful together with the two preceding steps according to the invention.
- the surface of a chip according to DE 103 31 838 rougher, however, according to the invention smoother.
- R 3 ⁇ 500 and R q ⁇ 600, in particular R a 400-450 and Rq 500-550.
- W a is between 100 and 180 and W q is between 150 and 250.
- TIR is preferably between 2000 and 3000.
- the absorption of carbon black on the ceramic is improved when the silicon is removed from the surface or coated with ceramic material.
- the ceramic coating takes place in thin-film technology or preferably has a surface roughness R a ⁇ 450, Rq ⁇ 550, W a ⁇ 180, W q ⁇ 230 and TIR ⁇ 3000.
- W 3 is between 150 and 170, Wq between 200 and 230.
- TIR is preferably between 2500 and 2800.
- a particularly smooth, SiO 2 -free surface is provided by sapphire.
- Sapphire flakes are therefore particularly suitable substrates for conductor track application without pretreatment steps.
- the measuring electrode structure 1 to 40 .mu.m, more preferably 2 to 20 .mu.m, in particular 5 to 15 microns thick on the substrate on the pretreated, especially smoothed surface of the substrate.
- a job using screen printing technology enables the smoothed surface to be preserved.
- a metal paste is applied, which is patterned with laser cuts, in particular meandered, so that a particularly large number of electrode pairs with reproducible measuring accuracy is produced.
- the electrode width is preferably 20 to 150 ⁇ m, in particular 50 to 100 ⁇ m. The ratio of the electrode width and that of the meandering
- the meandering laser cut reaches a length of 50 to 100 mm per 10 mm 2 of substrate surface 5.
- the substrate surface 5 is preferably 10 to 100 mm 2 , in particular 20 to 30 mm 2 .
- a heating conductor chip with a heating conductor produced in thin-film technology is arranged on the back side of the substrate before the substrate is etched and coated on the front side.
- the rear arrangement of the heating conductor allows maximum utilization of the front side for the measuring structure, in particular an interdigital capacitor (IDK) made of platinum.
- INK interdigital capacitor
- silicon-free means that the silicon of the firing skin, in particular the surface of the firing skin, is reduced by at least one order of magnitude, in particular two orders of magnitude, or the silicon is reduced in the surface by coating.
- Figure 1 shows a structure of a particle sensor in an exploded view.
- the substrate 1 is a 25 mm 2 thick plate of aluminum oxide thin film ceramics having a surface roughness
- This smooth silicon-free layer 5 forms the basis for the soot particles to be absorbed, which are decisive for determining the carbon black with the measuring resistor.
- a measuring electrode structure 7 is a platinum or platinum alloy paste is printed onto the pretreated surface of the substrate and at about 1200 0 C one
- a thin-film heating conductor chip made of a platinum thin-film heater 2 with pads 4 is arranged on a passivating base 3 before the substrate 1 is etched on the front side and coated with an Al 2 O 3 thin film 5.
- the rear-side arrangement of the heating conductor 2 allows maximum utilization of the front side for the measuring structure created as a Pt-IDK.
- the Schuleiterchip produced in thin-film technology is glazed on the back of the substrate before the surface of the front side is provided by etching the Brennhaut and vapor deposition of Al 2 O 3 virtually free of silicon.
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
Pour la fabrication d'une puce de capteur de suie selon l'invention dans laquelle une structure de piste conductrice est appliquée sur une base électriquement isolante, cette base électriquement isolante est produite par élimination de substances liantes, en particulier de SiO2, de la surface d'un substrat d'oxyde d'aluminium ou par application d'oxyde d'aluminium sans ajout de substance liante à la surface d'un substrat. Une puce de capteur de suie selon l'invention comporte une structure de piste conductrice sur du saphir ou une surface en Al2O3 qui est appliquée ou frittée sans ajout de SiO2 ou qui est appliquée ou frittée avec une pureté de 99,99 % en poids ou qui présente une dureté de surface réduite par rapport à une peau de cuisson.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007038680.1 | 2007-08-15 | ||
| DE102007038680A DE102007038680A1 (de) | 2007-08-15 | 2007-08-15 | Rußsensor mit glatter, reiner Al2O3-Oberfläche |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009021734A1 true WO2009021734A1 (fr) | 2009-02-19 |
Family
ID=40029264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2008/006688 Ceased WO2009021734A1 (fr) | 2007-08-15 | 2008-08-14 | Capteur de suie avec des surfaces lisses d'al2o3 pures |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE102007038680A1 (fr) |
| WO (1) | WO2009021734A1 (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010130370A1 (fr) * | 2009-05-11 | 2010-11-18 | Heraeus Sensor Technology Gmbh | Capteur à couche épaisse structuré par photolithographie |
| WO2014135450A1 (fr) * | 2013-03-06 | 2014-09-12 | Heraeus Sensor Technology Gmbh | Procédé de fabrication d'un capteur de suie ayant un faisceau laser |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007046900C5 (de) | 2007-09-28 | 2018-07-26 | Heraeus Sensor Technology Gmbh | Hochtemperatursensor und ein Verfahren zu dessen Herstellung |
| DE102012200995A1 (de) * | 2011-12-22 | 2013-06-27 | Continental Automotive Gmbh | Verfahren zum Herstellen eines resistiven Partikelsensors |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0909950A2 (fr) * | 1997-09-26 | 1999-04-21 | SIEMENS MATSUSHITA COMPONENTS GmbH & CO. KG | Composant avec des pistes conductrices planaires |
| EP1167955A2 (fr) * | 2000-06-30 | 2002-01-02 | DaimlerChrysler AG | Capteur de matière à haute température |
| WO2003006976A2 (fr) * | 2001-07-10 | 2003-01-23 | Robert Bosch Gmbh | Detecteur servant a la detection de particules, et procede de reglage de son fonctionnement |
| US6599132B1 (en) * | 1999-11-30 | 2003-07-29 | The Board Of Trustees Of The Leland Stanford Junior University | Scanning capacitance sample preparation technique |
| DE10331838B3 (de) * | 2003-04-03 | 2004-09-02 | Georg Bernitz | Sensorelement, Verfahren zu seiner Herstellung und Verfahren zur Erfassung von Partikeln |
| WO2006111386A1 (fr) * | 2005-04-20 | 2006-10-26 | Heraeus Sensor Technology Gmbh | Capteur de suies |
-
2007
- 2007-08-15 DE DE102007038680A patent/DE102007038680A1/de not_active Withdrawn
-
2008
- 2008-08-14 WO PCT/EP2008/006688 patent/WO2009021734A1/fr not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0909950A2 (fr) * | 1997-09-26 | 1999-04-21 | SIEMENS MATSUSHITA COMPONENTS GmbH & CO. KG | Composant avec des pistes conductrices planaires |
| US6599132B1 (en) * | 1999-11-30 | 2003-07-29 | The Board Of Trustees Of The Leland Stanford Junior University | Scanning capacitance sample preparation technique |
| EP1167955A2 (fr) * | 2000-06-30 | 2002-01-02 | DaimlerChrysler AG | Capteur de matière à haute température |
| WO2003006976A2 (fr) * | 2001-07-10 | 2003-01-23 | Robert Bosch Gmbh | Detecteur servant a la detection de particules, et procede de reglage de son fonctionnement |
| DE10331838B3 (de) * | 2003-04-03 | 2004-09-02 | Georg Bernitz | Sensorelement, Verfahren zu seiner Herstellung und Verfahren zur Erfassung von Partikeln |
| WO2006111386A1 (fr) * | 2005-04-20 | 2006-10-26 | Heraeus Sensor Technology Gmbh | Capteur de suies |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010130370A1 (fr) * | 2009-05-11 | 2010-11-18 | Heraeus Sensor Technology Gmbh | Capteur à couche épaisse structuré par photolithographie |
| US9068913B2 (en) | 2009-05-11 | 2015-06-30 | Heraeus Sensor Technology Gmbh | Photolithographic structured thick layer sensor |
| WO2014135450A1 (fr) * | 2013-03-06 | 2014-09-12 | Heraeus Sensor Technology Gmbh | Procédé de fabrication d'un capteur de suie ayant un faisceau laser |
| CN105074421A (zh) * | 2013-03-06 | 2015-11-18 | 贺利氏传感技术有限公司 | 利用激光束制造碳烟传感器的方法 |
| JP2016510173A (ja) * | 2013-03-06 | 2016-04-04 | ヘレーウス ゼンゾール テクノロジー ゲゼルシャフト ミット ベシュレンクテル ハフツングHeraeus Sensor Technology GmbH | レーザー光線を用いた煤煙センサーの製造方法 |
| US10107221B2 (en) | 2013-03-06 | 2018-10-23 | Heraeus Sensor Technology Gmbh | Method for producing a soot sensor with a laser beam |
| CN105074421B (zh) * | 2013-03-06 | 2020-02-14 | 贺利氏先进传感器技术有限公司 | 利用激光束制造碳烟传感器的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102007038680A1 (de) | 2009-02-26 |
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