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WO2009014115A1 - Adhesive for electronic component, semiconductor chip stacking method, and semiconductor device - Google Patents

Adhesive for electronic component, semiconductor chip stacking method, and semiconductor device Download PDF

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Publication number
WO2009014115A1
WO2009014115A1 PCT/JP2008/063124 JP2008063124W WO2009014115A1 WO 2009014115 A1 WO2009014115 A1 WO 2009014115A1 JP 2008063124 W JP2008063124 W JP 2008063124W WO 2009014115 A1 WO2009014115 A1 WO 2009014115A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
adhesive
support member
semiconductor device
stacking method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/063124
Other languages
French (fr)
Japanese (ja)
Inventor
Hideaki Ishizawa
Akinobu Hayakawa
Kohei Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to CN2008800252999A priority Critical patent/CN101755329B/en
Priority to KR1020097026044A priority patent/KR101155361B1/en
Priority to JP2008534802A priority patent/JP4339927B2/en
Publication of WO2009014115A1 publication Critical patent/WO2009014115A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/8312—Aligning
    • H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/83138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
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    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
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    • H01—ELECTRIC ELEMENTS
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    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)

Abstract

This invention provides an adhesive for an electronic component which can realize the connection of one electronic component to another electronic component or a support member parallel to each other while providing an accurate gap distance, semiconductor chip stacking method using the adhesive for an electronic component and a semiconductor device. The adhesive for an electronic component is used for stacking one electronic component and another electronic component or a support member parallel to each other while providing a gap distance of not more than 30 μm. The adhesive for an electronic component contains a curable compound, a curing agent, and spacer particles, and has a viscosity of not more than 50 Pa s as measured with E-type viscometer at 10 rpm and at a temperature at which the one electronic component is bonded to the another electronic component or the support member. The spacer particles have a CV value of not more than 10%. The average particle diameter is 40 to 70% of the gap distance between the one electronic component and the another electronic component or the support member.
PCT/JP2008/063124 2007-07-25 2008-07-22 Adhesive for electronic component, semiconductor chip stacking method, and semiconductor device Ceased WO2009014115A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800252999A CN101755329B (en) 2007-07-25 2008-07-22 Adhesive for electronic component, semiconductor chip stacking method, and semiconductor device
KR1020097026044A KR101155361B1 (en) 2007-07-25 2008-07-22 Adhesive for electronic component, semiconductor chip stacking method, and semiconductor device
JP2008534802A JP4339927B2 (en) 2007-07-25 2008-07-22 Method for stacking semiconductor chips

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007193758 2007-07-25
JP2007-193758 2007-07-25
JP2008-053249 2008-03-04
JP2008053249 2008-03-04

Publications (1)

Publication Number Publication Date
WO2009014115A1 true WO2009014115A1 (en) 2009-01-29

Family

ID=40281366

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063124 Ceased WO2009014115A1 (en) 2007-07-25 2008-07-22 Adhesive for electronic component, semiconductor chip stacking method, and semiconductor device

Country Status (5)

Country Link
JP (1) JP4339927B2 (en)
KR (1) KR101155361B1 (en)
CN (1) CN101755329B (en)
TW (1) TWI411049B (en)
WO (1) WO2009014115A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219162A (en) * 2009-03-13 2010-09-30 Sekisui Chem Co Ltd Adhesive agent for bonding semiconductor chips
JP2011168631A (en) * 2010-02-16 2011-09-01 Nippon Shokubai Co Ltd Method for producing metal-coated particle
JP2011233599A (en) * 2010-04-23 2011-11-17 Toshiba Corp Method of manufacturing semiconductor device
JP2012142438A (en) * 2010-12-28 2012-07-26 Jgc Catalysts & Chemicals Ltd Paste for mounting semiconductor device
WO2017170492A1 (en) * 2016-03-30 2017-10-05 積水化学工業株式会社 Inductor adhesive and inductor

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5676954B2 (en) * 2010-07-27 2015-02-25 京セラ株式会社 Thermal head and thermal printer equipped with the same
WO2012121336A1 (en) 2011-03-09 2012-09-13 積水化学工業株式会社 Adhesive for electronic components, and manufacturing method for semiconductor chip mount
US8937380B1 (en) * 2013-08-30 2015-01-20 Infineon Technologies Austria Ag Die edge protection for pressure sensor packages
KR101651649B1 (en) * 2016-01-22 2016-08-29 주식회사 일렉켐스 Conductive adhesive composition for accessing electric or electronic parts

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216973A (en) * 2004-01-27 2005-08-11 Sekisui Chem Co Ltd Semiconductor device
JP2005244188A (en) * 2004-01-27 2005-09-08 Sekisui Chem Co Ltd Paste-like adhesive for bonding semiconductor chip and semiconductor device
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JPWO2009014115A1 (en) 2010-10-07
KR20100018562A (en) 2010-02-17

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