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WO2009008509A1 - 無機粒子を含有した液状エポキシ樹脂形成用製剤 - Google Patents

無機粒子を含有した液状エポキシ樹脂形成用製剤 Download PDF

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Publication number
WO2009008509A1
WO2009008509A1 PCT/JP2008/062604 JP2008062604W WO2009008509A1 WO 2009008509 A1 WO2009008509 A1 WO 2009008509A1 JP 2008062604 W JP2008062604 W JP 2008062604W WO 2009008509 A1 WO2009008509 A1 WO 2009008509A1
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WIPO (PCT)
Prior art keywords
agent
epoxy resin
group
liquid preparation
inorganic particle
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/062604
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English (en)
French (fr)
Inventor
Toshiaki Takeyama
Naohiko Suemura
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Nissan Chemical Corp
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Nissan Chemical Corp
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Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Priority to CN2008800239299A priority Critical patent/CN101688051B/zh
Priority to EP08791085A priority patent/EP2166037A4/en
Priority to JP2009522687A priority patent/JPWO2009008509A1/ja
Priority to US12/452,388 priority patent/US8344048B2/en
Publication of WO2009008509A1 publication Critical patent/WO2009008509A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

【課題】　液状でのハンドリングの良さを維持したまま、高い透明性や高い曲げ強度を兼ね備えた硬化物性を有する液状エポキシ樹脂形成用製剤を提供する。 【解決手段】Ａ剤とＢ剤とを含む液状エポキシ樹脂形成用製剤であって、Ａ剤は、式（１）： 【化１】 （式中、Ｒ1及びＲ2はそれぞれアルキル基、アルケニル基、アルキニル基、アリール基、アラルキル基、複素環基、又はそれらのハロゲン化、アミノ化、若しくはニトロ化誘導体を表す。）で表される官能基を分子内に少なくとも１つ有する少なくとも１種の化合物（ｉ）と分子内にグリシジル基を有する化合物（ｉｉ）から形成される変性エポキシ樹脂（Ｉ）及び無機粒子（ＩＩ）を含むものであり、 　Ｂ剤は硬化剤（ＩＩＩ）を含むものであるところの、液状エポキシ樹脂形成用製剤。 　Ａ’剤とＢ’剤とを含む液状エポキシ樹脂形成用製剤であって、Ａ’剤は前記変性エポキシ樹脂（Ｉ）を含むものであり、Ｂ’剤は前記無機粒子（ＩＩ）と前記硬化剤（ＩＩＩ）とを含むものであるところの、液状エポキシ樹脂形成用製剤
PCT/JP2008/062604 2007-07-11 2008-07-11 無機粒子を含有した液状エポキシ樹脂形成用製剤 Ceased WO2009008509A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008800239299A CN101688051B (zh) 2007-07-11 2008-07-11 含有无机粒子的液体环氧树脂形成用制剂
EP08791085A EP2166037A4 (en) 2007-07-11 2008-07-11 EPOXY RESIN MOLDING LIQUID PREPARATION WITH INORGANIC PARTICLES
JP2009522687A JPWO2009008509A1 (ja) 2007-07-11 2008-07-11 無機粒子を含有した液状エポキシ樹脂形成用製剤
US12/452,388 US8344048B2 (en) 2007-07-11 2008-07-11 Epoxy resin-forming liquid preparation containing inorganic particle

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-182146 2007-07-11
JP2007182146 2007-07-11

Publications (1)

Publication Number Publication Date
WO2009008509A1 true WO2009008509A1 (ja) 2009-01-15

Family

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PCT/JP2008/062604 Ceased WO2009008509A1 (ja) 2007-07-11 2008-07-11 無機粒子を含有した液状エポキシ樹脂形成用製剤

Country Status (7)

Country Link
US (1) US8344048B2 (ja)
EP (1) EP2166037A4 (ja)
JP (1) JPWO2009008509A1 (ja)
KR (1) KR20100037616A (ja)
CN (1) CN101688051B (ja)
TW (1) TW200923006A (ja)
WO (1) WO2009008509A1 (ja)

Cited By (15)

* Cited by examiner, † Cited by third party
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WO2010092947A1 (ja) * 2009-02-10 2010-08-19 日産化学工業株式会社 長鎖アルキレン基含有エポキシ化合物
JP2013014663A (ja) * 2011-07-01 2013-01-24 Fuji Electric Co Ltd ポリマーナノコンポジット樹脂組成物
JP2013018886A (ja) * 2011-07-12 2013-01-31 Fuji Electric Co Ltd ナノコンポジット樹脂硬化物の製造方法
WO2013018783A1 (ja) * 2011-08-01 2013-02-07 株式会社Ｓｔｅｑ 半導体装置及びその製造方法
JP6039809B2 (ja) * 2013-07-31 2016-12-07 ミネベア株式会社 熱硬化性樹脂組成物及び摺動部材、並びに摺動部材の製造方法
JPWO2014188934A1 (ja) * 2013-05-20 2017-02-23 日産化学工業株式会社 シリカゾル及びシリカ含有エポキシ樹脂組成物
JP2017128546A (ja) * 2016-01-22 2017-07-27 四国化成工業株式会社 （メタ）アクリルエポキシイソシアヌレート化合物、その合成方法および該イソシアヌレート化合物の利用
WO2018074517A1 (ja) * 2016-10-18 2018-04-26 日産化学工業株式会社 プリント配線板形成用エポキシ樹脂組成物
JPWO2018003844A1 (ja) * 2016-07-01 2019-04-18 日産化学株式会社 沿面放電の発生を抑制する方法
JP2019090017A (ja) * 2017-11-14 2019-06-13 京セラ株式会社 透明液状熱硬化性樹脂組成物、光学材料用接着剤及び光半導体装置
WO2020230823A1 (ja) 2019-05-14 2020-11-19 日産化学株式会社 ケトン系溶媒分散シリカゾル及び樹脂組成物
WO2022097694A1 (ja) 2020-11-04 2022-05-12 日産化学株式会社 窒素含有溶媒に分散したアルミニウム含有シリカゾル及び樹脂組成物
WO2023032680A1 (ja) 2021-08-31 2023-03-09 日産化学株式会社 エポキシ基含有オルガノシリカゾル、エポキシ樹脂組成物、及びその製造方法
JP2023103095A (ja) * 2022-01-13 2023-07-26 日産化学株式会社 長鎖アルキレン基含有エポキシ化合物含有シリカゾル
KR20250083522A (ko) 2023-11-29 2025-06-10 닛산 가가쿠 가부시키가이샤 유기산을 포함하는 질소 함유 유기 용매에 분산된 실리카졸 및 절연성 수지 조성물

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CN101954348B (zh) * 2010-09-30 2013-02-06 哈尔滨工程大学 镁锂合金表面复合防护方法及专用环氧/纳米SiO2涂料
WO2015093370A1 (ja) 2013-12-17 2015-06-25 日産化学工業株式会社 高溶解性変性エポキシ樹脂組成物
KR102731982B1 (ko) * 2021-11-02 2024-11-19 주식회사 에프알에스아이 상온 경화형 친환경 방오코팅 조성물 이를 포함하는 친환경 방오코팅막
CN119432145A (zh) * 2023-07-31 2025-02-14 华为技术有限公司 分散液、浆料及其应用

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WO2013018783A1 (ja) * 2011-08-01 2013-02-07 株式会社Ｓｔｅｑ 半導体装置及びその製造方法
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WO2020230823A1 (ja) 2019-05-14 2020-11-19 日産化学株式会社 ケトン系溶媒分散シリカゾル及び樹脂組成物
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US11708273B2 (en) 2020-11-04 2023-07-25 Nissan Chemical Corporation Aluminum-containing silica sol dispersed in nitrogen-containing solvent and resin composition
WO2023032680A1 (ja) 2021-08-31 2023-03-09 日産化学株式会社 エポキシ基含有オルガノシリカゾル、エポキシ樹脂組成物、及びその製造方法
KR20240051955A (ko) 2021-08-31 2024-04-22 닛산 가가쿠 가부시키가이샤 에폭시기함유 오가노실리카졸, 에폭시 수지 조성물, 및 그의 제조방법
JP2023103095A (ja) * 2022-01-13 2023-07-26 日産化学株式会社 長鎖アルキレン基含有エポキシ化合物含有シリカゾル
KR20250083522A (ko) 2023-11-29 2025-06-10 닛산 가가쿠 가부시키가이샤 유기산을 포함하는 질소 함유 유기 용매에 분산된 실리카졸 및 절연성 수지 조성물

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TW200923006A (en) 2009-06-01
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EP2166037A4 (en) 2012-07-25
US8344048B2 (en) 2013-01-01
JPWO2009008509A1 (ja) 2010-09-09
US20100137475A1 (en) 2010-06-03
KR20100037616A (ko) 2010-04-09
CN101688051B (zh) 2013-03-13

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