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WO2009008448A1 - 回路部材接続用接着剤 - Google Patents

回路部材接続用接着剤 Download PDF

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Publication number
WO2009008448A1
WO2009008448A1 PCT/JP2008/062402 JP2008062402W WO2009008448A1 WO 2009008448 A1 WO2009008448 A1 WO 2009008448A1 JP 2008062402 W JP2008062402 W JP 2008062402W WO 2009008448 A1 WO2009008448 A1 WO 2009008448A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit member
member connection
adhesive
thermally crosslinkable
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/062402
Other languages
English (en)
French (fr)
Inventor
Akira Nagai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN200880023514A priority Critical patent/CN101689518A/zh
Priority to JP2009522658A priority patent/JP5557526B2/ja
Priority to KR1020127016495A priority patent/KR20120089347A/ko
Publication of WO2009008448A1 publication Critical patent/WO2009008448A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
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    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesive Tapes (AREA)

Abstract

熱架橋性樹脂及び該熱架橋性樹脂と反応する硬化剤を含む樹脂組成物と、該樹脂組成物中に分散している複合酸化物粒子と、からなる熱硬化型の回路部材接続用接着剤。
PCT/JP2008/062402 2007-07-11 2008-07-09 回路部材接続用接着剤 Ceased WO2009008448A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880023514A CN101689518A (zh) 2007-07-11 2008-07-09 电路部件连接用粘接剂
JP2009522658A JP5557526B2 (ja) 2007-07-11 2008-07-09 回路部材接続用接着剤及び半導体装置
KR1020127016495A KR20120089347A (ko) 2007-07-11 2008-07-09 회로 부재 접속용 접착제

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007182110 2007-07-11
JP2007-182110 2007-07-11

Publications (1)

Publication Number Publication Date
WO2009008448A1 true WO2009008448A1 (ja) 2009-01-15

Family

ID=40228619

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062402 Ceased WO2009008448A1 (ja) 2007-07-11 2008-07-09 回路部材接続用接着剤

Country Status (5)

Country Link
JP (2) JP5557526B2 (ja)
KR (2) KR20120089347A (ja)
CN (2) CN101689518A (ja)
TW (1) TWI425598B (ja)
WO (1) WO2009008448A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010131575A1 (ja) * 2009-05-13 2010-11-18 日立化成工業株式会社 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
JP2010278324A (ja) * 2009-05-29 2010-12-09 Hitachi Chem Co Ltd 接着剤組成物、接着シート及び半導体装置
JP2012007007A (ja) * 2010-06-22 2012-01-12 Shin-Etsu Chemical Co Ltd ダイボンド剤組成物及び半導体装置。
JP2012520387A (ja) * 2009-03-16 2012-09-06 ロックタイト （アール アンド ディー） リミテッド 基体へのエラストマーの接合
CN103740309A (zh) * 2013-12-10 2014-04-23 江苏瑞德新能源科技有限公司 一种可修复导电胶及其制备方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011102404A (ja) * 2011-02-17 2011-05-26 Sony Chemical & Information Device Corp 異方性導電フィルム
CN102408679B (zh) * 2011-08-29 2012-12-26 天威新能源控股有限公司 一种环氧树脂复合材料
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US20150371916A1 (en) * 2014-06-23 2015-12-24 Rohm And Haas Electronic Materials Llc Pre-applied underfill
CN104952702B (zh) * 2015-05-15 2017-11-28 张家港康得新光电材料有限公司 半导体器件及其制作方法
JP2025024833A (ja) * 2023-08-08 2025-02-21 株式会社レゾナック 接着剤フィルム、金属層付き接着剤フィルム、配線形成用部材、配線層の形成方法、及び、配線形成部材

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0741544A (ja) * 1993-08-02 1995-02-10 Tokuyama Corp エポキシ樹脂組成物及び光半導体装置
WO2006132165A1 (ja) * 2005-06-06 2006-12-14 Toray Industries, Inc. 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6645632B2 (en) * 2000-03-15 2003-11-11 Shin-Etsu Chemical Co., Ltd. Film-type adhesive for electronic components, and electronic components bonded therewith
JP4240460B2 (ja) * 2003-03-06 2009-03-18 ソニーケミカル＆インフォメーションデバイス株式会社 接着剤、接着剤の製造方法及び電気装置
JP4171898B2 (ja) * 2003-04-25 2008-10-29 信越化学工業株式会社 ダイシング・ダイボンド用接着テープ
JP4235808B2 (ja) * 2003-09-19 2009-03-11 信越化学工業株式会社 接着剤組成物及び接着フィルム
JP4810911B2 (ja) * 2005-07-26 2011-11-09 パナソニック電工株式会社 エポキシ樹脂組成物、エポキシ樹脂フィルム、光導波路、光・電気混載配線基板並びに電子デバイス
WO2007034775A1 (ja) * 2005-09-22 2007-03-29 Tomoegawa Co., Ltd. 粘土薄膜基板、電極付き粘土薄膜基板、及びそれらを用いた表示素子

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0741544A (ja) * 1993-08-02 1995-02-10 Tokuyama Corp エポキシ樹脂組成物及び光半導体装置
WO2006132165A1 (ja) * 2005-06-06 2006-12-14 Toray Industries, Inc. 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012520387A (ja) * 2009-03-16 2012-09-06 ロックタイト （アール アンド ディー） リミテッド 基体へのエラストマーの接合
WO2010131575A1 (ja) * 2009-05-13 2010-11-18 日立化成工業株式会社 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
JP2010285602A (ja) * 2009-05-13 2010-12-24 Hitachi Chem Co Ltd 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
JP2011157552A (ja) * 2009-05-13 2011-08-18 Hitachi Chem Co Ltd 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
JP2010278324A (ja) * 2009-05-29 2010-12-09 Hitachi Chem Co Ltd 接着剤組成物、接着シート及び半導体装置
JP2012007007A (ja) * 2010-06-22 2012-01-12 Shin-Etsu Chemical Co Ltd ダイボンド剤組成物及び半導体装置。
CN103740309A (zh) * 2013-12-10 2014-04-23 江苏瑞德新能源科技有限公司 一种可修复导电胶及其制备方法
CN103740309B (zh) * 2013-12-10 2015-01-21 江苏瑞德新能源科技有限公司 一种可修复导电胶及其制备方法

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