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WO2009008106A1 - 受光装置および受光装置の製造方法 - Google Patents

受光装置および受光装置の製造方法 Download PDF

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Publication number
WO2009008106A1
WO2009008106A1 PCT/JP2008/000260 JP2008000260W WO2009008106A1 WO 2009008106 A1 WO2009008106 A1 WO 2009008106A1 JP 2008000260 W JP2008000260 W JP 2008000260W WO 2009008106 A1 WO2009008106 A1 WO 2009008106A1
Authority
WO
WIPO (PCT)
Prior art keywords
light receiving
receiving device
support substrate
substrate
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/000260
Other languages
English (en)
French (fr)
Inventor
Toyosei Takahashi
Rie Takayama
Mitsuo Sugino
Masakazu Kawata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to EP08710414A priority Critical patent/EP2169723A4/en
Priority to US12/668,341 priority patent/US8034651B2/en
Priority to CN2008800244761A priority patent/CN101743638B/zh
Priority to KR1020107001432A priority patent/KR101109853B1/ko
Publication of WO2009008106A1 publication Critical patent/WO2009008106A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Optical Head (AREA)

Abstract

　受光装置１は、受光部１１１およびこの受光部１１１が設けられたベース基板１１２を備える受光素子１１が設けられた支持基板１２と、支持基板１２の受光素子１１の設けられた面に対向して配置される透明基板１３とを備える。支持基板１２と透明基板１３との間には、受光素子１１を囲むように枠部１４が設けられている。この枠部１４は、光硬化性の接着剤であり、透明基板１３と支持基板１２とに直接接着している。これにより、所望の性能を有する受光装置、および受光装置の製造方法を提供できる。
PCT/JP2008/000260 2007-07-12 2008-02-19 受光装置および受光装置の製造方法 Ceased WO2009008106A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08710414A EP2169723A4 (en) 2007-07-12 2008-02-19 Light receiving arrangement and method for producing a light receiving arrangement
US12/668,341 US8034651B2 (en) 2007-07-12 2008-02-19 Light receiving device and method of manufacturing light receiving device
CN2008800244761A CN101743638B (zh) 2007-07-12 2008-02-19 光接收装置及光接收装置的制造方法
KR1020107001432A KR101109853B1 (ko) 2007-07-12 2008-02-19 수광 장치 및 수광 장치의 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007182703A JP4091969B1 (ja) 2007-07-12 2007-07-12 受光装置および受光装置の製造方法
JP2007-182703 2007-07-12

Publications (1)

Publication Number Publication Date
WO2009008106A1 true WO2009008106A1 (ja) 2009-01-15

Family

ID=39509568

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000260 Ceased WO2009008106A1 (ja) 2007-07-12 2008-02-19 受光装置および受光装置の製造方法

Country Status (8)

Country Link
US (1) US8034651B2 (ja)
EP (1) EP2169723A4 (ja)
JP (1) JP4091969B1 (ja)
KR (1) KR101109853B1 (ja)
CN (1) CN101743638B (ja)
MY (1) MY143916A (ja)
TW (1) TW200903788A (ja)
WO (1) WO2009008106A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171239A (ja) * 2009-01-23 2010-08-05 Kyocera Kinseki Corp 電子デバイス及び電子デバイスの製造方法
WO2011034025A1 (ja) * 2009-09-16 2011-03-24 住友ベークライト株式会社 スペーサ形成用フィルム、半導体ウエハー接合体の製造方法、半導体ウエハー接合体および半導体装置
WO2023062195A1 (en) 2021-10-15 2023-04-20 Kettlitz B.V. Brick slip wall cladding system

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009302221A (ja) * 2008-06-12 2009-12-24 Nec Electronics Corp 電子装置及びその製造方法
SG188261A1 (en) * 2010-09-02 2013-04-30 Sumitomo Bakelite Co Fixing resin composition for use in rotor
JP6690157B2 (ja) * 2014-11-27 2020-04-28 ソニー株式会社 カメラモジュール、およびカメラモジュールの製造方法、撮像装置、並びに電子機器
EP4033621B1 (en) 2019-09-20 2023-11-01 Nichia Corporation Light source device and method of manufacturing the same
JP7405031B2 (ja) * 2020-07-16 2023-12-26 日本電気硝子株式会社 電子装置及び電子装置の製造方法
WO2023033090A1 (ja) * 2021-08-31 2023-03-09 日東電工株式会社 半導体素子パッケージの製造方法及び半導体素子パッケージ

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02225580A (ja) * 1988-11-16 1990-09-07 Ricoh Co Ltd 等倍光センサーの保護ガラス板用接着剤
JPH10144898A (ja) * 1996-11-15 1998-05-29 Sony Corp 固体撮像装置
JP2002076313A (ja) * 2000-08-28 2002-03-15 Canon Inc 固体撮像装置
JP2004296453A (ja) 2003-02-06 2004-10-21 Sharp Corp 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法
JP2006005025A (ja) * 2004-06-15 2006-01-05 Sharp Corp 蓋部を備えた半導体ウェハの製造方法及び半導体装置の製造方法
JP2006303482A (ja) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd 固体撮像装置の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3772702B2 (ja) * 2001-07-23 2006-05-10 松下電器産業株式会社 弾性表面波装置の製造方法
JP3754378B2 (ja) * 2002-02-14 2006-03-08 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
JP4265734B2 (ja) * 2002-07-08 2009-05-20 富士フイルム株式会社 反射防止膜、反射防止フィルムおよび画像表示装置
US20040038442A1 (en) * 2002-08-26 2004-02-26 Kinsman Larry D. Optically interactive device packages and methods of assembly
JP4015668B2 (ja) * 2004-05-31 2007-11-28 住友ベークライト株式会社 樹脂組成物、半導体パッケージ、接着フィルムおよび樹脂ワニス
JP4148932B2 (ja) 2004-08-31 2008-09-10 シャープ株式会社 半導体装置、半導体モジュール及び半導体装置の製造方法
EP1861880B1 (en) 2005-03-25 2012-06-20 FUJIFILM Corporation Method of manufacturing solid state imaging device
CN101604124B (zh) * 2005-06-08 2011-07-27 佳能株式会社 模子、图案形成方法以及图案形成设备
KR101024157B1 (ko) * 2006-06-07 2011-03-22 스미토모 베이클리트 컴퍼니 리미티드 수광 장치의 제조 방법
JP2008022001A (ja) * 2007-07-09 2008-01-31 Sumitomo Bakelite Co Ltd 受光装置および受光装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02225580A (ja) * 1988-11-16 1990-09-07 Ricoh Co Ltd 等倍光センサーの保護ガラス板用接着剤
JPH10144898A (ja) * 1996-11-15 1998-05-29 Sony Corp 固体撮像装置
JP2002076313A (ja) * 2000-08-28 2002-03-15 Canon Inc 固体撮像装置
JP2004296453A (ja) 2003-02-06 2004-10-21 Sharp Corp 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法
JP2006005025A (ja) * 2004-06-15 2006-01-05 Sharp Corp 蓋部を備えた半導体ウェハの製造方法及び半導体装置の製造方法
JP2006303482A (ja) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd 固体撮像装置の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2169723A4

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171239A (ja) * 2009-01-23 2010-08-05 Kyocera Kinseki Corp 電子デバイス及び電子デバイスの製造方法
WO2011034025A1 (ja) * 2009-09-16 2011-03-24 住友ベークライト株式会社 スペーサ形成用フィルム、半導体ウエハー接合体の製造方法、半導体ウエハー接合体および半導体装置
WO2023062195A1 (en) 2021-10-15 2023-04-20 Kettlitz B.V. Brick slip wall cladding system

Also Published As

Publication number Publication date
EP2169723A1 (en) 2010-03-31
CN101743638B (zh) 2012-11-14
MY143916A (en) 2011-07-29
JP4091969B1 (ja) 2008-05-28
US8034651B2 (en) 2011-10-11
TW200903788A (en) 2009-01-16
JP2009021381A (ja) 2009-01-29
US20100258713A1 (en) 2010-10-14
EP2169723A4 (en) 2013-03-13
KR20100031753A (ko) 2010-03-24
CN101743638A (zh) 2010-06-16
KR101109853B1 (ko) 2012-02-17

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