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WO2009003130A2 - Scellement hermétique basse température sans joint avec brasure tendre - Google Patents

Scellement hermétique basse température sans joint avec brasure tendre Download PDF

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Publication number
WO2009003130A2
WO2009003130A2 PCT/US2008/068410 US2008068410W WO2009003130A2 WO 2009003130 A2 WO2009003130 A2 WO 2009003130A2 US 2008068410 W US2008068410 W US 2008068410W WO 2009003130 A2 WO2009003130 A2 WO 2009003130A2
Authority
WO
WIPO (PCT)
Prior art keywords
rcm
preform
adjacent surfaces
sealing
fusible material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2008/068410
Other languages
English (en)
Other versions
WO2009003130A3 (fr
Inventor
Yuwei Xun
David Van Heerden
Maureen A. Curran
Timothy P. Weihs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Reactive Nanotechnologies Inc
Original Assignee
Reactive Nanotechnologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Reactive Nanotechnologies Inc filed Critical Reactive Nanotechnologies Inc
Priority to US12/666,000 priority Critical patent/US20110024416A1/en
Publication of WO2009003130A2 publication Critical patent/WO2009003130A2/fr
Publication of WO2009003130A3 publication Critical patent/WO2009003130A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Definitions

  • This invention is related generally to the sealing of containers or interfaces, and in particular to a seal assembly and method for forming hermetic seals using solder by heating only the sealing surfaces.
  • Many microelectronic devices such as photocells, capacitors, sensors, MEMS, aerospace electronics, and medical instruments require protection from air and moisture to prevent corrosion and degradation. These sensitive components are typically placed in a package and sealed by attaching a lid to the package. Such a seal is called a hermetic seal if the helium leak rate across the seal is less than 10 "8 atm-cc/s.
  • Reactive multilayer joining is a relatively new joining technique that is based on sandwiching a reactive composite material (RCM) such as a reactive multilayer foil between two layers of a fusible material and the two components to be joined, and then igniting the foil.
  • RCM reactive composite material
  • a self-propagating reaction is thus initiated in the reactive multilayer foil which results in a rapid rise in the reactive multilayer foil temperature.
  • the heat released by the reaction melts the fusible-material layers, and upon cooling, bonds the two components.
  • Reactive multilayer joining has been previously used for sealing a deformable gasket or member separate from the solder and RCM preform, as described in US Patent Nos. 7,121 ,402 and 7,143,568, incorporated herein by reference.
  • the gasket or separate member is an extra component, requiring adaptation of the sealing surfaces and alignment. Accordingly, it would be advantageous to provide a method for forming a seal or sealing a container utilizing a reactive composite material, such as a reactive multilayer foil, to heat the sealing surfaces and which does not require a separate gasket component.
  • a method of the present invention provides a sealing process for containers or interfaces having two surfaces to be joined and a region to be sealed. Initially, a thin strip or wire of reactive composite material surrounded with a fusible material is disposed between the surfaces to be sealed, extending at least peripherally around the region to be sealed. A pressure is applied to the reactive composite material within the fusible material, and the reactive composite material ignited. The heat generated by the ignition of the reactive composite material fuses the fusible material to the adjacent surfaces, which then cools to form a hermetic seal without the use of a separate gasket component.
  • Figure 1 is a schematic representation of reactive multilayer joining
  • Figure 2 is a side view of a seal formed by the process of Fig. 1 wherein cracks in the RCM may be filled or unfilled;
  • Figure 3 is a plan view of the seal of Fig. 2;
  • Figure 4A illustrates the RCM and sheet solder arrangement for assembly in a sealing preform
  • Figure 4B shows the components of Fig. 4A assembled to form the sealing preform
  • Figures 5A and 5B illustrate the formation of a sealing preform
  • Figure 6A shows two components and a sealing preform before reaction
  • Figure 6B shows the two components of Fig. 6A sealed with a sealing preform after reaction;
  • Figure 7 illustrates exemplary cross-section profiles for an RCM;
  • Figure 8 illustrates exemplary cross-section profiles of a sealing preform comprising an RCM with surrounding solder;
  • Figure 9 illustrates a container and lid with a sealing preform that does not have an opening in it;
  • Figure 10 illustrates a sealing preform with multiple loops of RCM;
  • Figure 11 illustrates an alternate configuration for the sealing preform of Fig. 10
  • Figure 12 is a sectional view of a sealing preform in which the solder sheets have grooves to accommodate the RCM strips;
  • Figure 13 is a sectional view of a sealing preform in which the RCM strips are interspersed with wires comprising solder or another material;
  • Figures 14A and 14B illustrate a semi-continuous sealing preform ribbon
  • Figure 15 shows a sealing preform and sealing surface design adapted to prevent shear forces on the seal.
  • FIGS 1 through 3 illustrate this prior art joining process schematically.
  • These techniques utilize a sheet of RCM 102 which is as wide as, or slightly wider than, the solder sheets 101 and the sealing surfaces 1101 of the components 1104A and 1104B to be joined.
  • the sheet 102 is placed between the sealing surfaces 1101 A and 1101 B of the components 1104, together with solder sheets 101a and 101 b.
  • the solder 101 may be applied directly to the sealing surfaces in a prior step.
  • Pressure 1103 is then applied to hold the components 1104A and 1104B against the solder 101 and the RCM 102 while a momentary ignition source, represented by match 1102, is used to ignite the self-propagating reaction in the RCM 102 that generates sufficient heat to melt the solder layers 101.
  • a momentary ignition source represented by match 1102
  • the solder adheres to the RCM 102 and to the sealing surfaces 1101 , joining the components 1104. Joining without a gasket is a highly effective joining method, however, such joining does not form a hermetic seal.
  • the RCM 102 changes phase from layers of elements to a monolithic intermetallic compound. This process results in a shrinkage of the RCM 102, leading to cracking, as shown in Figures 2 and 3. If the cracks form while the solder is molten, such as crack 1105, they usually fill with molten solder, creating in essence a composite material with brittle intermetallic islands in a metallic solder matrix.
  • FIG. 4A and 4B a sealing method and assembly of the present disclosure is shown which avoids the presence of leaks in a resulting seal caused by the formation of cracks spanning the entire width of a sealing surface.
  • the sealing method and assembly of the present disclosure ensures that solder 101 surrounds the RCM 102 entirely, ultimately sealing around any resulting cracks which form in the RCM 102 during the exothermic reaction.
  • the RCM 102 does not extend to the boundaries of the joining surfaces, but is instead disposed as a narrow strip within the boundaries of the adjacent solder material 101.
  • the RCM strip reacts, it melts the solder around it, forming a seal without necessarily filling all of the cracks that might form in the RCM.
  • the RCM 102 does not extend to the peripheral boundaries of the joining surfaces, any cracks formed therein similarly do not extend to the peripheral boundaries, and therefore do not result in leaks across the seal.
  • a flat strip of RCM 102 is folded to form a gasket shape 103, conforming to the shape of the sealing surfaces, e.g. a rectangle if the container opening is rectangular.
  • the folded RCM strip 103 is then sandwiched between two sheets of solder 101 as shown in Figure 4B.
  • the solder sheets are cut to the shape of the sealing surfaces, forming "window frames" which are wider than the strip of RCM 102.
  • the solder 101 and strip 102 assembly is pressed to cause the solder sheets 101 a and 101 b to adhere to the strip of RCM 102, forming a seal preform 100.
  • one end 104 of the RCM strip 102 is left to extend beyond the peripheral boundary of the solder 101 to provide an easy ignition point for igniting the RCM 102.
  • Figures 5A and 5B illustrate the preform 100 cross-section before ( Figure 5A) and after pressing (Figure 5B) of the solder 101 and RCM 102 together.
  • the strip of RCM 102 is shown between solder sheets 101 before (Fig. 5A) and after (Fig. 5B) the application of pressure as at 105.
  • the upper and lower solder sheets 101 A and 101 B deform around the RCM 102 and can no longer be individually distinguished.
  • a seal of the present disclosure is formed as shown in Figure 6A, with the pressed preform 100, comprising solder 101 and the embedded RCM strip 102 placed between the surfaces 201a and 201 b of the two bodies 202a and 202b to be sealed together, e.g. the lid and the wall of a container.
  • Pressure as indicated by 203, is subsequently applied to hold the two surfaces 201 a and 201 b against the preform 100 while the RCM 102 is ignited, such as at the extending tab 104.
  • the RCM 102 reacts, generating heat sufficient to melt the solder 101 completely above and below the RCM 102.
  • the solder 101 laterally adjacent to the RCM 102 also melts for some distance from the RCM 102.
  • This distance may vary depending on the composition of the solder 101 and RCM 102, as well as the relative dimensions thereof, but is typically on the order of 150 micrometers.
  • This molten solder 101 adheres to the two sealing surfaces 201a and 201 b, fusing them together as the molten solder cools.
  • the molten solder also flows together around the ignited RCM 201 , creating a continuous layer of solder between the two sealing surfaces 201a and 201 b.
  • Figure 6B shows a cross-section of the resulting seal after the RCM reaction has completed and the solder 101 has melted within the region marked by curved lines 204, adhering to surfaces 201 a and 201 b.
  • the two bodies 202a and 202b are shown slightly closer together than they were prior to sealing, due to shrinkage of the RCM and to a flow of the molten solder within the sealing region.
  • the sealing process of the present disclosure may be utilized with a wide variety of materials and to seal a wide variety of surfaces together.
  • a Pd-Al reactive multilayer foil 35 ⁇ m thick and 0.5mm wide was folded into a 1 inch by 1 inch square shape as shown in Figures 4A-5B. This shape was cold- pressed between two tin-silver-copper (SAC305) solder sheets 25 ⁇ m thick to form a sealing preform 100 approximately 2.5mm wide and 70 ⁇ m thick.
  • the preform 100 was positioned between two gold-plated (copper-nickel- gold) stainless steel blocks, placed under pressure, and ignited. The resulting seal was found to have a leak rate of 10 ⁇ 9 atm-cc/s.
  • the sealing preform may be used to form a joint that does not seal; that is, which does not serve to isolate a space from the outside environment.
  • the RCM 102 which is utilized in combination with the solder 101 may be round or oval in profile, or any convenient shape. It may be a wire or a flattened wire. It may be cut from a sheet or made by any conventional means such as described in US Patent No. 6,534,194 or in US Patent Application Publication No. 2004-0247931 A1. Some exemplary profiles for the RCM 102 are shown in Figure 7. Dimensions of the strip or wire are preferably between 30 to 100 ⁇ m thick and between 0.25 to 2mm wide, but are optimally close to 30 ⁇ m thick by 0.5mm wide. The assembled preform 100 may be between 40 to 1000 ⁇ m thick but is preferably less than about 100 ⁇ m.
  • the width affects ease of handling, since a very narrow preform is fragile and difficult to manipulate.
  • the thickness depends on the energy in the RCM 102 and the amount of energy needed to melt the surrounding solder 101 , but a thinner preform results in a thinner bond line between the adjoining surfaces 201 a and 201 b, which is usually advantageous and less expensive.
  • the solder 101 may be directly wrapped or formed around the RCM strip or wire 102 rather than comprising two separate sheets.
  • the window frame may be formed by any convenient method or, as shown in Figure 9, the solder 101 may extend beyond the sealing surfaces, covering or partially covering the mouth of the container 502.
  • the RCM strip 102 may be circumferentially looped multiple times as a continuous path within the preform 100 as shown in Figure 10, or the preform 100 may include multiple interconnected strips of RCM 102 as shown at Figure 11. In these figures, one solder sheet 101 is shown below the RCM strip(s) 102. If multiple strips of RCM 102 are used in one preform, as shown in Figure 11 , a means of igniting all the strips is needed.
  • One method of igniting all the strips uses small bridging strips of RCM 601 , which pass between different sealing strips 102 to allow one sealing strip to ignite the next.
  • these bridge strips 601 are spaced apart, for example as shown in Figure 11 , to reduce the chance of a crack or gap forming in the solder around them and extending across the sealing area.
  • the reactive composite material 102 may by ignited by any suitable means, and is not limited to direct ignition at a single point.
  • the exothermic reaction within the RCM 102 may be initiated by induction heating.
  • induction heating For procedures in which induction heating is used, individual strips of the RCM 102 need not be touching as in Figure 11 , because the individual strips need not ignite each other. This may make assembly easier because straight disconnected strips may be used, rather than overlapping strips at corners or strips cut to shape.
  • grooves 701 may optionally formed in the solder 101 to accommodate the strips or wires 102 during the pressing phase.
  • solder wires or strips 801 may additionally be interspersed with the RCM strips 102, as shown in Figure 13 between the solder layers 101 a and 101 b.
  • These filler wires or strips 801 may serve several purposes. They may make it easier to seal the solder around the RCM during pressing since the solder sheets 101 would not have to deform as much, thus maintaining flatness as well as providing for better thermal contact between the sides of the RCM 102 and the solder 101 during the reaction.
  • the wires or strips 801 may comprise a material other than solder, wherein they may provide additional thermal conduction or strength or otherwise modify the material properties of the resulting preform
  • Figure 14A shows an optional way to incorporate multiple strips of RCM 102 in a continuous ribbon preform that can then be cut to length and folded to shape. Strips of RCM 102 are laid out in parallel between wider strips of solder 101. The assembly is rolled or pressed in a continuous fashion to make a continuous ribbon preform 100.
  • Figure 14B shows an example of how this continuous ribbon may be folded to form part of a window frame shape. Dimensions are preferably between 5mm to 100mm wide, but would typically be less than 10mm wide. The ribbon could be manufactured very wide then slit to the desired width before use.
  • Figure 15 shows one possible container 1001 a and lid 1001 b design that reduces shear stress on the sealed region during service.
  • Material properties of the solder 101 and the RCM 102 utilized in the preform assembly 100 may be selected for a particular application. For example, higher melting point brazes may be used instead of the solder
  • a very ductile, low-melting solder 101 such as pure indium, which melts at 157°C and has a tensile strength of about 4MPa, may be desirable to provide a compliant seal.
  • the chemistry of the RCM 102 and the layer or reactant region spacing within the RCM 102 may be selected to control the amount of heat produced, the rate at which it is produced, and the maximum temperature reached during the reaction. These variables control how much solder 101 melts, how much the solder 101 is superheated, and whether the reaction is self-propagating or is quenched instead of reacting completely.
  • the effects of chemistry, microstructure, and thermal properties of the RCM 102 and the thermal properties of the materials surrounding the RCM 102 have been discussed in above-referenced published patent applications.
  • Process control parameters for the sealing process include the RCM reaction properties, cross-section shape, and strip spacing, as well as solder properties and thickness.
  • the thermal properties and surface condition of the two surfaces to be sealed are also important parameters.
  • the surface condition of the sealing surfaces should be smooth and clean.
  • Gold plating is often necessary to ensure good adhesion of the solder within the molten time period.
  • the surfaces may be plated with tin or lead-tin alloy to a thickness that may be at least 0.0001 " (2.5 micrometers) up to 0.001 " (25 micrometers) or more.
  • an RCM-solder composite ribbon according to the present disclosure was made by cold pressing three RCM strips 102 between sheets of solder 101.
  • the RCM used was a cold-rolled aluminum- palladium composite with stoichiometry 1 :1 , 0.5mm wide, 35 ⁇ m thick, and 8.7 passes (a measure of amount of deformation and microstructural refinement).
  • the sheet solder was SAC305, 0.003" (152 ⁇ m) thick.
  • the RCM strips were spaced 0.048" (1.2mm) apart.
  • a pressure of 72,000 psi (500MPa) was applied for 5 minutes to form a well-bonded preform.
  • the RCM used was a cold-rolled aluminum-palladium composite with stoichiometry 1 :1.
  • the RCM was 0.5mm wide, 35 ⁇ m thick, and 8.7 passes (a measure of amount of deformation and microstructural refinement).
  • the RCM strip was bent into a square shape and then cold pressed between two sheets of SAC305 solder each 0.001" (25 ⁇ m) thick. After pressing, excess solder was cut away to form a window frame shape with 0.1 " (2.5 mm) wide walls, similar to Figure 4A.
  • the window frame was positioned between two blocks of material (gold-coated brass or gold-coated stainless steel), a load was applied, and the end of the RCM that extended out of the bond was ignited to form the seal.
  • the leak rate was tested using a helium leak detector attached to a hole in one of the two blocks. Both configurations produced leak rates lower than 10 ⁇ 8 atm-cc/s.
  • the present disclosure provides a seal comprising at least two components with adjacent surfaces, defining an inside and an outside of a container; at least one strip of reacted RCM between the adjacent surfaces of the two components; and a fusible material substantially surrounding the at least one strip of reacted RCM, adhered to the at least one strip of reacted RCM and the adjacent surfaces of the at least two components.
  • the resulting seal has an helium leak rate across the joint is less than 10 ⁇ 8 atm-cc/s.
  • the present disclosure provides a sealed container with a seal formed by at least one strip of reacted RCM between adjacent container surfaces; and a fusible material substantially surrounding the at least one strip of reacted RCM, adhered to the at least one strip of reacted RCM and the adjacent surfaces of the container.
  • the present disclosure provides an object sealed within a container with a seal formed by at least one strip of reacted RCM between adjacent container surfaces; and a fusible material substantially surrounding the at least one strip of reacted RCM, adhered to the at least one strip of reacted RCM and the adjacent surfaces of the container.
  • the present invention provides a process for joining two surfaces comprising providing, between the two surfaces, a thin strip or wire of RCM fully surrounded with a fusible material; applying pressure; and igniting the RCM to melt at least some of the fusible material, wherein the fusible material adheres to the two surfaces, joining them.
  • the present invention provides a method for fusing a connection between two surfaces by providing, between the two surfaces, a thin strip or wire of RCM fully surrounded with a fusible material; applying pressure; and igniting the RCM to melt at least some of the fusible material, wherein the fusible material adheres to the two surfaces, joining them.
  • the present disclosure further provides a joint bonding two components with adjacent surfaces, comprising at least one strip of reacted RCM between the adjacent surfaces of the two components; and a fusible material substantially surrounding the at least one strip of reacted RCM, adhered to the at least one strip of reacted RCM and the adjacent surfaces of the at least two components.
  • the present disclosure comprises the steps of providing at least two components of the container, defining an inside and an outside of the container; providing between the two components at least one thin strip or wire of RCM surrounded with a fusible material; and chemically transforming the at least one strip or wire of RCM so as to melt at least a portion of the fusible material so as to join the at least two components.
  • the present disclosure further encompasses the resulting sealed container, and a resulting sealed container containing an object within a hermetically sealed environment.
  • the present disclosure provides a preform consisting of one or more strips of RCM surrounded by fusible material, wherein the strip is bent or folded so as to lie continuously along a surface to be joined.
  • the preform may have a long dimension cross-section of the strip of RCM between 0.25 and 2mm wide, and a short dimension of the cross-section of the strip of RCM between 30 ⁇ m and 100 ⁇ m wide.
  • the fusible material may optionally contain at least one groove to accommodate the strips of RCM, and strips of the fusible material may be interspersed with the strips of RCM. Alternatively, strips of another metal may optionally be interspersed with the strips of RCM.
  • the overall width of the preform may be within a range between 0.5 and 100mm, but is preferably within a range of between 0.5 and 6mm.
  • the overall thickness of the preform is may be within a range between 40 ⁇ m and 1000 ⁇ m.
  • the present disclosure further provides for seals made using the sealing preform, containers sealed with the sealing preform, and containers holding objects within a hermetically sealed environment sealed by the sealing preform.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Gasket Seals (AREA)
  • Sealing Material Composition (AREA)

Abstract

L'invention concerne des contenants ou des interfaces présentant deux surfaces 201a et 201b devant être jointes, et une zone devant être scellée, qui sont fusionnés en disposant entre les surfaces 201a et 201b une bande fine ou un fil de matériau composite réactif 102 incorporé dans un matériau fusible 101, en appliquant une pression 205 et en allumant le matériau composite réactif 102. L'énergie libérée par le matériau composite réactif 102 allumé provoque une fusion du matériau fusible 101 et, lors du refroidissement, une liaison du matériau fusible 101 sur les surfaces environnantes 201a et 201b, ce qui aboutit à un scellement hermétique entre les deux sans l'utilisation d'un composant de joint séparé.
PCT/US2008/068410 2007-06-26 2008-06-26 Scellement hermétique basse température sans joint avec brasure tendre Ceased WO2009003130A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/666,000 US20110024416A1 (en) 2007-06-26 2008-06-26 Gasketless low temperature hermetic sealing with solder

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US94630907P 2007-06-26 2007-06-26
US60/946,309 2007-06-26

Publications (2)

Publication Number Publication Date
WO2009003130A2 true WO2009003130A2 (fr) 2008-12-31
WO2009003130A3 WO2009003130A3 (fr) 2009-04-02

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PCT/US2008/068410 Ceased WO2009003130A2 (fr) 2007-06-26 2008-06-26 Scellement hermétique basse température sans joint avec brasure tendre

Country Status (2)

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US (1) US20110024416A1 (fr)
WO (1) WO2009003130A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
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JP2013514777A (ja) * 2009-12-16 2013-05-02 ダウ アグロサイエンシィズ エルエルシー 抵抗性昆虫の管理のためのＶｉｐ３ＡｂとＣｒｙ１Ｃａの併用
DE102014102717A1 (de) * 2014-02-28 2015-09-03 Endress + Hauser Gmbh + Co. Kg Bauteilanordnung mit mindestens zwei Bauteilen und Verfahren zum Herstellen einer Bauteilanordnung

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WO2014095596A1 (fr) * 2012-12-18 2014-06-26 Ceramtec Gmbh Procédé de dépôt préalable d'une brasure sur des surfaces métalliques sur des substrats métallisés au moyen d'un tissu métallique ; substrat métallisé pourvu d'une couche de brasure, laquelle présente une structure superficielle d'un tissu
US9056443B2 (en) * 2013-02-04 2015-06-16 General Electric Company Brazing process, braze arrangement, and brazed article
PL237370B1 (pl) * 2016-04-28 2021-04-06 Frydrychewicz Artur Af Praktyka Stomatologiczna Implanty bioniczne i sposoby ich wytwarzania
DE102016115364A1 (de) * 2016-08-18 2018-02-22 Few Fahrzeugelektrik Werk Gmbh & Co. Kg Verfahren zur Ausbildung einer stoffschlüssigen Fügeverbindung
CN111591585B (zh) * 2020-06-15 2024-04-19 杭州纬昌新材料有限公司 环形瓶口电磁感应加热封口垫及制作方法
CN113894460B (zh) * 2021-04-19 2023-04-18 江苏博睿光电股份有限公司 自蔓延钎焊薄膜及其制备方法

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US5641713A (en) * 1995-03-23 1997-06-24 Texas Instruments Incorporated Process for forming a room temperature seal between a base cavity and a lid using an organic sealant and a metal seal ring
US6736942B2 (en) * 2000-05-02 2004-05-18 Johns Hopkins University Freestanding reactive multilayer foils
US7121402B2 (en) * 2003-04-09 2006-10-17 Reactive Nano Technologies, Inc Container hermetically sealed with crushable material and reactive multilayer material
US20060220223A1 (en) * 2005-03-29 2006-10-05 Daoqiang Lu Reactive nano-layer material for MEMS packaging
US7354659B2 (en) * 2005-03-30 2008-04-08 Reactive Nanotechnologies, Inc. Method for fabricating large dimension bonds using reactive multilayer joining

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013514777A (ja) * 2009-12-16 2013-05-02 ダウ アグロサイエンシィズ エルエルシー 抵抗性昆虫の管理のためのＶｉｐ３ＡｂとＣｒｙ１Ｃａの併用
DE102014102717A1 (de) * 2014-02-28 2015-09-03 Endress + Hauser Gmbh + Co. Kg Bauteilanordnung mit mindestens zwei Bauteilen und Verfahren zum Herstellen einer Bauteilanordnung
US10551262B2 (en) 2014-02-28 2020-02-04 Endress+Hauser Se+Co.Kg Component arrangement with at least two components and method for producing a component arrangement
DE102014102717B4 (de) 2014-02-28 2022-10-06 Endress+Hauser SE+Co. KG Bauteilanordnung mit mindestens zwei Bauteilen und Verfahren zum Herstellen einer Bauteilanordnung

Also Published As

Publication number Publication date
WO2009003130A3 (fr) 2009-04-02
US20110024416A1 (en) 2011-02-03

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