WO2009002035A2

WO2009002035A2 - Method of manufacturing film carrier tape

Info

Publication number: WO2009002035A2
Application number: PCT/KR2008/003425
Authority: WO
Inventors: Dong-Eun Son
Original assignee: Stemco Co Ltd
Current assignee: Stemco Co Ltd
Priority date: 2007-06-22
Filing date: 2008-06-17
Publication date: 2008-12-31
Anticipated expiration: 2009-12-22
Also published as: JP2010531057A; WO2009002035A3; KR100818328B1

Abstract

Provided is a method of manufacturing film carrier tapes. The method includes: providing a base film which is divided into a film carrier tape formation region and a first sprocket hole formation region and which includes an insulating film and a conductive layer stacked on the insulating film; forming first sprocket holes in the first sprocket hole formation region; forming conductive patterns by patterning the conductive layer in the film carrier tape formation region; and forming second sprocket holes in the film carrier tape formation region.

Description

Description METHOD OF MANUFACTURING FILM CARRIER TAPE

Technical Field

[1] The present invention relates to a method of manufacturing film carrier tapes.

Background Art

[2] Unlike cathode ray tube (CRT) displays, flat panel displays (FPDs), such as liquid crystal displays (LCDs), plasma display panels (PDPs) and light emitting diodes (LEDs), can be made thinner and lighter. As FPDs become lighter and thinner, display parts for the FPDs have been required to become lighter and thinner. Therefore, semiconductor parts used in the display parts are provided as a package in order to make the FPDs lighter and thinner.

[3] A conventional semiconductor package is to form terminals for inputting/outputting signals to/from a main board by using a lead frame or a printed circuit board (PCB), and to be molded by using an encapsulating means in order to protect a semiconductor chip such as a single device or an integrated circuit, which includes a stack of various electronic circuits and wires, from various external environments (e.g., dust, moisture and electrical and mechanical load) and optimize and maximize the electrical performance of the semiconductor chip.

[4] Semiconductor packages are becoming lighter, thinner, shorter and smaller as the integration technology of semiconductor chips advances and electronic devices become smaller. Accordingly, there are greater demands for tape carrier packages (TCPs) using tapes, which contribute to a reduction in weight and thickness, than for conventional semiconductor packages.

[5] A TCP includes a greater number of signal input/output terminals in a limited, narrow area and have less restriction in the shape or position of package by thin flexible tape compared with a conventional semiconductor package. Thus, a TCP which can be made smaller and more highly integrated and include a greater number of pins represents a next-generation semiconductor packaging technology. Examples of the TCP include a tape automated bonding (TAB), a chip on film (COF), and a flexible ball grid array (BGA).

[6] A film carrier tape used in a TCP is transported in a reel-to-reel manner. Therefore, the film carrier tape includes sprocket holes into which pins of a pin roller fit, respectively. However, the sprocket holes may cause over exposure or the generation of foreign matter during a series of manufacturing processes of the film carrier tape, such as the processes of coating, exposing, and developing photoresist. That is, the sprocket holes may undermine the stability of the manufacturing processes of the film carrier tape.

Disclosure of Invention

Technical Problem

[7] Aspects of the present invention provide a method of manufacturing film carrier tapes in a more stable manner.

[8] However, aspects of the present invention are not restricted to the one set forth herein. The above and other aspects of the present invention will become more apparent to one of ordinary skill in the art to which the present invention pertains by referencing the detailed description of the present invention given below. Technical Solution

[9] According to an aspect of the present invention, there is provided a method of manufacturing film carrier tapes. The method includes: providing a base film which is divided into a film carrier tape formation region and a first sprocket hole formation region and which includes an insulating film and a conductive layer stacked on the insulating film; forming first sprocket holes in the first sprocket hole formation region; forming conductive patterns by patterning the conductive layer in the film carrier tape formation region; and forming second sprocket holes in the film carrier tape formation region.

[10] According to another aspect of the present invention, there is provided a method of manufacturing film carrier tapes. The method includes: providing a base film which is divided into a film carrier tape formation region and a first sprocket hole formation region and which includes an insulating film and a conductive layer stacked on the insulating film; forming first sprocket holes in the first sprocket hole formation region; and forming second sprocket holes in the film carrier tape formation region after the first sprocket holes are formed.

Advantageous Effects

[11] A method of manufacturing film carrier tapes according to the present invention prevents photoresist from being introduced into second sprocket holes. Therefore, the photoresist can be patterned in a more stable manner. [12] However, the effects of the present invention are not restricted to the one set forth herein. The above and other effects of the present invention will become more apparent to one of daily skill in the art to which the present invention pertains by referencing the claims.

Brief Description of the Drawings [13] FIG. 1 is a flowchart illustrating a method of manufacturing film carrier tapes according to one exemplary embodiment of the present invention; [14] FIGS. 2 through 18 are diagrams for explaining a method of manufacturing film carrier tapes according to one exemplary embodiment of the present invention;

[15] FIG. 19 is a flowchart illustrating a method of manufacturing film carrier tapes according to another exemplary embodiment of the present invention;

[16] FIGS. 20 and 21 are diagrams for explaining a method of manufacturing film carrier tapes according to another exemplary embodiment of the present invention;

[17] FIGS. 22 through 27 are diagrams for explaining a method of manufacturing film carrier tapes according to another exemplary embodiment of the present invention; and

[18] FIG. 28 is a flowchart illustrating a method of manufacturing film carrier tapes according to another exemplary embodiment of the present invention. Best Mode for Carrying Out the Invention

[19] Advantages and features of the present invention and methods of accomplishing the same may be understood more readily by reference to the following detailed description of exemplary embodiments and the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of the invention to those skilled in the art, and the present invention will only be defined by the appended claims. Like reference numerals refer to like elements throughout the specification. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

[20] It will be understood that, although the terms first, second, third, etc., may be used herein to describe various elements, components and/or sections, these elements, components and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component or section from another element, component or section. Thus, a first element, component or section discussed below could be termed a second element, component or section without departing from the teachings of the present invention.

[21] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated components, steps, operations, and/or elements, but do not preclude the presence or addition of one or more other components, steps, operations, elements, and/or groups thereof.

[22] Hereinafter, a method of manufacturing film carrier tapes according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 through 18.

[23] FIG. 1 is a flowchart illustrating a method of manufacturing film carrier tapes according to an exemplary embodiment of the present invention. FIGS. 2 through 18 are diagrams for explaining a method of manufacturing film carrier tapes according to one exemplary embodiment of the present invention. Here, each cross-sectional view has been taken along the line B-B' of a corresponding top view. For simplicity, a case where each group of four film carrier tapes is manufactured will be described below as an example. However, the present invention is not limited thereto.

[24] Referring to FIGS. 1 through 3, a base film 1 is provided (operation SlO). The base film 1 includes an insulating film 30 and a conductive layer 40 stacked on the insulating film 30.

[25] Specifically, the insulating film 30 is a thin film made of an insulating material such as a polymer material. The insulating film 30 may be, for example, a polyimide film. The conductive layer 40 may be formed by sputtering metal, such as gold, aluminum or copper, on the insulating film 30. The conductive layer 40 may be, for example, a copper layer.

[26] In the base film 1, a film carrier tape formation region 20 and a first sprocket hole formation region 10 are defined. The film carrier tape formation region 20 of the base film 1 is where a plurality of film carrier tapes are formed. The first sprocket hole formation region 10 of the base film 1 is where a plurality of first sprocket holes 50 (see FIG. 5), into which a sprocket of a roller fits when the base film 1 is transported in a manufacturing process of film carrier tapes, are formed.

[27] The base film 1, which is used to manufacture film carrier tapes and includes the insulating film 30 and the conductive layer 40 stacked on the insulating film 30, has been described above. However, the present invention is not limited thereto. For example, a reinforcing film (e.g., polyethylene terephthalate (PET)) may be attached to a surface which is opposite to a surface of the insulating film 30, on which the conductive layer 40 is stacked, in order to prevent the base film 1 from being warped due to the dead load of film carrier tapes.

[28] Referring to FIGS. 1, 4 and 5, the first sprocket holes 50 are formed in the first sprocket hole formation region 10 of the base film 1 (operation S20). To form the first sprocket holes 50, the conductive layer 40 and the insulating film 30 may be punched by using a mold. There are no restrictions on the shape of the first sprocket holes 50. However, the first sprocket holes 50 may be such as round, oval, square, rectangular, or the like.

[29] Referring to FIGS. 1, 6 and 7, photoresist patterns 60 are formed in the film carrier tape formation region 20 of the base film 1 (operation S30).

[30] Specifically, a photoresist layer is formed by coating photoresist on the conductive layer 40 by using a roll coater. Then, the photoresist layer is exposed and developed to form the photoresist patterns 60. That is, the photoresist layer is exposed to ultraviolet rays by using a glass mask and developed to form the photoresist patterns 60. The photoresist patterns 60 include a first pattern 62 for forming a wiring pattern and a second pattern 64 for forming a reinforcing pattern.

[31] Referring to FIGS. 1, 8 and 9, the conductive layer 40 is etched by using the photoresist patterns 60 as a mask, and the photoresist patterns 60 are exfoliated to form conductive patterns 70 (operation S40). A wet-etching process may be used to etch the conductive layer 40 and exfoliate the photoresist patterns 60.

[32] The conductive patterns 70 include a wiring pattern 72 and a reinforcing pattern 74.

The wiring pattern 72 is connected to each lead (e.g., solder ball) of a semiconductor chip and includes an input side and an output side.

[33] The reinforcing pattern 74 is formed outside a region where the wiring pattern 72 is formed. That is, the reinforcing pattern 74 is formed in a region where a plurality of second sprocket holes 80 (see FIG. 10), which will be described later, are formed. The reinforcing pattern 74 reinforces the second sprocket holes 80 into which sprockets of a roller fit when thin film carrier tapes are transported. The reinforcing pattern 74 prevents the second sprocket holes 80 from being torn or deformed due to stress applied by the sprockets of the roller. The reinforcing pattern 74 includes openings 76 which expose the insulating film 30 under the reinforcing pattern 74.

[34] Referring to FIGS. 1, 10 and 11, the second sprocket holes 80 are formed in the film carrier tape formation region 20 (operation S50). When the film carrier tapes are transported, the sprockets of the roller fit into the second sprocket holes 80.

[35] The second sprocket holes 80 are formed in portions of the insulating film 30 which are exposed by the openings 76, respectively. That is, the portions of the insulating film 30 which are exposed by the openings 76, respectively, may be punched by using a mold to form the second sprocket holes 80.

[36] The second sprocket holes 80 may be smaller than the openings 76. Specifically, if the second sprocket holes 80 and the openings 76 are square, each of the second sprocket holes 80 may be separated from each side of a corresponding one of the openings 76 by a predetermined distance D. Although not shown in the drawings, if the second sprocket holes 80 and the openings 76 are round, the second sprocket holes 80 may be smaller than the openings 76 in diameter.

[37] If the openings 76 are larger than the second sprocket holes 80, when the sprocket of the roller fits into the openings 76, it may not be damaged by its physical contact with the reinforcing pattern 74. Furthermore, a conductive material (e.g., copper) of the reinforcing pattern 74 may not be damaged, nor may the conductive material come off the reinforcing pattern 74 to short the wiring pattern 72. If the above problems no longer matter due to process improvement, the second sprocket holes 80 and the openings 76 may be the same size.

[38] If the second sprocket holes 80 are formed after the conductive patterns 70, the conductive patterns 70 can be formed in a more stable manner. Referring to FIG. 12, if photoresist 66 is coated by using a roll coater after the second sprocket holes 80 are formed, the photoresist 66 may be introduced into the second sprocket holes 80 and may harden. Due to surface tension and gravity, an end 68 of the photoresist 66 which has been introduced into and hardened in each of the second sprocket holes 80 may be thicker than other portions of the photoresist 66 which are coated on the conductive layer 40. Thus, if the photoresist 66 introduced into and hardened in each of the second sprocket holes 80 is exposed up to the end 68, other portions of the photoresist 66 may be over-exposed. If the end 68 of the photoresist 66 which has been introduced into and hardened in each of the second sprocket holes 80 is not considered when the photoresist 66 is exposed, it may remain as foreign matter and hinder accurate patterning. However, if the second sprocket holes 80 are formed after the conductive patterns 70 are formed, the above problems can be prevented, which results in more stable patterning.

[39] Referring to FIGS. 1, 13 and 14, the conductive patterns 70 are plated to form plated conductive patterns 70' (operation 60). The plated conductive patterns 70' may be formed by electroless plating of gold or tin. The plated conductive patterns 70' include a plated wiring pattern 72' and a plated reinforcing pattern 74'. The plated conductive patterns 70' can prevent the conductive patterns 70, which are made of, e.g., copper, from being damaged and enable a semiconductor chip to easily bond with a film carrier tape.

[40] Referring to FIGS. 1, 15 and 16, solder resist 90 is formed on the plated wiring pattern 72'. The solder resist 90 protects the plated wiring pattern 72' and prevents each lead (e.g., solder ball) of a semiconductor chip from being attached to an undesired region of a film carrier tape. The solder resist 90 may be formed by screen-printing ink, such as a urethane or photosensitive thermosetting resin composition.

[41] Referring to FIGS. 1, 17 and 18, a plurality of film carrier tapes 5 are formed by slitting the base film 1. Specifically, the film carrier tapes 5 are formed by slitting the base film 1 along the line X-X' of FIG. 15. Here, each portion of the base film 1 slit along the line X-X' of FIG. 15 is a region where the plated conductive patterns 70' are not formed but where only the insulating film 30 is formed.

[42] Hereinafter, a method of manufacturing a film carrier tape according to another exemplary embodiment of the present invention will be described with reference to FIGS. 2 through 9 and 13 through 21.

[43] FIG. 19 is a flowchart illustrating a method of manufacturing film carrier tapes according to another exemplary embodiment of the present invention. FIGS. 20 and 21 are diagrams for explaining the method of manufacturing film carrier tapes according to another exemplary embodiment of the present invention. Elements substantially identical to those in FIGS. 2 through 9 and 13 through 18 are indicated by like reference numerals, and thus their description will be omitted. In addition, each cross- sectional view has been taken along the line B-B' of a corresponding top view.

[44] The method of manufacturing film carrier tapes according to the present embodiment is different from the method according to the previous embodiment in that second sprocket holes are formed after conductive patterns are plated. Operations before operation S40 in which the conductive patterns are formed are identical to those in the previous embodiment. Thus, operations subsequent to operation S40 will be described below.

[45] Referring to FIGS. 19 through 21, conductive patterns 70 (see FIGS. 5A and 5B) are plated to form plated conductive patterns 70' (operation S52). As described above, the plated conductive patterns 70' may be formed by electroless plating of gold or tin. In addition, a plated reinforcing pattern 74' includes openings 76' which expose an insulating film 30 under the plated reinforcing pattern74'.

[46] Referring to FIGS. 19, 13 and 14, second sprocket holes 80 are formed in the insulating film 30 (operation S62). Specifically, portions of the insulating film 30 which are exposed by the openings 76', respectively, may be punched by using a mold to form the second sprocket holes 80.

[47] Hereinafter, a method of manufacturing film carrier tapes will be described with reference to FIGS. 1 through 5, 13 through 18, and 22 through 27. FIGS. 22 through 27 are diagrams for explaining a method of manufacturing film carrier tapes according to another exemplary embodiment of the present invention. Elements substantially identical to those in FIGS. 1 through 5 and FIGS. 13 through 18 are indicated by like reference numerals, and thus their description will be omitted. In addition, each cross- sectional view has been taken along the line B-B' of a corresponding top view.

[48] The method of manufacturing film carrier tapes according to the present embodiment is different from the methods according to the previous embodiments in that conductive patterns include a wiring pattern and an intermediate pattern and that the intermediate pattern and an insulating film are simultaneously punched to complete a reinforcing pattern and form second sprocket holes. That is, operation 30 in which the photoresist patterns are formed, operation S40 in which the conductive patterns are formed, and operation S50 in which the second sprocket holes are formed according to the present embodiment are different from those according to the previous embodiments. Thus, operations S30 through S50 will be described below.

[49] Referring to FIGS. 22 through 25, photoresist patterns 60 include a first pattern 62 for forming a wiring pattern and a second pattern 64a for forming an intermediate pattern. Therefore, a conductive layer is etched by using the photoresist patterns 60 as a mask, and the photoresist patterns 60 are exfoliated to form conductive patterns 70a. The conductive patterns 70a include a wiring pattern 72 and an intermediate pattern 74a.

[50] Referring to FIGS. 26 and 27, the intermediate pattern 74a and an insulating film 30 are simultaneously punched to form second sprocket holes 80. That is, the intermediate pattern 74a is punched by using a mold to form a reinforcing pattern 74 while the second sprocket holes 80 are formed in the insulating film 30.

[51] Although not shown in the drawings, the intermediate pattern 74a and the insulating film 30 may simultaneously be punched after the conductive patterns 70a are plated. As a result, the reinforcing pattern 74 may be completed while the second sprocket holes 80 are formed in the insulating film 30.

[52] FIG. 28 is a flowchart illustrating a method of manufacturing film carrier tapes according to another exemplary embodiment of the present invention. Referring to FIG. 28, the method of manufacturing film carrier tapes according to the present embodiment is different from the methods according to the previous embodiments in that second sprocket holes are formed before conductive patterns are formed after photoresist patterns are formed (operation S44). Operations before operation S30 in which the photoresist patterns are formed are identical to those in the previous embodiments. Thus, operations subsequent to operation S30 will be described below.

[53] A conductive layer and an insulating film are simultaneously punched to form the second sprocket holes (operation S44). Specifically, from among the photoresist patterns which are formed in operation S30, a first pattern for forming a reinforcing pattern includes openings which expose the conductive layer under the photoresist patterns. The conductive layer exposed by the openings and the insulating film disposed under the conductive layer are simultaneously punched by using a mold to form the second sprocket holes in the insulating film (operation S44).

[54] After the second sprocket holes are formed (operation S44), the photoresist patterns are exfoliated by wet etching to form the conductive patterns (operation S54).

[55] While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the present invention as defined by the following claims. The exemplary embodiments should be considered in a descriptive sense only and not for purposes of limitation. Therefore, the scope of the invention is defined not by the detailed description of the invention but by the following claims, and all differences within the scope will be construed as being included in the present invention.

Claims

[1] A method of manufacturing film carrier tapes, the method comprising: providing a base film which is divided into a film carrier tape formation region and a first sprocket hole formation region and which comprises an insulating film and a conductive layer stacked on the insulating film; forming first sprocket holes in the first sprocket hole formation region; forming conductive patterns by patterning the conductive layer in the film carrier tape formation region; and forming second sprocket holes in the film carrier tape formation region.

[2] The method of claim 1, wherein the conductive patterns comprise a wiring pattern and a reinforcing pattern.

[3] The method of claim 2, wherein the reinforcing pattern comprises openings which expose the insulating film under the reinforcing pattern, and the second sprocket holes are formed in the insulating film which is exposed by the openings.

[4] The method of claim 3, wherein the second sprocket holes are smaller than the openings.

[5] The method of claim 2, wherein the conductive patterns are plated to form a plated wiring pattern and a plated reinforcing pattern, the plated reinforcing pattern comprises openings which expose the insulating film under the plated reinforcing pattern, and the second sprocket holes are formed in the insulating film which is exposed by the openings.

[6] The method of claim 1, wherein the conductive patterns comprise a wiring pattern and an intermediate pattern, the intermediate pattern and the insulating film are simultaneously punched to complete the reinforcing pattern and form the second sprocket holes in the insulating film.

[7] The method of claim 2 or 6, wherein the patterning of the conductive layer com- prisesforming photoresist patterns on the conductive layer, wherein the photoresist patterns comprise a first pattern for forming the wiring pattern and a second pattern for forming the reinforcing pattern or the intermediate pattern.

[8] A method of manufacturing film carrier tapes, the method comprising: providing a base film which is divided into a film carrier tape formation region and a first sprocket hole formation region and which comprises an insulating film and a conductive layer stacked on the insulating film; forming first sprocket holes in the first sprocket hole formation region; and forming second sprocket holes in the film carrier tape formation region after the first sprocket holes are formed. [9] The method of claim 8, wherein the second sprocket holes are formed after a photoresist layer is formed in the film carrier tape formation region.