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WO2009001605A1 - Matière électriquement conductrice anisotrope, structure de connexion et procédé servant à produire la structure de connexion - Google Patents

Matière électriquement conductrice anisotrope, structure de connexion et procédé servant à produire la structure de connexion Download PDF

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Publication number
WO2009001605A1
WO2009001605A1 PCT/JP2008/057317 JP2008057317W WO2009001605A1 WO 2009001605 A1 WO2009001605 A1 WO 2009001605A1 JP 2008057317 W JP2008057317 W JP 2008057317W WO 2009001605 A1 WO2009001605 A1 WO 2009001605A1
Authority
WO
WIPO (PCT)
Prior art keywords
anisotropic
connection structure
melt viscosity
elctroconductive
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057317
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English (en)
Japanese (ja)
Inventor
Yoshito Tanaka
Jun Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008037781A external-priority patent/JP5093482B2/ja
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Priority to HK10106279.7A priority Critical patent/HK1140307B/xx
Priority to CN2008800217976A priority patent/CN101689409B/zh
Priority to US12/451,501 priority patent/US8148641B2/en
Priority to KR1020097026599A priority patent/KR101196684B1/ko
Publication of WO2009001605A1 publication Critical patent/WO2009001605A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

Cette invention concerne une matière électriquement conductrice anisotrope laquelle, lorsqu'un circuit intégré (IC) ou un câblage souple est connecté à une carte de câblage via une matière électriquement conductrice anisotrope, ne provoque pas de différence en termes de continuité de la résistance entre les bosses individuelles et entre les bornes linéaires. La matière électriquement conductrice anisotrope comprend des particules électriquement conductrices dispersées dans une matière liante isolante et elle a une viscosité à l'état fondu la plus faible [η0] de 1,0 × 102 à 1,0 × 106 mPa.s, et satisfait à la formule (1). 1 < [η1]/[η0] ≤ 3 (1) (Dans la formule, [η0] représente la viscosité à l'état fondu la plus faible de la matière électriquement conductrice anisotrope ; et [η1] représente la viscosité à l'état fondu à une température T1 qui est 30 °C en dessous de la température T0 à laquelle la viscosité à l'état fondu est à sa valeur la plus faible.)
PCT/JP2008/057317 2007-06-26 2008-04-15 Matière électriquement conductrice anisotrope, structure de connexion et procédé servant à produire la structure de connexion Ceased WO2009001605A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
HK10106279.7A HK1140307B (en) 2007-06-26 2008-04-15 Anisotropic electroconductive material, connection structure, and process for producing the connection structure
CN2008800217976A CN101689409B (zh) 2007-06-26 2008-04-15 各向异性导电材料、连接结构体及其制造方法
US12/451,501 US8148641B2 (en) 2007-06-26 2008-04-15 Anisotropic conductive material, connected structure, and production method thereof
KR1020097026599A KR101196684B1 (ko) 2007-06-26 2008-04-15 이방성 도전 재료, 접속 구조체 및 그 제조 방법

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-167479 2007-06-26
JP2007167479 2007-06-26
JP2008-037781 2008-02-19
JP2008037781A JP5093482B2 (ja) 2007-06-26 2008-02-19 異方性導電材料、接続構造体及びその製造方法

Publications (1)

Publication Number Publication Date
WO2009001605A1 true WO2009001605A1 (fr) 2008-12-31

Family

ID=40185428

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057317 Ceased WO2009001605A1 (fr) 2007-06-26 2008-04-15 Matière électriquement conductrice anisotrope, structure de connexion et procédé servant à produire la structure de connexion

Country Status (1)

Country Link
WO (1) WO2009001605A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013258139A (ja) * 2012-05-18 2013-12-26 Sekisui Chem Co Ltd 導電材料、接続構造体及び接続構造体の製造方法
JP2015091957A (ja) * 2009-11-17 2015-05-14 日立化成株式会社 回路接続材料、それを用いた接続構造体及び仮圧着方法
US9427545B2 (en) 2009-11-20 2016-08-30 Resmed Limited Mask system

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0757805A (ja) * 1993-08-10 1995-03-03 Shin Etsu Polymer Co Ltd 熱圧着性接続部材
WO2002054476A1 (fr) * 2000-12-28 2002-07-11 Toray Engineering Co., Ltd. Procede de montage de puce
JP2002252254A (ja) * 2001-02-26 2002-09-06 Sony Chem Corp 電気装置製造方法
WO2003001586A1 (fr) * 2001-06-20 2003-01-03 Toray Engineering Co., Ltd. Procede et dispositif de montage
JP2004335916A (ja) * 2003-05-12 2004-11-25 Toshiba Corp 半導体装置の製造方法
JP2004363167A (ja) * 2003-06-02 2004-12-24 Nippon Steel Chem Co Ltd 配線板の相互接続方法
JP2005200521A (ja) * 2004-01-15 2005-07-28 Sony Chem Corp 接着フィルム、接着フィルムの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0757805A (ja) * 1993-08-10 1995-03-03 Shin Etsu Polymer Co Ltd 熱圧着性接続部材
WO2002054476A1 (fr) * 2000-12-28 2002-07-11 Toray Engineering Co., Ltd. Procede de montage de puce
JP2002252254A (ja) * 2001-02-26 2002-09-06 Sony Chem Corp 電気装置製造方法
WO2003001586A1 (fr) * 2001-06-20 2003-01-03 Toray Engineering Co., Ltd. Procede et dispositif de montage
JP2004335916A (ja) * 2003-05-12 2004-11-25 Toshiba Corp 半導体装置の製造方法
JP2004363167A (ja) * 2003-06-02 2004-12-24 Nippon Steel Chem Co Ltd 配線板の相互接続方法
JP2005200521A (ja) * 2004-01-15 2005-07-28 Sony Chem Corp 接着フィルム、接着フィルムの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015091957A (ja) * 2009-11-17 2015-05-14 日立化成株式会社 回路接続材料、それを用いた接続構造体及び仮圧着方法
US9427545B2 (en) 2009-11-20 2016-08-30 Resmed Limited Mask system
JP2013258139A (ja) * 2012-05-18 2013-12-26 Sekisui Chem Co Ltd 導電材料、接続構造体及び接続構造体の製造方法

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