WO2009001420A1 - Composition de résine polymérisable de moulage tridimensionnel optique - Google Patents
Composition de résine polymérisable de moulage tridimensionnel optique Download PDFInfo
- Publication number
- WO2009001420A1 WO2009001420A1 PCT/JP2007/062659 JP2007062659W WO2009001420A1 WO 2009001420 A1 WO2009001420 A1 WO 2009001420A1 JP 2007062659 W JP2007062659 W JP 2007062659W WO 2009001420 A1 WO2009001420 A1 WO 2009001420A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- optical
- resin composition
- polymerizable resin
- molding
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C381/00—Compounds containing carbon and sulfur and having functional groups not covered by groups C07C301/00 - C07C337/00
- C07C381/12—Sulfonium compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
- C07F9/02—Phosphorus compounds
- C07F9/28—Phosphorus compounds with one or more P—C bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Polymerisation Methods In General (AREA)
Abstract
L'invention concerne une composition de résine polymérisable de moulage optique qui, à un rayonnement lumineux, présente une sensibilité de durcissement élevée, et qui, dans un temps de moulage raccourci, réalise la production d'un article moulé tridimensionnel ayant d'excellentes propriétés de précision de moulage, précision dimensionnelle, résistance à l'eau, résistance à l'humidité et d'excellentes propriétés mécaniques avec une productivité élevée, et qui possède une toxicité faible, qui est excellente en ce qui concerne la sécurité et qui ne provoquerait pas de pollution ou détérioration d'environnement de travail et d'environnement global. L'invention porte sur une composition de résine polymérisable de moulage tridimensionnel optique comprenant, en tant qu'initiateur cationique optique, l'un quelconque des composés de sulfonium aromatiques de la formule : [S+(R1)a(R2)b(R3)c][P-F6-n(Rf)n]m. Dans la formule, chacun de R1 et R2 représente phényle, chlorophényle, fluorophényle, 4-phénylthiophényle ou l'un quelconque des groupes de la formule: (dans laquelle X représente chlore ou fluor). R3 représente 4'-phénylsulfonio-4-phénylthiophényle. Rf représente un fluoroalkyle en C1-C8. Chacun parmi a, b et c vaut 0 à 3, à la condition que la somme de a, b et c soit de 3 ; m est un nombre égal à 1+c ; et n vaut 1 à 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2007/062659 WO2009001420A1 (fr) | 2007-06-25 | 2007-06-25 | Composition de résine polymérisable de moulage tridimensionnel optique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2007/062659 WO2009001420A1 (fr) | 2007-06-25 | 2007-06-25 | Composition de résine polymérisable de moulage tridimensionnel optique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009001420A1 true WO2009001420A1 (fr) | 2008-12-31 |
Family
ID=40185254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2007/062659 Ceased WO2009001420A1 (fr) | 2007-06-25 | 2007-06-25 | Composition de résine polymérisable de moulage tridimensionnel optique |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2009001420A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017179202A (ja) * | 2016-03-31 | 2017-10-05 | 株式会社Adeka | 硬化性組成物、硬化物の製造方法、およびその硬化物 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09268205A (ja) * | 1996-03-29 | 1997-10-14 | Asahi Denka Kogyo Kk | 光学的立体造形用樹脂組成物および光学的立体造形法 |
| JPH11199647A (ja) * | 1998-01-13 | 1999-07-27 | Teijin Seiki Co Ltd | 光学的造形用樹脂組成物 |
| JP2000062030A (ja) * | 1998-08-20 | 2000-02-29 | Asahi Denka Kogyo Kk | 光学的立体造形方法 |
| WO2004029037A1 (fr) * | 2002-09-25 | 2004-04-08 | Asahi Denka Co.Ltd. | Nouveau compose de sel de sulfonium aromatique, generateur photo-acide le comprenant et composition photopolymerisable le contenant, composition de resine pour la mise en forme tridimensionnelle optique et procede correspondant |
| WO2004113396A1 (fr) * | 2003-06-25 | 2004-12-29 | Cmet Inc. | Composition de resine stereolithographique durcissable par rayons actiniques, presentant une stabilite amelioree |
| JP2005015739A (ja) * | 2003-06-24 | 2005-01-20 | Cmet Inc | 靱性に優れた光学的立体造形用樹脂組成物 |
| JP2005263796A (ja) * | 2004-02-20 | 2005-09-29 | Asahi Denka Kogyo Kk | 新規な芳香族スルホニウム塩化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光学的立体造形用樹脂組成物ならびに光学的立体造形法 |
| WO2007037434A1 (fr) * | 2005-09-29 | 2007-04-05 | Cmet Inc. | Composition de résine pour objet optique moulé tridimensionnel |
-
2007
- 2007-06-25 WO PCT/JP2007/062659 patent/WO2009001420A1/fr not_active Ceased
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09268205A (ja) * | 1996-03-29 | 1997-10-14 | Asahi Denka Kogyo Kk | 光学的立体造形用樹脂組成物および光学的立体造形法 |
| JPH11199647A (ja) * | 1998-01-13 | 1999-07-27 | Teijin Seiki Co Ltd | 光学的造形用樹脂組成物 |
| JP2000062030A (ja) * | 1998-08-20 | 2000-02-29 | Asahi Denka Kogyo Kk | 光学的立体造形方法 |
| WO2004029037A1 (fr) * | 2002-09-25 | 2004-04-08 | Asahi Denka Co.Ltd. | Nouveau compose de sel de sulfonium aromatique, generateur photo-acide le comprenant et composition photopolymerisable le contenant, composition de resine pour la mise en forme tridimensionnelle optique et procede correspondant |
| JP2005015739A (ja) * | 2003-06-24 | 2005-01-20 | Cmet Inc | 靱性に優れた光学的立体造形用樹脂組成物 |
| WO2004113396A1 (fr) * | 2003-06-25 | 2004-12-29 | Cmet Inc. | Composition de resine stereolithographique durcissable par rayons actiniques, presentant une stabilite amelioree |
| JP2005263796A (ja) * | 2004-02-20 | 2005-09-29 | Asahi Denka Kogyo Kk | 新規な芳香族スルホニウム塩化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光学的立体造形用樹脂組成物ならびに光学的立体造形法 |
| WO2007037434A1 (fr) * | 2005-09-29 | 2007-04-05 | Cmet Inc. | Composition de résine pour objet optique moulé tridimensionnel |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017179202A (ja) * | 2016-03-31 | 2017-10-05 | 株式会社Adeka | 硬化性組成物、硬化物の製造方法、およびその硬化物 |
| JP7008398B2 (ja) | 2016-03-31 | 2022-01-25 | 株式会社Adeka | 硬化性組成物、硬化物の製造方法、およびその硬化物 |
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