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WO2009098033A1 - Method for producing a printed circuit board - Google Patents

Method for producing a printed circuit board Download PDF

Info

Publication number
WO2009098033A1
WO2009098033A1 PCT/EP2009/000727 EP2009000727W WO2009098033A1 WO 2009098033 A1 WO2009098033 A1 WO 2009098033A1 EP 2009000727 W EP2009000727 W EP 2009000727W WO 2009098033 A1 WO2009098033 A1 WO 2009098033A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
conductive
electronic
film
conductive foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2009/000727
Other languages
German (de)
French (fr)
Inventor
Jan Kostelnik
Frank Ebling
Ulrich Schaal
Andreas Kugler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Wuerth Elektronik Rot am See GmbH and Co KG
Original Assignee
Robert Bosch GmbH
Wuerth Elektronik Rot am See GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH, Wuerth Elektronik Rot am See GmbH and Co KG filed Critical Robert Bosch GmbH
Publication of WO2009098033A1 publication Critical patent/WO2009098033A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H05K1/187—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/29386—Base material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2224/29388—Glasses, e.g. amorphous oxides, nitrides or fluorides
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
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    • H01L2224/73267—Layer and HDI connectors
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/83132—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
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    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Definitions

  • the invention relates to a method for producing an electronic assembly having at least one electronic component which is contacted within the electronic assembly.
  • a known electronic assembly is made so that the electronic components are glued with their passive sides on a support plate. Subsequently, the space between them and above their active side is laminated with a filling material into which holes are then introduced for connection to the terminals (US 6972964).
  • the invention is based on the object to provide a way for simple and cost-effective production of electronic assemblies that allow a large packing density.
  • the invention proposes a method with the features mentioned in claim 1. Further developments of the invention are the subject of dependent claims.
  • the method uses as its starting point a conductive foil which is uncoated.
  • the multiple or at least one electronic component is then attached to this film.
  • the conductive foil is laminated with a printed circuit board carrier.
  • the carrier film may be made of metal, ceramic or polymer.
  • At the starting point forming conductive film structuring is carried out for the production of individual conductor tracks.
  • the connections of the conductive foil facing the conductive foil are then contacted electronic component.
  • the contacting can be carried out so that at the corresponding locations of the terminals of the electronic components holes are performed using lasers.
  • the drilled holes can then be metallized, which then produces the conductive connection between tracks and terminals of the devices.
  • the method can be carried out, for example, in a further development in the so-called reel-to-reel method.
  • the attachment of the at least one or more electronic components to the conductive foil can be done in a further development that the components are glued to the film.
  • the adhesive may be, for example, an adhesive that cures under application of heat.
  • the adhesive may be applied to the conductive foil by metering or stamping, at precisely those locations where the electronic components are to be later attached. Using known methods, the adhesive can be precisely dosed as well as applied in exactly the right place.
  • Another possibility also proposed by the invention is to apply the adhesive to the electronic components, to which also known methods can be used.
  • the components are then pressed under the interposition of the adhesive to the film.
  • heat such as hot air, furnace process or the like, the adhesive can then be cured. It is also possible that the attachment is done solely by pressure.
  • the adhesive which is present only where the electronic components are, in addition to the attachment also forms a dielectric.
  • spacer elements can be provided between the conductive foil and the electronic components, in particular spacer elements, which are contained in the adhesive. In this way it is also possible to set different dielectric thicknesses.
  • the envelope surrounds only one electronic component, or even several components, or even all electronic components of a group of components.
  • the wrapper may also be used to create three-dimensional structures, especially when such a combination of wrapper and conductive foil is to be assembled into further assemblies.
  • the conductive foil is provided with markings which enable or effect an adjustment.
  • These alignment marks can be produced for example by etching, stamping, drilling or the like. In particular, they can be used to position the devices in relation to the locations at which the components are to be attached and to which the adhesive is therefore to be applied.
  • the Justagemark isten can also be used to tailor the application of the components and the filling material, the electronic assemblies from the film strip.
  • a mechanical part for example a heat sink, can also be connected and fastened to the conductive foil and / or the components fastened thereto.
  • a mechanical part for example a heat sink
  • the wiring of the electronic components is produced by an electroless metal deposition.
  • the invention may be provided in a development to summarize several provided with electronic components, optionally a sheath and a printed circuit board carrier foils to a multilayer structure.
  • electronic components optionally a sheath and a printed circuit board carrier foils to a multilayer structure.
  • a sheath and a printed circuit board carrier foils to a multilayer structure.
  • the mentioned metallic layer is arranged for heat dissipation.
  • the invention also proposes an electronic assembly producible by a method as described and described in detail herein.
  • Figure 1 shows schematically the side view of a conductive film as a starting material for the process
  • FIG. 2 shows the same section of the film with applied adhesive dots
  • FIG. 3 shows the same view with two electronic components glued by means of the glue dots
  • Figure 4 shows the state of manufacture after the application of a sheath
  • Figure 5 shows the state after cutting an electronic assembly
  • Figure 6 is a schematic representation after preparation of the structuring of the conductive film
  • FIG. 7 shows the state after production of the contacting
  • FIG. 8 shows the final state of a multilayer printed circuit board produced by the method
  • Figure 9 is a schematic side view of a starting material according to a second embodiment of the method according to the invention.
  • FIG. 10 shows the state after a further method step
  • FIG. 11 shows the state after a further method step of the second embodiment
  • FIG. 12 shows a further method step
  • FIG. 13 shows the removal of the carrier film
  • Figure 14 is a representation corresponding to Figure 13 in a modification
  • FIG. 15 shows a starting situation in a still further embodiment
  • FIG. 16 shows the state of the embodiment according to FIG. 15 corresponding to FIG.
  • FIG. 17 is an illustration, corresponding to FIG. 15, of an intermediate state of a method according to a further embodiment
  • FIG. 18 shows a second state of the method
  • Figure 19 shows the result of attachment of the electronic component to the conductive foil.
  • FIG. 1 shows a highly simplified section of a conductive foil 1 unwound from a roll.
  • This foil 1 has adjustment markings 2 at certain precisely defined locations, for example in the form of holes passing through the foil 1.
  • the film 1 is uncoated on both sides. It is for example a copper foil.
  • adhesive is applied to the upper side 3 in FIGS. 1 to 4 at specific locations, which are fixed in position relative to the adjustment markings 2.
  • the application can be done by printing, spraying, dripping or the like.
  • individual spacers 5 for example, glass beads of a certain size, mixed. With the size of the spacers, it is possible to set different thicknesses of the dielectric.
  • a further method step which is not absolutely necessary, around the electronic components 6 around a sheath 7 are applied from a polymer composition, which in the example, all electronic components wrapped in a common enclosure 7.
  • the envelope 7 extends outside of the electronic components 6 up to the upper side 3 of the film 1 in FIGS. 1 to 4.
  • the alignment markings 2 can also serve for dimensioning and arranging the envelope 7 from the polyester mass relative to the electronic components 6. Since the envelope 7 encloses components 6 and extends to the film 1, optionally also forms a type of bonding with the film 1, a mechanically stable block is thereby formed.
  • the electronic assembly can now be cut to size, that is, cut out of the film 1.
  • the result of the previous process is reversed, so that now the free side 8 of the film 1 comes to lie up.
  • the film 1 provided with the envelope 7 is laminated with a printed circuit board carrier 9, which comes to lie on the side of the film 1, on which the electronic components 6 are arranged.
  • Figure 6 shows the result in an example where a wrapper 7 is absent.
  • the film 1 is now structured on its free side 8, so that conductor tracks are now produced.
  • holes 10 are then drilled, which lead from the free side of the film 1 to the terminals of the electronic components 6. This is also shown in FIG.
  • FIG. Figure 7 shows an already complete electronic assembly.
  • this electronic module can be further processed and further developed.
  • Figure 8 shows such a further embodiment of an electronic module, wherein practically two modules, as shown in Figure 7, back to back are connected to each other with the interposition of a metallic layer 12 which is disposed between the two circuit board carriers 9.
  • This metallic layer 12 is used for example for heat dissipation of the heat generated in the electronic components 6.
  • the two assemblies summarized here differ from the simple assembly of FIG. 7 in that a further metallic conductive layer 14 is applied to the metallic layer 1, which is still upper in FIG. 7, with the interposition of an insulating layer 13, which again penetrates through openings in the insulating layer 13 Produces contacts with conductor tracks of the originally upper conductive layer 1.
  • FIG. 8 shows by way of example that the upper of the two layers comprises electronic components 6 without an envelope, while the lower inverted arrangement contains an envelope 7.
  • FIGS. 9 to 13 show a further embodiment of the method proposed by the invention.
  • Figures 9 to 13 show states in the implementation of the method, which correspond approximately to Figures 1 to 7. While in FIG. 1 a film 1 which is uncoated on both sides is used as the starting material, the embodiment shown in FIGS. 9 to 13 uses as the starting material a film 21 which is attached to a carrier film 22.
  • the carrier film 22 may be made of metal, ceramic or polymer.
  • the conductive foil 21 is made of copper, for example.
  • the conductive foil 21 is structured in such a way that connection pads 23 are formed on the carrier foil 22, which correspond to the connection points of the electronic components to be fastened.
  • Such an electronic component 6 is shown in FIG.
  • This electronic component 6 is now connected with its connection points 24 with the connection pads 23.
  • the adhesive is a conductive adhesive.
  • an adhesive layer 25 is formed, which is present between the connection pads 23 and the connection points 24 of the electronic component 6. If this layer 25 is a solder layer, the attachment is carried out in the usual way by supplying heat. The same applies to a thermosetting adhesive. In this way, the electronic component 6 with its connection points 24 of the conductive foil 21 facing with this directly connected.
  • the electronic component 6 can be surrounded by a sheath 7, again made of polymer compound, which surrounds the entire electronic component 6, including the connection pads 23, and extends as far as the carrier foil 22.
  • a sheath 7, again made of polymer compound which surrounds the entire electronic component 6, including the connection pads 23, and extends as far as the carrier foil 22.
  • the carrier film 22 can be separated, which is shown in FIG 13 is indicated.
  • the further treatment of the envelope 7 or a lamination and the electronic component 6 contained therein is done in the usual manner with printed circuit boards.
  • FIG. 13 shows the detachment of the carrier layer 22.
  • detaching the carrier layer 22 it is also possible not to detach the carrier layer 22 but to further structure it, for example by etching, by ablation or the like. This is shown in FIG.
  • FIG. 15 shows a possibility of using a thicker film 31 as the starting film to be used, which is then first patterned on its side facing the electronic components, as in FIG. 10, to thereby form connection pads 23.
  • a thicker film 31 is shown on the left in FIG. 15
  • the result of the structuring is shown on the right in FIG. 15.
  • the electronic component 6 is then placed, connected and secured in the same way on the structured film produced in this way, as shown in FIG. 11. Again, after fixing the electronic component 6 and the envelope 7, structuring of the now exposed lower side of the conductive foil 31 in FIGS. 9 to 16 can take place.
  • FIG. 17 shows a further embodiment of the of the Invention proposed method.
  • the starting point is a resin-coated conductive foil, which is shown in FIG.
  • This resin-coated film contains a conductive layer 41, for example made of copper.
  • a resin layer 42 into which holes 43 are introduced from the top side.
  • FIG. 17 shows in the left half the still untreated film, while in the right half the holes 43 have already been produced.
  • an electronic component 6 With this conductive foil 41, an electronic component 6 is connected, which has so-called bumps as connection points.
  • the arrangement of these bumps 45 corresponds to the arrangement of the holes 43.
  • the electronic component 6 is pressed with its bumps 45 into the openings 43 of the film and heated. This results in a connection of the bumps 45 with the conductive foil 41.
  • the contact can be made by the compression itself.
  • connection between the electronic component 6 and the conductive foil 41 shown in FIG. 19 can then be further processed in the manner described in the preceding embodiments.
  • the method proposed by the invention makes it possible to realize a significantly increased land use on electronic circuit boards. It can be made with additional layers in a confined space components, both active and passive components.
  • the passive and active electronic components can be encapsulated cost-effectively, whereby a high reliability is achieved. There are risky mixing techniques ken, namely soldering, gluing and wire bonding in manufacturing avoided.
  • a planar output structure allows reproducible RF transitions to be realized.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

The invention relates to a method for producing an electronic module. The starting point is a metal conductive foil that is not coated on at least one side. Electronic components are fastened, particularly glued on said foil, wherein the active side faces the foil. The gluing is carried out by the glue being applied only to the points where the electronic components are to be fastened. The glue can either be applied to the foil or to the electronic components. The components are then pressed against the foil and are glued therewith. Then the foil comprising the glued-on components is laminated on the side of the components with a circuit board carrier. Only then is a circuit board structure created on the opposite side and only then are the connections of the electronic components contacted through the conductive foil. For contacting, further levels can be applied to the structured, conductive foil.

Description

Beschreibung description

Verfahren zum Herstellen einer LeiterplatteMethod for producing a printed circuit board

Die Erfindung betrifft ein Verfahren zum Herstellen einer elektronischen Baugruppe mit mindestens einem elektronischen Bauelement, das innerhalb der elektronischen Baugruppe kontaktiert ist.The invention relates to a method for producing an electronic assembly having at least one electronic component which is contacted within the electronic assembly.

Eine bekannte elektronische Baugruppe wird so hergestellt, dass die elektronischen Bauelemente mit ihren passiven Seiten auf eine Trägerplatte geklebt werden. Anschließend wird der Raum zwischen ihnen und oberhalb ihrer aktiven Seite mit einem Füllmaterial laminiert, in das dann Löcher zur Herstellung einer Verbindung mit den Anschlüssen eingebracht werden (US 6972964).A known electronic assembly is made so that the electronic components are glued with their passive sides on a support plate. Subsequently, the space between them and above their active side is laminated with a filling material into which holes are then introduced for connection to the terminals (US 6972964).

Der Erfindung liegt die Aufgabe zu Grunde, eine Möglichkeit zur einfachen und kostengünstigen Herstellung von elektronischen Baugruppen zu schaffen, die eine große Packungsdichte ermöglichen.The invention is based on the object to provide a way for simple and cost-effective production of electronic assemblies that allow a large packing density.

Zur Lösung dieser Aufgabe schlägt die Erfindung ein Verfahren mit den im Anspruch 1 genannten Merkmalen vor. Weiterbildungen der Erfindung sind Gegenstand von Unteransprüchen.To solve this problem, the invention proposes a method with the features mentioned in claim 1. Further developments of the invention are the subject of dependent claims.

Das Verfahren verwendet als Ausgangspunkt eine leitfähige Folie, die unbeschichtet ist. An dieser Folie werden dann die mehreren oder das mindestens eine elektronische Bauelement befestigt. Auf der Seite, an der die elektronischen Bauelemente angebracht sind, wird die leitfähige Folie mit einem Leiterplattenträger laminiert. Die Trägerfolie kann aus Metall, Keramik oder Polymer bestehen. An der den Ausgangspunkt bildenden leitfähigen Folie wird eine Strukturierung zur Herstellung von einzelnen Leiterbahnen durchgeführt. Anschließend oder gleichzeitig werden dann die dieser leitfähigen Folie zugewandten Anschlüsse des elektronischen Bauelements kontaktiert. Die Kontaktierung kann so erfolgen, dass an den den Anschlüssen der elektronischen Bauelemente entsprechenden Stellen Bohrungen mithilfe von Lasern durchgeführt werden. Die gebohrten Löcher können dann metallisiert werden, wodurch dann die leitende Verbindung zwischen Leiterbahnen und Anschlüssen der Bauelemente hergestellt werden.The method uses as its starting point a conductive foil which is uncoated. The multiple or at least one electronic component is then attached to this film. On the side where the electronic components are mounted, the conductive foil is laminated with a printed circuit board carrier. The carrier film may be made of metal, ceramic or polymer. At the starting point forming conductive film structuring is carried out for the production of individual conductor tracks. Subsequently or at the same time, the connections of the conductive foil facing the conductive foil are then contacted electronic component. The contacting can be carried out so that at the corresponding locations of the terminals of the electronic components holes are performed using lasers. The drilled holes can then be metallized, which then produces the conductive connection between tracks and terminals of the devices.

Aufgrund der Verwendung einer einfachen leitfähigen unbeschichteten Folie lässt sich das Verfahren beispielsweise in Weiterbildung im so genannten Reel-to-Reel-Verfahren durchführen.Due to the use of a simple conductive uncoated film, the method can be carried out, for example, in a further development in the so-called reel-to-reel method.

Die Befestigung des mindestens einen beziehungsweise der mehreren elektronischen Bauelemente an der leitfähigen Folie kann in Weiterbildung dadurch geschehen, dass die Bauelemente mit der Folie verklebt werden. Der Klebstoff kann beispielsweise ein Klebstoff sein, der unter Wärmeanwendung aushärtet.The attachment of the at least one or more electronic components to the conductive foil can be done in a further development that the components are glued to the film. The adhesive may be, for example, an adhesive that cures under application of heat.

Der Klebstoff kann beispielsweise auf die leitfähige Folie durch Dosieren oder Stempeln aufgebracht werden, und zwar genau an den Stellen, an denen später die elektronischen Bauelemente angebracht werden sollen. Mithilfe bekannter Verfahren lässt sich der Klebstoff sowohl genau dosieren als auch an genau der richtigen Stelle aufbringen.For example, the adhesive may be applied to the conductive foil by metering or stamping, at precisely those locations where the electronic components are to be later attached. Using known methods, the adhesive can be precisely dosed as well as applied in exactly the right place.

Eine andere von der Erfindung ebenfalls vorgeschlagene Möglichkeit besteht darin, den Klebstoff auf die elektronischen Bauelemente aufzubringen, wozu ebenfalls bekannte Verfahren verwendet werden können.Another possibility also proposed by the invention is to apply the adhesive to the electronic components, to which also known methods can be used.

Die Bauelemente werden dann unter der Zwischenlage des Klebstoffs auf die Folie angedrückt. Durch Anwendung von Wärme, beispielsweise Heißluft, Ofenprozess oder dergleichen kann der Klebstoff dann ausgehärtet werden. Ebenfalls möglich ist es, dass die Befestigung allein durch Druck erfolgt.The components are then pressed under the interposition of the adhesive to the film. By applying heat, such as hot air, furnace process or the like, the adhesive can then be cured. It is also possible that the attachment is done solely by pressure.

Der Klebstoff, der nur dort vorhanden ist, wo auch die elektronischen Bauelemente sind, bildet neben der Befestigung auch ein Dielektrikum. Zur Sicherstellung einer geeigneten Dicke der Dielektrikumsschicht können Abstandselemente zwischen der leitfähigen Folie und den elektronischen Bauelementen vorgesehen werden, insbesondere Abstandselemente, die in dem Klebstoff enthalten sind. Auf diese Weise ist es auch möglich, verschiedene Dielektrika-Dicken einzustellen.The adhesive, which is present only where the electronic components are, in addition to the attachment also forms a dielectric. To ensure a suitable thickness of the dielectric layer, spacer elements can be provided between the conductive foil and the electronic components, in particular spacer elements, which are contained in the adhesive. In this way it is also possible to set different dielectric thicknesses.

In Weiterbildung der Erfindung kann vorgesehen sein, dass nach dem Befestigen der elektronischen Bauelemente an der leitfähigen Folie diese von einem Polymermaterial umhüllt werden, das die elektronischen Bauelemente bis auf die leitfähige Folie umgibt. Insbesondere kann dabei Material verwendet werden, das mit der leitfähigen Folie eine Verbindung in Form einer Befestigung eingeht. Dadurch wird eine mechanisch wirksame zusätzliche Sicherung der elektronischen Bauelemente an der Leiterfolie erreicht.In a development of the invention, it can be provided that, after the attachment of the electronic components to the conductive foil, they are enveloped by a polymer material which surrounds the electronic components except for the conductive foil. In particular, it is possible to use material which forms a bond with the conductive foil in the form of a fastening. As a result, a mechanically effective additional securing of the electronic components to the conductor foil is achieved.

Es kann dabei vorgesehen sein, dass die Umhüllung nur jeweils ein elektronisches Bauelement umgibt, oder auch mehrere Bauelemente, oder auch alle elektronischen Bauelemente einer Bauteilgruppe.It can be provided that the envelope surrounds only one electronic component, or even several components, or even all electronic components of a group of components.

Die Umhüllung kann auch dazu verwendet werden, dreidimensionale Strukturen zu erstellen, insbesondere dann, wenn eine solche Kombination aus Umhüllung und leitfähiger Folie zu weiteren Baugruppen zusammengesetzt werden soll.The wrapper may also be used to create three-dimensional structures, especially when such a combination of wrapper and conductive foil is to be assembled into further assemblies.

In Weiterbildung der Erfindung kann vorgesehen sein, dass die leitfähige Folie mit Markierungen versehen wird, die eine Justierung ermöglichen oder bewirken sollen. Diese Justagemarkierungen können beispielsweise durch Ätzen, Stanzen, Bohren oder dergleichen hergestellt werden. Sie können insbesondere dazu dienen, die Einrichtungen gegenüber den Stellen zu positionieren, an denen die Bauelemente angebracht werden sollen und an denen daher der Kleber aufgebracht werden soll.In a development of the invention, it can be provided that the conductive foil is provided with markings which enable or effect an adjustment. These alignment marks can be produced for example by etching, stamping, drilling or the like. In particular, they can be used to position the devices in relation to the locations at which the components are to be attached and to which the adhesive is therefore to be applied.

Die Justagemarkierungen können auch dazu verwendet werden, nach dem Aufbringen der Bauelemente und des Füllmaterials die elektronischen Baugruppen aus dem Folienband zuzuschneiden.The Justagemarkierungen can also be used to tailor the application of the components and the filling material, the electronic assemblies from the film strip.

Erfindungsgemäß kann mit der leitfähigen Folie und/oder den daran befestigten Bauelementen auch ein mechanisches Teil, beispielsweise ein Kühlkörper, verbunden und befestigt werden. Insbesondere kann vorgesehen sein, dass auch solche mechanischen Teile in der Umhüllung untergebracht sind.According to the invention, a mechanical part, for example a heat sink, can also be connected and fastened to the conductive foil and / or the components fastened thereto. In particular, it can be provided that such mechanical parts are accommodated in the enclosure.

Erfindungsgemäß kann in Weiterbildung vorgesehen sein, dass die Verdrahtung der elektronischen Bauelemente durch eine stromlose Metall- abscheidung hergestellt wird.According to the invention may be provided in a development that the wiring of the electronic components is produced by an electroless metal deposition.

In nochmaliger Weiterbildung der Erfindung kann vorgesehen sein, dass mit dem Leiterplattenträger eine weitere metallische Schicht verbunden wird, die zur Wärmeabfuhr dienen kann. Es kann ebenfalls vorgesehen sein, dass zwischen den elektronischen Bauelementen und dieser metallischen Schicht Kühlkanäle oder Wärmeleiter untergebracht werden, die durch die Umhüllung hindurch gehen. Auch sie können dazu dienen, die in den elektronischen Bauteilen entstehende Wärme von den Bauteilen wegzuführen. Dadurch lässt sich die Packungsdichte weiter verbessern.In a further development of the invention can be provided that with the circuit board carrier another metal layer is connected, which can serve for heat dissipation. It can also be provided that between the electronic components and this metallic layer cooling channels or heat conductors are housed, which go through the enclosure. They too can serve to dissipate the heat generated in the electronic components away from the components. As a result, the packing density can be further improved.

Erfindungsgemäß kann in Weiterbildung vorgesehen sein, mehrere mit elektronischen Bauteilen, gegebenenfalls einer Umhüllung und einem Leiterplattenträger versehene Folien zu einem Mehrlagenaufbau zusammenzufassen. Insbesondere kann dabei vorgesehen sein, dass zwi- sehen zwei Leiterplattenträgern die erwähnte metallische Schicht zur Wärmeableitung angeordnet wird.According to the invention may be provided in a development to summarize several provided with electronic components, optionally a sheath and a printed circuit board carrier foils to a multilayer structure. In particular, it may be provided that see two printed circuit board carriers the mentioned metallic layer is arranged for heat dissipation.

Die Erfindung schlägt ebenfalls eine elektronische Baugruppe vor, die durch ein Verfahren herstellbar ist, wie es hierin im Einzelnen beschrieben wurde und wird.The invention also proposes an electronic assembly producible by a method as described and described in detail herein.

Weitere Merkmale, Einzelheiten und Vorzüge der Erfindung ergeben sich aus den Ansprüchen und der Zusammenfassung, deren beider Wortlaut durch Bezugnahme zum Inhalt der Beschreibung gemacht wird, der folgenden Beschreibung bevorzugter Ausführungsformen der Erfindung sowie anhand der Zeichnung. Hierbei zeigen:Further features, details and advantages of the invention will become apparent from the claims and the abstract, the wording of which is incorporated by reference into the content of the description, the following description of preferred embodiments of the invention and with reference to the drawing. Hereby show:

Figur 1 schematisch die Seitenansicht einer leitenden Folie als Ausgangsmaterial für das Verfahren;Figure 1 shows schematically the side view of a conductive film as a starting material for the process;

Figur 2 den gleichen Abschnitt der Folie mit aufgebrachten Klebstoffpunkten;FIG. 2 shows the same section of the film with applied adhesive dots;

Figur 3 die gleiche Ansicht mit zwei mithilfe der Klebstoffpunkte verklebten elektronischen Bauteilen;FIG. 3 shows the same view with two electronic components glued by means of the glue dots;

Figur 4 den Zustand der Herstellung nach dem Aufbringen einer Umhüllung;Figure 4 shows the state of manufacture after the application of a sheath;

Figur 5 den Zustand nach dem Zuschneiden einer elektronischen Baugruppe;Figure 5 shows the state after cutting an electronic assembly;

Figur 6 eine schematische Darstellung nach Herstellung der Strukturierung der leitfähigen Folie;Figure 6 is a schematic representation after preparation of the structuring of the conductive film;

Figur 7 den Zustand nach Herstellung der Kontaktierung; Figur 8 den Endzustand einer nach dem Verfahren hergestellten Mehrlagenleiterplatte;FIG. 7 shows the state after production of the contacting; FIG. 8 shows the final state of a multilayer printed circuit board produced by the method;

Figur 9 die schematische Seitenansicht eines Ausgangsmaterials nach einer zweiten Ausführungsform des erfindungsgemäßen Verfahrens;Figure 9 is a schematic side view of a starting material according to a second embodiment of the method according to the invention;

Figur 10 den Zustand nach einem weiteren Verfahrensschritt;FIG. 10 shows the state after a further method step;

Figur 11 den Zustand nach einem weiteren Verfahrensschritt der zweiten Ausführungsform;FIG. 11 shows the state after a further method step of the second embodiment;

Figur 12 einen weiteren Verfahrensschritt;FIG. 12 shows a further method step;

Figur 13 das Abziehen der Trägerfolie;FIG. 13 shows the removal of the carrier film;

Figur 14 eine der Figur 13 entsprechende Darstellung bei einer Abwandlung;Figure 14 is a representation corresponding to Figure 13 in a modification;

Figur 15 eine Ausgangssituation bei einer nochmals weiteren Ausführungsform;FIG. 15 shows a starting situation in a still further embodiment;

Figur 16 den der Figur 14 entsprechenden Zustand der Ausführungsform nach Figur 15;FIG. 16 shows the state of the embodiment according to FIG. 15 corresponding to FIG.

Figur 17 eine der Figur 15 entsprechende Darstellung eines Zwi- schenzustands eines Verfahrens nach einer weiteren Ausführungsform;FIG. 17 is an illustration, corresponding to FIG. 15, of an intermediate state of a method according to a further embodiment;

Figur 18 einen zweiten Zustand des Verfahrens; Figur 19 das Ergebnis der Befestigung des elektronischen Bauteils an der leitfähigen Folie.FIG. 18 shows a second state of the method; Figure 19 shows the result of attachment of the electronic component to the conductive foil.

Figur 1 zeigt stark vereinfacht einen Ausschnitt aus einer von einer Rolle abgewickelten leitfähigen Folie 1. Diese Folie 1 hat an bestimmten genau definierten Stellen Justagemarkierungen 2, beispielsweise in Form von durch die Folie 1 hindurchgehende Löchern. Die Folie 1 ist auf beiden Seiten unbeschichtet. Es handelt sich beispielsweise um eine Kupferfolie.FIG. 1 shows a highly simplified section of a conductive foil 1 unwound from a roll. This foil 1 has adjustment markings 2 at certain precisely defined locations, for example in the form of holes passing through the foil 1. The film 1 is uncoated on both sides. It is for example a copper foil.

Auf der Folie 1 wird auf der in den Figuren 1 bis 4 oberen Seite 3 an bestimmten Stellen, die in ihrer Position gegenüber den Justagemarkierungen 2 festgelegt sind, Klebstoff aufgebracht. Das Aufbringen kann durch Drucken, Spritzen, Tropfen oder dergleichen geschehen. In dem Klebstoff sind einzelne Abstandselemente 5, beispielsweise Glaskugeln einer bestimmten Größe, eingemischt. Mit der Größe der Spacer ist es möglich, verschiedene Dicken des Dielektrikums einzustellen.On the film 1, adhesive is applied to the upper side 3 in FIGS. 1 to 4 at specific locations, which are fixed in position relative to the adjustment markings 2. The application can be done by printing, spraying, dripping or the like. In the adhesive individual spacers 5, for example, glass beads of a certain size, mixed. With the size of the spacers, it is possible to set different thicknesses of the dielectric.

In einem weiteren Verfahrensschritt werden nun elektronische Bauelemente 6 mithilfe von geeigneten Einrichtungen auf die Stellen aufgesetzt, an denen vorher die Klebstoffpunkte 5 angebracht waren. Diese elektronischen Bauteile 6 werden angedrückt, so dass die Klebstoffpunkte 5 verquetscht werden und die gesamte aktive Fläche der elektronischen Bauelemente 6 abdecken und gegenüber der Folie 1 verkleben. Dieser Zustand ist in Figur 3 dargestellt. Je nach Art des verwendeten Klebstoffs können weitere Maßnahmen ergriffen werden, um das Aushärten des Klebstoffs zu beschleunigen, beispielsweise eine zusätzliche oder ausschließliche UV-Härtung.In a further method step, electronic components 6 are now placed on the locations at which the glue dots 5 were previously applied by means of suitable devices. These electronic components 6 are pressed so that the adhesive dots 5 are pinched and cover the entire active surface of the electronic components 6 and bond to the film 1. This state is shown in FIG. Depending on the type of adhesive used, further measures can be taken to accelerate the curing of the adhesive, such as additional or exclusive UV cure.

Anschließend kann in einem weiteren Verfahrensschritt, der nicht unbedingt erforderlich ist, um die elektronischen Bauelemente 6 herum eine Umhüllung 7 aus einer Polymermasse aufgebracht werden, die in dem dargestellten Beispiel alle elektronischen Bauelemente in einer gemeinsamen Umhüllung 7 umhüllt. Die Umhüllung 7 reicht außerhalb der elektronischen Bauelemente 6 bis zu der in den Figuren 1 bis 4 oberen Seite 3 der Folie 1. Auch zur Dimensionierung und Anordnung der Umhüllung 7 aus der Polyestermasse gegenüber den elektronischen Bauelementen 6 können die Justagemarkierungen 2 dienen. Da die Umhüllung 7 Bauelemente 6 umhüllt und bis zur Folie 1 reicht, gegebenenfalls auch mit der Folie 1 eine Art Verklebung eingeht, ist dadurch ein mechanisch stabiler Block gebildet.Subsequently, in a further method step, which is not absolutely necessary, around the electronic components 6 around a sheath 7 are applied from a polymer composition, which in the example, all electronic components wrapped in a common enclosure 7. The envelope 7 extends outside of the electronic components 6 up to the upper side 3 of the film 1 in FIGS. 1 to 4. The alignment markings 2 can also serve for dimensioning and arranging the envelope 7 from the polyester mass relative to the electronic components 6. Since the envelope 7 encloses components 6 and extends to the film 1, optionally also forms a type of bonding with the film 1, a mechanically stable block is thereby formed.

Anschließend an den Verfahrensschritt, dessen Ergebnis in Figur 4 dargestellt wurde, kann nun die elektronische Baugruppe zugeschnitten werden, das heißt aus der Folie 1 herausgeschnitten werden. Nun wird das Ergebnis des bisherigen Verfahrens umgedreht, so dass jetzt die freie Seite 8 der Folie 1 nach oben zu liegen kommt. In einem weiteren Schritt wird die mit der Umhüllung 7 versehene Folie 1 mit einem Leiterplattenträger 9 laminiert, der auf der Seite der Folie 1 zu liegen kommt, auf der auch die elektronischen Bauteile 6 angeordnet sind. Figur 6 zeigt das Ergebnis in einem Beispiel, bei dem eine Umhüllung 7 nicht vorhanden ist.Subsequent to the method step, the result of which was shown in FIG. 4, the electronic assembly can now be cut to size, that is, cut out of the film 1. Now, the result of the previous process is reversed, so that now the free side 8 of the film 1 comes to lie up. In a further step, the film 1 provided with the envelope 7 is laminated with a printed circuit board carrier 9, which comes to lie on the side of the film 1, on which the electronic components 6 are arranged. Figure 6 shows the result in an example where a wrapper 7 is absent.

In einem weiteren Schritt wird nun die Folie 1 auf ihrer freien Seite 8 strukturiert, so dass jetzt Leiterbahnen erzeugt sind. In diesem Schritt oder anschließend werden dann Löcher 10 gebohrt, die von der freien Seite der Folie 1 zu den Anschlüssen der elektronischen Bauelemente 6 führen. Dies ist ebenfalls in Figur 6 dargestellt.In a further step, the film 1 is now structured on its free side 8, so that conductor tracks are now produced. In this step or subsequently holes 10 are then drilled, which lead from the free side of the film 1 to the terminals of the electronic components 6. This is also shown in FIG.

Die zu den Anschlüssen der Bauelemente 6 führenden Löcher 10 werden nun in einem weiteren Schritt metallisiert, so dass jetzt die Anschlüsse durch die ausgefüllten Löcher mit den Leiterbahnen verbunden sind. Dies ist in Figur 7 dargestellt. Figur 7 zeigt also eine schon vollständige elektronische Baugruppe. Diese elektronische Baugruppe kann aber weiterverarbeitet und weiter ausgestaltet werden. Figur 8 zeigt eine solche weitere Ausgestaltung einer elektronischen Baugruppe, wobei praktisch zwei Baugruppen, wie in Figur 7 dargestellt, Rücken an Rücken miteinander verbunden werden unter Zwischenlage einer metallischen Schicht 12, die zwischen den beiden Leiterplattenträgern 9 angeordnet ist. Diese metallische Schicht 12 dient beispielsweise zur Wärmeabfuhr der in den elektronischen Bauteilen 6 erzeugten Wärme.The leading to the terminals of the components 6 holes 10 are now metallized in a further step, so that now the terminals are connected through the holes filled with the tracks. This is shown in FIG. Figure 7 thus shows an already complete electronic assembly. However, this electronic module can be further processed and further developed. Figure 8 shows such a further embodiment of an electronic module, wherein practically two modules, as shown in Figure 7, back to back are connected to each other with the interposition of a metallic layer 12 which is disposed between the two circuit board carriers 9. This metallic layer 12 is used for example for heat dissipation of the heat generated in the electronic components 6.

Die beiden hier zusammengefassten Baugruppen unterscheiden sich von der einfachen Baugruppe der Figur 7 noch darin, dass auf die in Figur 7 noch obere metallische Schicht 1 unter Zwischenlage einer Isolierungsschicht 13 eine weitere metallische leitende Schicht 14 aufgebracht ist, die durch Öffnungen in der Isolierungsschicht 13 wiederum Kontakte mit Leiterbahnen der ursprünglich oberen leitenden Schicht 1 herstellt.The two assemblies summarized here differ from the simple assembly of FIG. 7 in that a further metallic conductive layer 14 is applied to the metallic layer 1, which is still upper in FIG. 7, with the interposition of an insulating layer 13, which again penetrates through openings in the insulating layer 13 Produces contacts with conductor tracks of the originally upper conductive layer 1.

Von der nicht aktiven Seite der elektronischen Bauteile 6 führen metallisierte Kühlkanäle 15 durch den Leiterplattenträger 9 hindurch zu der mittleren Kühlschicht 12, so dass die Wärme hier abgeleitet werden kann.From the non-active side of the electronic components 6 lead metallized cooling channels 15 through the printed circuit board carrier 9 through to the middle cooling layer 12, so that the heat can be dissipated here.

In Figur 8 ist als Beispiel gezeigt, dass die obere der beiden Lagen elektronische Bauelemente 6 ohne eine Umhüllung aufweist, während die untere umgedrehte Anordnung eine Umhüllung 7 enthält.FIG. 8 shows by way of example that the upper of the two layers comprises electronic components 6 without an envelope, while the lower inverted arrangement contains an envelope 7.

In den Figuren 9 bis 13 wird eine weitere Ausführungsform des von der Erfindung vorgeschlagenen Verfahrens dargestellt. Die Figuren 9 bis 13 zeigen Zustände bei der Durchführung des Verfahrens, die etwa den Figuren 1 bis 7 entsprechen. Während in Figur 1 eine beidseits unbeschichtete Folie 1 als Ausgangsmaterial verwendet wird, verwendet die in den Figuren 9 bis 13 dargestellte Ausführungsform als Ausgangsmaterial eine Folie 21 , die an einer Trägerfolie 22 angebracht ist. Die Trägerfolie 22 kann aus Metall, aus Keramik oder auch aus Polymer bestehen. Die leitende Folie 21 besteht beispielsweise aus Kupfer. In einem ersten Verfahrensschritt wird die leitende Folie 21 in der Weise strukturiert, dass Anschlusspads 23 auf der Trägerfolie 22 ausgebildet werden, die den Anschlussstellen der zu befestigenden elektronischen Bauteile entsprechen.FIGS. 9 to 13 show a further embodiment of the method proposed by the invention. Figures 9 to 13 show states in the implementation of the method, which correspond approximately to Figures 1 to 7. While in FIG. 1 a film 1 which is uncoated on both sides is used as the starting material, the embodiment shown in FIGS. 9 to 13 uses as the starting material a film 21 which is attached to a carrier film 22. The carrier film 22 may be made of metal, ceramic or polymer. The conductive foil 21 is made of copper, for example. In a first method step, the conductive foil 21 is structured in such a way that connection pads 23 are formed on the carrier foil 22, which correspond to the connection points of the electronic components to be fastened.

Ein solches elektronisches Bauteil 6 ist in Figur 11 dargestellt. Dieses elektronische Bauteil 6 wird nun mit seinen Anschlussstellen 24 mit den Anschlusspads 23 verbunden. Dies kann beispielsweise in der gleichen Weise wie bei der ersten Ausführungsform dadurch geschehen, dass auf die Anschlusspads 23 oder die diesen zugewandten Seiten der Anschlussstellen 24 des elektronischen Bauteils 6 Klebstoff aufgebracht wird, oder aber auch Lot. Bei dem Klebstoff handelt es sich um einen leitfähigen Klebstoff. Dadurch wird eine Klebschicht 25 gebildet, die zwischen den Anschlusspads 23 und den Anschlussstellen 24 des elektronischen Bauelements 6 vorhanden ist. Falls es sich bei dieser Schicht 25 um eine Lotschicht handelt, wird die Befestigung in der üblichen Weise durch Wärmezufuhr durchgeführt. Das gleiche gilt auch für einen durch Wärme aushärtenden Klebstoff. Auf diese Weise wird das elektronische Bauelement 6 mit seinen Anschlussstellen 24 der leitenden Folie 21 zugewandt mit dieser direkt verbunden.Such an electronic component 6 is shown in FIG. This electronic component 6 is now connected with its connection points 24 with the connection pads 23. This can be done, for example, in the same way as in the first embodiment, by applying adhesive to the connection pads 23 or the sides of the connection points 24 of the electronic component 6 facing them, or also solder. The adhesive is a conductive adhesive. As a result, an adhesive layer 25 is formed, which is present between the connection pads 23 and the connection points 24 of the electronic component 6. If this layer 25 is a solder layer, the attachment is carried out in the usual way by supplying heat. The same applies to a thermosetting adhesive. In this way, the electronic component 6 with its connection points 24 of the conductive foil 21 facing with this directly connected.

Anschließend kann das elektronische Bauelement 6 mit einer Umhüllung 7, wiederum aus Polymermasse, umgeben werden, die das gesamte elektronische Bauteil 6 einschließlich der Anschlusspads 23 umgibt und bis zu der Trägerfolie 22 reicht. Das Ergebnis ist in Figur 12 dargestellt.Subsequently, the electronic component 6 can be surrounded by a sheath 7, again made of polymer compound, which surrounds the entire electronic component 6, including the connection pads 23, and extends as far as the carrier foil 22. The result is shown in FIG.

Anschließend kann die Trägerfolie 22 abgetrennt werden, was in Figur 13 angedeutet ist. Die weitere Behandlung der Umhüllung 7 oder einer Laminierung und des darin enthaltenen elektronischen Bauelements 6 geschieht in der bei Leiterplatten üblichen Weise.Subsequently, the carrier film 22 can be separated, which is shown in FIG 13 is indicated. The further treatment of the envelope 7 or a lamination and the electronic component 6 contained therein is done in the usual manner with printed circuit boards.

Figur 13 zeigt das Ablösen der Trägerschicht 22. Anstelle des Ablösens der Trägerschicht 22 ist es auch möglich, die Trägerschicht 22 nicht abzulösen, sondern weiter zu strukturieren, beispielsweise durch Ätzen, durch Abtragen oder dergleichen. Dies ist in Figur 14 dargestellt.FIG. 13 shows the detachment of the carrier layer 22. Instead of detaching the carrier layer 22, it is also possible not to detach the carrier layer 22 but to further structure it, for example by etching, by ablation or the like. This is shown in FIG.

Während bei der in Figur 9 als Ausgangsmaterial dargestellten Folie davon ausgegangen wird, dass es sich um eine auf einer Trägerfolie 22 angebrachte leitende Folie 21 handelt, wobei die leitende Folie 21 sehr dünn ist, zeigt Figur 15 eine Möglichkeit, als Ausgangsfolie eine dickere Folie 31 zu verwenden, die dann ähnlich wie in Figur 10 auf ihrer den elektronischen Bauteilen zugewandten Seite zunächst strukturiert wird, um dadurch Anschlusspads 23 zu bilden. Links in Figur 15 ist der Ausgangszustand dieser dickeren Folie 31 dargestellt, während rechts in Figur 15 das Ergebnis der Strukturierung dargestellt ist.While in the case of the film shown as starting material in FIG. 9 it is assumed that it is a conductive film 21 attached to a carrier film 22, the conductive film 21 being very thin, FIG. 15 shows a possibility of using a thicker film 31 as the starting film to be used, which is then first patterned on its side facing the electronic components, as in FIG. 10, to thereby form connection pads 23. On the left in FIG. 15 the initial state of this thicker foil 31 is shown, while on the right in FIG. 15 the result of the structuring is shown.

Auf die so hergestellte strukturierte Folie wird dann das elektronische Bauelement 6 in der gleichen Weise aufgesetzt, verbunden und befestigt, wie dies in Figur 11 dargestellt wurde. Auch hier kann nach dem Befestigen des elektronischen Bauteils 6 und der Umhüllung 7 eine Strukturierung der jetzt freiliegenden in Figur 9 bis 16 unteren Seite der leitenden Folie 31 erfolgen.The electronic component 6 is then placed, connected and secured in the same way on the structured film produced in this way, as shown in FIG. 11. Again, after fixing the electronic component 6 and the envelope 7, structuring of the now exposed lower side of the conductive foil 31 in FIGS. 9 to 16 can take place.

Die elektronischen Baugruppen, wie sie in Figur 13, Figur 14 und Figur 16 dargestellt sind, können dann in der gleichen Weise zu Mehrlagenbaugruppen zusammengefasst werden, wie dies bei der ersten Ausführungsform beschrieben wurde.The electronic assemblies, as shown in Figure 13, Figure 14 and Figure 16 can then be combined in the same way to multi-layer assemblies, as described in the first embodiment.

Die Figuren 17 bis 19 zeigen eine weitere Ausführungsform des von der Erfindung vorgeschlagenen Verfahrens. Ausgangspunkt ist eine harzbeschichtete leitende Folie, die in Figur 17 dargestellt ist. Diese harzbeschichtete Folie enthält eine leitende Schicht 41 , beispielsweise aus Kupfer. Mit dieser verbunden ist eine Harzschicht 42, in die von der Oberseite her Löcher 43 eingebracht werden. Figur 17 zeigt in der linken Hälfte die noch unbehandelte Folie, während in der rechten Hälfte die Löcher 43 schon hergestellt wurden.Figures 17 to 19 show a further embodiment of the of the Invention proposed method. The starting point is a resin-coated conductive foil, which is shown in FIG. This resin-coated film contains a conductive layer 41, for example made of copper. Connected to this is a resin layer 42 into which holes 43 are introduced from the top side. FIG. 17 shows in the left half the still untreated film, while in the right half the holes 43 have already been produced.

Mit dieser leitfähigen Folie 41 wird ein elektronisches Bauelement 6 verbunden, das als Anschlussstellen so genannte Bumps aufweist. Die Anordnung dieser Bumps 45 entspricht der Anordnung der Löcher 43. Das elektronische Bauelement 6 wird mit seinen Bumps 45 in die Öffnungen 43 der Folie eingepresst und erwärmt. Dadurch entsteht eine Verbindung der Bumps 45 mit der leitfähigen Folie 41. Der Kontakt kann durch das Verpressen selbst hergestellt werden.With this conductive foil 41, an electronic component 6 is connected, which has so-called bumps as connection points. The arrangement of these bumps 45 corresponds to the arrangement of the holes 43. The electronic component 6 is pressed with its bumps 45 into the openings 43 of the film and heated. This results in a connection of the bumps 45 with the conductive foil 41. The contact can be made by the compression itself.

Es ist ebenfalls möglich, die Bumps zu umschmelzen, oder aber auch die leitfähige Folie 41 mit Löchern zu versehen, in die die Spitzen der Bumps 45 eingreifen. Dann kann eine Verlötung erfolgen.It is also possible to remelt the bumps, or else to provide the conductive foil 41 with holes in which the tips of the bumps 45 engage. Then a soldering can be done.

Das in Figur 19 dargestellte Ergebnis der Verbindung zwischen dem elektronischen Bauelement 6 und der leitenden Folie 41 kann dann in der bei den vorhergehenden Ausführungsformen beschriebenen Weise weiterverarbeitet werden.The result of the connection between the electronic component 6 and the conductive foil 41 shown in FIG. 19 can then be further processed in the manner described in the preceding embodiments.

Das von der Erfindung vorgeschlagene Verfahren ermöglicht es, auf elektronischen Schaltungsträgern eine erheblich gesteigerte Flächennutzung zu verwirklichen. Es können zusätzliche Lagen mit auf engstem Raum bestückten Bauelementen hergestellt werden, sowohl aktiven als auch passiven Bauelementen. Die passiven und aktiven elektronischen Bauelemente können kostengünstig verkapselt werden, wodurch eine hohe Zuverlässigkeit erreicht wird. Es werden risikoreiche Mischtechni- ken, nämlich Löten, Kleben und Drahtbonden in der Fertigung vermieden. Durch eine planare Ausgangsstruktur lassen sich reproduzierbare HF- Übergänge verwirklichen. The method proposed by the invention makes it possible to realize a significantly increased land use on electronic circuit boards. It can be made with additional layers in a confined space components, both active and passive components. The passive and active electronic components can be encapsulated cost-effectively, whereby a high reliability is achieved. There are risky mixing techniques ken, namely soldering, gluing and wire bonding in manufacturing avoided. A planar output structure allows reproducible RF transitions to be realized.

Claims

Patentansprüche claims 1. Verfahren zum Herstellen einer elektronischen Baugruppe mit mindestens einem elektronischen Bauelement (6), mit folgenden Verfahrensschritten:1. A method for producing an electronic assembly with at least one electronic component (6), comprising the following method steps: 1.1 als Ausgangsmaterial wird eine leitfähige Folie (1 ) verwendet,1.1 as starting material a conductive foil (1) is used, 1.2 auf der leitfähigen Folie (1 ) wird das mindestens eine elektronische Bauelement (6) mit seiner aktiven Seite der Folie (1) zugewandt befestigt,1.2 on the conductive film (1), the at least one electronic component (6) with its active side of the film (1) facing attached, 1.3 die leitfähige Folie (1 ) wird mit dem daran befestigten mindestens einen elektronischen Bauelement (6) mit einem Leiterplattenträger (9) auf der Seite des mindestens einen elektronischen Bauelements (6) laminiert,1.3 the conductive foil (1) is laminated with the attached at least one electronic component (6) to a printed circuit board carrier (9) on the side of the at least one electronic component (6), 1.4 die leitfähige Folie (1 ) wird zur Bildung einer Leiterbahnenstruktur strukturiert,1.4 the conductive foil (1) is structured to form a strip conductor structure, 1.5 die Anschlüsse des mindestens einen elektronischen Bauelements (6) werden ankontaktiert.1.5 the terminals of the at least one electronic component (6) are contacted. 2. Verfahren nach Anspruch 1 , bei dem die leitfähige Folie (1 ) von der dem Leiterplattenträger (9) abgewandten Seite her zur Bildung der Leiterbahnenstruktur strukturiert wird.2. The method of claim 1, wherein the conductive foil (1) from the printed circuit board carrier (9) facing away from side to the formation of the conductor track structure is structured. 3. Verfahren nach Anspruch 1 oder 2, bei dem die Anschlüsse des mindestens einen elektronischen Bauelements (6) von der strukturierten Seite (8) der leitfähigen Folie (1 ) her ankontaktiert werden.3. The method of claim 1 or 2, wherein the terminals of the at least one electronic component (6) from the structured side (8) of the conductive foil (1) are contacted against her. 4. Verfahren nach Anspruch 1 , durchgeführt im Reel-to-Reel Verfahren.4. The method of claim 1, carried out in the reel-to-reel method. 5. Verfahren nach einem der vorhergehenden Ansprüche, bei dem das mindestens eine elektronische Bauelement (6) auf der elektrisch leitenden Folie (1 ) lokal verklebt wird. 5. The method according to any one of the preceding claims, wherein the at least one electronic component (6) on the electrically conductive film (1) is locally bonded. 6. Verfahren nach Anspruch 5, bei dem Klebstoff auf die leitende Folie (1 ) an den für das mindestens eine elektronische Bauelement (6) vorgesehenen Stellen aufgebracht wird.6. The method according to claim 5, wherein adhesive is applied to the conductive foil (1) at the locations provided for the at least one electronic component (6). 7. Verfahren nach Anspruch 5 oder 6, bei dem der Klebstoff auf die aktive Seite des elektronischen Bauelements (6) aufgebracht wird.7. The method of claim 5 or 6, wherein the adhesive is applied to the active side of the electronic component (6). 8. Verfahren nach einem der Ansprüche 5 bis 7, bei dem Abstandselemente (5) zwischen der leitfähigen Folie (1 ) und dem mindestens einen elektronischen Bauelement (6) vorgesehen werden.8. The method according to any one of claims 5 to 7, wherein the spacer elements (5) between the conductive foil (1) and the at least one electronic component (6) are provided. 9. Verfahren nach Anspruch 8, bei dem die Abstandselemente (5) dem Kleber beigefügt werden.9. The method of claim 8, wherein the spacer elements (5) are attached to the adhesive. 10. Verfahren nach Anspruch 9, bei dem durch Auswahl unterschiedlich großer Abstandselemente (5) verschiedene Dicken des Dielektrikums hergestellt werden.10. The method of claim 9, wherein by selecting different sized spacer elements (5) different thicknesses of the dielectric are produced. 11. Verfahren nach einem der vorhergehenden Ansprüche, bei dem die als Ausgangsmaterial verwendete leitende Folie eine durch eine Trägerfolie verstärkte Folie ist.11. The method according to any one of the preceding claims, wherein the conductive film used as the starting material is a reinforced by a carrier film film. 12. Verfahren nach einem der vorhergehenden Ansprüche, bei dem die leitende Folie vor dem Befestigen des elektronischen Bauelements (6) zur Bildung von Anschlusspads (23) für die Anschlüsse des elektronischen Bauelements (6) strukturiert wird.12. The method according to any one of the preceding claims, wherein the conductive film prior to attaching the electronic component (6) to form connection pads (23) for the terminals of the electronic component (6) is structured. 13. Verfahren nach Anspruch 12, bei dem das elektronische Bauelement (6) mit seinen Anschlüssen mit den Anschlusspads (23) der leitenden Folie verbunden wird. 13. The method of claim 12, wherein the electronic component (6) is connected with its terminals to the connection pads (23) of the conductive foil. 14. Verfahren nach Anspruch 12 oder 13, bei dem das elektronische Bauelement (6) mit einem leitenden Klebstoff befestigt wird.14. The method of claim 12 or 13, wherein the electronic component (6) is fixed with a conductive adhesive. 15. Verfahren nach einem der Ansprüche 12 bis 14, bei dem das elektronische Bauelement (6) mit Lot befestigt wird.15. The method according to any one of claims 12 to 14, wherein the electronic component (6) is fixed with solder. 16. Verfahren nach einem der Ansprüche 11 bis 15, bei dem nach der Befestigung des elektronischen Bauelements (6) die Trägerfolie abgezogen wird.16. The method according to any one of claims 11 to 15, wherein after the attachment of the electronic component (6), the carrier film is peeled off. 17. Verfahren nach einem der Ansprüche 10 bis 14, bei dem nach der Befestigung des mindestens einen elektronischen Bauelements (6) die Trägerfolie strukturiert wird.17. The method according to any one of claims 10 to 14, wherein after the attachment of the at least one electronic component (6), the carrier film is structured. 18. Verfahren nach einem der vorhergehenden Ansprüche, bei dem die leitende Folie nach der Befestigung des mindestens einen elektronischen Bauelements (6) strukturiert wird.18. The method according to any one of the preceding claims, wherein the conductive foil after the attachment of the at least one electronic component (6) is structured. 19. Verfahren nach einem der vorhergehenden Ansprüche, bei dem die auf der leitfähigen Folie (1 ) befestigten elektronischen Bauelemente (6) mit einem Füllmaterial umhüllt werden.19. The method according to any one of the preceding claims, wherein on the conductive foil (1) fixed electronic components (6) are enveloped with a filling material. 20. Verfahren nach Anspruch 19, bei dem mehrere elektronische Bauelemente (6) gemeinsam umhüllt werden.20. The method of claim 19, wherein a plurality of electronic components (6) are enveloped together. 21. Verfahren nach Anspruch 19 oder 20, bei dem die Umhüllung (7) zur Bildung dreidimensionaler Strukturen ausgebildet wird.21. The method according to claim 19 or 20, wherein the sheath (7) is formed to form three-dimensional structures. 22. Verfahren nach einem der vorhergehenden Ansprüche, bei dem die leitfähige Folie (1 ) vor dem Befestigen der Bauelemente (6) mit Justagemarkierungen (2) versehen wird. 22. The method according to any one of the preceding claims, wherein the conductive film (1) before attaching the components (6) with Justagemarkierungen (2) is provided. 23. Verfahren nach einem der vorhergehenden Ansprüche, bei dem die elektronische Baugruppe vor und/oder nach dem Auflaminie- ren auf den Leiterplattenträger (9) zugeschnitten wird.23. The method according to any one of the preceding claims, wherein the electronic assembly before and / or after lamination ren on the printed circuit board carrier (9) is cut. 24. Verfahren nach einem der vorhergehenden Ansprüche, bei dem Kühlkörper mit der leitfähigen Folie (1 ) und/oder mindestens einem elektronischen Bauelement (6) verbunden werden.24. The method according to any one of the preceding claims, wherein the heat sink with the conductive foil (1) and / or at least one electronic component (6) are connected. 25. Verfahren nach einem der vorhergehenden Ansprüche, bei dem mechanische Elemente mit eingebaut werden, die vorzugsweise in einer gemeinsamen Umhüllung (7) angeordnet werden.25. The method according to any one of the preceding claims, in which mechanical elements are incorporated, which are preferably arranged in a common enclosure (7). 26. Verfahren nach einem der vorhergehenden Ansprüche, bei dem die Verdrahtung der elektronischen Bauelemente (6) durch stromlose Metallabscheidung erzeugt wird.26. The method according to any one of the preceding claims, wherein the wiring of the electronic components (6) is generated by electroless metal deposition. 27. Verfahren nach einem der vorhergehenden Ansprüche, bei dem der Leiterplattenträger (9) mit einer metallischen Schicht (12) verbunden wird.27. The method according to any one of the preceding claims, wherein the printed circuit board carrier (9) with a metallic layer (12) is connected. 28. Verfahren nach Anspruch 27, bei dem zwischen den elektronischen Bauteilen (6) und/oder einem Kühlkörper und der metallischen Schicht (12) Kühlkanäle (15) ausgebildet werden.28. The method of claim 27, wherein between the electronic components (6) and / or a heat sink and the metallic layer (12) cooling channels (15) are formed. 29. Verfahren nach einem der vorhergehenden Ansprüche, bei dem mehrere mit jeweils mindestens einem elektronischen Bauelement (6) versehene leitende Folien (1 , 14) zu einem Mehrlagenaufbau zusammengefasst werden.29. The method according to any one of the preceding claims, wherein a plurality of each with at least one electronic component (6) provided conductive films (1, 14) are combined to form a multi-layer structure. 30. Verfahren nach Anspruch 29, bei dem der Mehrlagenaufbau zwei Leiterplattenträger (9) aufweist. 30. The method of claim 29, wherein the multi-layer structure comprises two printed circuit board carrier (9). 31. Verfahren nach Anspruch 30, bei dem zwischen den beiden Leiterplattenträgern (9) eine metallische Kühlschicht (12) angeordnet ist.31. The method according to claim 30, wherein between the two printed circuit board carriers (9) a metallic cooling layer (12) is arranged. 32. Verfahren nach einem der vorhergehenden Ansprüche, bei dem als Ausgangsmaterial eine harzbeschichtete Kupferfolie verwendet wird, durch deren Harzschicht Löcher gebohrt werden, durch die das mindestens eine elektronische Bauelement (6) mit Bumps (45) an der darunter liegenden leitenden Schicht befestigt wird.32. The method according to any one of the preceding claims, wherein as the starting material, a resin-coated copper foil is used, are drilled through the resin layer holes through which the at least one electronic component (6) with bumps (45) is attached to the underlying conductive layer. 33. Verfahren nach Anspruch 32, bei dem das elektronische Bauelement (6) in die gebildeten Öffnungen unter Temperatureinfluss eingepresst wird.33. The method of claim 32, wherein the electronic component (6) is pressed into the openings formed under the influence of temperature. 34. Verfahren nach Anspruch 32 oder 33, bei dem der elektrische Kontakt durch das Verpressen hergestellt wird.34. The method of claim 32 or 33, wherein the electrical contact is made by the pressing. 35. Verfahren nach Anspruch 32 oder 33, bei dem die Bumps (45) umschmolzen werden.35. The method of claim 32 or 33, wherein the bumps (45) are remelted. 36. Verfahren nach einem der Ansprüche 32 bis 35, bei dem die Kupferfolie in Verlängerung der Löcher der Harzschicht mit Löchern versehen wird, in die die Bumps (45) eingesteckt und verlötet werden.36. The method according to any one of claims 32 to 35, wherein the copper foil is provided in the extension of the holes of the resin layer with holes into which the bumps (45) are inserted and soldered. 37. Elektronische Baugruppe, enthaltend37. Electronic assembly containing 37.1 einen Leiterplattenträger (9),37.1 a printed circuit board carrier (9), 37.2 mindestens ein darin eingebettetes elektronisches Bauelement (6), sowie37.2 at least one embedded therein electronic component (6), and 37.3 eine Verdrahtungsstruktur, die37.3 a wiring structure, the 37.4 mit der aktiven Seite des elektronischen Bauelements (6) lokal verklebt ist. 37.4 is locally bonded to the active side of the electronic component (6). 38. Elektronische Baugruppe, insbesondere nach Anspruch 37, herstellbar durch ein Verfahren nach einem der Ansprüche 1 bis 36. 38. Electronic assembly, in particular according to claim 37, producible by a method according to one of claims 1 to 36.
PCT/EP2009/000727 2008-02-06 2009-02-04 Method for producing a printed circuit board Ceased WO2009098033A1 (en)

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DE102008009220A DE102008009220A1 (en) 2008-02-06 2008-02-06 Method for producing a printed circuit board
DE102008009220.7 2008-02-06

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DE102009058764A1 (en) * 2009-12-15 2011-06-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for producing an electronic assembly and electronic assembly
DE102010014579A1 (en) 2010-04-09 2011-10-13 Würth Elektronik Rot am See GmbH & Co. KG Producing electronic assembly, comprises providing electrically conductive film including support film and electrical component with electrical contact point, and forming component with electrical contact point on conductive film
DE102011089927A1 (en) * 2011-12-27 2013-06-27 Robert Bosch Gmbh Contact system with a connection means and method
US20150131240A1 (en) 2012-05-22 2015-05-14 Würth Elektronik Gmbh &Co. KG Method for Producing an Electronic Subassembly

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JP2002261449A (en) * 2000-12-27 2002-09-13 Matsushita Electric Ind Co Ltd Component built-in module and manufacturing method thereof
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