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WO2009096014A1 - Method of manufacturing head slider - Google Patents

Method of manufacturing head slider Download PDF

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Publication number
WO2009096014A1
WO2009096014A1 PCT/JP2008/051435 JP2008051435W WO2009096014A1 WO 2009096014 A1 WO2009096014 A1 WO 2009096014A1 JP 2008051435 W JP2008051435 W JP 2008051435W WO 2009096014 A1 WO2009096014 A1 WO 2009096014A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive layer
wiring
wafer
row bar
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/051435
Other languages
French (fr)
Japanese (ja)
Inventor
Woo Suk Song
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to PCT/JP2008/051435 priority Critical patent/WO2009096014A1/en
Publication of WO2009096014A1 publication Critical patent/WO2009096014A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
    • G11B5/60—Fluid-dynamic spacing of heads from record-carriers
    • G11B5/6005—Specially adapted for spacing from a rotating disc using a fluid cushion
    • G11B5/6082—Design of the air bearing surface
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
    • G11B5/3173—Batch fabrication, i.e. producing a plurality of head structures in one batch
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
    • G11B5/60—Fluid-dynamic spacing of heads from record-carriers
    • G11B5/6005—Specially adapted for spacing from a rotating disc using a fluid cushion
    • G11B5/6011—Control of flying height
    • G11B5/6064—Control of flying height using air pressure

Definitions

  • the present invention relates to a method for manufacturing a head slider, and more particularly to a method for manufacturing a head slider having a terminal portion on a surface (back surface) opposite to the air bearing surface (ABS surface) of the head slider.
  • FIG. 26A, 26B, and 27 are assembly diagrams of a head assembly (HGA) used in the magnetic disk device.
  • the head assembly is assembled by applying the adhesive 6 to the back surface (the surface opposite to the air bearing surface) of the head slider 5 (FIG. 26A) and bonding the head slider 5 to the gimbal portion 52 of the suspension 50.
  • FIG. 27 shows a state where the head assembly 5 is assembled by joining the head slider 5 to the suspension 50.
  • a terminal 7 is formed on the end surface of the head slider 5 where the element portion is formed. After joining the head slider 5 to the gimbal portion 52, the terminal 7 and the pad formed on the gimbal portion 52 are connected by the gold ball 8, thereby forming the element portion formed on the head slider 5 and the suspension 50.
  • the wiring is electrically connected.
  • a conventional head slider manufacturing process a plurality of magnetic head formation areas are set on a ceramic substrate (wafer) so as to be aligned vertically and horizontally, and in accordance with these magnetic head formation areas, a magnetic film, A single head is formed by laminating and patterning an insulating film and a conductive film to form an element portion and a connection terminal, then cutting out a row bar from the substrate, processing the air bearing surface into the row bar and dividing it into individual pieces. Got a slider.
  • the conventional head slider manufacturing method forms terminals on the surface of the head slider on which the element portion is formed, and the conventional method cannot form connection terminals on the back surface of the head slider.
  • An object of the present invention is to provide a method for manufacturing a head slider.
  • the present invention has the following configuration in order to achieve the above object. That is, a method of manufacturing a head slider comprising an element portion and a terminal portion that is provided on the back surface opposite to the air bearing surface and is electrically connected to the element portion.
  • Forming step for forming a groove in a thermally insulating wafer a conductive layer forming step for filling the groove with a first conductive layer, and forming an element portion on the wafer in which the groove is formed
  • a groove is formed in a wafer on which the head slider is to be formed. After the first conductive layer is formed by filling the groove with a conductor, an element portion is formed on the wafer. A terminal portion that is electrically connected to the element portion is formed using the conductive layer.
  • a method of manufacturing a head slider comprising: an element portion; and a terminal portion provided on the back surface opposite to the air bearing surface in electrical connection with the element portion.
  • An element portion forming step of forming an element portion on the electrically insulating wafer, a wiring forming step of forming a first wire electrically connected to the element portion on the wafer, and a cutting position of the row bar A groove forming step of forming a groove in a wafer; a conductive layer forming step of electrically connecting the inside of the groove with the first wiring and filling with a first conductive layer; and forming the first conductive layer Cutting the formed wafer perpendicularly to the wafer surface along the groove and exposing the end surface of the first conductive layer on one surface of the row bar; and processing the other surface of the row bar to form an air bearing surface.
  • a groove is formed in the wafer, a conductor is filled in the groove to form a first conductive layer, and the first conductive layer is used.
  • an element portion that is electrically connected to the element portion is formed on the back surface of the head slider. Also in this case, the end surface of the first conductive portion is exposed on the back surface of the row bar in a state where the row bar is formed, and the terminal portion and the element portion formed on the back surface of the head slider are reliably electrically connected.
  • FIG. 26A and 26B are perspective views showing a configuration of a conventional head slider and suspension. It is a perspective view which shows the structure of the conventional head assembly.
  • FIG. 1 shows a wafer 10 that is an electrically insulating substrate that forms the body of a head slider.
  • grooves 12 are formed on the wafer 10 by a groove forming process (FIG. 2).
  • the groove 12 is formed along the wafer cutting position where the device is formed on the wafer 10 and then the wafer 10 is cut to form row bars.
  • Elements are formed on the wafer 10 in vertical and horizontal alignment. Therefore, as shown in FIG. 2, the grooves 12 are formed in parallel at predetermined intervals according to the arrangement of the elements.
  • An area for cutting out a row bar is secured at a boundary position between adjacent row bars.
  • the groove 12 is formed using this region.
  • FIG. 3 is an enlarged view of portion A in FIG.
  • the groove 12 is formed so as to be cut from the element forming surface of the wafer 10 and is formed so as not to reach the back surface (the surface opposite to the element forming surface).
  • the groove 12 can be formed by mechanical grinding, laser processing, etching, or the like.
  • FIG. 4 shows a process of filling the grooves 12 formed in the wafer 10 with a conductor. Electroplating is performed by sputtering a metal such as copper on the surface of the wafer 10 where the groove 12 is open, forming a plating seed layer 14 on the surface of the wafer 10 including the inner surface of the groove 12, and using the plating seed layer as a plating power supply layer.
  • FIG. 5 shows that after filling the grooves 12 of the wafer 10 with a conductor, the surface of the wafer 10 is polished to remove the plating seed layer 14 adhering to the surface of the wafer 10 to expose the base material of the wafer 10. It is in the state. A first conductive layer 16 is formed in the groove 12.
  • FIG. 6 is an enlarged view of a portion B in FIG. The base material of the wafer 10 is exposed on the surface of the wafer 10, and a first conductive layer 16 filled with a conductor is formed in each groove 12.
  • elements are formed on the element forming surface of the wafer 10 (the surface from which the end surface of the first conductive layer 16 is exposed) (element portion forming step).
  • This element portion forming step is performed by a known method for forming a magnetic head element on a wafer.
  • a magnetic film, an insulating film, a conductive film, etc. are formed in a predetermined pattern on the surface of the wafer 10 to form a magnetic head element.
  • the element portion 18 is formed in alignment with the first conductive layer 16 formed along the row bar cutting position for cutting the wafer 10 to form a row bar.
  • FIG. 7 shows a state in which the element portion 18 is formed on the surface of the wafer 10.
  • a first wiring 19 that electrically connects the element portion 18 and the first conductive layer 16 is formed (wiring forming step).
  • wiring forming step By forming a part of the first wiring 19 on the conductive layer 16, it is possible to reliably connect electrically to a connection terminal provided on the back surface opposite to the air bearing surface described later.
  • the element portion 18 is provided with four terminals, four first wirings 19 connected to the first conductive layer 16 are formed.
  • the step of providing the first wiring 19 is not a step different from the step of forming the element portion 18 and can be included in a series of steps (film formation step) for forming the element portion 18.
  • the wafer 10 is cut perpendicularly to the wafer surface at a row bar cutting position to form a row bar (row bar forming step).
  • the position of line C in FIG. 7 is a position at which the wafer 10 is cut.
  • the wafer 10 is cut so that the first conductor layer 16 is deposited on the back surface (one surface) side of the row bar.
  • FIG. 8 shows an enlarged part of the row bar 20 cut out from the wafer 10.
  • FIG. 9 shows a state in which the other surface of the row bar 20 has been processed to process the flying surface (ABS surface) of the head slider (floating surface forming step). The figure shows the air bearing surface facing upward. The other surface of the row bar 20 is ground to process the levitating rail 22 on the air bearing surface.
  • FIG. 10 shows a process of forming the connection terminal 24 on one surface of the row bar 20 (terminal part forming process). As shown in FIG. 8, the first conductive layer 16 is deposited on the back surface of the row bar 20.
  • the first conductive layer 16 and the element portion 18 are electrically connected via the first wiring 19, the first conductive layer 16 is patterned into a predetermined pattern, and then the second conductive line 16a is connected. Thus, the element portion 18 and the terminal 24 can be electrically connected.
  • the design is such that four terminals 24 are arranged in a row at the center position in the width direction of the back surface of the head slider.
  • the patterning is performed so that the second wiring 24 a is connected to the first wiring 19, whereby the element portion 18 and the connection pad 24 are electrically connected.
  • the single head slider S is obtained by cutting into pieces from the state of the row bar 20 shown in FIG.
  • the head slider S is provided with a connection terminal 24 on the back surface opposite to the air bearing surface, and the terminal 24 is electrically connected to the element portion 18 via the first wiring 19 and the second wiring 24a.
  • the element portion 18 is formed on the wafer 10 (element portion forming step).
  • FIG. 11 shows a state in which the element portion 18 is formed on the wafer 10.
  • the step of forming the element portion 18 is the same as the conventional step of forming the element portion on the wafer 10.
  • FIG. 12 is an enlarged view showing a state in which the element portion 18 is formed on the wafer 10.
  • a portion D in the figure is a position where the wafer 10 is cut.
  • the first wiring 19 connected to the element unit 18 is formed so as to cross the cutting position D of the wafer 10 on the extending end side.
  • the first wiring 19 can be formed by being included in the process of forming the element portion 18, or can be a separate process after the element portion 18 is formed.
  • the groove 26 is formed in accordance with the cutting position when the row bar is cut out from the wafer 10 (groove forming step).
  • the groove 26 is formed so as to communicate with the entire length in the longitudinal direction of the row bar in accordance with the cutting position of the wafer 10.
  • the groove 26 can be formed by cutting, for example.
  • the reason why the grooves 26 are formed in accordance with the cutting position of the wafer is to form the grooves 26 so as to cross the first wiring 19.
  • the depth may be any depth at which the first wiring 19 is deleted.
  • FIG. 14 shows a state in which the groove 26 is filled with the first conductive layer 16 (conductive layer forming step).
  • the first wiring 19 and the first conductive layer 16 are electrically connected.
  • the first conductive layer 16 is formed by filling the groove 26 with metal by plating, vapor deposition, sputtering, or the like.
  • the element portion 18 and the first wiring 19 are protected by a resist so that when the first conductive layer 16 is formed, an electrical short circuit does not occur at an unnecessary portion.
  • FIG. 15 shows a row bar 20 obtained by cutting the wafer 10 perpendicularly to the wafer surface (row bar forming step).
  • FIG. 16 shows a state in which the second conductive layer 28 is formed on the back surface (one surface) of the row bar 20.
  • the second conductive layer 28 is formed on the entire back surface of the row bar 20 by plating, vapor deposition, sputtering, or the like.
  • the second conductive layer 28 Since the upper end surface of the first conductive layer 16 is exposed on the back surface of the row bar 20, the second conductive layer 28 is formed on the entire back surface of the row bar 20, thereby forming the upper surface of the first conductive layer 16 on the upper surface.
  • the second conductive layer 28 is directly laminated, and the first conductive layer 16 and the second conductive layer 28 are electrically connected.
  • the other surface of the row bar 20 is processed to form an air bearing surface (ABS surface) (air bearing surface forming step). This processing step is the same as the step shown in FIG.
  • the second conductive layer 28 formed on one surface (rear surface) of the row bar 20 is patterned, and the connection terminal 24 and the first wiring 19 are electrically connected to one surface of the row bar 20.
  • the second wiring 24a is formed (FIG. 17).
  • the first conductive layer 16 is also etched so as to leave only the portion connected to the first wiring 19.
  • the first wiring 19 and the second wiring 24a are electrically connected to each other through the unetched portion of the first conductive layer 16 (terminal portion forming step).
  • a small step is formed at the edge of the element formation surface of the row bar 20.
  • the first conductive layer 16 is filled in the step, and the second wiring 24 a is formed by being stacked on the first conductive layer 16.
  • the row bar 20 is cut into individual pieces to obtain a single head slider.
  • This head slider is also provided with a connection terminal 24 on the side opposite to the air bearing surface.
  • (Third embodiment) 18 to 22 show a third embodiment of the method for manufacturing a head slider according to the present invention.
  • This embodiment is a modification of the second embodiment.
  • the groove 26 when the groove 26 is processed in the wafer 10, the groove 26 is formed to communicate with the entire length of the row bar, whereas in the present embodiment, each first wiring 19 is formed.
  • the groove 30 is formed in a separately separated arrangement (groove forming step).
  • the groove 30 is formed by machining, dry etching, or the like.
  • FIG. 19 shows a state in which each groove 30 is filled with the first conductive layer 16 by plating or the like.
  • the first conductive layer 16 is formed in a pattern independent from each other so as not to be electrically short-circuited (conductive layer forming step).
  • the wafer 10 is cut to form the row bar 20.
  • FIG. 20 is an enlarged view of a part of the row bar 20.
  • the first conductive layer 16 is formed in an independent arrangement in an arrangement connected to the end of the first wiring 19 at an edge portion intersecting with the back surface of the row bar 20 on the element formation surface (row bar forming step). ).
  • the second conductive layer 28 is formed on the back surface (one surface) of the row bar 20 (FIG.
  • the second conductive layer 28 is formed on the entire back surface of the row bar 20 by plating, vapor deposition, sputtering, or the like.
  • the first conductive layer 16 is formed so that the upper end surface is flush with the back surface of the row bar 20 and is exposed on the upper end surface of the row bar 20, and thus the second conductive layer 28 is formed on the back surface of the row bar 20.
  • the second conductive layer 28 is formed in connection with the first conductive layer 16.
  • connection terminals 24 and second wiring 24 a on the back surface of the row bar 20.
  • the second wiring 24a is formed in a pattern so as to connect the connection terminal 24 and the first conductive layer 16 (terminal portion forming step).
  • a single head slider is obtained by cutting the row bar 20 into pieces. This head slider also has a connection terminal 24 formed on the surface opposite to the air bearing surface of the head slider.
  • the head slider manufacturing method according to the present invention is not limited to the manufacturing method shown in the above-described embodiment. In the first embodiment, the groove 12 is previously formed in the wafer 10 and then the first conductive layer 16 is formed.
  • the groove 12 in the wafer 10 when forming the groove 12 in the wafer 10, it is possible to set the depth of the groove 12 shallower than in the above embodiment.
  • the row bar is formed so that the end surface of the first conductive layer 16 is exposed on the back surface (one surface) of the row bar 20, and then the back surface of the row bar.
  • the second conductor layer is formed on the head slider, and the head slider can be manufactured by the same method as in the second and third embodiments described above.
  • the groove 26 is formed shallow, but the groove 26 is set to be formed deeper, and the groove 26 is filled with a conductor to form the first conductive layer.
  • the first conductive layer may be patterned to form a terminal and a second wiring connected to the first wiring on the back surface of the row bar.
  • the second conductive layer is formed on the back surface of the row bar, and the terminal and the second wiring are formed by patterning the second conductive layer.
  • the method of forming the terminal and the second wiring on the back surface of the row bar is not necessarily limited to the method of forming and patterning the second conductive layer. As long as the terminal and the second wiring can be formed by being electrically connected to the first conductive layer 16 and the first wiring 19, a method of printing the conductor or patterning the conductor into a predetermined pattern may be used. A method for forming a film can be used.
  • FIG. 23 shows an example of the head slider 40 manufactured by the head slider manufacturing method described above.
  • a flying rail 22 is formed on the flying surface (ABS surface) of the head slider 40, and a connection terminal 24 is provided on the surface opposite to the flying surface.
  • the terminal 24 is electrically connected to the element portion 18 via the first wiring 19 provided on the end surface where the element portion of the head slider 40 is formed and the second wiring 24 a provided on the back surface of the head slider 40.
  • FIG. 24 shows the configuration of the gimbal portion 52 in the suspension 50 on which the head slider 40 is mounted.
  • connection pads 52a are formed in the same plane arrangement as the connection terminals 24 provided on the head slider 40. Since the head slider 40 shown in FIG. 23 has four terminals 24, four pads 52 a are arranged on the gimbal portion 52. Each of the pads 52a is connected to a wiring for connection.
  • FIG. 25 shows a state where the head slider 40 is mounted on the gimbal portion 52. A conductive adhesive 44 is applied to the terminal 24 of the head slider 40 and the pad 52a of the gimbal portion 52, and the head slider 40 is positioned and joined to the mounting position of the gimbal portion 52 to assemble the head assembly.
  • connection terminal 24 is arranged on the back surface like the head slider 40 of the present embodiment, the entire back surface of the head slider 40 can be used as a region for forming the terminal 24 and the second wiring 24a. Even if the head slider is downsized, a sufficient space for forming the terminals can be secured. Further, it is possible to alleviate the difficulty of forming terminals that increase as the number of terminals formed on the head slider increases.

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  • Magnetic Heads (AREA)

Abstract

A method of manufacturing a head slider includes a trench formation process of forming trenches (12) in a wafer (10), a conductive layer formation process of filling the trenches (12) with a first conductive layer (16), an element portion formation process of forming element portions (18) on the wafer formed with the trenches, an interconnection formation process of forming a first interconnection (19) for electrically connecting the element portions (18) and the first conductive layer (16) to the wafer (10), a row bar formation process wherein the wafer formed with the first interconnection (19) is cut perpendicularly to the wafer plane along the trenches (12) to expose an end face of the first conductive layer (16) on one face of a row bar, a floating face formation process wherein the other face of the row bar is processed to form a floating face, and a terminal portion formation process of forming a second interconnection and a terminal portion to be electrically connected to the first interconnection on the one face of the row bar.

Description

ヘッドスライダの製造方法Manufacturing method of head slider

　本発明はヘッドスライダの製造方法に関し、とくにヘッドスライダの浮上面（ABS面）と反対側の面（裏面）に、端子部を有するヘッドスライダの製造方法に関する。 The present invention relates to a method for manufacturing a head slider, and more particularly to a method for manufacturing a head slider having a terminal portion on a surface (back surface) opposite to the air bearing surface (ABS surface) of the head slider.

　図２６Ａ、２６Ｂ、２７は、磁気ディスク装置に用いられるヘッドアセンブリ（HGA）の組み立て図を示す。ヘッドアセンブリは、ヘッドスライダ５の裏面（浮上面と反対面）に接着剤６を塗布し（図２６Ａ）、サスペンション５０のジンバル部５２に、ヘッドスライダ５を接着して組み立てられる。図２７は、サスペンション５０にヘッドスライダ５を接合してヘッドアセンブリ６０を組み立てた状態を示す。
　ヘッドスライダ５の素子部が形成された端面には端子７が形成されている。ヘッドスライダ５をジンバル部５２に接合した後、端子７とジンバル部５２に形成されたパッドとを金ボール８によって接続することにより、ヘッドスライダ５に形成された素子部とサスペンション５０に形成された配線とが電気的に接続される。
　近年は、ヘッドスライダの浮上追従特性を向上させるため、ヘッドスライダの軽量化が求められ、ヘッドスライダが徐々に小型化している。この結果ヘッドスライダに端子を形成するスペースが狭くなり、従来のようにヘッドスライダの端面に端子を形成することが困難になってきた。また、ヘッドスライダの浮上量を調節するためにヘッドスライダにヒータを組み込むことが行われるようになってきたため、ヘッドスライダに形成する端子数が増加し、これによってさらにヘッドスライダに端子を形成することが難しくなってきた。また、端子の配置間隔が狭くなることによって、ヘッドアセンブリを組み立てる工程の難易度が増している。
　このような問題を解決する方法として、ヘッドスライダの裏面に接続用の端子を設けて端子数の増加に対応できるようにする方法が考えられる。
特開昭６３－１１３９１８号公報 特開平１１－１８５２３２号公報 26A, 26B, and 27 are assembly diagrams of a head assembly (HGA) used in the magnetic disk device. The head assembly is assembled by applying the adhesive 6 to the back surface (the surface opposite to the air bearing surface) of the head slider 5 (FIG. 26A) and bonding the head slider 5 to the gimbal portion 52 of the suspension 50. FIG. 27 shows a state where the head assembly 5 is assembled by joining the head slider 5 to the suspension 50.
A terminal 7 is formed on the end surface of the head slider 5 where the element portion is formed. After joining the head slider 5 to the gimbal portion 52, the terminal 7 and the pad formed on the gimbal portion 52 are connected by the gold ball 8, thereby forming the element portion formed on the head slider 5 and the suspension 50. The wiring is electrically connected.
In recent years, in order to improve the flying follow-up characteristics of the head slider, the weight of the head slider has been demanded, and the head slider has been gradually reduced in size. As a result, the space for forming the terminal on the head slider is reduced, and it has become difficult to form the terminal on the end surface of the head slider as in the prior art. In addition, since the heater has been incorporated into the head slider in order to adjust the flying height of the head slider, the number of terminals formed on the head slider increases, thereby further forming the terminals on the head slider. Has become difficult. In addition, the difficulty in the process of assembling the head assembly is increasing due to the narrow spacing between the terminals.
As a method for solving such a problem, a method of providing a connection terminal on the back surface of the head slider so as to cope with an increase in the number of terminals can be considered.
JP-A-63-113918 Japanese Patent Laid-Open No. 11-185232

　従来のヘッドスライダの製造工程では、セラミックからなる基板（ウェハー）上に、縦横に整列させて多数個の磁気ヘッドの形成領域を設定し、これらの磁気ヘッドの形成領域に合わせて、磁性膜や絶縁膜、導電膜を積層、パターニングして素子部および接続用の端子を形成した後、基板からロウバー(row bar)を切り出し、ロウバーに浮上面を加工して個片化することによって単体のヘッドスライダを得ている。
　しかしながら、従来のヘッドスライダの製造方法は、ヘッドスライダの素子部を形成する面に端子を形成するものであり、従来方法ではヘッドスライダの裏面に接続用の端子を形成することができない。
　また、ヘッドスライダの裏面に端子を形成する場合には、ヘッドスライダの素子部とヘッドスライダの裏面に形成される端子とが確実に電気的に接続されるようにすること、また、その製造工程は量産に適する方法でなければならない。
　本発明は、これらの課題を解決すべくなされたものであり、裏面に接続用の端子を備えるヘッドスライダの量産を容易にし、ヘッドスライダの小型化、端子数の増加に容易に対応することができるヘッドスライダの製造方法を提供することを目的とする。
　本発明は、上記目的を達成するため次の構成を備える。
　すなわち、素子部と、浮上面と反対側の裏面に前記素子部と電気的に接続して設けられた端子部とを備えるヘッドスライダの製造方法であって、前記ヘッドスライダの本体を構成する電気的絶縁性のウェハーに溝を形成する溝形成工程と、前記溝内を、第１の導電層により充填する導電層形成工程と、前記溝が形成されたウェハーに素子部を形成する素子部形成工程と、前記ウェハーに前記素子部と前記第１の導電層とを電気的に接続する第１の配線を形成する配線形成工程と、該第１の配線が形成されたウェハーを前記溝に沿ってウェハー面に垂直に切断し、ロウバーの一方の面に前記第１の導電層の端面を露出させるロウバー形成工程と、ロウバーの他方の面を加工し浮上面を形成する浮上面形成工程と、ロウバーの一方の面に、前記第１の配線と電気的に接続する第２の配線および端子部を形成する端子部形成工程とを有することを特徴とする。
　このヘッドスライダの製造方法は、ヘッドスライダを形成するウェハーにまず溝を形成し、この溝に導電体を充填して第１の導電層を形成した後、ウェハーに素子部を形成し、第１の導電層を利用して素子部と電気的に接続する端子部を形成するものである。第１の導電層はウェハーを切断してロウバーを形成した状態で、ロウバーの裏面に端面が露出するから、ロウバーの裏面に第２の配線を形成する方法によって、素子部と端子部とが確実に電気的に接続される。
　ウェハーに溝加工を施し、ロウバーの裏面に第２の配線および端子部を形成することは、ヘッドスライダの製造に利用される従来方法を適用するものであり、ヘッドスライダの量産にも適している。
　また、素子部と、浮上面と反対側の裏面に前記素子部と電気的に接続して設けられた端子部とを備えるヘッドスライダの製造方法であって、前記ヘッドスライダの本体を構成する電気的絶縁性のウェハーに素子部を形成する素子部形成工程と、前記ウェハーに、前記素子部と電気的に接続する第１の配線を形成する配線形成工程と、前記ロウバーの切断位置に沿ってウェハーに溝を形成する溝形成工程と、前記溝内を、前記第１の配線と電気的に接続して第１の導電層により充填する導電層形成工程と、前記第１の導電層が形成されたウェハーを前記溝に沿ってウェハー面に垂直に切断し、ロウバーの一方の面に前記第１の導電層の端面を露出させるロウバー形成工程と、ロウバーの他方の面を加工し浮上面を形成する浮上面形成工程と、ロウバーの一方の面に、前記第１の配線と電気的に接続する第２の配線および端子部を形成する端子部形成工程とを有することを特徴とする。
　このヘッドスライダの製造方法は、ウェハーに素子部を形成した後に、ウェハーに溝を形成し、この溝に導電体を充填して第１の導電層を形成し、第１の導電層を利用して素子部と電気的に接続する素子部をヘッドスライダの裏面に形成する方法である。この場合も、ロウバーを形成した状態で第１の導電部の端面がロウバーの裏面に露出し、ヘッドスライダの裏面に形成する端子部と素子部とが確実に電気的に接続される。 In a conventional head slider manufacturing process, a plurality of magnetic head formation areas are set on a ceramic substrate (wafer) so as to be aligned vertically and horizontally, and in accordance with these magnetic head formation areas, a magnetic film, A single head is formed by laminating and patterning an insulating film and a conductive film to form an element portion and a connection terminal, then cutting out a row bar from the substrate, processing the air bearing surface into the row bar and dividing it into individual pieces. Got a slider.
However, the conventional head slider manufacturing method forms terminals on the surface of the head slider on which the element portion is formed, and the conventional method cannot form connection terminals on the back surface of the head slider.
In addition, when forming the terminal on the back surface of the head slider, ensure that the element portion of the head slider and the terminal formed on the back surface of the head slider are securely electrically connected, and the manufacturing process thereof. Must be suitable for mass production.
The present invention has been made to solve these problems, and facilitates mass production of head sliders having connection terminals on the back surface, and can easily cope with downsizing of the head slider and increase in the number of terminals. An object of the present invention is to provide a method for manufacturing a head slider.
The present invention has the following configuration in order to achieve the above object.
That is, a method of manufacturing a head slider comprising an element portion and a terminal portion that is provided on the back surface opposite to the air bearing surface and is electrically connected to the element portion. Forming step for forming a groove in a thermally insulating wafer, a conductive layer forming step for filling the groove with a first conductive layer, and forming an element portion on the wafer in which the groove is formed A step of forming a first wiring for electrically connecting the element portion and the first conductive layer to the wafer, and a wafer on which the first wiring is formed along the groove. A row bar forming step of cutting the wafer bar perpendicularly to the wafer surface and exposing an end surface of the first conductive layer on one side of the row bar; and a floating surface forming step of processing the other side of the row bar to form an air bearing surface; On one side of the row bar, the first And having its terminal portion forming step of forming a second wiring and a terminal portion for wiring and electrically connected.
In the method of manufacturing the head slider, first, a groove is formed in a wafer on which the head slider is to be formed. After the first conductive layer is formed by filling the groove with a conductor, an element portion is formed on the wafer. A terminal portion that is electrically connected to the element portion is formed using the conductive layer. Since the end surface of the first conductive layer is exposed on the back surface of the row bar in a state where the wafer is cut and the row bar is formed, the element portion and the terminal portion are reliably formed by forming the second wiring on the back surface of the row bar. Is electrically connected.
Applying a groove to the wafer and forming the second wiring and terminal portion on the back surface of the row bar applies a conventional method used for manufacturing the head slider, and is also suitable for mass production of the head slider. .
A method of manufacturing a head slider, comprising: an element portion; and a terminal portion provided on the back surface opposite to the air bearing surface in electrical connection with the element portion. An element portion forming step of forming an element portion on the electrically insulating wafer, a wiring forming step of forming a first wire electrically connected to the element portion on the wafer, and a cutting position of the row bar A groove forming step of forming a groove in a wafer; a conductive layer forming step of electrically connecting the inside of the groove with the first wiring and filling with a first conductive layer; and forming the first conductive layer Cutting the formed wafer perpendicularly to the wafer surface along the groove and exposing the end surface of the first conductive layer on one surface of the row bar; and processing the other surface of the row bar to form an air bearing surface. An air bearing surface forming step to be formed; On one side of the bar, and having a terminal portion forming step of forming a second wiring and a terminal portion for connecting said first wiring electrically.
In this method of manufacturing a head slider, after forming an element portion on a wafer, a groove is formed in the wafer, a conductor is filled in the groove to form a first conductive layer, and the first conductive layer is used. In this method, an element portion that is electrically connected to the element portion is formed on the back surface of the head slider. Also in this case, the end surface of the first conductive portion is exposed on the back surface of the row bar in a state where the row bar is formed, and the terminal portion and the element portion formed on the back surface of the head slider are reliably electrically connected.

ウェハーの斜視図である。It is a perspective view of a wafer. ウェハーに溝を形成した状態の斜視図である。It is a perspective view in the state where a groove was formed in a wafer. ウェハーに溝を形成した状態を拡大して示す斜視図である。It is a perspective view which expands and shows the state which formed the groove | channel in the wafer. ウェハーの表面にめっきシード層を形成して第１の導電層を形成する工程を示す斜視図である。It is a perspective view which shows the process of forming a plating seed layer on the surface of a wafer and forming a 1st conductive layer. ウェハーに第１の導電層を形成した状態の斜視図である。It is a perspective view in the state where the 1st conductive layer was formed in the wafer. ウェハーに第１の導電層を形成した状態を拡大して示す斜視図である。It is a perspective view which expands and shows the state in which the 1st conductive layer was formed in the wafer. ウェハーに素子部を形成した状態を拡大して示す斜視図である。It is a perspective view which expands and shows the state in which the element part was formed in the wafer. ウェハーを切断して得られたロウバーの斜視図である。It is a perspective view of a row bar obtained by cutting a wafer. ロウバーの浮上面を加工した状態の斜視図である。It is a perspective view of the state which processed the floating surface of a row bar. ロウバーの裏面に端子と第２の配線を形成した状態の斜視図である。It is a perspective view in the state where the terminal and the second wiring were formed on the back surface of the row bar. ウェハーに素子部を形成した状態の正面図である。It is a front view of the state which formed the element part in the wafer. 第１の配線を形成した状態を拡大して示す斜視図である。It is a perspective view which expands and shows the state in which the 1st wiring was formed. ウェハーに溝を形成した状態を拡大して示す斜視図である。It is a perspective view which expands and shows the state which formed the groove | channel in the wafer. 溝に第１の導電層を形成した状態を示す斜視図である。It is a perspective view which shows the state which formed the 1st conductive layer in the groove | channel. ウェハーから切り出したロウバーの斜視図である。It is a perspective view of the row bar cut out from the wafer. ロウバーの裏面に第２の導電層を形成した状態の斜視図である。It is a perspective view in the state where the 2nd conductive layer was formed in the back of a row bar. ロウバーの裏面に端子と第２の配線を形成した状態の斜視図である。It is a perspective view in the state where the terminal and the second wiring were formed on the back surface of the row bar. ウェハーに凹部を形成した状態を拡大して示す斜視図である。It is a perspective view which expands and shows the state which formed the recessed part in the wafer. 凹部に第１の導電層を形成した状態の斜視図である。It is a perspective view in the state where the 1st conductive layer was formed in the crevice. ウェハーから切り出したロウバーの斜視図である。It is a perspective view of the row bar cut out from the wafer. ロウバーの裏面に第２の導電層を形成した状態の斜視図である。It is a perspective view in the state where the 2nd conductive layer was formed in the back of a row bar. ロウバーの裏面に端子と第２の配線を形成した状態の斜視図である。It is a perspective view in the state where the terminal and the second wiring were formed on the back surface of the row bar. ヘッドスライダの斜視図である。It is a perspective view of a head slider. サスペンションのジンバル部の構成を示す斜視図である。It is a perspective view which shows the structure of the gimbal part of a suspension. ジンバル部にヘッドスライダを搭載したヘッドアセンブリの斜視図である。It is a perspective view of the head assembly which mounted the head slider in the gimbal part. 図２６Ａ、Ｂは、従来のヘッドスライダとサスペンションの構成を示す斜視図である。26A and 26B are perspective views showing a configuration of a conventional head slider and suspension. 従来のヘッドアセンブリの構成を示す斜視図である。It is a perspective view which shows the structure of the conventional head assembly.

（第１の実施の形態）
　図１～１０は、本発明に係るヘッドスライダの製造方法についての第１の実施の形態を示す。
　図１は、ヘッドスライダの本体を形成する、電気的絶縁性の基板であるウェハー１０を示す。このウェハー１０に、まず溝形成工程により溝１２を形成する（図２）。溝１２はウェハー１０に素子を形成した後、ウェハー１０を切断してロウバーを形成するウェハーの切断位置に沿って形成する。ウェハー１０には縦横に整列して素子が形成される。したがって、溝１２は、図２に示すように、素子の配列に合わせて所定間隔で平行に形成される。隣接するロウバーの境界位置には、ロウバーを切り出すための領域が確保されている。この領域を利用して溝１２を形成する。
　図３は、図２のＡ部分を拡大して示す。溝１２は、ウェハー１０の素子形成面から切り込みを入れるように形成し、裏面（素子形成面とは反対面）までは達しないように形成する。溝１２は、機械的な研削加工、レーザ加工、エッチング加工等によって形成できる。　図４は、ウェハー１０に形成した溝１２を導電体によって充填する工程を示す。ウェハー１０の溝１２が開口する面側に銅等の金属をスパッタリングし、溝１２の内面を含めてウェハー１０の表面にめっきシード層１４を形成し、めっきシード層をめっき給電層とする電解めっきを施して、溝１２を銅等の導電体によって充填する（導電層形成工程）。
　図５は、ウェハー１０の溝１２を導電体によって充填した後、ウェハー１０の表面を研磨してウェハー１０の表面に付着しているめっきシード層１４を除去し、ウェハー１０の基材を露出させた状態である。溝１２には第１の導電層１６が形成される。
　図６は、図５のＢ部分を拡大して示している。ウェハー１０の表面にウェハー１０の基材が露出し、各々の溝１２に導電体が充填された第１の導電層１６が形成されている。
　このようにウェハー１０に第１の導電層１６を形成した後、ウェハー１０の素子形成面（第１の導電層１６の端面が露出する面）に素子を形成する（素子部形成工程）。
　この素子部形成工程は、ウェハー上に磁気ヘッド素子を形成する公知の方法による。ウェハー１０の表面に磁性膜、絶縁膜、導電膜等を所定パターンに形成して磁気ヘッド素子を形成する。素子部１８は、ウェハー１０を切断してロウバーを形成するロウバーの切断位置に沿って形成されている第１の導電層１６に合わせて整列して形成される。
　図７は、ウェハー１０の表面に素子部１８を形成した状態を示す。素子部１８を形成する工程に続いて、素子部１８と第１の導電層１６とを電気的に接続する第１の配線１９を形成する（配線形成工程）。第１の配線１９の一部を導電層１６上に形成することで、後述する浮上面とは反対側の裏面に設けられる接続用の端子と確実に電気的に接続することができる。本実施形態では素子部１８に４端子を設ける構成としているから、第１の導電層１６に接続する第１の配線１９は、４本形成する。
　なお、この第１の配線１９を設ける工程は素子部１８を形成する工程とは別工程とせず、素子部１８を形成する一連の工程（成膜工程）に含めることもできる。
　ウェハー１０に素子部１８を形成した後、ウェハー１０をロウバーの切断位置で、ウェハー面に垂直に切断してロウバーを形成する（ロウバー形成工程）。図７のＣ線の位置がウェハー１０を切断する位置である。ウェハー１０を切断してロウバーを形成する際には、ロウバーの裏面（一方の面）側に第１の導体層１６が被着されるように切断する。
　図８は、ウェハー１０から切り出ししたロウバー２０の一部を拡大して示す。
　図７のＣ線の位置でウェハー１０を切断することによって、ヘッドスライダの一方の面に第１の導電層１６が被着した状態でロウバー２０が得られる。ロウバー２０の素子形成面には、素子部１８と素子部１８と第１の導電層１６とを電気的に接続する第１の配線１９が形成されている。
　図９は、ロウバー２０の他方の面を加工してヘッドスライダの浮上面（ABS面）を加工した状態を示す（浮上面形成工程）。図は浮上面を上側に向けて示している。ロウバー２０の他方の面を研削加工して、浮上面に浮上用のレール２２を加工する。
　図１０は、ロウバー２０の一方の面に接続用の端子２４を形成する工程である（端子部形成工程）。図８に示したように、ロウバー２０の裏面には第１の導電層１６が被着形成されている。第１の導電層１６と素子部１８とは第１の配線１９を介して電気的に接続されているから、第１の導電層１６を所定パターンにパターニングすることによって第２の配線２４ａを介して素子部１８と端子２４とを電気的に接続することができる。
　本実施形態では、ヘッドスライダの裏面の幅方向の中央位置に４つの端子２４を一列に配置したデザインとしている。第１の導電層１６をパターニングする際に、第２の配線２４ａが第１の配線１９に接続するようにパターニングすることによって、素子部１８と接続用のパッド２４とが電気的に接続されるようにすることができる。
　単体のヘッドスライダＳは、図１０に示したロウバー２０の状態から個片に切断することによって得られる。このヘッドスライダＳは、浮上面とは反対側の裏面に接続用の端子２４が設けられ、端子２４が第１の配線１９および第２の配線２４ａを介して素子部１８と電気的に接続されたものとなる。
（第２の実施の形態）
　図１１～１７は、本発明に係るヘッドスライダの製造方法についての第２の実施の形態を示す。
　本実施の形態においては、まずウェハー１０に素子部１８を形成する（素子部形成工程）。図１１は、ウェハー１０に素子部１８を形成した状態を示す。
　この素子部１８を形成する工程は、ウェハー１０に素子部を形成する従来の工程と同様である。ただし、この素子部形成工程においては、ウェハー１０を切断してロウバーを形成する切断位置にまで素子部１８から第１の配線１９が延出するように形成する（配線形成工程）。
　図１２に、ウェハー１０に素子部１８を形成した状態を拡大して示す。図のＤ部分が、ウェハー１０を切断する位置である。素子部１８に接続する第１の配線１９は、その延出端側でウェハー１０の切断位置Ｄを横切るように形成する。
　第１の配線１９は、素子部１８を形成する工程に含めて形成することもできるし、素子部１８を形成した後の別工程とすることもできる。
　図１３は、ウェハー１０からロウバーを切り出す際の切断位置に合わせて溝２６を形成した状態を示す（溝形成工程）。本実施形態では、ウェハー１０の切断位置に合わせて、ロウバーの長手方向の全長にわたって連通するように溝２６を形成している。溝２６は、たとえば切削加工によって形成することができる。
　溝２６をウェハーの切断位置に合わせて形成しているのは、第１の配線１９を横切るようにして溝２６を形成するためである。溝２６を加工する際には、第１の配線１９が削除される深さであればよい。溝２６を形成したことによって、溝２６の縁部に第１の配線１９の端縁が臨む配置となる。
　図１４は、溝２６を第１の導電層１６によって充填した状態を示す（導電層形成工程）。溝２６を第１の導電層１６によって充填したことによって、第１の配線１９と第１の導電層１６とが電気的に接続される。第１の導電層１６は、めっき、蒸着、スパッタリング等により、溝２６に金属を充填して形成する。素子部１８および第１の配線１９をレジストにより保護し、第１の導電層１６を形成した際に、不要個所で電気的な短絡が生じないようにする。
　図１５は、ウェハー１０をウェハー面に垂直に切断して得られたロウバー２０を示す（ロウバー形成工程）。ウェハー１０を切断する際には、第１の導電層１６の上端面がロウバー２０の裏面に露出するように切断する。これによって、ロウバー２０の素子形成面が裏面と交差する縁部に沿って第１の導電層１６が形成される。第１の導電層１６の上端面はロウバー２０の裏面と面一となる。
　図１６は、ロウバー２０の裏面（一方の面）に第２の導電層２８を形成した状態を示す。第２の導電層２８はめっき、蒸着、スパッタリング等により、ロウバー２０の裏面の全面に形成する。第１の導電層１６の上端面がロウバー２０の裏面に露出しているから、ロウバー２０の裏面の全面に第２の導電層２８を形成することにより、第１の導電層１６の上端面に第２の導電層２８が直接、積層され、第１の導電層１６と第２の導電層２８とが電気的に接続される。
　次いで、ロウバー２０の他方の面を加工して浮上面（ABS面）を形成する（浮上面形成工程）。この加工工程は、図９に示した工程と同様である。
　次いで、ロウバー２０の一方の面（裏面）に形成した第２の導電層２８をパターニングし、ロウバー２０の一方の面に接続用の端子２４と、第１の配線１９と電気的に接続される第２の配線２４ａを形成する（図１７）。第２の導電層２８をパターニングする際には、第１の導電層１６についても第１の配線１９に接続する部位のみを残すようにエッチングする。これによって、第１の配線１９と第２の配線２４ａとが第１の導電層１６のエッチング残し部を介して電気的に接続するようにする（端子部形成工程）。
　第１の導電層１６をエッチングして除去したことによって、ロウバー２０の素子形成面の縁部には小さい段差が形成される。第１の導電層１６を残した部位については、段差に第１の導電層１６が充填され、第１の導電層１６に積層して第２の配線２４ａが形成されている。
　次いで、ロウバー２０を個片に切断して、単体のヘッドスライダが得られる。このヘッドスライダも、浮上面の反対面側に接続用の端子２４が設けられたものである。
（第３の実施の形態）
　図１８～２２は、本発明に係るヘッドスライダの製造方法についての第３の実施の形態を示す。本実施の形態は、第２の実施の形態の変形例である。
　第２の実施の形態においては、ウェハー１０に溝２６を加工する際に、ロウバーの全長にわたって溝２６が連通するように形成したのに対して、本実施形態では、各々の第１の配線１９の端部に接続して、個別に分離した配置に溝３０を形成する（溝形成工程）。溝３０は、機械加工、ドライエッチング等によって形成する。
　ウェハー１０上に第１の配線１９を形成する際には、溝３０が形成される位置まで第１の配線１９の端部を延出させ、溝３０を形成した際に溝３０の縁部に第１の配線１９の端部が臨むようにする（配線形成工程）。
　図１９は、各々の溝３０に、めっき等により第１の導電層１６を充填して形成した状態を示す。第１の導電層１６は電気的に短絡しないように、互いに独立したパターンに形成する（導電層形成工程）。
　次に、ウェハー１０を切断してロウバー２０を形成する。図２０は、ロウバー２０の一部を拡大して示したものである。素子形成面のロウバー２０の裏面と交差する縁部に、第１の配線１９の端部に接続した配置に、個々に独立した配置に第１の導電層１６が形成されている（ロウバー形成工程）。
　次に、ロウバー２０の裏面（一方の面）に第２の導電層２８を形成する（図２１）。第２の導電層２８はロウバー２０の裏面の全面に、めっき、蒸着、スパッタリング等によって形成する。第１の導電層１６は、上端面をロウバー２０の裏面と面一に、ロウバー２０の上端面に露出して形成されているから、ロウバー２０の裏面に第２の導電層２８を形成することにより、第１の導電層１６に接続して第２の導電層２８が形成される。第１の導電層１６の端面をロウバー２０の裏面に露出させることで、第１の導電層１６と第２の導電層２８との電気的接続が確実になされる。
　次いで、ロウバー２０の他方の面を加工して浮上面を形成する（浮上面形成工程）。
　図２２は、ロウバー２０の一方の面（裏面）に被着形成された第２の導電層２８をエッチングして、ロウバー２０の裏面に接続用の端子２４と第２の配線２４ａを形成した状態を示す。第２の配線２４ａは、接続用の端子２４と第１の導電層１６とを接続するようにパターン形成する（端子部形成工程）。
　ロウバー２０を個片に切断することによって単体のヘッドスライダが得られる。このヘッドスライダも、ヘッドスライダの浮上面の反対側の面に接続用の端子２４が形成されたものとなる。
　なお、本発明に係るヘッドスライダの製造方法は、上述した実施形態において示した製造方法に限定されるものではない。
　第１の実施の形態においては、ウェハー１０にあらかじめ溝１２を形成してから第１の導電層１６を形成した。この方法においてもウェハー１０に溝１２を形成する際に、上記実施形態にくらべて、溝１２の深さを浅く設定することも可能である。この場合には、溝に第１の導電層１６を形成した後、第１の導電層１６の端面がロウバー２０の裏面（一方の面）に露出するようにロウバーを形成した後、ロウバーの裏面に第２の導体層を形成し、上述した第２、第３の実施の形態と同様の方法によってヘッドスライダを製造することができる。
　また、第２の実施の形態においては、溝２６を浅く形成したが、溝２６をより深く形成するように設定し、溝２６に導電体を充填して第１の導電層を形成することにより、第１の導電層をパターニングしてロウバーの裏面に、端子と、第１の配線に接続する第２の配線を形成することもできる。
　また、第２、第３の実施形態においては、ロウバーの裏面に第２の導電層を形成し、この第２の導電層をパターニングして端子と第２の配線を形成した。ロウバーの裏面に端子と第２の配線を形成する方法は、必ずしも第２の導電層を形成してパターニングする方法に限るものではない。第１の導電層１６、第１の配線１９と電気的に接続して端子および第２の配線が形成できる方法であれば、導電体を印刷する方法や、導電体を所定パターンにパターン形成して成膜する方法等を利用することができる。
　また、上記実施形態ではヘッドスライダに４個の端子を形成する例について説明したが、４個以上の端子を形成する場合についてもまったく同様に適用することができる。
（ヘッドアセンブリ）
　図２３は、上述したヘッドスライダの製造方法によって製造したヘッドスライダ４０の例を示す。ヘッドスライダ４０の浮上面（ABS面）に浮上用のレール２２が形成され、浮上面と反対側の面に接続用の端子２４が設けられている。端子２４は、ヘッドスライダ４０の素子部が形成された端面に設けられた第１の配線１９と、ヘッドスライダ４０の裏面に設けられた第２の配線２４ａを介して素子部１８に電気的に接続する。
　図２４は、ヘッドスライダ４０を搭載するサスペンション５０におけるジンバル部５２の構成を示す。ジンバル部５２には、ヘッドスライダ４０に設けられた接続用の端子２４と同一の平面配置に接続用のパッド５２ａが形成されている。図２３に示すヘッドスライダ４０では４つの端子２４を設けているから、ジンバル部５２には４つのパッド５２ａが配されている。これらのパッド５２ａには、各々接続用の配線が接続される。
　図２５は、ジンバル部５２にヘッドスライダ４０を搭載した状態を示す。ヘッドスライダ４０の端子２４と、ジンバル部５２のパッド５２ａにそれぞれ導電性接着剤４４を塗布し、ヘッドスライダ４０をジンバル部５２の搭載位置に位置合わせして接合することによりヘッドアセンブリが組み立てられる。
　本実施形態のヘッドスライダ４０のように、裏面に接続用の端子２４を配する構成とすれば、ヘッドスライダ４０の裏面の全面を端子２４と第２の配線２４ａを形成する領域として利用できるから、ヘッドスライダが小型化しても、端子を形成するスペースを十分に確保することができる。また、ヘッドスライダに形成する端子数が増えることによって増大する端子を形成する困難さを緩和することが可能となる。
 
 
  (First embodiment)
1 to 10 show a first embodiment of a method for manufacturing a head slider according to the present invention.
FIG. 1 shows a wafer 10 that is an electrically insulating substrate that forms the body of a head slider. First, grooves 12 are formed on the wafer 10 by a groove forming process (FIG. 2). The groove 12 is formed along the wafer cutting position where the device is formed on the wafer 10 and then the wafer 10 is cut to form row bars. Elements are formed on the wafer 10 in vertical and horizontal alignment. Therefore, as shown in FIG. 2, the grooves 12 are formed in parallel at predetermined intervals according to the arrangement of the elements. An area for cutting out a row bar is secured at a boundary position between adjacent row bars. The groove 12 is formed using this region.
FIG. 3 is an enlarged view of portion A in FIG. The groove 12 is formed so as to be cut from the element forming surface of the wafer 10 and is formed so as not to reach the back surface (the surface opposite to the element forming surface). The groove 12 can be formed by mechanical grinding, laser processing, etching, or the like. FIG. 4 shows a process of filling the grooves 12 formed in the wafer 10 with a conductor. Electroplating is performed by sputtering a metal such as copper on the surface of the wafer 10 where the groove 12 is open, forming a plating seed layer 14 on the surface of the wafer 10 including the inner surface of the groove 12, and using the plating seed layer as a plating power supply layer. Then, the grooves 12 are filled with a conductor such as copper (conductive layer forming step).
FIG. 5 shows that after filling the grooves 12 of the wafer 10 with a conductor, the surface of the wafer 10 is polished to remove the plating seed layer 14 adhering to the surface of the wafer 10 to expose the base material of the wafer 10. It is in the state. A first conductive layer 16 is formed in the groove 12.
FIG. 6 is an enlarged view of a portion B in FIG. The base material of the wafer 10 is exposed on the surface of the wafer 10, and a first conductive layer 16 filled with a conductor is formed in each groove 12.
After forming the first conductive layer 16 on the wafer 10 in this way, elements are formed on the element forming surface of the wafer 10 (the surface from which the end surface of the first conductive layer 16 is exposed) (element portion forming step).
This element portion forming step is performed by a known method for forming a magnetic head element on a wafer. A magnetic film, an insulating film, a conductive film, etc. are formed in a predetermined pattern on the surface of the wafer 10 to form a magnetic head element. The element portion 18 is formed in alignment with the first conductive layer 16 formed along the row bar cutting position for cutting the wafer 10 to form a row bar.
FIG. 7 shows a state in which the element portion 18 is formed on the surface of the wafer 10. Following the step of forming the element portion 18, a first wiring 19 that electrically connects the element portion 18 and the first conductive layer 16 is formed (wiring forming step). By forming a part of the first wiring 19 on the conductive layer 16, it is possible to reliably connect electrically to a connection terminal provided on the back surface opposite to the air bearing surface described later. In the present embodiment, since the element portion 18 is provided with four terminals, four first wirings 19 connected to the first conductive layer 16 are formed.
Note that the step of providing the first wiring 19 is not a step different from the step of forming the element portion 18 and can be included in a series of steps (film formation step) for forming the element portion 18.
After the element portion 18 is formed on the wafer 10, the wafer 10 is cut perpendicularly to the wafer surface at a row bar cutting position to form a row bar (row bar forming step). The position of line C in FIG. 7 is a position at which the wafer 10 is cut. When the wafer 10 is cut to form a row bar, the wafer 10 is cut so that the first conductor layer 16 is deposited on the back surface (one surface) side of the row bar.
FIG. 8 shows an enlarged part of the row bar 20 cut out from the wafer 10.
By cutting the wafer 10 at the position of line C in FIG. 7, the row bar 20 is obtained in a state where the first conductive layer 16 is deposited on one surface of the head slider. On the element formation surface of the row bar 20, the first wiring 19 that electrically connects the element portion 18, the element portion 18, and the first conductive layer 16 is formed.
FIG. 9 shows a state in which the other surface of the row bar 20 has been processed to process the flying surface (ABS surface) of the head slider (floating surface forming step). The figure shows the air bearing surface facing upward. The other surface of the row bar 20 is ground to process the levitating rail 22 on the air bearing surface.
FIG. 10 shows a process of forming the connection terminal 24 on one surface of the row bar 20 (terminal part forming process). As shown in FIG. 8, the first conductive layer 16 is deposited on the back surface of the row bar 20. Since the first conductive layer 16 and the element portion 18 are electrically connected via the first wiring 19, the first conductive layer 16 is patterned into a predetermined pattern, and then the second conductive line 16a is connected. Thus, the element portion 18 and the terminal 24 can be electrically connected.
In this embodiment, the design is such that four terminals 24 are arranged in a row at the center position in the width direction of the back surface of the head slider. When the first conductive layer 16 is patterned, the patterning is performed so that the second wiring 24 a is connected to the first wiring 19, whereby the element portion 18 and the connection pad 24 are electrically connected. Can be.
The single head slider S is obtained by cutting into pieces from the state of the row bar 20 shown in FIG. The head slider S is provided with a connection terminal 24 on the back surface opposite to the air bearing surface, and the terminal 24 is electrically connected to the element portion 18 via the first wiring 19 and the second wiring 24a. It will be.
(Second Embodiment)
11 to 17 show a second embodiment of the method for manufacturing the head slider according to the present invention.
In the present embodiment, first, the element portion 18 is formed on the wafer 10 (element portion forming step). FIG. 11 shows a state in which the element portion 18 is formed on the wafer 10.
The step of forming the element portion 18 is the same as the conventional step of forming the element portion on the wafer 10. However, in this element part formation process, it forms so that the 1st wiring 19 may be extended from the element part 18 to the cutting position which cut | disconnects the wafer 10 and forms a row bar (wiring formation process).
FIG. 12 is an enlarged view showing a state in which the element portion 18 is formed on the wafer 10. A portion D in the figure is a position where the wafer 10 is cut. The first wiring 19 connected to the element unit 18 is formed so as to cross the cutting position D of the wafer 10 on the extending end side.
The first wiring 19 can be formed by being included in the process of forming the element portion 18, or can be a separate process after the element portion 18 is formed.
FIG. 13 shows a state in which the groove 26 is formed in accordance with the cutting position when the row bar is cut out from the wafer 10 (groove forming step). In this embodiment, the groove 26 is formed so as to communicate with the entire length in the longitudinal direction of the row bar in accordance with the cutting position of the wafer 10. The groove 26 can be formed by cutting, for example.
The reason why the grooves 26 are formed in accordance with the cutting position of the wafer is to form the grooves 26 so as to cross the first wiring 19. When the groove 26 is processed, the depth may be any depth at which the first wiring 19 is deleted. By forming the groove 26, the edge of the first wiring 19 faces the edge of the groove 26.
FIG. 14 shows a state in which the groove 26 is filled with the first conductive layer 16 (conductive layer forming step). By filling the groove 26 with the first conductive layer 16, the first wiring 19 and the first conductive layer 16 are electrically connected. The first conductive layer 16 is formed by filling the groove 26 with metal by plating, vapor deposition, sputtering, or the like. The element portion 18 and the first wiring 19 are protected by a resist so that when the first conductive layer 16 is formed, an electrical short circuit does not occur at an unnecessary portion.
FIG. 15 shows a row bar 20 obtained by cutting the wafer 10 perpendicularly to the wafer surface (row bar forming step). When the wafer 10 is cut, the upper end surface of the first conductive layer 16 is cut so as to be exposed on the back surface of the row bar 20. Thus, the first conductive layer 16 is formed along the edge where the element formation surface of the row bar 20 intersects the back surface. The upper end surface of the first conductive layer 16 is flush with the back surface of the row bar 20.
FIG. 16 shows a state in which the second conductive layer 28 is formed on the back surface (one surface) of the row bar 20. The second conductive layer 28 is formed on the entire back surface of the row bar 20 by plating, vapor deposition, sputtering, or the like. Since the upper end surface of the first conductive layer 16 is exposed on the back surface of the row bar 20, the second conductive layer 28 is formed on the entire back surface of the row bar 20, thereby forming the upper surface of the first conductive layer 16 on the upper surface. The second conductive layer 28 is directly laminated, and the first conductive layer 16 and the second conductive layer 28 are electrically connected.
Next, the other surface of the row bar 20 is processed to form an air bearing surface (ABS surface) (air bearing surface forming step). This processing step is the same as the step shown in FIG.
Next, the second conductive layer 28 formed on one surface (rear surface) of the row bar 20 is patterned, and the connection terminal 24 and the first wiring 19 are electrically connected to one surface of the row bar 20. The second wiring 24a is formed (FIG. 17). When the second conductive layer 28 is patterned, the first conductive layer 16 is also etched so as to leave only the portion connected to the first wiring 19. As a result, the first wiring 19 and the second wiring 24a are electrically connected to each other through the unetched portion of the first conductive layer 16 (terminal portion forming step).
By removing the first conductive layer 16 by etching, a small step is formed at the edge of the element formation surface of the row bar 20. At the portion where the first conductive layer 16 is left, the first conductive layer 16 is filled in the step, and the second wiring 24 a is formed by being stacked on the first conductive layer 16.
Next, the row bar 20 is cut into individual pieces to obtain a single head slider. This head slider is also provided with a connection terminal 24 on the side opposite to the air bearing surface.
(Third embodiment)
18 to 22 show a third embodiment of the method for manufacturing a head slider according to the present invention. This embodiment is a modification of the second embodiment.
In the second embodiment, when the groove 26 is processed in the wafer 10, the groove 26 is formed to communicate with the entire length of the row bar, whereas in the present embodiment, each first wiring 19 is formed. The groove 30 is formed in a separately separated arrangement (groove forming step). The groove 30 is formed by machining, dry etching, or the like.
When forming the first wiring 19 on the wafer 10, the end of the first wiring 19 is extended to the position where the groove 30 is formed, and at the edge of the groove 30 when the groove 30 is formed. The end portion of the first wiring 19 faces (wiring forming step).
FIG. 19 shows a state in which each groove 30 is filled with the first conductive layer 16 by plating or the like. The first conductive layer 16 is formed in a pattern independent from each other so as not to be electrically short-circuited (conductive layer forming step).
Next, the wafer 10 is cut to form the row bar 20. FIG. 20 is an enlarged view of a part of the row bar 20. The first conductive layer 16 is formed in an independent arrangement in an arrangement connected to the end of the first wiring 19 at an edge portion intersecting with the back surface of the row bar 20 on the element formation surface (row bar forming step). ).
Next, the second conductive layer 28 is formed on the back surface (one surface) of the row bar 20 (FIG. 21). The second conductive layer 28 is formed on the entire back surface of the row bar 20 by plating, vapor deposition, sputtering, or the like. The first conductive layer 16 is formed so that the upper end surface is flush with the back surface of the row bar 20 and is exposed on the upper end surface of the row bar 20, and thus the second conductive layer 28 is formed on the back surface of the row bar 20. Thus, the second conductive layer 28 is formed in connection with the first conductive layer 16. By exposing the end surface of the first conductive layer 16 to the back surface of the row bar 20, electrical connection between the first conductive layer 16 and the second conductive layer 28 is ensured.
Next, the other surface of the row bar 20 is processed to form an air bearing surface (floating surface forming step).
FIG. 22 shows a state in which the second conductive layer 28 deposited on one surface (back surface) of the row bar 20 is etched to form connection terminals 24 and second wiring 24 a on the back surface of the row bar 20. Indicates. The second wiring 24a is formed in a pattern so as to connect the connection terminal 24 and the first conductive layer 16 (terminal portion forming step).
A single head slider is obtained by cutting the row bar 20 into pieces. This head slider also has a connection terminal 24 formed on the surface opposite to the air bearing surface of the head slider.
The head slider manufacturing method according to the present invention is not limited to the manufacturing method shown in the above-described embodiment.
In the first embodiment, the groove 12 is previously formed in the wafer 10 and then the first conductive layer 16 is formed. Also in this method, when forming the groove 12 in the wafer 10, it is possible to set the depth of the groove 12 shallower than in the above embodiment. In this case, after forming the first conductive layer 16 in the groove, the row bar is formed so that the end surface of the first conductive layer 16 is exposed on the back surface (one surface) of the row bar 20, and then the back surface of the row bar. The second conductor layer is formed on the head slider, and the head slider can be manufactured by the same method as in the second and third embodiments described above.
Further, in the second embodiment, the groove 26 is formed shallow, but the groove 26 is set to be formed deeper, and the groove 26 is filled with a conductor to form the first conductive layer. The first conductive layer may be patterned to form a terminal and a second wiring connected to the first wiring on the back surface of the row bar.
In the second and third embodiments, the second conductive layer is formed on the back surface of the row bar, and the terminal and the second wiring are formed by patterning the second conductive layer. The method of forming the terminal and the second wiring on the back surface of the row bar is not necessarily limited to the method of forming and patterning the second conductive layer. As long as the terminal and the second wiring can be formed by being electrically connected to the first conductive layer 16 and the first wiring 19, a method of printing the conductor or patterning the conductor into a predetermined pattern may be used. A method for forming a film can be used.
In the above embodiment, an example in which four terminals are formed on the head slider has been described. However, the present invention can be applied to a case where four or more terminals are formed.
(Head assembly)
FIG. 23 shows an example of the head slider 40 manufactured by the head slider manufacturing method described above. A flying rail 22 is formed on the flying surface (ABS surface) of the head slider 40, and a connection terminal 24 is provided on the surface opposite to the flying surface. The terminal 24 is electrically connected to the element portion 18 via the first wiring 19 provided on the end surface where the element portion of the head slider 40 is formed and the second wiring 24 a provided on the back surface of the head slider 40. Connecting.
FIG. 24 shows the configuration of the gimbal portion 52 in the suspension 50 on which the head slider 40 is mounted. In the gimbal portion 52, connection pads 52a are formed in the same plane arrangement as the connection terminals 24 provided on the head slider 40. Since the head slider 40 shown in FIG. 23 has four terminals 24, four pads 52 a are arranged on the gimbal portion 52. Each of the pads 52a is connected to a wiring for connection.
FIG. 25 shows a state where the head slider 40 is mounted on the gimbal portion 52. A conductive adhesive 44 is applied to the terminal 24 of the head slider 40 and the pad 52a of the gimbal portion 52, and the head slider 40 is positioned and joined to the mounting position of the gimbal portion 52 to assemble the head assembly.
If the connection terminal 24 is arranged on the back surface like the head slider 40 of the present embodiment, the entire back surface of the head slider 40 can be used as a region for forming the terminal 24 and the second wiring 24a. Even if the head slider is downsized, a sufficient space for forming the terminals can be secured. Further, it is possible to alleviate the difficulty of forming terminals that increase as the number of terminals formed on the head slider increases.


Claims (7)

　素子部と、浮上面と反対側の裏面に前記素子部と電気的に接続して設けられた端子部とを備えるヘッドスライダの製造方法であって、
　前記ヘッドスライダの本体を構成する電気的絶縁性のウェハーに溝を形成する溝形成工程と、
　前記溝内を、第１の導電層により充填する導電層形成工程と、
　前記溝が形成されたウェハーに素子部を形成する素子部形成工程と、
　前記ウェハーに前記素子部と前記第１の導電層とを電気的に接続する第１の配線を形成する配線形成工程と、
　該第１の配線が形成されたウェハーを前記溝に沿ってウェハー面に垂直に切断し、ロウバーの一方の面に前記第１の導電層の端面を露出させるロウバー形成工程と、
　ロウバーの他方の面を加工し浮上面を形成する浮上面形成工程と、
　ロウバーの一方の面に、前記第１の配線と電気的に接続する第２の配線および端子部を形成する端子部形成工程とを有することを特徴とするヘッドスライダの製造方法。 A method of manufacturing a head slider, comprising: an element part; and a terminal part electrically connected to the element part on the back surface opposite to the air bearing surface,
A groove forming step of forming a groove in an electrically insulating wafer constituting the main body of the head slider;
A conductive layer forming step of filling the groove with a first conductive layer;
An element part forming step of forming an element part on the wafer in which the groove is formed;
Forming a first wiring for electrically connecting the element portion and the first conductive layer to the wafer;
A row bar forming step of cutting the wafer on which the first wiring is formed perpendicularly to the wafer surface along the groove and exposing an end surface of the first conductive layer on one surface of the row bar;
An air bearing surface forming step of forming the air bearing surface by processing the other surface of the row bar;
A method of manufacturing a head slider, comprising: a second wiring electrically connected to the first wiring and a terminal portion forming step for forming a terminal portion on one surface of the row bar. 　素子部と、浮上面と反対側の裏面に前記素子部と電気的に接続して設けられた端子部とを備えるヘッドスライダの製造方法であって、
　前記ヘッドスライダの本体を構成する電気的絶縁性のウェハーに素子部を形成する素子部形成工程と、
　前記ウェハーに、前記素子部と電気的に接続する第１の配線を形成する配線形成工程と、
　前記ロウバーの切断位置に沿ってウェハーに溝を形成する溝形成工程と、
　前記溝内を、前記第１の配線と電気的に接続して第１の導電層により充填する導電層形成工程と、
　前記第１の導電層が形成されたウェハーを前記溝に沿ってウェハー面に垂直に切断し、ロウバーの一方の面に前記第１の導電層の端面を露出させるロウバー形成工程と、
　ロウバーの他方の面を加工し浮上面を形成する浮上面形成工程と、
　ロウバーの一方の面に、前記第１の配線と電気的に接続する第２の配線および端子部を形成する端子部形成工程とを有することを特徴とするヘッドスライダの製造方法。 A method of manufacturing a head slider, comprising: an element part; and a terminal part electrically connected to the element part on the back surface opposite to the air bearing surface,
An element part forming step of forming an element part on an electrically insulating wafer constituting the main body of the head slider;
A wiring formation step of forming a first wiring electrically connected to the element portion on the wafer;
A groove forming step of forming a groove in the wafer along the cutting position of the row bar;
A conductive layer forming step of filling the groove with a first conductive layer electrically connected to the first wiring;
A row bar forming step of cutting the wafer on which the first conductive layer is formed perpendicularly to the wafer surface along the groove, and exposing an end surface of the first conductive layer on one surface of the row bar;
An air bearing surface forming step of forming the air bearing surface by processing the other surface of the row bar;
A method of manufacturing a head slider, comprising: a second wiring electrically connected to the first wiring and a terminal portion forming step for forming a terminal portion on one surface of the row bar. 　前記配線形成工程を、前記素子部形成工程において、前記第１の配線を形成する工程を含めた工程として行うことを特徴とする請求項１または２記載のヘッドスライダの製造方法。 3. The method of manufacturing a head slider according to claim 1, wherein the wiring forming step is performed as a step including a step of forming the first wiring in the element portion forming step. 　前記端子部形成工程において、前記第１の導電層をパターニングして前記第２の配線および前記端子部を形成することを特徴とする請求項１～３のいずれか一項記載のヘッドスライダの製造方法。 The head slider manufacturing method according to any one of claims 1 to 3, wherein, in the terminal portion forming step, the second conductive layer and the terminal portion are formed by patterning the first conductive layer. Method. 　前記端子部形成工程において、前記ロウバー形成工程後にロウバーの一方の面に第２の導電層を積層し、該第２の導電層と前記第１の導電層とをパターニングして前記第２の配線および前記端子部を形成することを特徴とする請求項１～３のいずれか一項記載のヘッドスライダの製造方法。 In the terminal portion forming step, after the row bar forming step, a second conductive layer is laminated on one surface of the row bar, and the second conductive layer and the first conductive layer are patterned to form the second wiring. The method of manufacturing a head slider according to any one of claims 1 to 3, wherein the terminal portion is formed. 　前記配線形成工程において、前記第１の配線を配線の端部が前記ロウバーの切断位置にまで延出させて形成し、
　前記溝形成工程において、前記第１の配線と前記ロウバーの切断位置との各接続部に個別に溝を形成することを特徴とする請求項１または２記載のヘッドスライダの製造方法。 In the wiring formation step, the first wiring is formed such that the end of the wiring extends to the cutting position of the row bar,
3. The method of manufacturing a head slider according to claim 1, wherein in the groove forming step, a groove is individually formed at each connection portion between the first wiring and the row bar cutting position. 　前記ロウバー形成工程後にロウバーの一方の面に第２の導電層を積層し、
　該第２の導電層をパターニングして前記第２の配線および前記端子部を形成することを特徴とする請求項６記載のヘッドスライダの製造方法。 After the row bar forming step, a second conductive layer is laminated on one side of the row bar,
7. The method of manufacturing a head slider according to claim 6, wherein the second conductive layer is patterned to form the second wiring and the terminal portion.
PCT/JP2008/051435 2008-01-30 2008-01-30 Method of manufacturing head slider Ceased WO2009096014A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8995091B2 (en) 2012-12-21 2015-03-31 HGST Netherlands B.V. Magnetic head for thermally assisted magnetic recording

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529417A (en) * 1975-07-14 1977-01-25 Hitachi Ltd Floating type magnetic head
JPH08167115A (en) * 1994-12-12 1996-06-25 Iwatsu Electric Co Ltd Coil electrode structure for driving thin film magnetic head and method of forming the same
JPH10124839A (en) * 1996-10-23 1998-05-15 Nec Corp Magnetic head slider

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529417A (en) * 1975-07-14 1977-01-25 Hitachi Ltd Floating type magnetic head
JPH08167115A (en) * 1994-12-12 1996-06-25 Iwatsu Electric Co Ltd Coil electrode structure for driving thin film magnetic head and method of forming the same
JPH10124839A (en) * 1996-10-23 1998-05-15 Nec Corp Magnetic head slider

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8995091B2 (en) 2012-12-21 2015-03-31 HGST Netherlands B.V. Magnetic head for thermally assisted magnetic recording

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