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WO2009078380A1 - ネガ型感光性樹脂積層体を用いたレジスト硬化物の製造方法、ネガ型感光性樹脂積層体、及びネガ型感光性樹脂積層体の使用方法 - Google Patents

ネガ型感光性樹脂積層体を用いたレジスト硬化物の製造方法、ネガ型感光性樹脂積層体、及びネガ型感光性樹脂積層体の使用方法 Download PDF

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Publication number
WO2009078380A1
WO2009078380A1 PCT/JP2008/072771 JP2008072771W WO2009078380A1 WO 2009078380 A1 WO2009078380 A1 WO 2009078380A1 JP 2008072771 W JP2008072771 W JP 2008072771W WO 2009078380 A1 WO2009078380 A1 WO 2009078380A1
Authority
WO
WIPO (PCT)
Prior art keywords
negative photosensitive
photosensitive resin
resin laminate
photosensitive layer
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/072771
Other languages
English (en)
French (fr)
Inventor
Youichiroh Ide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Original Assignee
Asahi Kasei E Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp filed Critical Asahi Kasei E Materials Corp
Priority to JP2009546256A priority Critical patent/JP5199282B2/ja
Priority to CN200880121352.5A priority patent/CN101952777B/zh
Publication of WO2009078380A1 publication Critical patent/WO2009078380A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

　現像後に密着性及び解像性に優れたレジストパターン並びに優れたレジスト形状をもたらす、レジスト硬化物の製造方法、ネガ型感光性樹脂積層体、及びネガ型感光性樹脂積層体の使用方法を提供する。本発明に係るレジスト硬化物の製造方法は、少なくとも支持体(Ａ)とネガ型感光性樹脂層(Ｂ)と基板(Ｃ)とが積層されてなるネガ型感光性樹脂積層体を形成する積層体形成工程と、フォトマスクの像を投影させた光を用いレンズを介して該ネガ型感光性樹脂層(Ｂ)を露光する露光工程と、該ネガ型感光性樹脂層(Ｂ)の未露光部を現像除去することによって、該ネガ型感光性樹脂層(Ｂ)の硬化部からなるレジスト硬化物を形成する現像工程とを含み、該ネガ型感光性樹脂層(Ｂ)の波長３６５ｎｍにおける光線透過率が２５％以上５０％以下であるレジスト硬化物の製造方法である。
PCT/JP2008/072771 2007-12-18 2008-12-15 ネガ型感光性樹脂積層体を用いたレジスト硬化物の製造方法、ネガ型感光性樹脂積層体、及びネガ型感光性樹脂積層体の使用方法 Ceased WO2009078380A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009546256A JP5199282B2 (ja) 2007-12-18 2008-12-15 ネガ型感光性樹脂積層体を用いたレジスト硬化物の製造方法、ネガ型感光性樹脂積層体、及びネガ型感光性樹脂積層体の使用方法
CN200880121352.5A CN101952777B (zh) 2007-12-18 2008-12-15 使用负型感光性树脂层压体的抗蚀剂固化物的制造方法、负型感光性树脂层压体、以及负型感光性树脂层压体的使用方法

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007-326102 2007-12-18
JP2007-325795 2007-12-18
JP2007326102 2007-12-18
JP2007-325831 2007-12-18
JP2007325831 2007-12-18
JP2007325795 2007-12-18

Publications (1)

Publication Number Publication Date
WO2009078380A1 true WO2009078380A1 (ja) 2009-06-25

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ID=40795495

Family Applications (1)

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PCT/JP2008/072771 Ceased WO2009078380A1 (ja) 2007-12-18 2008-12-15 ネガ型感光性樹脂積層体を用いたレジスト硬化物の製造方法、ネガ型感光性樹脂積層体、及びネガ型感光性樹脂積層体の使用方法

Country Status (5)

Country Link
JP (1) JP5199282B2 (ja)
KR (1) KR101175079B1 (ja)
CN (2) CN102937776B (ja)
TW (1) TWI424266B (ja)
WO (1) WO2009078380A1 (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012215676A (ja) * 2011-03-31 2012-11-08 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びそれを用いた積層体
JP2015062080A (ja) * 2014-12-15 2015-04-02 旭化成イーマテリアルズ株式会社 感光性樹脂積層体
WO2016104585A1 (ja) * 2014-12-25 2016-06-30 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法
WO2016163540A1 (ja) * 2015-04-08 2016-10-13 旭化成株式会社 感光性樹脂組成物
JPWO2016185604A1 (ja) * 2015-05-21 2017-07-13 株式会社メイコー プリント配線板の製造方法及びエッチングレジストのパターン形成方法
US9989854B2 (en) 2013-07-23 2018-06-05 Hitachi Chemical Company, Ltd. Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame
JP2019133143A (ja) * 2018-01-30 2019-08-08 旭化成株式会社 感光性樹脂積層体及びレジストパターンの製造方法
US10520816B2 (en) 2014-05-23 2019-12-31 Hitachi Chemical Company, Ltd. Method for forming resist pattern, method for manufacturing printed wiring board, photosensitive resin composition for projection exposure and photosensitive element
KR20230033718A (ko) 2020-10-23 2023-03-08 아사히 가세이 가부시키가이샤 감광성 수지 적층체

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107250913A (zh) * 2015-02-26 2017-10-13 株式会社Adeka 图案形成方法和使用其制造的电子设备
KR20170111411A (ko) * 2016-03-28 2017-10-12 동우 화인켐 주식회사 레지스트 박리액 조성물, 및 디스플레이 장치용 플랫 패널의 제조방법 및 그에 의해 제조된 디스플레이 장치용 플랫 패널, 및 디스플레이 장치
KR102792073B1 (ko) * 2016-12-29 2025-04-08 주식회사 동진쎄미켐 네가티브 감광성 수지 조성물
JP6852234B2 (ja) * 2019-03-29 2021-03-31 太陽インキ製造株式会社 フォトレジスト組成物およびその硬化物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03236956A (ja) * 1989-05-17 1991-10-22 Asahi Chem Ind Co Ltd 光硬化性樹脂積層体及びそれを用いるプリント配線板の製造方法
JP2001042522A (ja) * 1999-05-27 2001-02-16 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP2001056553A (ja) * 1999-08-20 2001-02-27 Nippon Synthetic Chem Ind Co Ltd:The 蛍光体パターンの形成方法
JP2002268215A (ja) * 2001-03-08 2002-09-18 Hitachi Chem Co Ltd 感光性樹脂組成物とその利用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200303895A (en) * 2002-03-06 2003-09-16 Hitachi Chemical Co Ltd Photosensitive resin composition
JP4346315B2 (ja) * 2003-01-14 2009-10-21 旭化成イーマテリアルズ株式会社 感光性樹脂組成物およびその用途
JP4368639B2 (ja) * 2003-08-19 2009-11-18 株式会社アドテックエンジニアリング 投影露光装置
JP2005352180A (ja) * 2004-06-10 2005-12-22 Renesas Technology Corp 半導体装置の製造方法
KR101017550B1 (ko) * 2006-04-28 2011-02-28 아사히 가세이 일렉트로닉스 가부시끼가이샤 감광성 수지 적층체

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03236956A (ja) * 1989-05-17 1991-10-22 Asahi Chem Ind Co Ltd 光硬化性樹脂積層体及びそれを用いるプリント配線板の製造方法
JP2001042522A (ja) * 1999-05-27 2001-02-16 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP2001056553A (ja) * 1999-08-20 2001-02-27 Nippon Synthetic Chem Ind Co Ltd:The 蛍光体パターンの形成方法
JP2002268215A (ja) * 2001-03-08 2002-09-18 Hitachi Chem Co Ltd 感光性樹脂組成物とその利用

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012215676A (ja) * 2011-03-31 2012-11-08 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びそれを用いた積層体
US9989854B2 (en) 2013-07-23 2018-06-05 Hitachi Chemical Company, Ltd. Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame
US10520816B2 (en) 2014-05-23 2019-12-31 Hitachi Chemical Company, Ltd. Method for forming resist pattern, method for manufacturing printed wiring board, photosensitive resin composition for projection exposure and photosensitive element
JP2015062080A (ja) * 2014-12-15 2015-04-02 旭化成イーマテリアルズ株式会社 感光性樹脂積層体
WO2016104585A1 (ja) * 2014-12-25 2016-06-30 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法
JPWO2016104585A1 (ja) * 2014-12-25 2017-10-05 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法
WO2016163540A1 (ja) * 2015-04-08 2016-10-13 旭化成株式会社 感光性樹脂組成物
JPWO2016163540A1 (ja) * 2015-04-08 2017-11-02 旭化成株式会社 感光性樹脂組成物
JPWO2016185604A1 (ja) * 2015-05-21 2017-07-13 株式会社メイコー プリント配線板の製造方法及びエッチングレジストのパターン形成方法
JP2019133143A (ja) * 2018-01-30 2019-08-08 旭化成株式会社 感光性樹脂積層体及びレジストパターンの製造方法
KR20230033718A (ko) 2020-10-23 2023-03-08 아사히 가세이 가부시키가이샤 감광성 수지 적층체

Also Published As

Publication number Publication date
TW200947116A (en) 2009-11-16
CN102937776A (zh) 2013-02-20
CN101952777B (zh) 2014-04-09
JPWO2009078380A1 (ja) 2011-04-28
KR101175079B1 (ko) 2012-08-21
CN102937776B (zh) 2017-04-19
TWI424266B (zh) 2014-01-21
CN101952777A (zh) 2011-01-19
KR20100032939A (ko) 2010-03-26
JP5199282B2 (ja) 2013-05-15

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