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WO2009078221A1 - Dicing sheet, method for manufacturing dicing sheet and method for manufacturing electronic component - Google Patents

Dicing sheet, method for manufacturing dicing sheet and method for manufacturing electronic component Download PDF

Info

Publication number
WO2009078221A1
WO2009078221A1 PCT/JP2008/069729 JP2008069729W WO2009078221A1 WO 2009078221 A1 WO2009078221 A1 WO 2009078221A1 JP 2008069729 W JP2008069729 W JP 2008069729W WO 2009078221 A1 WO2009078221 A1 WO 2009078221A1
Authority
WO
WIPO (PCT)
Prior art keywords
dicing sheet
manufacturing
adhesive layer
electronic component
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/069729
Other languages
French (fr)
Japanese (ja)
Inventor
Tomomichi Takatsu
Takeshi Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Publication of WO2009078221A1 publication Critical patent/WO2009078221A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)

Abstract

Provided are a dicing sheet, a method for manufacturing the dicing sheet, and a method for manufacturing an electronic component. The dicing sheet is provided with a base material sheet; an adhesive layer laminated on the base material sheet; and a ring frame adhesive layer laminated in a region where a ring frame is to be bonded to the adhesive layer. The adhesive force of the ring frame adhesive layer is higher than that of the adhesive layer. Adhesive characteristics between the dicing sheet and the ring frame are improved, while maintaining peeling easiness between the dicing sheet and the die attach film for pickup.
PCT/JP2008/069729 2007-12-17 2008-10-30 Dicing sheet, method for manufacturing dicing sheet and method for manufacturing electronic component Ceased WO2009078221A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-324496 2007-12-17
JP2007324496A JP2009147201A (en) 2007-12-17 2007-12-17 Dicing sheet, manufacturing method thereof, and manufacturing method of electronic component

Publications (1)

Publication Number Publication Date
WO2009078221A1 true WO2009078221A1 (en) 2009-06-25

Family

ID=40795340

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069729 Ceased WO2009078221A1 (en) 2007-12-17 2008-10-30 Dicing sheet, method for manufacturing dicing sheet and method for manufacturing electronic component

Country Status (3)

Country Link
JP (1) JP2009147201A (en)
TW (1) TW200933723A (en)
WO (1) WO2009078221A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011155065A (en) * 2010-01-26 2011-08-11 Hitachi Chem Co Ltd Adhesive film for processing semiconductor wafer, and manufacturing method thereof
JP2011210887A (en) * 2010-03-29 2011-10-20 Furukawa Electric Co Ltd:The Adhesive tape for processing radiation curing wafer
WO2011158835A1 (en) * 2010-06-18 2011-12-22 日立化成工業株式会社 Adhesive sheet
KR20150026844A (en) * 2013-08-30 2015-03-11 히다치 막셀 가부시키가이샤 Adhesive tape for dicing and method for manufacturing semiconductor chip
CN107442943A (en) * 2016-05-16 2017-12-08 株式会社迪思科 Extend piece

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5564645B2 (en) * 2010-05-12 2014-07-30 古河電気工業株式会社 Multilayer adhesive sheet and manufacturing method thereof
JP5161284B2 (en) * 2010-10-14 2013-03-13 電気化学工業株式会社 Manufacturing method of electronic parts
JP5882577B2 (en) * 2010-12-06 2016-03-09 スリーエム イノベイティブ プロパティズ カンパニー Film sticking method, back grinding method, semiconductor chip manufacturing method, and film sticking apparatus
JP5767478B2 (en) * 2011-01-27 2015-08-19 古河電気工業株式会社 Manufacturing method of semiconductor wafer processing tape and semiconductor wafer processing tape
JP5807341B2 (en) * 2011-02-18 2015-11-10 日立化成株式会社 Dicing tape integrated adhesive sheet
JP5807340B2 (en) * 2011-02-18 2015-11-10 日立化成株式会社 Dicing tape integrated adhesive sheet
JP4904432B1 (en) 2011-03-01 2012-03-28 古河電気工業株式会社 Wafer processing tape
JP5801584B2 (en) * 2011-03-29 2015-10-28 リンテック株式会社 Dicing tape and chip-shaped part manufacturing method
JP2013095843A (en) * 2011-10-31 2013-05-20 Lintec Corp Sheet manufacturing device
WO2014017537A1 (en) 2012-07-26 2014-01-30 古河電気工業株式会社 Method for manufacturing semiconductor-wafer-processing tape and semiconductor-wafer-processing tape
JP6190671B2 (en) * 2013-09-05 2017-08-30 古河電気工業株式会社 Dicing adhesive tape and method for manufacturing semiconductor device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000340530A (en) * 1999-05-27 2000-12-08 Toshiba Corp Semiconductor device and manufacturing method thereof
JP2006140348A (en) * 2004-11-12 2006-06-01 Lintec Corp Marking method and protective film forming and dicing sheet
JP2007123914A (en) * 2006-11-27 2007-05-17 Nitto Denko Corp Dicing die bond film
JP2007246633A (en) * 2006-03-15 2007-09-27 Denki Kagaku Kogyo Kk The multilayer adhesive sheet, the adhesive sheet for multilayer adhesive sheets, and the manufacturing method of the electronic component using a multilayer adhesive sheet.

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3949513B2 (en) * 2002-05-27 2007-07-25 本田技研工業株式会社 Die for superplastic processing
JP4819537B2 (en) * 2006-03-15 2011-11-24 日本碍子株式会社 Permselective membrane reactor and hydrogen production method using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000340530A (en) * 1999-05-27 2000-12-08 Toshiba Corp Semiconductor device and manufacturing method thereof
JP2006140348A (en) * 2004-11-12 2006-06-01 Lintec Corp Marking method and protective film forming and dicing sheet
JP2007246633A (en) * 2006-03-15 2007-09-27 Denki Kagaku Kogyo Kk The multilayer adhesive sheet, the adhesive sheet for multilayer adhesive sheets, and the manufacturing method of the electronic component using a multilayer adhesive sheet.
JP2007123914A (en) * 2006-11-27 2007-05-17 Nitto Denko Corp Dicing die bond film

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011155065A (en) * 2010-01-26 2011-08-11 Hitachi Chem Co Ltd Adhesive film for processing semiconductor wafer, and manufacturing method thereof
JP2011210887A (en) * 2010-03-29 2011-10-20 Furukawa Electric Co Ltd:The Adhesive tape for processing radiation curing wafer
WO2011158835A1 (en) * 2010-06-18 2011-12-22 日立化成工業株式会社 Adhesive sheet
JP5196034B2 (en) * 2010-06-18 2013-05-15 日立化成株式会社 Adhesive sheet
KR101422603B1 (en) 2010-06-18 2014-07-23 히타치가세이가부시끼가이샤 Adhesive sheet
KR20150026844A (en) * 2013-08-30 2015-03-11 히다치 막셀 가부시키가이샤 Adhesive tape for dicing and method for manufacturing semiconductor chip
JP2015050216A (en) * 2013-08-30 2015-03-16 日立マクセル株式会社 Adhesive tape for dicing and method of manufacturing semiconductor chip
KR102226881B1 (en) 2013-08-30 2021-03-12 맥셀 홀딩스 가부시키가이샤 Adhesive tape for dicing and method for manufacturing semiconductor chip
KR20210031439A (en) * 2013-08-30 2021-03-19 맥셀 홀딩스 가부시키가이샤 Adhesive tape for dicing and method for manufacturing semiconductor chip
KR102331226B1 (en) 2013-08-30 2021-12-01 맥셀 주식회사 Adhesive tape for dicing and method for manufacturing semiconductor chip
CN107442943A (en) * 2016-05-16 2017-12-08 株式会社迪思科 Extend piece

Also Published As

Publication number Publication date
TW200933723A (en) 2009-08-01
JP2009147201A (en) 2009-07-02

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