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WO2009078289A3 - Cooling fin and manufacturing method of the cooling fin - Google Patents

Cooling fin and manufacturing method of the cooling fin Download PDF

Info

Publication number
WO2009078289A3
WO2009078289A3 PCT/JP2008/072110 JP2008072110W WO2009078289A3 WO 2009078289 A3 WO2009078289 A3 WO 2009078289A3 JP 2008072110 W JP2008072110 W JP 2008072110W WO 2009078289 A3 WO2009078289 A3 WO 2009078289A3
Authority
WO
WIPO (PCT)
Prior art keywords
fin
end portion
cooling fin
distal end
partially
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/072110
Other languages
French (fr)
Other versions
WO2009078289A2 (en
Inventor
Masahiro Morino
Yasuji Taketsuna
Yuya Takano
Hirofumi Inoshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Priority to CN2008801208160A priority Critical patent/CN101897011A/en
Priority to US12/747,777 priority patent/US20100276135A1/en
Priority to EP08861207A priority patent/EP2220674A2/en
Publication of WO2009078289A2 publication Critical patent/WO2009078289A2/en
Publication of WO2009078289A3 publication Critical patent/WO2009078289A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

A cooling fin (31) includes fin parts (1) integrally extending from a base part (2). Each fin part (1) is partially formed at a slant so that a proximal end portion is straight and a distal end portion is wavy (corrugated). Each fin part (1) is partially slanted to make each fin part (1) wavier as coming closer to the distal end portion from the proximal end portion. In a manufacturing process of the cooling fin (31), firstly, a straight cooling fin is produced by extrusion molding (an extruding step). Subsequently, the distal end portion of each fin is partially bent in a direction intersecting an extruding direction into a wave shape (a bending step).
PCT/JP2008/072110 2007-12-14 2008-11-28 Cooling fin and manufacturing method of the cooling fin Ceased WO2009078289A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008801208160A CN101897011A (en) 2007-12-14 2008-11-28 Cooling fin and method for manufacturing cooling fin
US12/747,777 US20100276135A1 (en) 2007-12-14 2008-11-28 Cooling fin and manufacturing method of the cooling fin
EP08861207A EP2220674A2 (en) 2007-12-14 2008-11-28 Cooling fin and manufacturing method of the cooling fin

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-322831 2007-12-14
JP2007322831A JP2009147107A (en) 2007-12-14 2007-12-14 Cooling fin and method of manufacturing cooling fin

Publications (2)

Publication Number Publication Date
WO2009078289A2 WO2009078289A2 (en) 2009-06-25
WO2009078289A3 true WO2009078289A3 (en) 2009-09-17

Family

ID=40329239

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072110 Ceased WO2009078289A2 (en) 2007-12-14 2008-11-28 Cooling fin and manufacturing method of the cooling fin

Country Status (6)

Country Link
US (1) US20100276135A1 (en)
EP (1) EP2220674A2 (en)
JP (1) JP2009147107A (en)
KR (1) KR20100087377A (en)
CN (1) CN101897011A (en)
WO (1) WO2009078289A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104006696A (en) * 2014-05-06 2014-08-27 北京理工大学 Rectangular and circular channel mixed type contact-heat-resistance-free heat transfer element

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JP4992808B2 (en) 2008-04-16 2012-08-08 トヨタ自動車株式会社 Manufacturing method of heat exchanger
FR2938637B1 (en) * 2008-11-18 2013-01-04 Cie Mediterraneenne Des Cafes CIRCULATING CONDUIT OF A FLUID
WO2010134191A1 (en) 2009-05-22 2010-11-25 トヨタ自動車株式会社 Heat exchanger and method of manufacturing the same
JP2011091301A (en) * 2009-10-26 2011-05-06 Toyota Industries Corp Liquid cooling type cooling device
JP2011171686A (en) * 2010-02-22 2011-09-01 Nakamura Mfg Co Ltd Metal-based printed board with heat radiation part
JP5545260B2 (en) 2010-05-21 2014-07-09 株式会社デンソー Heat exchanger
US8944147B2 (en) * 2010-05-28 2015-02-03 Toyota Jidosha Kabushiki Kaisha Heat exchanger and method for manufacturing same
WO2012147544A1 (en) * 2011-04-26 2012-11-01 富士電機株式会社 Cooler for semiconductor module, and semiconductor module
EP2720262A4 (en) * 2011-06-07 2015-06-17 Toyota Motor Co Ltd REFRIGERANT APPARATUS
KR101106614B1 (en) 2011-08-12 2012-01-20 주식회사 영동테크 Method for manufacturing cooling device for heating element and cooling device for heating element
KR101328322B1 (en) * 2011-12-08 2013-11-11 재단법인 포항산업과학연구원 Cooling Device for Heating Parts and Power Semiconductor module having The Same
JP2013131666A (en) * 2011-12-22 2013-07-04 Ntn Corp Cooling structure of power semiconductor
US20130327508A1 (en) * 2012-06-07 2013-12-12 Mark A. Zaffetti Cold plate assembly incorporating thermal heat spreader
EP2719985B1 (en) * 2012-10-09 2015-08-26 Danfoss Silicon Power GmbH A flow distribution module with a patterned cover plate
ITTO20130055A1 (en) 2013-01-23 2014-07-24 Denso Thermal Systems Spa FIN STRUCTURE FOR HEAT EXCHANGER FOR AUTOMOTIVE APPLICATIONS, IN PARTICULAR FOR AGRICULTURAL AND CONSTRUCTION MACHINES.
WO2015141714A1 (en) * 2014-03-20 2015-09-24 富士電機株式会社 Cooler, and semiconductor module using same
CN104006694A (en) * 2014-05-06 2014-08-27 北京理工大学 Hexagonal and ditrigonal mixed channel contact-heat-resistance-free heat transfer element
JP6340610B2 (en) * 2014-05-29 2018-06-13 株式会社高砂製作所 Heat sink manufacturing method
JP2016004805A (en) * 2014-06-13 2016-01-12 昭和電工株式会社 Liquid cooling type cooling device
JP6254051B2 (en) * 2014-08-04 2017-12-27 日本軽金属株式会社 heatsink
JP6256295B2 (en) * 2014-10-28 2018-01-10 株式会社デンソー Heat exchanger
JPWO2016194158A1 (en) * 2015-06-03 2017-12-14 三菱電機株式会社 Liquid-cooled cooler and method of manufacturing radiating fin in liquid-cooled cooler
JP6632879B2 (en) * 2015-12-11 2020-01-22 昭和電工株式会社 Liquid cooling system
CN105806136B (en) * 2016-05-10 2019-05-07 广东工业大学 A fin and a plate-fin heat exchanger
JP2018059678A (en) * 2016-10-06 2018-04-12 株式会社デンソー Heat exchanger
KR102013702B1 (en) * 2017-10-11 2019-08-23 에디슨모터스 주식회사 Battery HVAC system with active inside and outside cooling air flowing control
JP2019102506A (en) * 2017-11-29 2019-06-24 本田技研工業株式会社 Heat sink and manufacturing method thereof
JP6663899B2 (en) * 2017-11-29 2020-03-13 本田技研工業株式会社 Cooling system
JP6698111B2 (en) * 2018-01-09 2020-05-27 日本軽金属株式会社 Liquid cooling jacket
JP7016054B2 (en) * 2018-01-12 2022-02-04 パナソニックＩｐマネジメント株式会社 Power supplies, headlights, and mobiles
JP7266034B2 (en) * 2018-07-03 2023-04-27 日本軽金属株式会社 heat sink
CN109855067A (en) * 2019-04-12 2019-06-07 刘松铭 A kind of turbine radiator of light and preparation method thereof
CN111916410A (en) * 2019-05-10 2020-11-10 株洲中车时代电气股份有限公司 Heat radiator
CN110600444A (en) * 2019-09-02 2019-12-20 奇鋐科技股份有限公司 Liquid cooling type heat dissipation head structure
US11039550B1 (en) * 2020-04-08 2021-06-15 Google Llc Heat sink with turbulent structures
JP7340567B2 (en) 2021-06-25 2023-09-07 古河電気工業株式会社 heat sink
DE102021209504A1 (en) * 2021-08-30 2023-03-02 Robert Bosch Gesellschaft mit beschränkter Haftung Cooling rib arrangement of a fluid-through-flow cooler for cooling power electronics
DE102021128634A1 (en) 2021-11-03 2023-05-04 BAB-Bildungsgesellschaft für angewandte Betriebswirtschaft mbH heat transfer device
EP4350274A1 (en) * 2022-10-05 2024-04-10 Borgwarner Emissions Systems Spain, S.L.U. Heat exchanger
DK202330338A1 (en) * 2023-11-20 2024-11-13 Vestas Wind Sys As Power module with cooling fins improving mechanical strength

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04269855A (en) * 1991-02-26 1992-09-25 Nec Corp Semiconductor package provided with heat sink
EP0757220A1 (en) * 1995-07-26 1997-02-05 MA Fabtec Co., Ltd. Radiating fins and method for manufacturing the same
US5625229A (en) * 1994-10-03 1997-04-29 Sumitomo Metal Industries, Ltd. Heat sink fin assembly for cooling an LSI package
JPH10200278A (en) * 1997-01-13 1998-07-31 Yaskawa Electric Corp Cooling system
JPH10263779A (en) * 1997-03-24 1998-10-06 Fujikura Ltd Heat sink manufacturing method
EP1018763A2 (en) * 1998-12-18 2000-07-12 Alstom Uk Ltd An improved heatsink assembly
WO2003051552A1 (en) * 2001-12-19 2003-06-26 Showa Denko K.K. Extrusion tool, method for manufacturing shaped article with fins, and heat sink
US20040244947A1 (en) * 2003-05-14 2004-12-09 Inventor Precision Co., Ltd. Heat sinks for a cooler
GB2406442A (en) * 2003-09-24 2005-03-30 Giga Byte Tech Co Ltd Heat sink
US20050252639A1 (en) * 2004-05-14 2005-11-17 Hung-Yi Lin Radiation fin having an airflow guiding front edge
US20060092613A1 (en) * 2004-11-03 2006-05-04 Ping-Sheng Kao Staggered fin array
DE102005043055B3 (en) * 2005-09-09 2006-12-21 Siemens Ag Electronics housing cooling body with cooling fins, useful in automobiles, is produced inexpensively from extruded profiled slabs, specifically of aluminum, by cutting to length using profiled circular saw
EP1739378A1 (en) * 2005-06-23 2007-01-03 Autokühler Gmbh & Co. Kg. Heat exchange element and associated heat exchanger

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JPH06252300A (en) * 1992-12-28 1994-09-09 Hitachi Ltd Integrated circuit chip provided with cooling device and manufacture thereof
JPH07235623A (en) * 1994-02-24 1995-09-05 Mitsubishi Materials Corp Cooling device for electronic part
JPH07297583A (en) * 1994-04-25 1995-11-10 Pfu Ltd Heat sink with fan
JP3577192B2 (en) * 1997-03-27 2004-10-13 三菱電機株式会社 Cooling device for semiconductor device
JP4472833B2 (en) * 2000-04-24 2010-06-02 昭和電工株式会社 Heat sink and manufacturing method thereof
JP4861840B2 (en) * 2007-01-26 2012-01-25 アイシン・エィ・ダブリュ株式会社 Heating element cooling structure and driving device

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04269855A (en) * 1991-02-26 1992-09-25 Nec Corp Semiconductor package provided with heat sink
US5625229A (en) * 1994-10-03 1997-04-29 Sumitomo Metal Industries, Ltd. Heat sink fin assembly for cooling an LSI package
EP0757220A1 (en) * 1995-07-26 1997-02-05 MA Fabtec Co., Ltd. Radiating fins and method for manufacturing the same
JPH10200278A (en) * 1997-01-13 1998-07-31 Yaskawa Electric Corp Cooling system
JPH10263779A (en) * 1997-03-24 1998-10-06 Fujikura Ltd Heat sink manufacturing method
EP1018763A2 (en) * 1998-12-18 2000-07-12 Alstom Uk Ltd An improved heatsink assembly
WO2003051552A1 (en) * 2001-12-19 2003-06-26 Showa Denko K.K. Extrusion tool, method for manufacturing shaped article with fins, and heat sink
US20040244947A1 (en) * 2003-05-14 2004-12-09 Inventor Precision Co., Ltd. Heat sinks for a cooler
GB2406442A (en) * 2003-09-24 2005-03-30 Giga Byte Tech Co Ltd Heat sink
US20050252639A1 (en) * 2004-05-14 2005-11-17 Hung-Yi Lin Radiation fin having an airflow guiding front edge
US20060092613A1 (en) * 2004-11-03 2006-05-04 Ping-Sheng Kao Staggered fin array
EP1739378A1 (en) * 2005-06-23 2007-01-03 Autokühler Gmbh & Co. Kg. Heat exchange element and associated heat exchanger
DE102005043055B3 (en) * 2005-09-09 2006-12-21 Siemens Ag Electronics housing cooling body with cooling fins, useful in automobiles, is produced inexpensively from extruded profiled slabs, specifically of aluminum, by cutting to length using profiled circular saw

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104006696A (en) * 2014-05-06 2014-08-27 北京理工大学 Rectangular and circular channel mixed type contact-heat-resistance-free heat transfer element

Also Published As

Publication number Publication date
EP2220674A2 (en) 2010-08-25
KR20100087377A (en) 2010-08-04
WO2009078289A2 (en) 2009-06-25
JP2009147107A (en) 2009-07-02
CN101897011A (en) 2010-11-24
US20100276135A1 (en) 2010-11-04

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