[go: up one dir, main page]

WO2009078130A1 - ワイヤソーによるワークの切断方法およびワイヤソー - Google Patents

ワイヤソーによるワークの切断方法およびワイヤソー Download PDF

Info

Publication number
WO2009078130A1
WO2009078130A1 PCT/JP2008/003540 JP2008003540W WO2009078130A1 WO 2009078130 A1 WO2009078130 A1 WO 2009078130A1 JP 2008003540 W JP2008003540 W JP 2008003540W WO 2009078130 A1 WO2009078130 A1 WO 2009078130A1
Authority
WO
WIPO (PCT)
Prior art keywords
work
wire saw
cutting
wire
grooved rollers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/003540
Other languages
English (en)
French (fr)
Inventor
Koji Kitagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Priority to KR1020107012818A priority Critical patent/KR101486302B1/ko
Priority to CN2008801151410A priority patent/CN101855045B/zh
Priority to JP2009546129A priority patent/JP5056859B2/ja
Priority to US12/734,452 priority patent/US7959491B2/en
Priority to DE112008003339.0T priority patent/DE112008003339B4/de
Publication of WO2009078130A1 publication Critical patent/WO2009078130A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

　本発明は、ワイヤを複数の溝付きローラに巻掛けし、該溝付きローラにスラリを供給しつつ、前記ワイヤを走行させながらワークを前記ワイヤに押し当てることによって、前記ワークをウェーハ状に切断するワイヤソーであって、前記スラリの供給温度を、前記ワークの切断開始から切断終了までの間上昇させながらワークを切断するよう制御するものであることを特徴とするワイヤソーである。これにより、ワークの切断終了部付近でのワークの温度の低下を抑制し、なおかつ切断中の溝付きローラの変位の増加を直線的にすることにより、すなわち、ワークに描かれる切断軌跡を直線に近くすることにより、切断するワークのＷａｒｐを改善可能なワイヤソーが提供される。  
PCT/JP2008/003540 2007-12-19 2008-12-01 ワイヤソーによるワークの切断方法およびワイヤソー Ceased WO2009078130A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020107012818A KR101486302B1 (ko) 2007-12-19 2008-12-01 와이어 쏘에 의한 워크의 절단 방법 및 와이어 쏘
CN2008801151410A CN101855045B (zh) 2007-12-19 2008-12-01 利用线锯的工件的切断方法
JP2009546129A JP5056859B2 (ja) 2007-12-19 2008-12-01 ワイヤソーによるワークの切断方法およびワイヤソー
US12/734,452 US7959491B2 (en) 2007-12-19 2008-12-01 Method for slicing workpiece by using wire saw and wire saw
DE112008003339.0T DE112008003339B4 (de) 2007-12-19 2008-12-01 Verfahren zum Zerschneiden eines Werkstücks durch Verwendung einer Drahtsäge

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-327890 2007-12-19
JP2007327890 2007-12-19

Publications (1)

Publication Number Publication Date
WO2009078130A1 true WO2009078130A1 (ja) 2009-06-25

Family

ID=40795254

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/003540 Ceased WO2009078130A1 (ja) 2007-12-19 2008-12-01 ワイヤソーによるワークの切断方法およびワイヤソー

Country Status (7)

Country Link
US (1) US7959491B2 (ja)
JP (1) JP5056859B2 (ja)
KR (1) KR101486302B1 (ja)
CN (1) CN101855045B (ja)
DE (1) DE112008003339B4 (ja)
TW (1) TWI382905B (ja)
WO (1) WO2009078130A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015156433A (ja) * 2014-02-20 2015-08-27 株式会社Sumco シリコンウェーハの製造方法およびシリコンウェーハ
JP2022538517A (ja) * 2019-05-27 2022-09-05 ジルトロニック アクチエンゲゼルシャフト ワイヤソーによる複数のスライス作業中に被加工物から複数のウェハをスライスして切り出す方法、および単結晶ケイ素の半導体ウェハ

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4816511B2 (ja) * 2007-03-06 2011-11-16 信越半導体株式会社 切断方法およびワイヤソー装置
KR20120037576A (ko) * 2010-10-12 2012-04-20 주식회사 엘지실트론 단결정 잉곳 절단장치 및 단결정 잉곳 절단방법
DE102011005948B4 (de) * 2011-03-23 2012-10-31 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück
DE102011005949B4 (de) * 2011-03-23 2012-10-31 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück
SG186510A1 (en) * 2011-06-23 2013-01-30 Systems Automation S Pte Ltd Fa Cutting machine and method of cutting
CN102275232A (zh) * 2011-08-25 2011-12-14 湖州金科光伏科技有限公司 一种硅块切割方法
US20130144421A1 (en) * 2011-12-01 2013-06-06 Memc Electronic Materials, Spa Systems For Controlling Temperature Of Bearings In A Wire Saw
US9156187B2 (en) 2011-12-29 2015-10-13 Sunedison Semiconductor Ltd. Methods for mounting an ingot on a wire saw
DE102012201938B4 (de) 2012-02-09 2015-03-05 Siltronic Ag Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben von einem Werkstück
JP6102927B2 (ja) * 2012-09-03 2017-03-29 日立金属株式会社 高硬度材料のマルチワイヤーソーによる切断方法
JP5962614B2 (ja) * 2013-08-12 2016-08-03 信越半導体株式会社 ワークの切断方法及びワイヤソー
JP5994766B2 (ja) * 2013-11-21 2016-09-21 信越半導体株式会社 ワークの切断方法
DE102013225104B4 (de) 2013-12-06 2019-11-28 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück mittels einer Drahtsäge
JP6172030B2 (ja) * 2014-04-03 2017-08-02 信越半導体株式会社 ワークの切断方法及び加工液
DE102014208187B4 (de) 2014-04-30 2023-07-06 Siltronic Ag Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben mit besonders gleichmäßiger Dicke von einem Werkstück
KR101612755B1 (ko) * 2014-12-02 2016-04-18 한국에너지기술연구원 다중와이어 절단장치
KR20160002078U (ko) 2014-12-08 2016-06-16 백무윤 와이어소의 장력조절롤러
JP6898116B2 (ja) * 2017-03-09 2021-07-07 コマツＮｔｃ株式会社 ワイヤソー
CN108724495B (zh) * 2017-04-24 2020-04-10 上海新昇半导体科技有限公司 硅片切割装置
DE102018221922A1 (de) * 2018-12-17 2020-06-18 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben mittels einer Drahtsäge, Drahtsäge und Halbleiterscheibe aus einkristallinem Silizium
KR102149092B1 (ko) * 2019-01-14 2020-08-27 에스케이실트론 주식회사 와이어 쏘잉 장치
EP3858569A1 (de) * 2020-01-28 2021-08-04 Siltronic AG Verfahren zum abtrennen einer vielzahl von scheiben von werkstücken mittels einer drahtsäge während einer abfolge von abtrennvorgängen
EP3922389A1 (de) * 2020-06-10 2021-12-15 Siltronic AG Verfahren zum abtrennen einer vielzahl von scheiben mittels einer drahtsäge von werkstücken während einer abfolge von abtrennvorgängen
EP3922386A1 (de) * 2020-06-10 2021-12-15 Siltronic AG Verfahren zum abtrennen einer vielzahl von scheiben von werkstücken mittels einer drahtsäge während einer abfolge von abtrennvorgängen
EP3922385A1 (de) * 2020-06-10 2021-12-15 Siltronic AG Verfahren zum abtrennen einer vielzahl von scheiben von werkstücken mittels einer drahtsäge während einer abfolge von abtrennvorgängen
CN115416170B (zh) * 2022-09-05 2024-11-15 北京天科合达半导体股份有限公司 一种晶棒的切割方法以及切割装置
CN115816675A (zh) * 2022-12-07 2023-03-21 宁夏中欣晶圆半导体科技有限公司 半导体晶棒硅片切割方法
CN116001118B (zh) * 2022-12-20 2025-02-21 浙江晶越半导体有限公司 一种碳化硅多线切割冷却系统、切割装置及方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11245153A (ja) * 1998-03-03 1999-09-14 Tokyo Seimitsu Co Ltd ワイヤソーのスラリ加熱方法及び装置
JP2005103683A (ja) * 2003-09-29 2005-04-21 Toshiba Ceramics Co Ltd ワイヤソー
JP2006150505A (ja) * 2004-11-29 2006-06-15 Sumco Corp ワイヤソーおよびこれを用いたワーク切断方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2674662B2 (ja) * 1989-02-15 1997-11-12 住友電気工業株式会社 半導体ウェーハの研削装置
JPH0413570A (ja) * 1990-05-07 1992-01-17 Hitachi Seiko Ltd 溝入加工装置
JP2571488B2 (ja) 1992-01-14 1997-01-16 信越半導体株式会社 ワイヤーソーによるワークの切断方法及び切断装置
US6113473A (en) * 1997-04-25 2000-09-05 G.T. Equipment Technologies Inc. Method and apparatus for improved wire saw slurry
JP3637740B2 (ja) 1997-08-25 2005-04-13 三菱住友シリコン株式会社 ワイヤソーおよびインゴット切断方法
JPH11104955A (ja) * 1997-10-02 1999-04-20 Sumitomo Metal Ind Ltd 研磨終点検出方法、研磨方法及び研磨装置
JPH11333712A (ja) * 1998-05-21 1999-12-07 Nikon Corp 研磨ヘッド及びそれを用いた研磨装置
US6652356B1 (en) * 1999-01-20 2003-11-25 Shin-Etsu Handotai Co., Ltd. Wire saw and cutting method
US6315635B1 (en) * 1999-03-31 2001-11-13 Taiwan Semiconductor Manufacturing Company, Ltd Method and apparatus for slurry temperature control in a polishing process
JP4659326B2 (ja) * 2000-05-31 2011-03-30 エムイーエムシー・エレクトロニック・マテリアルズ・ソシエタ・ペル・アチオニ 複数の半導体インゴットをスライスするワイヤソー及びプロセス
DE10122628B4 (de) * 2001-05-10 2007-10-11 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück
JP4308463B2 (ja) 2001-11-08 2009-08-05 株式会社Ｓｕｍｃｏ ワイヤソー
EP1685927B1 (en) * 2003-10-27 2013-04-10 Mitsubishi Denki Kabushiki Kaisha Multi-wire saw
US7878883B2 (en) 2006-01-26 2011-02-01 Memc Electronics Materials, Inc. Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control
JP4816511B2 (ja) * 2007-03-06 2011-11-16 信越半導体株式会社 切断方法およびワイヤソー装置
JP5185419B2 (ja) 2011-08-22 2013-04-17 コマツＮｔｃ株式会社 ワイヤソー
JP2020031624A (ja) 2018-08-23 2020-03-05 株式会社ソーダ 畜舎およびその臭気低減システム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11245153A (ja) * 1998-03-03 1999-09-14 Tokyo Seimitsu Co Ltd ワイヤソーのスラリ加熱方法及び装置
JP2005103683A (ja) * 2003-09-29 2005-04-21 Toshiba Ceramics Co Ltd ワイヤソー
JP2006150505A (ja) * 2004-11-29 2006-06-15 Sumco Corp ワイヤソーおよびこれを用いたワーク切断方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015156433A (ja) * 2014-02-20 2015-08-27 株式会社Sumco シリコンウェーハの製造方法およびシリコンウェーハ
WO2015125366A1 (ja) * 2014-02-20 2015-08-27 株式会社Sumco シリコンウェーハの製造方法およびシリコンウェーハ
JP2022538517A (ja) * 2019-05-27 2022-09-05 ジルトロニック アクチエンゲゼルシャフト ワイヤソーによる複数のスライス作業中に被加工物から複数のウェハをスライスして切り出す方法、および単結晶ケイ素の半導体ウェハ

Also Published As

Publication number Publication date
CN101855045B (zh) 2012-01-18
TW200938347A (en) 2009-09-16
JP5056859B2 (ja) 2012-10-24
US7959491B2 (en) 2011-06-14
US20100258103A1 (en) 2010-10-14
JPWO2009078130A1 (ja) 2011-04-28
KR20100110296A (ko) 2010-10-12
DE112008003339B4 (de) 2022-02-24
CN101855045A (zh) 2010-10-06
TWI382905B (zh) 2013-01-21
DE112008003339T5 (de) 2010-12-09
KR101486302B1 (ko) 2015-01-26

Similar Documents

Publication Publication Date Title
WO2009078130A1 (ja) ワイヤソーによるワークの切断方法およびワイヤソー
WO2009075062A1 (ja) ワイヤソーによるワークの切断方法およびワイヤソー
WO2008149490A1 (ja) 切断方法およびワイヤソー装置
WO2008108051A1 (ja) 切断方法およびワイヤソー装置
JP2010029955A5 (ja)
MY163638A (en) Method for cutting workpiece with wire saw
ATE544535T1 (de) Verfahren zum steuern des antriebs einer haspel
WO2010035301A3 (en) Rewinding machine and winding method
MY159000A (en) Control device, control method, program, and recording medium
PL3189926T3 (pl) Urządzenie oraz sposób monitorowania, a w szczególności regulowania procesu cięcia laserowego
WO2014013322A3 (en) Method and system to start and stop a hot wire system
MY186619A (en) An automatic tapping machine
WO2011066823A3 (de) Verfahren und vorrichtung zur analyse des energieeinsatzes beim betrieb eines produktionssystems
EP2584419A3 (en) CNC machine for cutting with plasma, oxygen and water jet used as a cutting tool with automatic setting up a precise position of a cutting tool in a cutting head by autocalibration and method thereof
WO2016142297A3 (de) Faserlegemaschine und verfahren zum legen einer faserbahn auf einem werkstück
ATE433371T1 (de) Vorrichtung und verfahren zum aufwickeln eines faserstranges
WO2013004752A3 (de) Nachstellsystem
CN104626344B (zh) 切坯机自动换钢丝装置
WO2009129551A8 (de) VERFAHREN ZUM REGELN EINES SCHWEIßGERÄTES
CN204431458U (zh) 切坯机自动换钢丝装置
ATE525179T1 (de) Abtrennmaschine zum schneiden von blöcken oder papierrollen in kleine rollen mit geringerer achsenlänge und zugehöriges verfahren
WO2014087222A3 (en) Safety plant for a cable stretching machine, corresponding method and stretching machine using said plant
CN202910226U (zh) 铁丝自动扳弯装置
CN202922310U (zh) 一种型材切割设备
ATE380635T1 (de) Handwerkzeugmaschine zur schnitteinbringung und verfahren zum verstellen einer handwerkzeugmaschine zwischen zieh- und schiebebetrieb

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880115141.0

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08861635

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009546129

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 12734452

Country of ref document: US

ENP Entry into the national phase

Ref document number: 20107012818

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 1120080033390

Country of ref document: DE

RET De translation (de og part 6b)

Ref document number: 112008003339

Country of ref document: DE

Date of ref document: 20101209

Kind code of ref document: P

122 Ep: pct application non-entry in european phase

Ref document number: 08861635

Country of ref document: EP

Kind code of ref document: A1