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WO2009075320A1 - 冷却デバイスとその製造方法 - Google Patents

冷却デバイスとその製造方法 Download PDF

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Publication number
WO2009075320A1
WO2009075320A1 PCT/JP2008/072493 JP2008072493W WO2009075320A1 WO 2009075320 A1 WO2009075320 A1 WO 2009075320A1 JP 2008072493 W JP2008072493 W JP 2008072493W WO 2009075320 A1 WO2009075320 A1 WO 2009075320A1
Authority
WO
WIPO (PCT)
Prior art keywords
cooling device
manufacture
metal
composite layer
fine whisker
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/072493
Other languages
English (en)
French (fr)
Inventor
Chihiro Kawai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of WO2009075320A1 publication Critical patent/WO2009075320A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)

Abstract

相手材との接触熱抵抗が小さい冷却デバイスを低コストで提供する。本発明は、冷却体と、少なくとも該冷却体の一面に形成された、微細髭状構造体と金属の複合体を有する複合層とを有し、該複合層において微細髭状構造体の一方の端部が金属表面から露出していることを特徴とする。微細髭状構造体は、カーボンナノチューブ、カーボンナノファイバー又はカーボンファイバー等の炭素系材料であることが好ましい。
PCT/JP2008/072493 2007-12-11 2008-12-11 冷却デバイスとその製造方法 Ceased WO2009075320A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-319100 2007-12-11
JP2007319100 2007-12-11

Publications (1)

Publication Number Publication Date
WO2009075320A1 true WO2009075320A1 (ja) 2009-06-18

Family

ID=40755559

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072493 Ceased WO2009075320A1 (ja) 2007-12-11 2008-12-11 冷却デバイスとその製造方法

Country Status (1)

Country Link
WO (1) WO2009075320A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011112330A (ja) * 2009-11-30 2011-06-09 Shinko Electric Ind Co Ltd 放熱部品及びその製造方法
JP2013534363A (ja) * 2010-07-23 2013-09-02 インターナショナル・ビジネス・マシーンズ・コーポレーション 熱界面材料の性能を高めるための方法及びシステム
US9082744B2 (en) 2013-07-08 2015-07-14 International Business Machines Corporation Method for aligning carbon nanotubes containing magnetic nanoparticles in a thermosetting polymer using a magnetic field
US9090004B2 (en) 2013-02-06 2015-07-28 International Business Machines Corporation Composites comprised of aligned carbon fibers in chain-aligned polymer binder
US9096784B2 (en) 2010-07-23 2015-08-04 International Business Machines Corporation Method and system for allignment of graphite nanofibers for enhanced thermal interface material performance
US9245813B2 (en) 2013-01-30 2016-01-26 International Business Machines Corporation Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance
US9257359B2 (en) 2011-07-22 2016-02-09 International Business Machines Corporation System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09126670A (ja) * 1995-10-30 1997-05-16 Furukawa Electric Co Ltd:The ヒートパイプ式ヒートシンク
JP2001322139A (ja) * 2000-05-16 2001-11-20 Jsr Corp 複合シートの製造方法および複合シート
JP2002146672A (ja) * 2000-11-06 2002-05-22 Polymatech Co Ltd 熱伝導性充填剤及び熱伝導性接着剤並びに半導体装置
JP2003046038A (ja) * 2001-07-27 2003-02-14 Mitsubishi Electric Corp 熱伝導基材とその製造方法及び半導体装置
JP2004156074A (ja) * 2002-11-01 2004-06-03 Univ Shinshu めっき構造物とその製造方法
JP2006152372A (ja) * 2004-11-29 2006-06-15 Shinshu Univ 金属−ファイバ複合めっき物およびその製造方法
JP2007162079A (ja) * 2005-12-14 2007-06-28 Nissan Motor Co Ltd 自動車エンジン用摺動部材及びその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09126670A (ja) * 1995-10-30 1997-05-16 Furukawa Electric Co Ltd:The ヒートパイプ式ヒートシンク
JP2001322139A (ja) * 2000-05-16 2001-11-20 Jsr Corp 複合シートの製造方法および複合シート
JP2002146672A (ja) * 2000-11-06 2002-05-22 Polymatech Co Ltd 熱伝導性充填剤及び熱伝導性接着剤並びに半導体装置
JP2003046038A (ja) * 2001-07-27 2003-02-14 Mitsubishi Electric Corp 熱伝導基材とその製造方法及び半導体装置
JP2004156074A (ja) * 2002-11-01 2004-06-03 Univ Shinshu めっき構造物とその製造方法
JP2006152372A (ja) * 2004-11-29 2006-06-15 Shinshu Univ 金属−ファイバ複合めっき物およびその製造方法
JP2007162079A (ja) * 2005-12-14 2007-06-28 Nissan Motor Co Ltd 自動車エンジン用摺動部材及びその製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011112330A (ja) * 2009-11-30 2011-06-09 Shinko Electric Ind Co Ltd 放熱部品及びその製造方法
JP2013534363A (ja) * 2010-07-23 2013-09-02 インターナショナル・ビジネス・マシーンズ・コーポレーション 熱界面材料の性能を高めるための方法及びシステム
US9096784B2 (en) 2010-07-23 2015-08-04 International Business Machines Corporation Method and system for allignment of graphite nanofibers for enhanced thermal interface material performance
US9257359B2 (en) 2011-07-22 2016-02-09 International Business Machines Corporation System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks
US9245813B2 (en) 2013-01-30 2016-01-26 International Business Machines Corporation Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance
US9090004B2 (en) 2013-02-06 2015-07-28 International Business Machines Corporation Composites comprised of aligned carbon fibers in chain-aligned polymer binder
US9082744B2 (en) 2013-07-08 2015-07-14 International Business Machines Corporation Method for aligning carbon nanotubes containing magnetic nanoparticles in a thermosetting polymer using a magnetic field
US9406651B2 (en) 2013-07-08 2016-08-02 Globalfoundries Inc. Chip stack with oleic acid-aligned nanotubes in thermal interface material

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