[go: up one dir, main page]

WO2009075088A1 - 表面波装置及びデュプレクサ - Google Patents

表面波装置及びデュプレクサ Download PDF

Info

Publication number
WO2009075088A1
WO2009075088A1 PCT/JP2008/003639 JP2008003639W WO2009075088A1 WO 2009075088 A1 WO2009075088 A1 WO 2009075088A1 JP 2008003639 W JP2008003639 W JP 2008003639W WO 2009075088 A1 WO2009075088 A1 WO 2009075088A1
Authority
WO
WIPO (PCT)
Prior art keywords
idt electrode
finger electrodes
acoustic wave
surface acoustic
wave device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/003639
Other languages
English (en)
French (fr)
Inventor
Yuichi Takamine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to KR1020107012304A priority Critical patent/KR101129107B1/ko
Priority to EP08860490.5A priority patent/EP2226935A4/en
Priority to JP2009545343A priority patent/JP5024388B2/ja
Priority to CN200880119491.4A priority patent/CN101889392B/zh
Publication of WO2009075088A1 publication Critical patent/WO2009075088A1/ja
Priority to US12/796,757 priority patent/US8169278B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/70Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/72Networks using surface acoustic waves
    • H03H9/725Duplexers
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/02637Details concerning reflective or coupling arrays
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/058Holders or supports for surface acoustic wave devices
    • H03H9/059Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/10Mounting in enclosures
    • H03H9/1064Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/125Driving means, e.g. electrodes, coils
    • H03H9/145Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14517Means for weighting
    • H03H9/1452Means for weighting by finger overlap length, apodisation
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/125Driving means, e.g. electrodes, coils
    • H03H9/145Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14544Transducers of particular shape or position
    • H03H9/14573Arrow type transducers
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46Filters
    • H03H9/64Filters using surface acoustic waves
    • H03H9/6423Means for obtaining a particular transfer characteristic
    • H03H9/643Means for obtaining a particular transfer characteristic the transfer characteristic being determined by reflective or coupling array characteristics

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

 小型化、特に薄型化を進めた場合であっても、モールド樹脂層形成時の溶融樹脂の圧力による変形が生じがたく、特性の劣化が生じがたい表面波装置を提供する。  圧電基板2上にIDT電極3が形成されており、IDT電極3を囲む空間Bを形成するように絶縁部材18が圧電基板2上に形成されており、空間Bの面積を小さくするように、IDT電極3の両側に配置された反射器4,5において、IDT電極3側からIDT電極3に対して遠ざかる側につれて電極指の長さが短くなるように重み付けされている部分が設けられており、それに応じて空間Bの形状が小さくされている、表面波装置1。
PCT/JP2008/003639 2007-12-11 2008-12-08 表面波装置及びデュプレクサ Ceased WO2009075088A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020107012304A KR101129107B1 (ko) 2007-12-11 2008-12-08 표면파 장치 및 듀플렉서
EP08860490.5A EP2226935A4 (en) 2007-12-11 2008-12-08 SURFACE WAVING DEVICE AND DUPLEX
JP2009545343A JP5024388B2 (ja) 2007-12-11 2008-12-08 表面波装置及びデュプレクサ
CN200880119491.4A CN101889392B (zh) 2007-12-11 2008-12-08 表面波装置及双工器
US12/796,757 US8169278B2 (en) 2007-12-11 2010-06-09 Surface acoustic wave device and duplexer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007319287 2007-12-11
JP2007-319287 2007-12-11

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/796,757 Continuation US8169278B2 (en) 2007-12-11 2010-06-09 Surface acoustic wave device and duplexer

Publications (1)

Publication Number Publication Date
WO2009075088A1 true WO2009075088A1 (ja) 2009-06-18

Family

ID=40755336

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/003639 Ceased WO2009075088A1 (ja) 2007-12-11 2008-12-08 表面波装置及びデュプレクサ

Country Status (6)

Country Link
US (1) US8169278B2 (ja)
EP (1) EP2226935A4 (ja)
JP (1) JP5024388B2 (ja)
KR (1) KR101129107B1 (ja)
CN (1) CN101889392B (ja)
WO (1) WO2009075088A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101860342A (zh) * 2010-04-29 2010-10-13 贵州大学 汇流条兼作反射栅型idt结构的saw器件
JPWO2013002033A1 (ja) * 2011-06-28 2015-02-23 京セラ株式会社 弾性波素子およびそれを用いた弾性波装置
JP5886989B1 (ja) * 2015-01-13 2016-03-16 ワイソル株式会社 圧電素子デバイス
US9876484B2 (en) 2013-08-13 2018-01-23 Murata Manufacturing Co., Ltd. Elastic wave device with first and second support layers providing a hollow path
US10243536B2 (en) 2013-12-27 2019-03-26 Murata Manufacturing Co., Ltd. Elastic wave device and manufacturing method thereof

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009050932A1 (ja) * 2007-10-18 2009-04-23 Murata Manufacturing Co., Ltd. 弾性表面波共振子及びラダー型フィルタ
CN102365822B (zh) * 2009-04-07 2014-07-09 株式会社村田制作所 弹性边界波谐振器以及梯型滤波器
JP5141852B2 (ja) * 2011-03-28 2013-02-13 株式会社村田製作所 電子部品及びその製造方法
WO2015040922A1 (ja) * 2013-09-17 2015-03-26 株式会社村田製作所 デュプレクサ
CN106464230B (zh) * 2014-06-23 2019-05-17 株式会社村田制作所 弹性波装置
CN105742255B (zh) * 2016-04-01 2018-10-09 江苏长电科技股份有限公司 金属圆片级凹槽埋孔型表面声滤波芯片封装结构及方法
CN110663174B (zh) 2017-06-06 2023-12-29 株式会社村田制作所 弹性波滤波器装置、多工器以及复合滤波器装置
CN110809673B (zh) * 2017-06-30 2022-04-26 维斯塔斯风力系统集团公司 改进的电热加热元件
WO2019022006A1 (ja) * 2017-07-27 2019-01-31 京セラ株式会社 弾性波素子
WO2020202960A1 (ja) * 2019-03-29 2020-10-08 株式会社村田製作所 縦結合共振子型弾性波フィルタ及びフィルタ装置
CN114221635A (zh) * 2022-02-21 2022-03-22 成都频岢微电子有限公司 一种用作射频前端声表面波滤波器的谐振器
CN114268294B (zh) * 2022-03-03 2022-06-17 深圳新声半导体有限公司 包含混合加权型反射栅的saw器件及混合加权型反射栅
CN114614794A (zh) * 2022-03-23 2022-06-10 浙江星曜半导体有限公司 一种具有不同倾角汇流条的声表面波谐振器
CN114710134A (zh) * 2022-04-08 2022-07-05 浙江星曜半导体有限公司 声表面波谐振器及声表面波滤波器
CN116032238A (zh) * 2023-02-13 2023-04-28 成都频岢微电子有限公司 一种叉指换能器及蜂窝状结构声表面波滤波器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001082480A1 (fr) * 2000-04-24 2001-11-01 Mitsubishi Denki Kabushiki Kaisha Filtre a ondes acoustiques de surface a couplage vertical
JP2002261582A (ja) * 2000-10-04 2002-09-13 Matsushita Electric Ind Co Ltd 弾性表面波デバイスおよびその製造方法ならびにそれを用いた回路モジュール
JP2002314365A (ja) * 2001-04-17 2002-10-25 Hitachi Ltd 所望の比帯域を有する弾性表面波共振子およびその製造方法。
JP2004253937A (ja) * 2003-02-19 2004-09-09 Toyo Commun Equip Co Ltd 弾性表面波フィルタとその製造方法
WO2006006343A1 (ja) * 2004-07-14 2006-01-19 Murata Manufacturing Co., Ltd. 圧電デバイス
JP2006217226A (ja) 2005-02-03 2006-08-17 Matsushita Electric Ind Co Ltd 弾性表面波素子およびその製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03128519A (ja) * 1989-09-12 1991-05-31 Seiko Epson Corp Saw共振子及びsawフィルタ
JPH07240658A (ja) * 1994-03-01 1995-09-12 Kinseki Ltd 弾性表面波デバイス
JP3825475B2 (ja) 1995-06-30 2006-09-27 株式会社 東芝 電子部品の製造方法
DE69718693T2 (de) * 1996-03-08 2003-11-27 Matsushita Electric Industrial Co., Ltd. Elektronisches Bauteil und Herstellungsverfahren
JP3128519B2 (ja) * 1996-11-06 2001-01-29 リンナイ株式会社 複合温水暖房システムの温度制御装置
JP4377500B2 (ja) * 1999-12-24 2009-12-02 京セラ株式会社 弾性表面波装置及び弾性表面波装置の製造方法
JP3449352B2 (ja) * 2000-02-07 2003-09-22 株式会社村田製作所 弾性表面波フィルタ
JP2001298346A (ja) * 2000-04-13 2001-10-26 Mitsubishi Electric Corp 弾性表面波装置
JP3863712B2 (ja) 2000-09-06 2006-12-27 株式会社日立製作所 弾性表面波共振器
US6710682B2 (en) * 2000-10-04 2004-03-23 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device, method for producing the same, and circuit module using the same
JP3772702B2 (ja) 2001-07-23 2006-05-10 松下電器産業株式会社 弾性表面波装置の製造方法
JP4273935B2 (ja) * 2003-01-24 2009-06-03 株式会社村田製作所 弾性表面波装置、通信装置
JP4186677B2 (ja) 2003-04-01 2008-11-26 株式会社村田製作所 弾性表面波装置及びその製造方法
US7307369B2 (en) * 2004-08-26 2007-12-11 Kyocera Corporation Surface acoustic wave device, surface acoustic wave apparatus, and communications equipment
JP4811232B2 (ja) * 2005-11-02 2011-11-09 パナソニック株式会社 電子部品パッケージ
JP4509038B2 (ja) * 2006-02-01 2010-07-21 富士通メディアデバイス株式会社 弾性波デバイスおよびその製造方法
JP2007273585A (ja) 2006-03-30 2007-10-18 Sony Corp マイクロデバイスモジュール及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001082480A1 (fr) * 2000-04-24 2001-11-01 Mitsubishi Denki Kabushiki Kaisha Filtre a ondes acoustiques de surface a couplage vertical
JP2002261582A (ja) * 2000-10-04 2002-09-13 Matsushita Electric Ind Co Ltd 弾性表面波デバイスおよびその製造方法ならびにそれを用いた回路モジュール
JP2002314365A (ja) * 2001-04-17 2002-10-25 Hitachi Ltd 所望の比帯域を有する弾性表面波共振子およびその製造方法。
JP2004253937A (ja) * 2003-02-19 2004-09-09 Toyo Commun Equip Co Ltd 弾性表面波フィルタとその製造方法
WO2006006343A1 (ja) * 2004-07-14 2006-01-19 Murata Manufacturing Co., Ltd. 圧電デバイス
JP2006217226A (ja) 2005-02-03 2006-08-17 Matsushita Electric Ind Co Ltd 弾性表面波素子およびその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2226935A4

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101860342A (zh) * 2010-04-29 2010-10-13 贵州大学 汇流条兼作反射栅型idt结构的saw器件
CN101860342B (zh) * 2010-04-29 2013-12-18 贵州大学 汇流条兼作反射栅型idt结构的saw器件
JPWO2013002033A1 (ja) * 2011-06-28 2015-02-23 京セラ株式会社 弾性波素子およびそれを用いた弾性波装置
US9319023B2 (en) 2011-06-28 2016-04-19 Kyocera Corporation Acoustic wave element and acoustic wave device using same
USRE47991E1 (en) 2011-06-28 2020-05-12 Kyocera Corporation Acoustic wave element and acoustic wave device using same
US9876484B2 (en) 2013-08-13 2018-01-23 Murata Manufacturing Co., Ltd. Elastic wave device with first and second support layers providing a hollow path
US10243536B2 (en) 2013-12-27 2019-03-26 Murata Manufacturing Co., Ltd. Elastic wave device and manufacturing method thereof
DE112014006039B4 (de) 2013-12-27 2022-08-25 Murata Manufacturing Co., Ltd. Vorrichtung für elastische Wellen und Herstellungsverfahren dafür
JP5886989B1 (ja) * 2015-01-13 2016-03-16 ワイソル株式会社 圧電素子デバイス
US9935610B2 (en) 2015-01-13 2018-04-03 Wisol Co., Ltd. Acoustic wave device

Also Published As

Publication number Publication date
CN101889392B (zh) 2013-04-03
US8169278B2 (en) 2012-05-01
CN101889392A (zh) 2010-11-17
KR20100089868A (ko) 2010-08-12
EP2226935A4 (en) 2013-08-21
JPWO2009075088A1 (ja) 2011-04-28
EP2226935A1 (en) 2010-09-08
US20100237963A1 (en) 2010-09-23
KR101129107B1 (ko) 2012-03-23
JP5024388B2 (ja) 2012-09-12

Similar Documents

Publication Publication Date Title
WO2009075088A1 (ja) 表面波装置及びデュプレクサ
WO2009022410A1 (ja) 弾性境界波装置
WO2008078573A1 (ja) 弾性表面波共振器並びにそれを用いた弾性表面波フィルタ及びアンテナ共用器
WO2008081935A1 (ja) 弾性表面波装置およびその製造方法
WO2013185737A3 (zh) 一种温度补偿能力可调节的压电声波谐振器
WO2008087836A1 (ja) 弾性境界波装置の製造方法
WO2006093913A3 (en) Piezoelectric micromachined ultrasonic transducer with air-backed cavities
TW200610266A (en) Thin film bulk acoustic resonator and method of manufacturing the same
EP2009710A3 (en) Piezoelectric component and manufacturing method thereof
WO2008019349A3 (en) Thin film solar cell with finger pattern
WO2009112969A3 (en) Patterned ultrasonic transducers
JP2017200175A5 (ja) 電子部品と電子装置
JP2020188408A5 (ja)
TW200644046A (en) Method for manufacturing a film bulk acoustic resonator
WO2009057699A1 (ja) 弾性波装置
EP1480335A3 (en) Method of manufacturing film bulk acoustic resonator using internal stress of metallic film and resonator manufactured thereby
WO2009028027A1 (ja) 圧電薄膜共振子、それを用いたフィルタ、そのフィルタを用いたデュプレクサおよびそのフィルタまたはそのデュプレクサを用いた通信機
KR101392744B1 (ko) 적층형 압전 스피커 장치
TW200603418A (en) A film bulk acoustic resonator package and method of fabricating same
JPWO2009098840A1 (ja) 弾性境界波装置
EP2477332A4 (en) ACOUSTIC WAVE ELEMENT AND ACOUSTIC WAVE ELEMENT SENSOR
WO2009057195A1 (ja) 弾性波素子、デュープレクサ、通信モジュール、および通信装置
CN108173531B (zh) 一种体声波谐振器与表面声波谐振器的混合式声波谐振器
WO2009060594A1 (ja) 弾性波共振器、弾性波フィルタおよびこれを用いたアンテナ共用器
WO2009143354A3 (en) Insulated film use in a mems device

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880119491.4

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08860490

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009545343

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 2008860490

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 20107012304

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE