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WO2009075060A1 - 基板処理方法 - Google Patents

基板処理方法 Download PDF

Info

Publication number
WO2009075060A1
WO2009075060A1 PCT/JP2008/003316 JP2008003316W WO2009075060A1 WO 2009075060 A1 WO2009075060 A1 WO 2009075060A1 JP 2008003316 W JP2008003316 W JP 2008003316W WO 2009075060 A1 WO2009075060 A1 WO 2009075060A1
Authority
WO
WIPO (PCT)
Prior art keywords
processing method
substrate processing
substrate
rotor
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/003316
Other languages
English (en)
French (fr)
Inventor
Minoru Matsuzawa
Kazuhiro Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
REALIZE ADVANCED Tech Ltd
Original Assignee
REALIZE ADVANCED Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by REALIZE ADVANCED Tech Ltd filed Critical REALIZE ADVANCED Tech Ltd
Publication of WO2009075060A1 publication Critical patent/WO2009075060A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

遠心力とロータによる排液、排気効率を高めることのできる基板処理方法を提供すること。本発明の基板処理方法は、被処理基板（１）を載置する試料ステージ（２）と、試料ステージ（２）内に配置するスピンロータ（３）と、スピンロータ（３）の中心部から液体を供給する供給ノズル（４）とを備え、スピンロータ（３）の回転によって、供給ノズル（４）から供給される液体を被処理基板（１）の外周方向に排出させることを特徴とする。
PCT/JP2008/003316 2007-12-13 2008-11-14 基板処理方法 Ceased WO2009075060A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-321957 2007-12-13
JP2007321957A JP2009147061A (ja) 2007-12-13 2007-12-13 基板処理方法

Publications (1)

Publication Number Publication Date
WO2009075060A1 true WO2009075060A1 (ja) 2009-06-18

Family

ID=40755310

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/003316 Ceased WO2009075060A1 (ja) 2007-12-13 2008-11-14 基板処理方法

Country Status (2)

Country Link
JP (1) JP2009147061A (ja)
WO (1) WO2009075060A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018144446A1 (en) * 2017-02-06 2018-08-09 Planar Semiconductor, Inc. Sub-nanometer-level substrate cleaning mechanism
WO2018145001A1 (en) * 2017-02-06 2018-08-09 Planar Semiconductor, Inc. Subnanometer-level light-based substrate cleaning mechanism
WO2018145070A1 (en) * 2017-02-06 2018-08-09 Planar Semiconductor, Inc. Removal of process effluents
CN115054326A (zh) * 2022-07-26 2022-09-16 上海鸿脉医疗科技有限公司 旋磨系统、旋磨组件及其旋磨头

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09257367A (ja) * 1996-03-19 1997-10-03 Ebara Corp 基板乾燥装置
JP2001135610A (ja) * 1999-05-25 2001-05-18 Ebara Corp 基板処理装置及び運転方法
JP2005259874A (ja) * 2004-03-10 2005-09-22 Tokyo Electron Ltd 基板処理装置及び基板処理方法
WO2006051585A1 (ja) * 2004-11-10 2006-05-18 Mimasu Semiconductor Industry Co., Ltd. 枚葉式ウェーハ処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09257367A (ja) * 1996-03-19 1997-10-03 Ebara Corp 基板乾燥装置
JP2001135610A (ja) * 1999-05-25 2001-05-18 Ebara Corp 基板処理装置及び運転方法
JP2005259874A (ja) * 2004-03-10 2005-09-22 Tokyo Electron Ltd 基板処理装置及び基板処理方法
WO2006051585A1 (ja) * 2004-11-10 2006-05-18 Mimasu Semiconductor Industry Co., Ltd. 枚葉式ウェーハ処理装置

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102126645B1 (ko) 2017-02-06 2020-06-24 플레이너 세미컨덕터, 인크. 나노미터 미만 수준 기판 세정 메커니즘
KR102226086B1 (ko) 2017-02-06 2021-03-09 플레이너 세미컨덕터, 인크. 공정 배출물들의 제거
WO2018145070A1 (en) * 2017-02-06 2018-08-09 Planar Semiconductor, Inc. Removal of process effluents
US10892172B2 (en) 2017-02-06 2021-01-12 Planar Semiconductor, Inc. Removal of process effluents
CN110603628A (zh) * 2017-02-06 2019-12-20 平面半导体公司 处理污水的去除
KR20200011408A (ko) * 2017-02-06 2020-02-03 플레이너 세미컨덕터, 인크. 나노미터 미만 수준 기판 세정 메커니즘
KR20200011407A (ko) * 2017-02-06 2020-02-03 플레이너 세미컨덕터, 인크. 공정 배출물들의 제거
JP2020507936A (ja) * 2017-02-06 2020-03-12 プレイナー・セミコンダクター・インコーポレイテッド プロセス廃液の除去
WO2018145001A1 (en) * 2017-02-06 2018-08-09 Planar Semiconductor, Inc. Subnanometer-level light-based substrate cleaning mechanism
WO2018144446A1 (en) * 2017-02-06 2018-08-09 Planar Semiconductor, Inc. Sub-nanometer-level substrate cleaning mechanism
CN110603629A (zh) * 2017-02-06 2019-12-20 平面半导体公司 亚纳米级光基基板清洁机构
US10985039B2 (en) 2017-02-06 2021-04-20 Planar Semiconductor, Inc. Sub-nanometer-level substrate cleaning mechanism
US11069521B2 (en) 2017-02-06 2021-07-20 Planar Semiconductor, Inc. Subnanometer-level light-based substrate cleaning mechanism
TWI770115B (zh) * 2017-02-06 2022-07-11 新加坡商平面半導體公司 加工汙水之去除
TWI770114B (zh) * 2017-02-06 2022-07-11 新加坡商平面半導體公司 次奈米級基板清潔機構
US11830726B2 (en) 2017-02-06 2023-11-28 Planar Semiconductor Corporation Pte. Ltd. Subnanometer-level light-based substrate cleaning mechanism
CN110603628B (zh) * 2017-02-06 2023-11-07 平面半导体公司 处理污水的去除
CN115054326B (zh) * 2022-07-26 2022-11-15 上海鸿脉医疗科技有限公司 旋磨系统、旋磨组件及其旋磨头
CN115054326A (zh) * 2022-07-26 2022-09-16 上海鸿脉医疗科技有限公司 旋磨系统、旋磨组件及其旋磨头

Also Published As

Publication number Publication date
JP2009147061A (ja) 2009-07-02

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